EFM32G890 DATASHEET - F128/F64/F32

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EFM32G890 DATASHEET
F128/F64/F32
• ARM Cortex-M3 CPU platform
• High Performance 32-bit processor @ up to 32 MHz
• Memory Protection Unit
• Wake-up Interrupt Controller
• Flexible Energy Management System
• 20 nA @ 3 V Shutoff Mode
• 0.6 µA @ 3 V Stop Mode, including Power-on Reset, Brown-out
Detector, RAM and CPU retention
• 0.9 µA @ 3 V Deep Sleep Mode, including RTC with 32.768 kHz
oscillator, Power-on Reset, Brown-out Detector, RAM and CPU
retention
• 45 µA/MHz @ 3 V Sleep Mode
• 180 µA/MHz @ 3 V Run Mode, with code executed from flash
• 128/64/32 KB Flash
• 16/16/8 KB RAM
• 90 General Purpose I/O pins
• Configurable push-pull, open-drain, pull-up/down, input filter, drive
strength
• Configurable peripheral I/O locations
• 16 asynchronous external interrupts
• Output state retention and wake-up from Shutoff Mode
• 8 Channel DMA Controller
• 8 Channel Peripheral Reflex System (PRS) for autonomous inter-peripheral signaling
• Hardware AES with 128/256-bit keys in 54/75 cycles
• Timers/Counters
• 3× 16-bit Timer/Counter
• 3×3 Compare/Capture/PWM channels
• Dead-Time Insertion on TIMER0
• 16-bit Low Energy Timer
• 1× 24-bit Real-Time Counter
• 3× 8-bit Pulse Counter
• Watchdog Timer with dedicated RC oscillator @ 50 nA
• Integrated LCD Controller for up to 4×40 segments
• Voltage boost, adjustable contrast and autonomous animation
• External Bus Interface for up to 4x64 MB of external
memory mapped space
• Communication interfaces
• 3× Universal Synchronous/Asynchronous Receiver/Transmitter
• UART/SPI/SmartCard (ISO 7816)/IrDA
• Triple buffered full/half-duplex operation
• 1× Universal Asynchronous Receiver/Transmitter
• 2× Low Energy UART
• Autonomous operation with DMA in Deep Sleep
Mode
2
• I C Interface with SMBus support
• Address recognition in Stop Mode
• Ultra low power precision analog peripherals
• 12-bit 1 Msamples/s Analog to Digital Converter
• 8 single ended channels/4 differential channels
• On-chip temperature sensor
• 12-bit 500 ksamples/s Digital to Analog Converter
• 2 single ended channels/1 differential channel
• 2× Analog Comparator
• Capacitive sensing with up to 16 inputs
• Supply Voltage Comparator
• Ultra efficient Power-on Reset and Brown-Out Detector
• 2-pin Serial Wire Debug interface
• 1-pin Serial Wire Viewer
• Pre-Programmed UART Bootloader
• Temperature range -40 to 85 ºC
• Single power supply 1.98 to 3.8 V
• BGA112 package
32-bit ARM Cortex-M0+, Cortex-M3 and Cortex-M4 microcontrollers for:
• Energy, gas, water and smart metering
• Health and fitness applications
• Smart accessories
• Alarm and security systems
• Industrial and home automation
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1 Ordering Information
Table 1.1 (p. 2) shows the available EFM32G890 devices.
Table 1.1. Ordering Information
Ordering Code
Flash (kB)
RAM (kB)
Max
Speed
(MHz)
Supply
Voltage
(V)
Temperature
(ºC)
Package
EFM32G890F32-BGA112
32
8
32
1.98 - 3.8
-40 - 85
BGA112
EFM32G890F64-BGA112
64
16
32
1.98 - 3.8
-40 - 85
BGA112
EFM32G890F128-BGA112
128
16
32
1.98 - 3.8
-40 - 85
BGA112
Adding the suffix 'T' to the part number (e.g. EFM32G890F32-BGA112T) denotes tray.
Visit www.silabs.com for information on global distributors and representatives.
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2 System Summary
2.1 System Introduction
The EFM32 MCUs are the world’s most energy friendly microcontrollers. With a unique combination of
the powerful 32-bit ARM Cortex-M3, innovative low energy techniques, short wake-up time from energy
saving modes, and a wide selection of peripherals, the EFM32G microcontroller is well suited for any
battery operated application as well as other systems requiring high performance and low-energy consumption. This section gives a short introduction to each of the modules in general terms and also shows
a summary of the configuration for the EFM32G890 devices. For a complete feature set and in-depth
information on the modules, the reader is referred to the EFM32G Reference Manual.
