Formosa MS SMD Switching Diode 1N4148WS-FL List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date DS-221954 2009/08/10 2011/08/12 Revision B Page. 7 Formosa MS SMD Switching Diode 1N4148WS-FL 200mW Surface Mount Switching Diode-100V Features • Fast switching speed. • Electrically identical to standard JEDEC. • Surface mount package ideally suited for automatic insertion. • Tiny plastic SMD package. • High Conductance. • Silicon epitaxial planar chip. • Lead-free parts for green partner, exceeds environmental Package Outline SOD-323FL 0.106(2.70) 0.091(2.30) standards of MIL-STD-19500 /228 • Suffix "-H" indicates Halogen-free parts, ex. 1N4148WS-FL-H 0.016(0.40) 0.010(0.25) 0.053(1.35) 0.045(1.15) 0.078(1.95) 0.063(1.60) Mechanical data • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, SOD-323FL • Terminals :Plated terminals, solderable per MIL-STD-750, 0.010(0.25) 0.002(0.05) 0.039(1.00) 0.028(0.70) Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.004 gram Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT PARAMETER T A=25 oC unless otherwise noted) Symbol 1N4148WS-FL UNIT Maximum reverse voltage VR 75 V Maximum peak reverse voltage V RM 100 V Maximum RMS voltage V RMS 50 V Maximum DC blocking voltage V DC 75 V Maximum average forward current at T A = 25 oC IO 150 mA Maximum peak forward surge current, 1.0us I FSM 2.0 A PD 200 mW VF 0.715@IF=0.001A 0.855@ IF= 0.01A 1.0@ IF= 0.05A 1.25@ IF= 0.15A V Maximum DC reverse current at rated DC blocking voltage T J = 25 oC IR 0.025@VR=20V 1.0@VR=75V Typical junction capacitance (Notes 1) o Maximum power dissipation derate above 25 C Maximum forward voltage CJ 2.0 Maximum reverse recovery time (Notes 2) t rr 4.0 Typical thermal resistance junction to ambient R θJA 500 Operating junction and Storage Temperature Range T J , T STG uA pF ns o C/W o -55 to +150 C Notes : 1. C J at V R = 0V, f = 1MHZ 2. From I F = 10mA to I R = 1mA, V R = 6V, R L = 100ohm http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date Revised Date DS-221954 2009/08/10 2011/08/12 Revision B Page. 7 Rating and characteristic curves (1N4148WS-FL) Fig. 1 TYPICAL FORWARD CHARACTERISTICS Fig. 2 TYPICAL REVERSE CHARACTERISTICS REVERSE CURRENT , (uA) FORWARD CURRENT ,(mA) T J=125°C T J=25°C T J=75°C T J=25°C 0 FORWARD VOLTAGE , (V) 20 40 60 80 100 REVERSE VOLTAGE ,(V) P D, POWER DISSIPATION, (mW) Fig. 3 POWER DERATING CURVE 250 200 150 100 50 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE ( oC ) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date DS-221954 2009/08/10 2011/08/12 Revision B Page. 7 Formosa MS SMD Switching Diode 1N4148WS-FL Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code 1N4148WS-FL S1 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-323FL 0.032 (0.82) 0.022 (0.56) 0.069 (1.75) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date DS-221954 2009/08/10 2011/08/12 Revision B Page. 7 Formosa MS SMD Switching Diode 1N4148WS-FL Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-323FL Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 1.46 2.95 1.25 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date DS-221954 2009/08/10 2011/08/12 Revision B Page. 7 Formosa MS SMD Switching Diode 1N4148WS-FL Reel packing PACKAGE REEL SIZE SOD-323FL 7" REEL (pcs) COMPONENT SPACING (m/m) 4.0 3,000 BOX (pcs) 30,000 INNER BOX (m/m) REEL DIA, (m/m) CARTON SIZE (m/m) 183*183*123 178 382*262*387 APPROX. CARTON GROSS WEIGHT (pcs) (kg) 240,000 9.5 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date DS-221954 2009/08/10 2011/08/12 Revision B Page. 7 Formosa MS SMD Switching Diode 1N4148WS-FL High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. Forward Surge JESD22-A102 15P SIG at T A=121 OC for 4 hrs. -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1051 Peak forward surge current MIL-STD-750D METHOD-4066-2 9. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 10. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date DS-221954 2009/08/10 2011/08/12 Revision B Page. 7