DATA SHEET WIRELESS COMPONENTS Ceramic Chip Antenna ANT1003LL16R1524A 2.4GHZ AND GPS Product Specification – March 29, 2013 V.0 1003 Series Product specification WIRELESS COMPONENTS FEATURES z Compact size z Omni-directional radiation z Tape & reel automatic mounting z Reflow process compatible z RoHS compliant ORDERING INFORMATION APPLICATIONS z Tablet z Navigation device z Telematics box z Fleet management z 2.4 GHz WiFi device z Bluetooth gadget z Zigbee device (1) PRODUCT z ISM band equipment 2 2 Ceramic Chip Antenna All part numbers are identified by the series, packing type, material, size, antenna type, working frequency and packing quantity. PART NUMBER ANT 1003 L L16 R 1524A (1) (2) (3) (4) (5) (6) ANT = Antenna (2) SIZE 1003= 10 × 3 mm (3) ANTENNA TYPE L,F,A = Chip Antenna (4) SERIAL NO. L16 (5) PACKING TYPE R = Tape and Reel (6) WORKING FREQUENCY 1524 = 1.575 / 2.4GHz PHYCOMP CTC CAN4311756161521K 12NC 431175616152 www.yageo.com Mar. 29, 2013 V0 3 Product specification WIRELESS COMPONENTS 3 Ceramic Chip Antenna SPECIFICATION Table 1 VALUE DESCRIPTION Centre Frequency 1.575G / 2.45G Hz Bandwidth 50M / 140 MHz (Typ.) Return Loss 10 dB min Polarization Linear Azimuth Beamwidth Omni-directional Peak Gain 1.50 / 2.03 dBi ( Typ. ) Impedance 50 Ω – 40 °C ~ 105 °C Operating Temperature Maximum Power 1W Termination Ag (Environmentally-Friendly Leadless) Resistance to Soldering Heats 260℃ , 10sec. NOTE 1. The specification is defined on Yageo evaluation board DIMENSIONS Table 2 Machinical Dimension DIMENSION L (mm) 9.90 ± 0.15 W (mm) 3.20 ± 0.15 T (mm) 1.47 ± 0.15 A (mm) 2.81 ± 0.15 B (mm) 1.23 ± 0.15 C (mm) 1.03 ± 0.15 D (mm) 0.83 ± 0.15 E (mm) 2.39 ± 0.15 F (mm) 0.60 ± 0.15 OUTLINES Top View Side View L W Bottom View FUNCTION S1 BT Feeding Point / GND S2 GPS Feeding Point / GND S3 GND B D A A S3 S3 E TERMINAL NAME C S3 C S3 B S1 Table 3 Termination configuration T F S2 E YNH00108 Fig. 1 Antenna outlines www.yageo.com Mar. 29, 2013 V0 Product specification WIRELESS COMPONENTS 4 4 Ceramic Chip Antenna REFERENCE DESIGN OF EVALUATION BOARD 90 40 Unit : mm Fig. 2 Outlook and dimension of evaluation board Top Layer Bottom Layer / GND Unit : mm 0.4 4.07 0.3 1.0 4.07 0.65 0.85 1.35 1.45 6.4 3.85 1.4 3.0 4.2 4.2 0.9 0.75 10.8 Fig. 3 Details of soldering Pad YNH00109 www.yageo.com Mar. 29, 2013 V0 Product specification WIRELESS COMPONENTS 5 5 Ceramic Chip Antenna ELECTRICAL PERFORMANCES 50 50 Isolation (dB) Return loss (dB) GPS Port 30 30 10 10 BT Port −10 1 3 3 −10 4 6 2 4 −30 2 −30 1 5 −50 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 f (GHz) −50 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 f (GHz) Marker data Marker data 1. 2. 3. 4. 5. 6. 1. 2. 3. 4. 1.552GHz , -10dB 1.575GHz , -20.7dB 1.602GHz , -10dB 2.38 GHz , -10dB 2.45GHz , -29.9dB 2.52GHz , -10dB Fig. 4 Retrun losss 1.575GHz , -23.27dB 2.40GHz , -15.3dB 2.45GHz , -14.2dB 2.48GHz , -15dB YNH00110 Fig. 5 Isolation www.yageo.com Mar. 29, 2013 V0 Product specification WIRELESS COMPONENTS 6 6 Ceramic Chip Antenna Gain (dBi) 5.00 − Z axle -0.00 − − 5.00 − − 10.00 − − 15.00 − − 20.00 − − 25.00 − X axle Y axle − 30.00 − X Z − 35.00 − Frequency= 1.57 GHz Max gain = 1.50dBi, at (30,30) MEG (mean effective gain)= -0.78 dBi Directivity (dB) = 3.36 Efficiency = -1.86dB, 65.10 % Y Evaluation board and XYZ direction Gain (dBi) 5.00 − Z axle -0.00 − − 5.00 − − 10.00 − − 15.00 − − 20.00 − − 25.00 − X axle Y axle − 30.00 − − 35.00 − YNH00111 Frequency= 2.45 GHz Max gain = 2.03 dBi, at (60,150) MEG (mean effective gain)= -1.07 dBi Directivity (dB) = 2.80 Efficiency = -0.77dB, 83.75 % Fig. 6 Radiation pattern www.yageo.com Mar. 29, 2013 V0 Product specification WIRELESS COMPONENTS Ceramic Chip Antenna 7 7 REVISION HISTORY REVISION DATE CHANGE NOTIFICATION Version 0 - Mar. 29, 2013 DESCRIPTION - New data sheet for Ceramic Chip Antenna, 2.4GHz and GPS application, 1003 series www.yageo.com Mar. 29, 2013 V0