ADVANCED CERAMICS AND MODULES DATA SHEET Class 2, X7R 16 V, 25 V and 50 V Low Inductance Surface mount ceramic multilayer capacitors Product specification Supersedes data of February 1999 File under Advanced Ceramics and Modules, ACM2 1999 Aug 24 Philips Components Product specification Surface mount ceramic multilayer capacitors FEATURES Class 2, X7R 16 V, 25 V and 50 V Low Inductance QUICK REFERENCE DATA • Two standard sizes VALUE DESCRIPTION • For high frequency applications • Supplied in tape on reel • Nickel-barrier end terminations. APPLICATIONS Consumer electronics, for example: • High speed IC packages • Processor package decoupling • AC noise reduction in multi-chip modules. Rated voltage UR (DC) 0508 0612 16 V; 25 V 50 V Capacitance range (E6 series); note 1 16 V 100 to 220 nF 25 V 10 to 100 nF 50 V 10 to 100 nF ±10%; note 2 Tolerance on capacitance after 1000 hours 2.5 × UR Test voltage (DC) for 1 minute Equivalent series inductance (ESL) 16 V 600 pH DESCRIPTION 25 V 600 pH The capacitor consists of a rectangular block of ceramic dielectric in which a number of interleaved metal electrodes are contained. This structure gives rise to a high capacitance per unit volume. 50 V The inner electrodes are connected to the two terminations and finally covered with a layer of plated tin (Nickel-barrier). A cross section of the structure is shown in Fig.1. 500 pH Sectional specifications IEC 60384-10, second edition 1989-04; also based on CECC 32 100 Detailed specification based on CECC 32 101-801 End terminations NiSn Climatic category (IEC 60068) 55/125/56 Notes 1. Other values on request. 2. Special tolerance values available on request. terminations , , , electrodes MLB457 ceramic material Fig.1 Construction of a ceramic multilayer capacitor. 1999 Aug 24 2 Philips Components Product specification Surface mount ceramic multilayer capacitors Class 2, X7R 16 V, 25 V and 50 V Low Inductance MECHANICAL DATA W T L2 L3 L4 CCB397 L1 For dimensions see Table 1. Fig.2 Component outline. Physical dimensions Table 1 Capacitor dimensions in mm; see Fig.2 CASE SIZE L2 and L3 T L4 MIN. L1 W 0508 1.25 ±0.20 2.00 ±0.20 0.85 ±0.10 0.13 0.46 0.38 0612 1.60 ±0.20 3.20 ±0.20 0.85 ±0.10 0.13 0.46 0.50 MIN. Footprint Table 2 MAX. Footprint dimensions; see Fig.3 FOOTPRINT DIMENSIONS (mm) CASE SIZE C A A C olumns B CCB408 For dimensions see Table 2. Fig.3 Footprint dimensions. 1999 Aug 24 3 B C 0508 0.50 2.00 1.0 0612 0.760 3.05 0.89 Philips Components Product specification Surface mount ceramic multilayer capacitors Class 2, X7R 16 V, 25 V and 50 V Low Inductance SELECTION CHART C (nF) 16 V LAST TWO DIGITS OF 12NC 10 36 12 37 15 38 18 39 22 41 27 42 33 43 39 44 47 45 56 46 68 47 82 48 100 49 120 51 150 52 180 53 220 54 25 V 50 V 0508 0612 0.85 ±0.10 0.85 ±0.10 0.85 ±0.10 Thickness classification and packaging quantities 8 mm TAPE WIDTH AMOUNT PER REEL THICKNESS CLASSIFICATION (mm) 0.85 ±0.10 1999 Aug 24 ∅180 mm; 7" ∅330 mm; 13" PAPER BLISTER PAPER BLISTER 4000 4000 15000 10000 4 Philips Components Product specification Surface mount ceramic multilayer capacitors Class 2, X7R 16 V, 25 V and 50 V Low Inductance ORDERING INFORMATION Components may be ordered by using either a simple 15-digit clear text code or Philips unique 12NC. Clear text code EXAMPLE: 06122R103K9BB0L SIZE CODE 0508 0612 TEMP. CHAR. 2R = X7R CAPACITANCE TOL. 103 = 10000 pF; the third digit signifies the multiplying factor: 3 = × 1000 4 = × 10000 K = ±10% VOLTAGE TERMINATION 7 = 16 V 8 = 25 V 9 = 50 V B = Ni-barrier PACKAGING 2 = 180 mm; 7" paper MARKING 0 = no marking 3 = 330 mm; 13" paper B = 180 mm; 7" blister F = 330 mm; 13" blister Ordering code 12NC handbook, full pagewidth 2 2 X X X X X X 6 X X X Capacitance value(1) Carrier type 50 blister 55 paper tape 56 bulk Tolerance 6 ±10% Rated voltage - Termination 06 50 V; Ni-barrier 07 25 V; Ni-barrier 08 16 V; Ni-barrier Size 0 0612 low inductance 1 0508 low inductance CCB398 Packaging(2) 1 reel: ∅180 mm; 7" 5 reel: ∅330 mm; 13" 9 specials (1) Refer to chapter “Selection chart”. (2) Amount on reel depends on thickness classification, see section “Thickness classification and packaging quantities”. 