WT-U3A8TW-8539 TOP Mount Super Bright SMD LED Product Specifications Specification Material Quantity Resin Cool White Silicone Resin Carrier tape EIA 481-1A specs Conductive black tape Reel EIA 481-1A specs Conductive black Label WT standard Paper Packing bag 220x240mm Aluminum laminated bag/ no-zipper One reel per bag Carton WT standard Paper Non-specified 1000pcs per reel Others: Each immediate box consists of 5 reels. The 5 reels may not necessarily have the same lot number or the same bin combinations of Iv, λD and Vf. Each reel has a label identifying its specification; the immediate box consists of a product label as well. ATTENTION: Electrostatic Discharge (ESD) protection The symbol to the left denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based chips is necessary even though they are relatively safe in the presence of low static-electric discharge. Parts built with AlInGaP, GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD precaution must be taken during design and assembly. If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process. WEITRON http://www.weitron.com.tw 1/12 01-Feb-2013 WT-U3A8TW-8539 Label Specifications ▓ WEITRON P/N : T W - U 3 A 8 Series Name TW Emitting Color WT-U3A8 TW WT: WEITRON TW = InGaN White@60mA, ® U: tLED series 5.4(L) x 5.0(W) x 1.5(H) mm - 8539 Custom code 8539 Custom specified code 20mA Single crystal 60mA Three crystal 3A8: PLCC6 package WEITRON http://www.weitron.com.tw 2/12 01-Feb-2013 WT-U3A8TW-8539 ▓ Lot No.: Code 1 1 2 3 4 5 6 7 8 P 1 2 2 3 0 A - 9 10 D T Code 2 Code 3 Code 4, 5 Code 6, 7 Code 9 Code 10 Mfg. Year Mfg. Month Mfg. Date Lots Resin Color Packaging 1: Jan. Z: 2000 2: Feb. Internal 1: 2001 …. Tracing 2: 2002 9: Sep. Code 3: 2003 A: Oct. ….. B: Nov. 1~31/ (30) 01~99, A,B,C… C: Clear D: Milky White T: Tape & Reel C: Dec. ▓ Luminous Intensity (Iv) Bin: Color Bin Code Spec. Range (mcd) AG1 5600~6300 AG2 6300~7150 AH1 7150~8000 AH2 8000~9000 White If = 60mA per package / 20mA per die ▓ Forward Voltage (Vf) Bin: Forward Voltage Range (V) Bin White (TW) Min Max H2 2.9 3.0 H3 3.0 3.1 H4 3.1 3.2 J1 3.2 3.3 J2 3.3 3.4 Tolerance: + 0.05 V WEITRON http://www.weitron.com.tw 3/12 01-Feb-2013 WT-U3A8TW-8539 Correlated Color Temperature Rank D1A 6500~6750K x D0C y 6500~6750K x y 0.31 0.322 0.31175 0.3115 0.308 0.3345 0.31 0.322 0.31175 0.33775 0.3135 0.3255 0.3135 0.3255 0.3151 0.31475 0.31 0.322 0.31175 0.3115 D1B 6250~6500K x D0D y 6250~6500K x y 0.3135 0.3255 0.3151 0.31475 0.31175 0.33775 0.3135 0.3255 0.3155 0.341 0.317 0.329 0.317 0.329 0.3185 0.318 0.3135 0.3255 0.3151 0.31475 C1B 6750~7000K x C0D y 6750~7000K x y 0.3055 0.3165 0.307625 0.3065 0.303 0.3285 0.3055 0.3165 0.308 0.3345 0.31 0.322 0.31 0.322 0.31175 0.3115 0.3055 0.3165 0.307625 0.3065 E1A 6000K~6250K E1C x y 6000K~6250K x y 0.317 0.329 0.3155 0.341 0.3155 0.341 0.314 0.353 0.3205 0.34525 0.3195 0.3575 0.3215 0.333 0.3205 0.34525 0.317 0.329 0.3155 Note: It maintains a tolerance of ±5% on CCT WEITRON http://www.weitron.com.tw 0.341 4/12 01-Feb-2013 WT-U3A8TW-8539 Product Features Electro-Optical Characteristics (If=60mA @25ºC) Code for parts WT- U3A8TW White TW * λ (nm) VF(V) Lighting Color typ max λ 2.9 3.4 --- D λ P --- I V (mcd)* △λ Min. --- 5600.0 *If=20mA per die/ Ta= 25O C, total If=60mA in this package WEITRON http://www.weitron.com.tw 5/12 01-Feb-2013 WT-U3A8TW-8539 Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering Outline Dim. Unit: mm Tolerance: +/-0.1 Solder Pattern Soldering terminals may shift in the x, y direction. Absolute Maximum Ratings (Ta 25 oC) o o Series Pd (mW) IF (mA)* IFP (mA) VR (V) IR (uA) TOP ( C) TST ( C) WT- U3A8TW 74 25 80 5 <100@ VR = 5 -30~+80 -40~+85 *If=20mA per die/ Ta= 25O C, total If=60mA in this package ** Condition for IFP is pulse of 1/10 duty and 0.1msec width WEITRON http://www.weitron.com.tw 6/12 01-Feb-2013 WT-U3A8TW-8539 Characteristics Curves If=20mA per die/ Ta= 25O C, total If=60mA in this package. Relative Intensity vs. Forward Current @ 20mA Forward Voltage vs. Forward Current @ 20mA Directive Characteristics Directive Characteristics WEITRON http://www.weitron.com.tw 7/12 01-Feb-2013 WT-U3A8TW-8539 Packaging Tape, Reel, and Packing Model Tape Dimension Reel Dimension WEITRON http://www.weitron.com.tw 8/12 01-Feb-2013 WT-U3A8TW-8539 Precaution