ROHM BH1750FVI-TR

Ambient Light Sensor IC Series
Digital 16bit Serial Output Type
Ambient Light Sensor IC
BH1750FVI
No.10046ECT01
●Descriptions
2
BH1750FVI is an digital Ambient Light Sensor IC for I C bus interface. This IC is the most suitable to obtain the ambient light
data for adjusting LCD and Keypad backlight power of Mobile phone. It is possible to detect wide range at High resolution.
( 1 - 65535 lx ).
●Features
2
1) I C bus Interface ( f / s Mode Support )
2) Spectral responsibility is approximately human eye response
3) Illuminance to Digital Converter
4) Wide range and High resolution. ( 1 - 65535 lx )
5) Low Current by power down function
6) 50Hz / 60Hz Light noise reject-function
7) 1.8V Logic input interface
8) No need any external parts
9) Light source dependency is little. ( ex. Incandescent Lamp. Fluorescent Lamp. Halogen Lamp. White LED. Sun Light )
2
10) It is possible to select 2 type of I C slave-address.
11) Adjustable measurement result for influence of optical window
( It is possible to detect min. 0.11 lx, max. 100000 lx by using this function. )
12) Small measurement variation (+/- 20%)
13) The influence of infrared is very small.
●Applications
Mobile phone, LCD TV, NOTE PC, Portable game machine, Digital camera, Digital video camera, Car navigation, PDA,
LCD display
●Absolute Maximum Ratings
Parameter
Symbol
Limits
Units
Supply Voltage
Vmax
4.5
V
Operating Temperature
Topr
-40~85
℃
Storage Temperature
Tstg
-40~100
℃
SDA Sink Current
Imax
7
mA
Power Dissipation
Pd
260※
mW
※ 70mm × 70mm × 1.6mm glass epoxy board. Derating in done at 3.47mW/℃ for operating above Ta=25℃.
●Operating Conditions
Parameter
VCC Voltage
2
I C Reference Voltage
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Symbol
Min.
Typ.
Max.
Units
Vcc
2.4
3.0
3.6
V
VDVI
1.65
-
VCC
V
1/17
2010.04 - Rev.C
BH1750FVI
Technical Note
●Electrical Characteristics ( VCC = 3.0V, DVI = 3.0V, Ta = 25℃, unless otherwise noted )
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
Supply Current
Icc1
-
120
190
µA
Ev = 100 lx
Powerdown Current
Icc2
-
0.01
1.0
µA
No input Light
Peak Wave Length
λp
-
560
-
nm
Measurement Accuracy
S/A
0.96
1.2
1.44
times
Sensor out / Actual lx
EV = 1000 lx ※1, ※2
Dark ( 0 lx ) Sensor out
S0
0
0
3
count
H-Resolution Mode
H-Resolution Mode Resolution
rHR
-
1
-
lx
L-Resolution Mode Resolution
rLR
-
4
-
lx
H-Resolution Mode Measurement
Time
tHR
-
120
180
ms
L-Resolution Mode Measurement
Time
tLR
-
16
24
ms
Incandescent / Fluorescent Sensor
out ratio
rIF
-
1
-
times
ADDR Input ‘H’ Voltage
VAH
0.7 * VCC
-
-
V
ADDR Input ‘L’ Voltage
VAL
-
-
0.3 * VCC
V
DVI Input ‘L’ Voltage
VDVL
-
-
0.4
V
SCL, SDA Input ‘H’ Voltage 1
VIH1
0.7 * DVI
-
-
V
DVI ≧ 1.8V
SCL, SDA Input ‘H’ Voltage 2
VIH2
1.26
-
-
V
1.65V ≦ DVI <1.8V
SCL, SDA Input ‘L’ Voltage 1
VIL1
-
-
0.3 * DVI
V
DVI ≧ 1.8V
SCL, SDA Input ‘L’ Voltage 2
VIL2
-
-
DVI – 1.26
V
1.65V ≦ DVI < 1.8V
SCL, SDA, ADDR Input ‘H’ Current
IIH
-
-
10
µA
SCL, SDA, ADDR Input ‘L’ Current
IIL
-
-
10
µA
I2C SCL Clock Frequency
fSCL
-
-
400
kHz
I2C Bus Free Time
tBUF
1.3
-
-
µs
I C Hold Time ( repeated ) START
Condition
tHDSTA
0.6
-
-
µs
I2C Set up time for a Repeated
START Condition
tSUSTA
0.6
-
-
µs
I2C Set up time for a Repeated STOP
Condition
tSUSTD
0.6
-
-
µs
I2C Data Hold Time
※1
※3
EV = 1000 lx
2
tHDDAT
0
-
0.9
µs
2
tSUDAT
100
-
-
ns
2
tLOW
1.3
-
-
µs
2
tHIGH
0.6
-
-
µs
VOL
0
-
0.4
V
I C Data Setup Time
I C ‘L’ Period of the SCL Clock
I C ‘H’ Period of the SCL Clock
2
I C SDA Output ‘L’ Voltage
IOL = 3 mA
※1 White LED is used as optical source.