A block diagram of the EFM32G890 is shown in Figure 2.1 (p. 3) .
Figure 2.1. Block Diagram
G890F32/ 64/ 128
Core and Memory
Clock Managem ent
Memory
Protection
Unit
ARM Cortex™- M3 processor
Flash
Memory
[KB]
32/ 64/ 128
RAM
Memory
[KB]
Debug
Interface
DMA
Controller
8/ 16/ 16
Energy Managem ent
High Frequency
Crystal
Oscilla tor
High Frequency
RC
Oscilla tor
Aux High Freq
RC
Oscillator
Lo w Frequency
RC
Oscilla tor
Lo w Frequency
Crystal
Oscilla tor
Watchdog
Oscillator
Voltage
Regulator
Voltage
Comparator
Power-on
Reset
Brown-out
Detector
32-bit bus
Peripheral Reflex System
Serial Interfaces
USA RT
UART
I/O Ports
Ex ternal
Bus
Interface
General
Purpose
I/ O
3x
Low
Energy
UART™
90 pins
I2C
Ex ternal
Interrupts
2x
Pin
Reset
Timers and Triggers
Timer/
Counter
3x
Peripheral
Reflex
Sys tem
Low Energy
Timer™
Real Time
Counter
Analog Interfaces
ADC
DAC
Security
AES
2x
Pulse
Counter
3x
Watchdog
Timer
LCD
Controller
Analog
Comparator
4x 40
2x
2.1.1 ARM Cortex-M3 Core
The ARM Cortex-M3 includes a 32-bit RISC processor which can achieve as much as 1.25 Dhrystone
MIPS/MHz. A Memory Protection Unit with support for up to 8 memory segments is included, as well
as a Wake-up Interrupt Controller handling interrupts triggered while the CPU is asleep. The EFM32
implementation of the Cortex-M3 is described in detail in EFM32G Cortex-M3 Reference Manual.
2.1.2 Debug Interface (DBG)
This device includes hardware debug support through a 2-pin serial-wire debug interface . In addition
there is also a 1-wire Serial Wire Viewer pin which can be used to output profiling information, data trace
and software-generated messages.
2.1.3 Memory System Controller (MSC)
The Memory System Controller (MSC) is the program memory unit of the EFM32G microcontroller. The
flash memory is readable and writable from both the Cortex-M3 and DMA. The flash memory is divided
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into two blocks; the main block and the information block. Program code is normally written to the main
block. Additionally, the information block is available for special user data and flash lock bits. There is
also a read-only page in the information block containing system and device calibration data. Read and
write operations are supported in the energy modes EM0 and EM1.
2.1.4 Direct Memory Access Controller (DMA)
The Direct Memory Access (DMA) controller performs memory operations independently of the CPU.
This has the benefit of reducing the energy consumption and the workload of the CPU, and enables
the system to stay in low energy modes when moving for instance data from the USART to RAM or
from the External Bus Interface to a PWM-generating timer. The DMA controller uses the PL230 µDMA
controller licensed from ARM.
2.1.5 Reset Management Unit (RMU)
The RMU is responsible for handling the reset functionality of the EFM32G.
2.1.6 Energy Management Unit (EMU)
The Energy Management Unit (EMU) manage all the low energy modes (EM) in EFM32G microcontrollers. Each energy mode manages if the CPU and the various peripherals are available. The EMU
can also be used to turn off the power to unused SRAM blocks.
2.1.7 Clock Management Unit (CMU)
The Clock Management Unit (CMU) is responsible for controlling the oscillators and clocks on-board
the EFM32G. The CMU provides the capability to turn on and off the clock on an individual basis to all
peripheral modules in addition to enable/disable and configure the available oscillators. The high degree
of flexibility enables software to minimize energy consumption in any specific application by not wasting
power on peripherals and oscillators that are inactive.
2.1.8 Watchdog (WDOG)
The purpose of the watchdog timer is to generate a reset in case of a system failure, to increase application reliability. The failure may e.g. be caused by an external event, such as an ESD pulse, or by a
software failure.
2.1.9 Peripheral Reflex System (PRS)
The Peripheral Reflex System (PRS) system is a network which lets the different peripheral module
communicate directly with each other without involving the CPU. Peripheral modules which send out
Reflex signals are called producers. The PRS routes these reflex signals to consumer peripherals which
apply actions depending on the data received. The format for the Reflex signals is not given, but edge
triggers and other functionality can be applied by the PRS.
