To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.) Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names are mentioned in the document, these names have in fact all been changed to Renesas Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. Renesas Technology Home Page: http://www.renesas.com Renesas Technology Corp. Customer Support Dept. April 1, 2003 Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party. 2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corporation by various means, including the Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corporation for further details on these materials or the products contained therein. HD74CBT32160C 16-bit to 32-bit Demux PCI Hot-plug Bus Switch ADE-205-673 (Z) Preliminary Rev. 0 Feb. 2002 Description The HD74CBT32160C device provides 16-bit to 32-bit demux PCI Hot-plug bus switching. The low on state resistance of the switch allows connections to be made with minimal propagation delay. Select control (SEL1, SEL2) inputs, select the appropriate B1 and B2 outputs for the A-input data. Features • Minimal propagation delay through the switch. • 5 Ω switch connection between two ports. Pullup on B1 and B2 ports. • TTL-compatible input levels. • Ultra low quiescent power. -Ideally suited for notebook applications. • Package type Product code example: HD74CBT32160CTEL Package type Package code Package suffix Taping code TSSOP-56pin TTP-56DAV T EL (1,000 pcs / Reel) Function Table Inputs SEL1 SEL2 Function L H nA to nB1 H L nA to nB2 L L nA to nB1 and nB2 H H nB1, nB2 = VBIAS H: L: High level Low level HD74CBT32160C Pin Arrangement 1B1 1 56 1A 2B1 2 55 1B2 2A 3 54 2B2 3B1 4 53 3A 4B1 5 52 3B2 4A 6 51 4B2 5B1 7 50 5A 6B1 8 49 5B2 6A 9 48 6B2 7B1 10 47 7A 8B1 11 46 7B2 8A 12 45 8B2 GND 13 44 GND Vcc 14 43 Vcc 9B1 15 42 9A 10B1 16 41 9B2 10A 17 40 10B2 11B1 18 39 11A 12B1 19 38 11B2 12A 20 37 12B2 13B1 21 36 13A 14B1 22 35 13B2 14A 23 34 14B2 15B1 24 33 15A 16B1 25 32 15B2 16A 26 31 16B2 VBIAS1 27 30 VBIAS2 SEL1 28 29 SEL2 (Top view) Rev.0, Feb. 2002, page 2 of 2 HD74CBT32160C Absolute Maximum Ratings Item Symbol Ratings Unit VCC −0.5 to 7.0 V VI −0.5 to 7.0 V Input clamp current IIK −50 mA VI < 0 Continuous output current IO 128 mA VO = 0 to VCC Continuous current through VCC or GND ICC or IGND ±100 mA Maximum power dissipation *2 at Ta = 25°C (in still air) PT 1.32 W Storage temperature Tstg −65 to 150 °C Supply voltage range Input voltage range Notes: *1 Conditions The absolute maximum ratings are values which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. 1. The input and output voltage ratings may be exceeded even if the input and output clamp-current ratings are observed. 2. The maximum package power dissipation was calculated using a junction temperature of 150°C. Recommended Operating Conditions Item Symbol Min Max Unit Supply voltage range VCC 4.5 5.5 V VBIAS 1.3 VCC Input voltage range VI 0 5.5 V Output voltage range VI/O 0 5.5 V Input transition rise or fall rate ∆t / ∆v 0 5 ns / V Operating free-air temperature Ta −40 85 °C Conditions VCC = 4.5 to 5.5 V Note: Unused or floating inputs must be held high or low. Rev.0, Feb. 2002, page 3 of 3 HD74CBT32160C Logic Diagram VBIAS1 1A 1B1 VBIAS2 1B2 VBIAS1 16A 16B1 VBIAS2 16B2 SEL1 SEL2 Rev.0, Feb. 2002, page 4 of 4 HD74CBT32160C DC Electrical Characteristics (Ta = −40 to 85°C) Item Symbol VCC (V) Min Typ Clamp diode voltage VIK 4.5 Input voltage VIH 4.0 to 5.5 VIL RON On-state switch *2 resistance *1 Max Unit Test conditions −1.2 V IIN = −18 mA 2.0 V 4.0 to 5.5 0.8 4.5 5 8 4.5 10 15 Ω VIN = 0 V, IIN = 48 mA VIN = 2.4 V, IIN = 15 mA Input current IIN 0 to 5.5 ±1.0 µA VIN = 5.5 V or GND Off-state leakage current IOZA 5.5 20 µA A = 5.5 V, VBIAS = 5.5 V IOZB –1.0 A = 0 V, VBIAS = 5.5 V ±1.0 B = 5.5 V, VBIAS = 5.5 V –5 –0.25 mA B = 0 V, VBIAS = 5.5 V Quiescent supply current ICC 5.5 3 µA VIN = VCC or GND, IO = 0 mA Increase in ICC *3 per input ∆ICC 5.5 2.5 mA One input at 3.4 V, other inputs at VCC or GND Notes: For condition shown as Min or Max use the appropriate values under recommended operating conditions. 