※2 Measurement Accuracy typical value is possible to change '1' by "Measurement result adjustment function".
※3 Use H-resolution mode or H-resolution mode2 if dark data ( less than 10 lx ) is need.
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2/17
2010.04 - Rev.C
BH1750FVI
Technical Note
●Reference Data
64
1.2
100000
56
Ratio
0.8
0.6
0.4
10000
48
Measurement Result
Measurement Result
1
40
32
H-Res.
H-Res.
L-Res.
24
16
100
10
L-Res.
8
0.2
1000
1
0
0
400
500
600
700
800
900
1000
0
1100
8
16
24
32
40
48
56
1
64
Wavelength [ nm ]
1.2
1.2
1
Measurement Result
0.8
+
Ratio
Ratio
-
0.6
0.6
-
0.4
1pin
-
0.4
-
+
0.2
-90
-60
-30
0
30
60
-60
-30
90
30
H-Res.
+
60
0
90
-40
ICC @ Measurement
Halogen
Light
0.6
Kripton Light
0.4
Artifical Sun
Light
0.2
0
20
40
60
80
100
0.5
1
Ratio
2
2
2.5
-40
-20
0
20
40
60
80
100
Ta [ ℃ ]
Fig.10 VCC – [email protected] Lx
( POWER DOWN )
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4
1
VCC=3V
0.8
0.01
3.5
1.2
DVI=1.8V
0.1
3
VCC [ V ]
Fig.9 VCC - ICC
( During measurement )
1
0.8
Ratio
Ratio
ICC @ POWER DOWN [ uA ]
1.5
1.2
1
100
50
Fig.8 Light Source Dependency
( Fluorescent Light is set to '1' )
10
80
0
0
Ta [ ℃ ]
Fig.7 Measurement Accuracy
Temperature Dependency
60
100
White LED
-20
40
150
0
-40
20
200
Incandescent
Light
0.8
0
Fig.6 Dark Response
Fluorescent
Light
1
-20
Ta [ ℃ ]
Fig.5 Directional Characteristics 2
1.2
Ratio
0
Angle [ deg ]
Angle [ deg ]
Fig.4 Directional Characteristics 1
4
2
0
-90
100000
6
+
0.2
0
10000
蛍光灯白熱灯感度比
8
0.8
1000
10
1
1pin
100
Fig.3 Illuminance Measuremnet Result 2
Fig.2 Illuminance Measurement Result 1
Fig.1 Spectral Response
10
Illuminance [ lx ]
Illuminance [ lx ]
0.6
0.6
0.4
0.4
0.2
0.2
0
0
2
2.5
3
VCC [ V ]
3.5
4
Fig.11 Measurement Result
VCC Dependency
3/17
1.5
2
2.5
DVI [ V ]
3
3.5
Fig.12 Measurement Result
DVI Dependency
2010.04 - Rev.C
BH1750FVI
Technical Note
●Block Diagram
DVI
VCC
AMP
Logic
+
I C Interface
ADC
2
SCL
SDA
PD
OSC
GND
ADDR
●Block Diagram Descriptions
・PD
Photo diode with approximately human eye response.