2.1.10 External Bus Interface (EBI)
The External Bus Interface provides access to external parallel interface devices such as SRAM, FLASH,
ADCs and LCDs. The interface is memory mapped into the address bus of the Cortex-M3. This enables
seamless access from software without manually manipulating the IO settings each time a read or write
is performed. The data and address lines are multiplexed in order to reduce the number of pins required
to interface the external devices. The timing is adjustable to meet specifications of the external devices.
The interface is limited to asynchronous devices.
2.1.11 Inter-Integrated Circuit Interface (I2C)
2
2
The I C module provides an interface between the MCU and a serial I C-bus. It is capable of acting as
both a master and a slave, and supports multi-master buses. Both standard-mode, fast-mode and fastmode plus speeds are supported, allowing transmission rates all the way from 10 kbit/s up to 1 Mbit/s.
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Slave arbitration and timeouts are also provided to allow implementation of an SMBus compliant system.
2
The interface provided to software by the I C module, allows both fine-grained control of the transmission
process and close to automatic transfers. Automatic recognition of slave addresses is provided in all
energy modes.
2.1.12 Universal Synchronous/Asynchronous Receiver/Transmitter (USART)
The Universal Synchronous Asynchronous serial Receiver and Transmitter (USART) is a very flexible
serial I/O module. It supports full duplex asynchronous UART communication as well as RS-485, SPI,
MicroWire and 3-wire. It can also interface with ISO7816 SmartCards, and IrDA devices.
2.1.13 Pre-Programmed UART Bootloader
The bootloader presented in application note AN0003 is pre-programmed in the device at factory. Autobaud and destructive write are supported. The autobaud feature, interface and commands are described
further in the application note.
2.1.14 Universal Asynchronous Receiver/Transmitter (UART)
The Universal Asynchronous serial Receiver and Transmitter (UART) is a very flexible serial I/O module.
It supports full- and half-duplex asynchronous UART communication.
2.1.15 Low Energy Universal Asynchronous Receiver/Transmitter
(LEUART)
TM
The unique LEUART , the Low Energy UART, is a UART that allows two-way UART communication on
a strict power budget. Only a 32.768 kHz clock is needed to allow UART communication up to 9600 baud/
s. The LEUART includes all necessary hardware support to make asynchronous serial communication
possible with minimum of software intervention and energy consumption.
2.1.16 Timer/Counter (TIMER)
The 16-bit general purpose Timer has 3 compare/capture channels for input capture and compare/PulseWidth Modulation (PWM) output. TIMER0 also includes a Dead-Time Insertion module suitable for motor
control applications.
2.1.17 Real Time Counter (RTC)
The Real Time Counter (RTC) contains a 24-bit counter and is clocked either by a 32.768 kHz crystal
oscillator, or a 32.768 kHz RC oscillator. In addition to energy modes EM0 and EM1, the RTC is also
available in EM2. This makes it ideal for keeping track of time since the RTC is enabled in EM2 where
most of the device is powered down.
2.1.18 Low Energy Timer (LETIMER)
TM
The unique LETIMER , the Low Energy Timer, is a 16-bit timer that is available in energy mode EM2
in addition to EM1 and EM0. Because of this, it can be used for timing and output generation when most
of the device is powered down, allowing simple tasks to be performed while the power consumption of
the system is kept at an absolute minimum. The LETIMER can be used to output a variety of waveforms
with minimal software intervention. It is also connected to the Real Time Counter (RTC), and can be
configured to start counting on compare matches from the RTC.
2.1.19 Pulse Counter (PCNT)
The Pulse Counter (PCNT) can be used for counting pulses on a single input or to decode quadrature
encoded inputs. It runs off either the internal LFACLK or the PCNTn_S0IN pin as external clock source.
The module may operate in energy mode EM0 - EM3.
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2.1.20 Analog Comparator (ACMP)
The Analog Comparator is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is higher. Inputs can either be one of the selectable internal references or from
external pins. Response time and thereby also the current consumption can be configured by altering
the current supply to the comparator.
2.1.21 Voltage Comparator (VCMP)
The Voltage Supply Comparator is used to monitor the supply voltage from software. An interrupt can
be generated when the supply falls below or rises above a programmable threshold. Response time and
thereby also the current consumption can be configured by altering the current supply to the comparator.
2.1.22 Analog to Digital Converter (ADC)
The ADC is a Successive Approximation Register (SAR) architecture, with a resolution of up to 12 bits
at up to one million samples per second. The integrated input mux can select inputs from 8 external
pins and 6 internal signals.