of Application Designing 1: Soldering pattern The dimensions of the recommended soldering pattern may not meet every user. Please confirm and study first before designing the soldering pattern in order to obtain the best performance of soldering. Designing 2: Circuit layout Due to the circuit design is not available, assuming the circuit is in parallel and a resistor that is put in series in the circuit, it cannot provide an effective current-limiting function to the LEDs due to each LED had a different inherent resistance. In general, the LEDs usually have a different inherent resistance. Different inherent resistance will cause different current, the LED on the different path would be driven at different power, and the result was the LED with a higher resistance would be dimmer than the other. To solve this situation, a suitable resistor is put in series with each LED to limit the current disparity through the LED will be very useful. Designing 3: Max Rating Any application should refer to the specifications of absolute maximum ratings. Dry Pack Any SMD optical device, like this chip LED, is MOISTURE SENSITIVE device. Avoid absorbing moisture at any time during transportation or storage. Every reel will be packaged in the moisture barrier anti-static bag (Specific bag material will depend upon customers’ requirement or option). And the bag is well sealed before shipment. By customer’s requirement, we will put a humidity indicator in each moisture barrier anti-static bag before shipment. WEITRON http://www.weitron.com.tw 9/12 01-Feb-2013 WT-U3A8TW-8539 The package Storage It’s recommended to store the products in the following conditions: Humidity: 60 %RH Max. Temperature: 5 OC ~30 OC (41OF~86 OF) 1 Shelf life in sealed bag: 12 month at<40 OC and <90%RH. (Base on aluminum laminated 2 moisture barrier bag.) After the bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing must be: 2.1 Mounted within 72 hours at factory conditions of≦ 30 OC /60% RH, or 2.2 Stored at ≦ 20% RH with zip-lock sealed. Baking It’s recommended to bake before soldering once the pack is unsealed open & re-sealed after 72 hours. The conditions are as followings: 60 ±3OC×(12~24hrs) and < 5% RH, taped reel type 100±3OC×(45min~1hr), bulk type 130±3OC×(15~30min), bulk type Soldering Manual soldering (We do not recommend this method strongly.) Soldering wire: 63/37 Sn/Pb, flux contained. To prevent cracking, please bake before manual soldering, if the device is subject to moisture. Temperature at tip of soldering tool : 300 OC±5 OC Max.(25W) It’s banned to load any stress on the resin during soldering. Soldering time : 3±1sec WEITRON http://www.weitron.com.tw 10/12 01-Feb-2013 WT-U3A8TW-8539 Handling of Silicone Resin LEDs Handling Indications During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should mot be used to pierce the sealing compound. Figure 1 In general, LEDs should only be handled from the side. By the way ,this also applies to LEDs without a silicone sealant, since the surface can also become scratched. Figure 2 When populating boards in SMT production, there are basically no restrictions regarding the from of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is large than LEDs reflector area. WEITRON http://www.weitron.com.tw 11/12 01-Feb-2013 WT-U3A8TW-8539 Reflow Soldering 1. Recommend soldering paste specifications: 2. Operating temp.: Above 220 OC ,60sec 3. Peak temp.:260 OCMax.,10sec Max. 4. Never take next process until the component is cooled down to room temperature after reflow. 5. The recommended reflow soldering profile (measuring on the surface of the LED terminal) is following: Lead-free Solder Cleaning The conditions of cleaning after soldering: An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended. Temperature×Time: <50 OC×30sec, or <30 OC×3min Ultra sonic cleaning: < 15W/ bath; Bath volume: 1liter max. Curing: 100 OC max, <3min Do not contact with component on the assembly board. Cautions of Pick and Place It should be avoided to load stress on the resin during high temperature. Avoid rubbing or scraping the resin by any object. Electric-static may cause damage to the component. Please confirm that the equipment grounding well. Using an ionizer fan is recommended. WEITRON http://www.weitron.com.tw 12/12 01-Feb-2013