・AMP
Integration-OPAMP for converting from PD current to Voltage.
・ADC
AD converter for obtainment Digital 16bit data.
2
・Logic + I C Interface
Ambient Light Calculation and I2C BUS Interface. It is including below register.
Data Register → This is for registration of Ambient Light Data. Initial Value is "0000_0000_0000_0000".
Measurement Time Register → This is for registration of measurement time. Initial Value is "0100_0101".
・OSC
Internal Oscillator ( typ. 320kHz ). It is CLK for internal logic.
●Measurement Procedure
Power supply
Initial state is Power Down mode after
VCC and DVI supply.
State is automatically changed to
Power Down mode.
Power Down
Power On
Measurement Command
Continuous Measurement
One Time Measurement
State Transition by I2C write-command.
Automatically State Transition
*
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4/17
"Power On" Command is possible to omit.
2010.04 - Rev.C
BH1750FVI
Technical Note
●Instruction Set Architecture
Instruction
Opecode
Comments
Power Down
0000_0000
No active state.
Power On
0000_0001
Waiting for measurement command.
Reset
0000_0111
Continuously H-Resolution Mode
0001_0000
Continuously H-Resolution Mode2
0001_0001
Continuously L-Resolution Mode
0001_0011
One Time H-Resolution Mode
0010_0000
One Time H-Resolution Mode2
0010_0001
One Time L-Resolution Mode
0010_0011
Change Measurement time
( High bit )
Change Masurement time
( Low bit )
01000_MT[7,6,5]
011_MT[4,3,2,1,0]
Reset Data register value. Reset command is not acceptable in
Power Down mode.
Start measurement at 1lx resolution.
Measurement Time is typically 120ms.
Start measurement at 0.5lx resolution.
Measurement Time is typically 120ms.
Start measurement at 4lx resolution.
Measurement Time is typically 16ms.
Start measurement at 1lx resolution.
Measurement Time is typically 120ms.
It is automatically set to Power Down mode after measurement.
Start measurement at 0.5lx resolution.
Measurement Time is typically 120ms.
It is automatically set to Power Down mode after measurement.
Start measurement at 4lx resolution.
Measurement Time is typically 16ms.
It is automatically set to Power Down mode after measurement.
Change measurement time.
※ Please refer "adjust measurement result for influence of optical window."
Change measurement time.
※ Please refer "adjust measurement result for influence of optical window."
※ Don't input the other opecode.
●Measurement mode explanation
Measurement Mode
Measurement Time.
Resolurtion
H-resolution Mode2
Typ. 120ms.
0.5 lx
H-Resolution Mode
Typ. 120ms.
1 lx.
L-Resolution Mode
Typ. 16ms.
4 lx.
We recommend to use H-Resolution Mode.
Measurement time ( integration time ) of H-Resolution Mode is so long that some kind of noise( including in 50Hz / 60Hz
noise ) is rejected. And H-Resolution Mode is 1 l x resolution so that it is suitable for darkness ( less than 10 lx )
H-resolution mode2 is also suitable to detect for darkness.
●Explanation of Asynchronous reset and Reset command "0000_0111"
1) Asynchronous reset
All registers are reset. It is necessary on power supply sequence. Please refer "Timing chart for VCC and DVI power
supply sequence" in this page. It is power down mode during DVI = 'L'.
2) Reset command
Reset command is for only reset Illuminance data register. ( reset value is '0' ) It is not necessary even power supply
sequence.It is used for removing previous measurement result. This command is not working in power down mode, so
that please set the power on mode before input this command.
