WT-T3A83DNC-60P

WT-T3A83DNC-60P
PLCC TOP View LED
Product Specifications
Item
Specification
Material
Quantity
Min 6300-9000 mcd
IV
@60mA / Ts= 25℃;Tolerance: + 10%
Chromaticity
As page 6~8
Coordinate
@60mA/ TS= 25℃;Tolerance: + 0.005
Vf
2.8~3.4 V (0.1V/Bin)
@60mA/ TS= 25℃;Tolerance: + 0.05V
Resin
Yellow
Silicon Resin
CRI
CRI>70, Tolerance+ 2
Carrier tape
EIA 481-1A specs
Conductive black tape
Reel
EIA 481-1A specs
Conductive black
Label
WT standard
Paper
Packing bag
220x240mm
Aluminum laminated bag/ no-zipper
One reel per bag
Carton
WT standard
Paper
Non-specified
Others:
Each immediate box consists of 5 reels. The 5 reels may not necessarily have the same lot number or the same bin
combinations of Iv, CIE and Vf. Each reel has a label identifying its specification; the immediate box consists of a product
label as well.
Note :This is shipped test conditions
※Remarks: This product should be operated in forward bias. If a reverse voltage is continuously applied to the product,
such operation can cause migration resulting in LED damage.
ATTENTION: Electrostatic Discharge (ESD) protection
The symbol to the left denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based
chips is necessary even though they are relatively safe in the presence of low static-electric discharge. Parts
built with AlInGaP, GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD precaution must
be taken during design and assembly.
If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process.
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Label Specifications
■WEITRON P/N:
T
3A8
3
DNC
60P-
Product
Dice
Current
LF
3:Tri
60mA
Package
Color
5.4(L)x5.0(W)x1.5(H)mm
DNC:White , CRI>70
■ Lot No.:
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Specifications Range
■ (Iv) Bin:
Color
White
Bin Code
Spec. Range(mcd)
AG2
6300-7150 mcd
AH1
7150-8000 mcd
AH2
8000-9000 mcd
Note: It maintains a tolerance of ±10% on IV
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■Color Bin:
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■Chromaticity Coordinate
Note: It maintains a tolerance of x, y ±0.005
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■Forward Voltage (Vf) Bin:
Color
White
Bin Code
Spec. Range
H1
2.8-2.9V
H2
2.9-3.0V
H3
3.0-3.1V
H4
3.1-3.2V
J1
3.2-3.3V
J2
3.3-3.4V
Note: It maintains a tolerance of ±0.05V on forward voltage measurements
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Product Features
Electro-Optical Characteristics
o
TSoldering , 25 C)
VF(V)
Series
Emitting Color
Material
Chromaticity Coordinate
IV(mcd)
typ
max
x,y
Typical
Viewing Angle
2
1
2
T3A83
Cold White
InGaN
3.0
3.4
x=0.345,y=0.35
7000
120
T3A83
Neutral White
InGaN
3.0
3.4
x=0.38,y=0.38
6500
120
T3A83
Warm White
InGaN
3.0
3.4
x=0.435,y=0.405
6300
120
Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering
Unit: mm Tolerance: +/-0.1
Outline Dim.
Soldering Pattern
Soldering terminals may shift in the x, y direction.
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Absolute Maximum Ratings
o
(TSoldering 25 C)
Series
PD (mW)
IF (mA)
Color
Power Dissipation
Forward Current
Cold White
204
Neutral White
Warm White
o
o
IFP (mA)*
TOP ( C)
TST ( C)
Peak Forward
Operating
Current
Temperature
60
90
-40~+85
-40~+100
204
60
90
-40~+85
-40~+100
204
60
90
-40~+85
-40~+100
Storage Temperature
* Condition for IFP is pulse of 1/10 duty and 0.1msec width
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Characteristics of T3A83DNC
Directive Characteristics
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Precaution for Use
1. The chips should not be used directly in any type of fluid such as water, oil, organic
solvent, etc.
2. When the LEDs are illuminating, the maximum ambient temperature should be first
considered before operation.
3. LEDs must be stored in a clean environment. A sealed container with a nitrogen
atmosphere is necessary if the storage period is over 3 months after shipping.
4. The LEDs must be used within seven days after unpacked. Unused products must be
5.
6.
repacked in an anti-electrostatic package, folded to close any opening and then stored in
a dry and cool space.
The appearance and specifications of the products may be modified for improvement
without further notice.
The LEDs are sensitive to the static electricity and surge. It is strongly recommended to
use a grounded wrist band and anti-electrostatic glove when handling the LEDs.If a
voltage over the absolute maximum rating is applied to LEDs, it will damage
LEDs.Damaged LEDs will show some abnormal characteristics such as remarkable
increase of leak current, lower turn-on voltage and getting unlit at low current.
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Packaging
Tape Dimension
Dim. A
Dim. B
Dim. C
Q’ty/Reel
5.5±0.1
5.3±0.1
1.6±0.1
1K
Unit: mm
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Reel Dimension
Packing
5 boxes per carton is available depending on shipment quantity.
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Dry Pack
All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times
during transportation or storage. Every reel is packaged in a moisture protected anti-static bag.
Each bag is properly sealed prior to shipment.
Upon request, a humidity indicator will be included in the moisture protected anti-static bag
prior to shipment.
The packaging sequence is as follows:
Baking
Baking before soldering is recommended when the package has been unsealed for 72 hours.
The conditions are as followings:
1. 60±3℃×(12~24hrs)and<5%RH, taped reel type.
2. 100±3℃×(45min~1hr), bulk type.
3.
130±3℃×(15min~30min), bulk type.
Precautions
1. Avoid exposure to moisture at all times during transportation or storage.
2. Anti-Static precaution must be taken when handling GaN, InGaN, and AlInGaP products.
3. It is suggested to connect the unit with a current limiting resistor of the proper size. Avoid
applying a reverse voltage beyond the specified limit.
4. Avoid operation beyond the limits as specified by the absolute maximum ratings.
5. Avoid direct contact with the surface through which the LED emits light.
6. If possible, assemble the unit in a clean room or dust-free environment.
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Handling of Silicone Resin LEDs
Handling Indications
During processing, mechanical stress on the surface should be minimized as much as
possible.
Sharp objects of all types should not be used to pierce the sealing compound.
Figure 1
In general, LEDs should only be handled from the side. By the way ,this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
Figure 2
When populating boards in SMT production, there are basically no restrictions regarding the
from of the pick and place nozzle, except that mechanical pressure on the surface of the resin
must be prevented.
This is assured by choosing a pick and place nozzle which is large than LEDs reflector area.
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Reflow Soldering
Recommend soldering paste specifications:
1. Operating temp.: Above 220 OC ,60 sec.
2. Peak temp.:260 OCMax.,10sec Max.
3. Reflow soldering should not be done more than two times.
4. Never attempt next process until the component is cooled down to room temperature after
reflow.
5. The recommended reflow soldering profile (measured on the surface of the LED terminal)
is as following:
Lead-free Solder Profile
Reworking

Rework should be completed within 5 seconds under 260 OC.


The iron tip must not come in contact with the copper foil.
Twin-head type is preferred.
Cleaning
Following are cleaning procedures after soldering:




An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended.
Temperature x Time should be 50oC x 30sec. or <30oC x 3min
Ultrasonic cleaning: < 15W/ bath; bath volume ≤ 1liter
Curing: 100 OC max, <3min
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