1. All typical values are at VCC = 5 V (unless otherwise noted), Ta = 25°C. 2. Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower voltage of the two (A or B) terminals. 3. This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. Capacitance (Ta = 25°C) Item Symbol VCC (V) Min Typ Max Unit Test conditions Control input capacitance CIN 5.0 5 pF VIN = 0 or 3 V CI/O (OFF) 5.0 10 pF 7 VO = 0 or 3 V SEL1, SEL2 = VCC Input / output capacitance A port B port Note: This parameter is determined by device characterization is not production tested. Rev.0, Feb. 2002, page 5 of 5 HD74CBT32160C Switching Characteristics (Ta = −40 to 85°C) • VCC = 5.0±0.5 V, VBIAS = VCC Test conditions FROM (Input) TO (Output) ns CL = 50 pF RL = 500 Ω A or B B or A 7.0 ns CL = 50 pF RL = 500 Ω SEL A or B 2.0 6.0 ns SEL A or B 2.0 7.0 CL = 50 pF RL = 500 Ω Item Symbol Min Max Unit Propagation delay *1 time tPLH tPHL 0.25 Enable time tZH tZL 2.0 Disable time tHZ tLZ Notes: 1. The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). Test Circuit See under table 500 Ω S1 OPEN GND *1 CL = 50 pF 500 Ω Load circuit for outputs Symbol S1 t PLH / tPHL OPEN t ZH / t HZ OPEN t ZL / t LZ 7V Note: 1. CL includes probe and jig capacitance. Rev.0, Feb. 2002, page 6 of 6 HD74CBT32160C Waveforms – 1 tr tf 90 % 1.5 V Input 3V 90 % 1.5 V 10 % 10 % t PLH GND t PHL V OH 1.5 V Output 1.5 V V OL Waveforms – 2 tf tr 90 % Output Control 3V 90 % 1.5 V 1.5 V 10 % t ZL 10 % GND t LZ 3.5 V Waveform - A 1.5 V V OL + 0.3 V t ZH t HZ V OH - 0.3 V Waveform - B V OL V OH 1.5 V GND Notes: 1. All input pulses are supplied by generators having the following characteristics : PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. 2. Waveform - A is for an output with internal conditions such that the output is low except when disabled by the output control. 3. Waveform - B is for an output with internal conditions such that the output is high except when disabled by the output control. 4. The output are measured one at a time with one transition per measurement. Rev.0, Feb. 2002, page 7 of 7 HD74CBT32160C Package Dimensions As of July, 2001 14.0 14.2 Max 29 6.10 56 Unit: mm 1 *0.19 ± 0.05 0.50 28 0.08 M 1.0 8.10 ± 0.20 0.65 Max *Pd plating Rev.0, Feb. 2002, page 8 of 8 0.10 ± 0.05 0.10 *0.15 ± 0.05 1.20 Max 0˚ – 8˚ 0.50 ± 0.1 Hitachi Code JEDEC JEITA Mass (reference value) TTP-56DAV — — 0.32 g HD74CBT32160C Disclaimer 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Sales Offices Hitachi, Ltd. Semiconductor & Integrated Circuits Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: (03) 3270-2111 Fax: (03) 3270-5109 URL http://www.hitachisemiconductor.com/ For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe Ltd. Electronic Components Group Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 585200 Hitachi Asia Ltd. Hitachi Tower 16 Collyer Quay #20-00 Singapore 049318 Tel : <65>-538-6533/538-8577 Fax : <65>-538-6933/538-3877 URL : http://semiconductor.hitachi.com.sg Hitachi Europe GmbH Electronic Components Group Dornacher Straße 3 D-85622 Feldkirchen Postfach 201, D-85619 Feldkirchen Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Asia Ltd. (Taipei Branch Office) 4/F, No. 167, Tun Hwa North Road Hung-Kuo Building Taipei (105), Taiwan Tel : <886>-(2)-2718-3666 Fax : <886>-(2)-2718-8180 Telex : 23222 HAS-TP URL : http://www.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon Hong Kong Tel : <852>-(2)-735-9218 Fax : <852>-(2)-730-0281 URL : http://semiconductor.hitachi.com.hk Copyright © Hitachi, Ltd., 2002. All rights reserved. Printed in Japan. Colophon 5.0 Rev.0, Feb. 2002, page 9 of 9