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5/17
2010.04 - Rev.C
BH1750FVI
Technical Note
●Timing chart for VCC and DVI power supply sequence
DVI is I2C bus reference voltage terminal. And it is also asynchronous reset terminal. It is necessary to set to 'L'
supplied. In DVI 'L' term, internal state is set to Power Down mode.
after VCC is
1) Recommended Timing chart1 for VCC and DVI supply.
VCC
DVI
Reset Term ( more than 1us )
2) Timing chart2 for VCC and DVI supply.
( If DVI rises within 1µs after VCC supply )
VCC
DVI
Reset Term ( more than 1us )
Don't care state
ADDR, SDA, SCL is not stable if DVI 'L' term ( 1us ) is not given by systems.
In this case, please connect the resisters ( approximately 100kOhm ) to ADDR without directly
connecting to VCC or GND,
because it is 3 state buffer for Internal testing.
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6/17
2010.04 - Rev.C
BH1750FVI
Technical Note
●Measurement sequence example from "Write instruction" to "Read measurement result"
ex1) Continuously H-resolution mode ( ADDR = 'L' )
from Slave to Master
from Master to Slave
① Send "Continuously H-resolution mode " instruction
ST
0100011
0
Ack
00010000
Ack
SP
② Wait to complete 1st H-resolution mode measurement.( max. 180ms. )
③ Read measurement result.
ST
0100011
1
Ack
Low Byte [ 7:0 ]
High Byte [ 15:8 ]
Ack
Ack
SP
How to calculate when the data High Byte is "10000011" and Low Byte is "10010000"
( 215 + 29 + 28 + 27 + 24 ) / 1.2 ≒ 28067 [ lx ]
The result of continuously measurement mode is updated.( 120ms.typ at H-resolution mode, 16ms.typ at L-resolution
mode )
ex2 ) One time L-resolution mode ( ADDR = 'H' )
① Send "One time L-resolution mode " instruction
ST
1011100
0
Ack
00100011
Ack
SP
② Wait to complete L-resolution mode measurement.( max. 24ms. )
③ Read measurement result
ST
1011100
1
Ack
Low Byte [ 7:0 ]
High Byte [ 15:8 ]
Ack
Ack
SP
How to calculate when the data High Byte is "00000001" and Low Byte is "00010000"
8
4
( 2 + 2 ) / 1.2 ≒ 227 [ lx ]
In one time measurement, Statement moves to power down mode after measurement completion.If updated result is need
then please resend measurement instruction.
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7/17
2010.04 - Rev.C
BH1750FVI
Technical Note
●Application circuit example of DVI terminal
The DVI terminal is an asynchronous reset terminal. Please note that there is a possibility that IC doesn't operate normally
if the reset section is not installed after the start-up of VCC.
(Please refer to the paragraph of "Timing chart for VCC and DVI power supply sequence" )
The description concerning SDA and the terminal SCL is omitted in this application circuit example. Please design the
application the standard of the I2C bus as it finishes being satisfactory. Moreover, the description concerning the terminal
ADDR is omitted. Please refer to the paragraph of "Timing chart for VCC and DVI power supply sequence" about the terminal
ADDR design.
ex 1) The control signal line such as CPU is connected.
BH1750FVI
0.1µF
VCC
SCL
ADDR
DVI
GND
SDA
Micro
Controller
0.1µF
ex 2) Reset IC is used.
1, For Reset IC of the Push-Pull type
BH1750FVI
0.1µF
VCC
SCL
ADDR
DVI
GND
SDA
0.1µF
RESET
Reset IC( Push-Pull type )
2, For Reset IC of the Open drain output
BH1750FVI
VCC
0.1µF
1kOhm
SCL
ADDR
DVI
GND
SDA
0.1µF
RESET
Reset IC( Open drain type )
ex 3) A different power supply is used.
BH1750FVI
VCC
0.1µF
V1
SCL
ADDR
DVI
GND
SDA
V2
0.1µF
※ Power supply of DVI must stand up later than power supply of VCC stand up, because it is necessary to secure reset section ( 1µs or more ).