1999 Aug 24 5 SERIES L = low inductance Philips Components Product specification Surface mount ceramic multilayer capacitors Class 2, X7R 16 V, 25 V and 50 V Low Inductance ELECTRICAL CHARACTERISTICS Class 2 capacitors; low inductance; NiSn terminations Unless otherwise stated all electrical values apply at an ambient temperature of 23 ±3 °C, an atmospheric pressure of 86 to 105 kPa, and a relative humidity of 63 to 67%. VALUE DESCRIPTION 0508 0612 Capacitance range (E6 series); note 1 16 V 100 to 220 nF 25 V 10 to 100 nF 50 V 10 to 100 nF ±10% Tolerance on capacitance after 1000 hours Tan δ; note 1: 16 V ≤3.5% 25 V and 50 V ≤2.5% Rins × C ≥ 1000 seconds Insulation resistance after 1 minute at UR (DC) ±15% Typical capacitance change as a function of temperature Ageing typical 1% per time decade 260 °C; 10 seconds Resistance to soldering heat Note 1. Measured at 20 °C, 1 V and 1 kHz, using a four-gauge method. MGA488 - 1 handboo, halfpage ∆C C (%) 15 10 5 0 −5 −10 −15 −40 Fig.4 1999 Aug 24 0 40 80 120 T (oC) Typical capacitance change as a function of temperature. 6 Philips Components Product specification Surface mount ceramic multilayer capacitors Class 2, X7R 16 V, 25 V and 50 V Low Inductance TESTS AND REQUIREMENTS Table 3 Test procedures and requirements IEC IEC 60384-10/ 60068-2 CECC 32 100 TEST CLAUSE METHOD TEST PROCEDURE REQUIREMENTS 4.4 mounting the capacitors may be mounted no visible damage on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapour phase soldering) or conductive adhesive 4.5 visual inspection and any applicable method using dimension check ×10 magnification in accordance with specification 4.6.1 capacitance f = 1 kHz; measuring voltage 1 Vrms at 20 °C measured 1000 hours after date of manufacture 4.6.2 tan δ f = 1 kHz; measuring voltage 1 Vrms at 20 °C in accordance with specification 4.6.3 insulation resistance at UR (DC) for 1 minute in accordance with specification 4.6.4 voltage proof 2.5 × UR for 1 minute no breakdown or flashover 4.7.1 temperature characteristic between minimum and maximum temperature in accordance with specification 4.8 adhesion a force of 5 N applied for 10 s to the line joining the terminations and in a plane parallel to the substrate no visible damage 4.9 bond strength of plating on end face mounted in accordance with CECC 32 100, paragraph 4.4 no visible damage conditions: bending 1 mm at a rate of 1 mm/s, radius jig 340 mm ∆C/C: ±10% resistance to soldering heat precondition: 120 to 150 °C for 1 minute; 260 ±5 °C for 10 ±0.5 s in a static solder bath the terminations shall be well tinned after recovery resistance to leaching 260 ±5 °C for 30 ±1 s in a static solder bath using visual enlargement of ×10, dissolution of the terminations shall not exceed 10% solderability zero hour test, and test after storage (20 to 24 months) in original packing in normal atmosphere; unmounted chips completely immersed for 2 ±0.5 s in a solder bath at 235 ±5 °C the terminations shall be well tinned 4.10 4.11 1999 Aug 24 Tb Ta 7 Philips Components Product specification Surface mount ceramic multilayer capacitors IEC IEC 60384-10/ 60068-2 CECC 32 100 TEST CLAUSE METHOD 4.12 4.14 Na Ca Class 2, X7R 16 V, 25 V and 50 V Low Inductance TEST rapid change of temperature damp heat, PROCEDURE REQUIREMENTS preconditioning; 5 cycles in the following sequence: 30 minutes at −55 °C, change within 30 minutes to +125 °C no visible damage after 24 hours recovery: preconditioning (thermal treatment): 56 days at 40 °C; 90 to 95% RH; UR applied no visual damage ∆C/C: ±15% after 24 hours recovery: ∆C/C: ±15% tan δ: ≤7% Rins: 1000 MΩ or RiCR ≥ 25 s, whichever is less 4.15 1999 Aug 24 endurance preconditioning (thermal treatment): 1000 hours at 125 °C and 2 × UR applied 8 after 24 hours recovery: ∆C/C: ±20% tan δ: ≤7% Rins: 2000 MΩ or RiCR ≥ 50 s, whichever is less