DATA SHEET
SURFACE-MOUNT CERAMIC
MULTILAYER CAPACITORS
Product Specification – Dec 06, 2010 V.11
Introduction
Product specification
Surface-Mount Ceramic Multilayer Capacitors
2
5
Introduction
GENERAL DATA
ORDERING INFORMATION - GLOBAL PART
Ceramic capacitors are widely used in electronic
circuitry for coupling, decoupling and in filters. These
different functions require specific capacitor
properties.
Capacitors are ordered in three ways. All ways give
logistic and packing information.
CERAMIC CAPACITORS CAN BE DIVIDED INTO TWO CLASSES:
Class
-
In these capacitors dielectric materials are used which
have a very high specific resistance, very good Q and
linear temperature dependence (r from 6 up to 550).
They are used in such applications as oscillators and
filters where low losses, capacitance drift
compensation and high stability are required.
Class
-
1
2
CTC:
This unique number is an easily-readable
code that is identified by the series, size,
tolerance, TC material, packing style, voltage,
process code, termination and capacitance value.
Global part number is preferred.
14~18 digits code (Global part number):
Yageo/Phycomp branded products
15 digits code (PHYCOMP CTC for North
America): Phycomp branded products
12NC:
These capacitors have higher losses and have nonlinear characteristics (r > 250). They are used for
coupling and decoupling.
In general, the carrier tape, voltage, size,
tolerance, packing and capacitance code are
integral parts of this number.
Phycomp branded product
Further information will be mentioned in the
relevant data sheet.
CONSTRUCTION
The capacitance of a ceramic capacitor depends on
the area of the electrodes (A), the thickness of the
ceramic dielectric (t) and the dielectric constant of
the ceramic material ( r ); and on the number of
dielectric layers (n) with multilayer ceramic
capacitors:
C r o
NUMBER, CTC FOR NORTH AMERICA & 12NC
A
n
t
The rated voltage is dependent on the dielectric
strength, which is mainly governed by the thickness
of the dielectric layer and the ceramic structure. For
this reason a reduction of the layer thickness is
limited.
Construction of a multilayer capacitor shown on the
following.
MANUFACTURING OF CERAMIC CAPACITORS
The raw materials are finely milled and carefully
mixed. Thereafter the powders are calcined at
temperatures between 1,100 and 1,300 °C to achieve
the required chemical composition. The resultant
mass is reground and dopes and/or sintering means
are added.
The finely ground material is mixed with a solvent
and binding matter. Thin sheets are obtained by
casting or rolling.
For multilayer capacitors , the electrode material is
printed on the ceramic sheet , after stacking and
pressing of sheets, it is sintered together with the
ceramic material at temperature between 1,000 and
1,400 °C.
The totally enclosed electrodes of a multilayer
capacitor guarantee good life test behaviour as well.
terminations
electrodes
MLB457-2
ceramic material
Fig. 1 Cross-section of a multilayer capacitor
www.yageo.com
Dec 06, 2010 V.11
Product specification
Surface-Mount Ceramic Multilayer Capacitors
3
5
Introduction
EQUIVALENT CIRCUIT FOR CERAMIC CAPACITORS
Definition of symbols (see fig. 2)
Symbol
Description
C
Capacitance between the two electrodes, plus the stray capacitance at the
edges and between the leads.
Rp
Rp
Resistance of insulation and dielectric. Generally Rp is very high, and of
decreasing importance with increasing frequency. Rp also represents the
polarization losses of the material in an alternating electric field.
Rs
L
C
HBK074
Losses in the leads, the electrodes and the contacts. Up to several hundreds
of MHz the current penetration depth is greater than the conductor
thickness so that no skin-effect occurs. For ceramic capacitors Rs is
extremely low.
L
Rs
Fig. 2 Equivalent circuit
Inductance of the leads and the internal inductance of the capacitor; the
latter, however, is almost negligible. The inductance is only important in high
frequency applications, since the capacitor will act as an inductance when
the frequency is higher than its resonance frequency.
TANGENT OF THE LOSS ANGLE
The losses of a capacitor are expressed in terms of tan which is the relationship between the resistive and reactive
parts of the impedance, specified as follows:
tan
R p R s { 1 (CR p )2 }
R
X
(CR p )2 L { 1 (CR p )2 }
HBK075
MAINLY
INSULATION
INFLUENCED RESISTANCE
BY
tan δ =
POLARIZATION LOSSES
1
ω CR p
LEAD
ELECTRODE
LOSSES
RESONANCE
INDUCTION
ω CR s
ω CR s
1-ω 2LC
ωL
Rs
tan δ
LF
UHF
f res
frequency (log)
Fig. 3 Tan as a function of frequency
www.yageo.com
Dec 06, 2010 V.11
Product specification
Surface-Mount Ceramic Multilayer Capacitors
4
5
Introduction
FAILURE IN TIME (FIT)
The failure rates shown in Table 1 have a confidence
level of 60%. Failure rates are given under
Table 1 FIT of multilayer capacitor
TYPE
FIT () (1)
MTTF (hours) (2)
2,973,600 (123,900 days)
normalized conditions, i.e. (at 125 ℃ / 85 ℃, 2 times
of rated voltage for 1,008 hours, “IEC 60384-8 4.25.1”).
NP0
336
X5R
1,901
Failures include capacitance, tan δ and insulation
resistance values, which do not meet the
requirements after endurance test.
X7R
323
3,098,504 (129,104 days)
Y5V
784
1,275,339
The determination of failure rates is based on the
rated conditions as stated in “MIL-HDBK-217E”. All the
test results should be interpreted as results under
rated conditions even if the temperature and voltage
exceed the rated values.
525,913
(21,913 days)
(53,139 days)
NOTE
1. FIT = failure rate within 109 component hours.
2. MTTF means " mean time to failure"
3. Data updated from 2008 1st semi-annual report
www.yageo.com
Dec 06, 2010 V.11
Product specification
Surface-Mount Ceramic Multilayer Capacitors
Introduction
5
5
REVISION HISTORY
REVISION DATE
CHANGE NOTIFICATION
DESCRIPTION
Version 11
Dec 06, 2010
-
- 12NC ordering information updated
Version 10
Mar 05, 2009
-
- Change to dual brand datasheet
- Failure in time (FIT) data modified
Version 9
Jul 15, 2003
-
- Cover page revised
Version 8
Jan 15, 2003
-
- Updated company logo
- Updated FIT
Version 7
May 30, 2001
-
- Converted to Phycomp brand
www.yageo.com
Dec 06, 2010 V.11