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8/17
2010.04 - Rev.C
BH1750FVI
Technical Note
ex 4) LPF using CR is inserted between VCC and DVI.
This method has the possibility that the Reset section of turning on the power supply can not satisfied. cannot be satisfied.
Please design the set considering the characteristic of the power supply enough.
R1 : 1kOhm
BH1750FVI
0.1µF
VCC
SCL
ADDR
DVI
GND
SDA
C1 : 1µF
◆ Notes when CR is inserted between VCC and DVI
※ Please note that there is a possibility that reset section ( 1µs ) can not be satisfied because the power supply is turned on when the rise time of VCC is slow
※ When VCC is turned off, the DVI voltage becomes higher than VCC voltage but IC destruction is not occred if recommended constant
( R1 = 1kOhm, C1 = 1µF ) is used.
※ Please note that there is a possibility that Reset section (1µsec) cannot be satisfied if wait time is not enough long after turning off VCC.
(It is necessary to consider DVI voltage level after turning off VCC.)
t1
VCC
t2
DVI
2.4V
0.4V
Reset
0V
* Please
Section : 1us or more
do the application design to secure Reset section 1us or more after the reclosing of the power supply.
◆ Example of designing set when CR ( C = 1µF, R = 1kΩ ) is inserted between VCC and DVI with VCC=2.8V
①The rise time to 0→2.4V of VCC must use the power supply of 100µs or less.
②Please wait 25ms or more after VCC turn off ( VCC <= 0.05V ), because it is necessary to secure reset section
( 1µs or more ).
Rise time of power supply : 100us or less
2.8V
Time to power supply reclosing : 25ms or more
れ
VCC
DVI
2.4V
0.4V
0V
0.05V
Reset Section : 1us or more
*
Please do the application design to secure Reset section 1us or more after the reclosing of the power supply.
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9/17
2010.04 - Rev.C
BH1750FVI
Technical Note
●I2C Bus Access
1 ) I2C Bus Interface Timing chart
2
Write measurement command and Read measurement result are done by I C Bus interface. Please refer the formally
2
specification of I C Bus interface, and follow the formally timing chart.
SDA
tSU ; DAT
tr
tf
tf
tHD ; STA
HD
tLOW
tr
tBUF
SCL
tSU ; STA
tHD ; STA
S
S
tSU;STO
tHD ; DAT
P
Sr
tHIGH
t
S
S
2) Slave Address
Slave Address is 2 types, it is determined by ADDR Terminal
ADDR = ‘H’ ( ADDR ≧ 0.7VCC ) → “1011100“
ADDR = 'L' ( ADDR ≦ 0.3VCC ) → “0100011“
3 ) Write Format
BH1750FVI is not able to accept plural command without stop condition. Please insert SP every 1 Opecode.
R/W
0
Slave Address
ST
Ack
Opecode
Ack
SP
4 ) Read Format
ST
R/W
1
Slave Address
7
2
26
Ack
Low Byte [7:0]
25 24 23 22
15
2
21
20
High Byte [15:8]
214 213 212 211 210 29 28
Ack
Ack
SP
from Slave to Master
from Master to Slave
ex )
High Byte = "1000_0011"
Low Byte = "1001_0000"
15
9
8
7
4
( 2 + 2 + 2 + 2 + 2 ) / 1.2 ≒ 28067 [ lx ]
* I2C BUS is trademark of Phillips Semiconductors. Please refer formality specification.
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10/17
2010.04 - Rev.C
BH1750FVI
Technical Note
●Adjust measurement result for influence of optical window. ( sensor sensitivity adjusting )
BH1750FVI is possible to change sensor sensitivity. And it is possible to cancel the optical window influence ( difference with
/ without optical window ) by using this function. Adjust is done by changing measurement time. For example, when
transmission rate of optical window is 50% ( measurement result becomes 0.5 times if optical window is set ), influence of
optical window is ignored by changing sensor sensitivity from default to 2 times
Sensor sensitivity is shift by changing the value of MTreg ( measurement time regisiter ). MTreg value has to set 2 times if
target of sensor sensitivity is 2 times. Measurement time is also set 2 times when MTreg value is changed from default to 2
times.
ex) Procedure for changing target sensor sensitivity to 2 times.
