Formosa MS SMD Transient Voltage Suppressor For ESD Protection ESD5Zxx SERIES List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Electrical characteristics................................................................... 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision DS-221824 2009/08/10 2012/01/10 F Page. 7 Formosa MS SMD Transient Voltage Suppressor For ESD Protection ESD5Zxx SERIES Surface Mount Uni-Directional TVS For ESD Protection Diode - 3.3V - 5.0V Package outline Features • Stand−off Voltage: 3.3V~5.0V • Peak Power up to 200 Watts@8 x 20 u s Pulse • Low Leakage • Response Time is Typically < 1 ns • ESD rating of class 3 ( > 16kV) per human body Model • IEC61000-4-2 level 4 ESD protection • IEC61000-4-4 level 4 FET protection • Lead-free parts meet environmental standards of 0.014(0.35) 0.009(0.25) 0.035(0.90) 0.028(0.70) SOD-523FL 0.051(1.30) 0.043(1.10) MIL-STD-19500 /228 • Suffix "-H" indicates Halogen-free part, ex.ESD5Z2.5-H 0.028(0.70) 0.020(0.50) 0.007(0.20) 0.002(0.05) Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOD-523FL • Terminals : Solder plated, solderable per 0.067(1.70) 0.059(1.50) MIL-STD-750, Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.002 gram Dimensions in inches and (millimeters) Maximum ratings (at T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Total power dissipation Symbol Value UNIT P PP 200 W Peak Pulse Power (tp = 8/20us) ±15 Electrostatic discharge IEC61000-4-2 Air discharge IEC61000-4-2 Contact discharge ESD voltage Per Human Body Model 16 Electrostatic discharge IEC61000-4-4 40 kV ±8 kV A Lead solder temperature-maximum 10 second duration TL 260(10s) o C Junction Temperature TJ +150 o C Storage temperature T STG -55~+150 o C Operating Temperature T OP -40~+125 o C Electrical characteristics (at T =25 C unless otherwise noted, V F = 0.9V Max. o A Part No. V RWM (V) I R(uA) @V RWM V BR(V)@I T (Note 2) Max Max Min IT (mA) ESD5Z3.3 3.3 1.0 5.0 1.0 ESD5Z5.0 5.0 1.0 6.2 1.0 @ I F =10mA for all types ) V C(V)(Note 1) @ I PP=5.0A I PP(A) (Note 1) V C(V)(Note 1) @Max I PP Typ Max Max P PK (W) (Note 1) Max 8.4 11.2 14.1 158 11.6 9.4 18.6 174 C(pF) Typ 105 80 Note 1. Surge current waveform per Fig.1 2. V BR is measured with a pulse test current I T at an ambient temperature of 25°C. Http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date Revised Date Revision DS-221824 2009/08/10 2012/01/10 F Page. 7 Formosa MS SMD Transient Voltage Suppressor For ESD Protection ESD5Zxx SERIES Typical characteristics (at T =25 C unless otherwise noted) o A I IF V C V BR V RWM IR IT V VF I PP Uni-Directional TVS V C : Clamping Voltage @ I PP I PP : Maximum Reverse Peak Pulse Current V RWM : Working Peak Reverse voltage I R : Maximum Reverse Leakage Current @V RWM V BR : Breakdown voltage @I T I T : Test Current P PK : Peak Power Dissipation I F : Forward Current V F : Forward Voltage @ I F C : Max. Capacitance @V R = 0 and f = 1MHz Rating and characteristic curves (ESD5Zxx SERIES) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date Revision DS-221824 2009/08/10 2012/01/10 F Page. 7 Formosa MS SMD Transient Voltage Suppressor For ESD Protection ESD5Zxx SERIES Application Note Electrostatic discharge (ESD) is a major cause of failure in electronic system. Transient Voltage Suppressors (TVS) are an ideal choice for ESD protection. They are capable of clamping the incoming transient to a low enough level such that damage to the protected semiconductor is prevented. Surface mount TVS offers the best choice for minimal lead inductance. They serve as parallel protection elements, connected between the signal lines to ground. As the transient rise above the operating voltage of the device, the TVS becomes a low impedance path diverting the transient current to ground. The ESD5Zxx Series is the ideal board evel protection of ESD senditive semiconductor components. The tiny SOD-523FL package allows design flexibility in the design of high density boards where the space is at a premium. This enables to shorten the routing and contributes to hardening against ESD. Pinning information Pin1 Pin2 Pin Simplified outline cathode anode 1 Symbol 1 2 2 Marking Type number Marking code ESD5Z3.3 ESD5Z5.0 ZE ZF Suggested solder pad layout C A B Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 PACKAGE A B C SOD-523FL 0.032 (0.80) 0.024 (0.60) 0.044 (1.10) Page 4 Document ID Issued Date Revised Date Revision DS-221824 2009/08/10 2012/01/10 F Page. 7 Formosa MS SMD Transient Voltage Suppressor For ESD Protection ESD5Zxx SERIES Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Symbol Tolerance Carrier width Carrier length Carrier depth Sprocket hole A B C d 0.05 0.05 0.1 0.1 0.96 1.94 0.76 1.50 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width D D1 D2 E F P P0 P1 T W W1 1.0 0.4 0.05 0.01 0.05 0.05 0.1 0.05 0.02 0.4 0.2 178.00 54.40 1.30 1.75 3.50 2.00 4.00 2.00 0.18 8.00 12.30 Item SOD-523FL Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision DS-221824 2009/08/10 2012/01/10 F Page. 7 Formosa MS SMD Transient Voltage Suppressor For ESD Protection ESD5Zxx SERIES Reel packing PACKAGE SOD-523FL REEL SIZE REEL (pcs) COMPONENT SPACING (m/m) 7" 3,000 4.0 BOX (pcs) INNER BOX (m/m) 30,000 183*183*123 REEL DIA, (m/m) CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) 178 382*262*387 240,000 9.5 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page6 Document ID Issued Date Revised Date Revision DS-221824 2009/08/10 2012/01/10 F Page. 7 Formosa MS SMD Transient Voltage Suppressor For ESD Protection ESD5Zxx SERIES High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V RWM=100% rate at T J=125 OC for 168 hrs. MIL-STD-750D METHOD-1026 4. Pressure Cooker 15P SIG at T A=121 OC for 4 hrs. JESD22-A102 5. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1051 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1038 at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 6. Thermal Shock 7. Humidity 8. High Temperature Storage Life http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date Revision DS-221824 2009/08/10 2012/01/10 F Page. 7