Please change Mtreg from ”0100_0101” ( default ) to ”1000_1010” ( default * 2 ).
1) Changing High bit of MTreg
ST
Slave Address
R/W
0
Ack
01000_100
Ack
SP
R/W
0
Ack
011_01010
Ack
SP
R/W
0
Ack
0001_0000
Ack
SP
2) Changing Low bit of MTreg
ST
Slave Address
3) Input Measurement Command
ST
Slave Address
* This example is High Resolution mode, but it accepts the other measurement.
4) After about 240ms, measurement result is registered to Data Register.
( High Resolution mode is typically 120ms, but measurement time is set twice. )
The below table is seeing the changable range of MTreg.
changable
range of MTreg
binary
decimal
Min.
0001_1111
( sensitivity : default * 0.45 )
31
( sensitivity : default * 0.45 )
Typ.
0100_0101
default
69
default
Max.
1111_1110
( sensitivity : default * 3.68 )
254
( sensitivity : default * 3.68 )
It is possilbe to detect 0.23lx by using this function at H-resolution mode. And it is possilbe to detect 0.11lx by using this
function at H-resolution mode2.
The below formula is to calculate illuminance per 1 count.
H-reslution mode : Illuminance per 1 count ( lx / count ) = 1 / 1.2 *( 69 / X )
H-reslution mode2 : Illuminance per 1 count ( lx / count ) = 1 / 1.2 *( 69 / X ) / 2
1.2 : Measurement accuracy
69 : Default value of MTreg ( dec )
X : MTreg value
The below table is seeing the detail of resolution.
Mtreg の値
lx / count
at H-resolutin mode
lx / count
at H-resolution mode2
0001_1111
1.85
0.93
0100_0101
0.83
0.42
1111_1110
0.23
0.11
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11/17
2010.04 - Rev.C
BH1750FVI
Technical Note
●H-Resolution Mode2
H-resolution mode2 is 0.5lx ( typ. ) resolution mode. It is suitable if under less than 10 lx measure ment data is necessary.
This measurement mode supports " Adjust measurement result for influence of optical window ". Please refer it. It is possible
to detect min. 0.11 lx by using H-resolution mode2.
○ Instruction set architecture for H-resolution mode2
Instruction
Opecode
Continuously H-Resolution Mode2
0001_0001
One Time H-Resolution Mode2
0010_0001
Comments
Start measurement at 0.5lx resolution.
Measurement Time is typically 120ms.
Start measurement at 0.5lx resolution.
Measurement Time is typically 120ms.
It is automatically set to Power Down mode after measurement.
○ Measurement sequence example from "Write instruction" to "Read measurement result"
ex) Continuously H-resolution mode2 ( ADDR = 'L' )
from Slave to Master
from Master to Slave
① Send "Continuously H-resolution mode2 " instruction
ST
0100011
0
Ack
00010001
Ack
SP
② Wait to complete 1st H-resolution mode2 measurement.( max. 180ms. )
③ Read measurement result.
ST
0100011
1
26
25
Ack
Low Byte [7:0]
24 23 22 21
20
High Byte [15:8]
214 213 212 211 210 29 28 27
2-1
Ack
Ack
SP
How to calculate when the data High Byte is "00000000" and Low Byte is "00010010"
( 23+ 20 ) / 1.2 ≒ 7.5 [ lx ]
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12/17
2010.04 - Rev.C
BH1750FVI
Technical Note
●Terminal Description
PIN No.
Terminal Name
1
Equivalent Circuit
VCC
Function
Power Supply Terminal
2
VCC
I C Slave-address Terminal
ADDR = ‘H’ ( ADDR ≧ 0.7VCC )
“1011100“
ADDR = 'L' ( ADDR ≦ 0.3VCC )
“0100011“
ADDR Terminal is designed as 3 state buffer for
internal test. So that please take care of VCC
and DVI supply procedure.Please see P6.
2
ADDR
3
GND
GND Terminal
4
SDA
I2C bus Interface SDA Terminal
5
DVI
SDA, SCL Reference Voltage Terminal
And DVI Terminal is also asynchronous Reset
for internal registers.So that please set to 'L'
( at least 1µs, DVI <= 0.4V ) after VCC is
supplied. BH1750FVI is pulled down by
150kOhm while DVI = 'L'.
6
SCL
150kΩ
I2C bus Interface SCL Terminal
※These values are design-value, not guaranteed.
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13/17
2010.04 - Rev.C
BH1750FVI
Technical Note
●Package Outlines
A
A
Lot No.
Product No.
WSOF6I ( Unit : mm )
●About an optical design on the device
0.8 mm
1.3 mm
Min.0.4 mm
Min.0.4 mm
PD area ( 0.25 mm x 0.3 mm )
Please design the optical window so that
light can cover at least this area.
Min.0.4 mm
Min.0.4 mm
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© 2010 ROHM Co., Ltd. All rights reserved.
14/17
2010.04 - Rev.C
BH1750FVI
Technical Note
●The method of distinguishing 1pin.
There is some method of distinguishing 1pin.
① Distinguishing by 1Pin wide-lead
② Distinguishing by die pattern
③ Distinguishing by taper part of 1-3pin side
② (by die patern) is the easiest method to distinguish by naked eye.
A
A
②
③
Production code
①
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© 2010 ROHM Co., Ltd. All rights reserved.
15/17
2010.04 - Rev.C
BH1750FVI
Technical Note
●Cautions on use
1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage ( Vmax ), temperature range of operating conditions
( Topr ), etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open
circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take
physical safety measures including the use of fuses, etc.
2) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
3) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
4) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
5) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,
for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
6) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals; such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
7) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation ( Pd ) in actual
states of use.
8) Treatment of package
Dusts or scratch on the photo detector may affect the optical characteristics. Please handle it with care.
9) Rush current
When power is first supplied to the CMOS IC, it is possible that the internal logic may be unstable and rush current may
flow instantaneously. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND
wiring, and routing of connections.
10) The exposed central pad on the back side of the package
There is an exposed central pad on the back side of the package. But please do it non connection. ( Don't solder, and
don't do electrical connection ) Please mount by Footprint dimensions described in the Jisso Information for WSOF6I. This
pad is GND level, therefore there is a possibility that LSI malfunctions and heavy-current is generated.
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© 2010 ROHM Co., Ltd. All rights reserved.
16/17
2010.04 - Rev.C
BH1750FVI
Technical Note
●Ordering part number
B
H
1
Part No.
7
5
0
F
Part No.
V
I
Package
FVI: WSOF6I
-
T
R
Packaging and forming specification
TR: Embossed tape and reel
WSOF6I
<Tape and Reel information>
1.6 ± 0.1
(MAX1.8 include BURR)
0.5 0.5
0.3
4
4
5
0.75MAX
0.27 ±0.05
2
3000pcs
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
(1.2)
2
)
1pin
(1.4)
3
3
1
0.3
0.5
Embossed carrier tape
Quantity
6
(1.5)
(0.45)
1
0.525
Tape
Direction
of feed
(0.15)
3.0 ±0.1
5
2.6 ±0.1
(MAX2.8 include BURR)
6
0.3
0.275
0.145 ±0.05
S
0.08 S
0.22 ± 0.05
0.08
Direction of feed
M
(Unit : mm)
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© 2010 ROHM Co., Ltd. All rights reserved.
Reel
17/17
∗ Order quantity needs to be multiple of the minimum quantity.
2010.04 - Rev.C
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2010 ROHM Co., Ltd. All rights reserved.
R1010A