2.1.23 Digital to Analog Converter (DAC)
The Digital to Analog Converter (DAC) can convert a digital value to an analog output voltage. The DAC
is fully differential rail-to-rail, with 12-bit resolution. It has two single ended output buffers which can be
combined into one differential output. The DAC may be used for a number of different applications such
as sensor interfaces or sound output.
2.1.24 Advanced Encryption Standard Accelerator (AES)
The AES accelerator performs AES encryption and decryption with 128-bit or 256-bit keys. Encrypting or
decrypting one 128-bit data block takes 52 HFCORECLK cycles with 128-bit keys and 75 HFCORECLK
cycles with 256-bit keys. The AES module is an AHB slave which enables efficient access to the data
and key registers. All write accesses to the AES module must be 32-bit operations, i.e. 8- or 16-bit
operations are not supported.
2.1.25 General Purpose Input/Output (GPIO)
In the EFM32G890, there are 90 General Purpose Input/Output (GPIO) pins, which are divided into ports
with up to 16 pins each. These pins can individually be configured as either an output or input. More
advanced configurations like open-drain, filtering and drive strength can also be configured individually
for the pins. The GPIO pins can also be overridden by peripheral pin connections, like Timer PWM
outputs or USART communication, which can be routed to several locations on the device. The GPIO
supports up to 16 asynchronous external pin interrupts, which enables interrupts from any pin on the
device. Also, the input value of a pin can be routed through the Peripheral Reflex System to other
peripherals.
2.1.26 Liquid Crystal Display Driver (LCD)
The LCD driver is capable of driving a segmented LCD display with up to 4x40 segments. A voltage
boost function enables it to provide the LCD display with higher voltage than the supply voltage for the
device. In addition, an animation feature can run custom animations on the LCD display without any
CPU intervention. The LCD driver can also remain active even in Energy Mode 2 and provides a Frame
Counter interrupt that can wake-up the device on a regular basis for updating data.
2.2 Configuration Summary
The features of the EFM32G890 is a subset of the feature set described in the EFM32G Reference
Manual. Table 2.1 (p. 7) describes device specific implementation of the features.
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Table 2.1. Configuration Summary
Module
Configuration
Pin Connections
Cortex-M3
Full configuration
NA
DBG
Full configuration
DBG_SWCLK, DBG_SWDIO,
DBG_SWO
MSC
Full configuration
NA
DMA
Full configuration
NA
RMU
Full configuration
NA
EMU
Full configuration
NA
CMU
Full configuration
CMU_OUT0, CMU_OUT1
WDOG
Full configuration
NA
PRS
Full configuration
NA
EBI
Full configuration
EBI_ARDY, EBI_ALE, EBI_WEn,
EBI_REn, EBI_CS[3:0], EBI_AD[15:0]
I2C0
Full configuration
I2C0_SDA, I2C0_SCL
USART0
Full configuration with IrDA
US0_TX, US0_RX. US0_CLK, US0_CS
USART1
Full configuration
US1_TX, US1_RX, US1_CLK, US1_CS
USART2
Full configuration
US2_TX, US2_RX, US2_CLK, US2_CS
UART0
Full configuration
U0_TX, U0_RX
LEUART0
Full configuration
LEU0_TX, LEU0_RX
LEUART1
Full configuration
LEU1_TX, LEU1_RX
TIMER0
Full configuration with DTI
TIM0_CC[2:0], TIM0_CDTI[2:0]
TIMER1
Full configuration
TIM1_CC[2:0]
TIMER2
Full configuration
TIM2_CC[2:0]
RTC
Full configuration
NA
LETIMER0
Full configuration
LET0_O[1:0]
PCNT0
Full configuration, 8-bit count register
PCNT0_S[1:0]
PCNT1
Full configuration, 8-bit count register
PCNT1_S[1:0]
PCNT2
Full configuration, 8-bit count register
PCNT2_S[1:0]
ACMP0
Full configuration
ACMP0_CH[7:0], ACMP0_O
ACMP1
Full configuration
ACMP1_CH[7:0], ACMP1_O
VCMP
Full configuration
NA
ADC0
Full configuration
ADC0_CH[7:0]
DAC0
Full configuration
DAC0_OUT[1:0]
AES
Full configuration
NA
GPIO
90 pins
Available pins are shown in
Table 4.3 (p. 57)
LCD
Full configuration
LCD_SEG[39:0], LCD_COM[3:0],
LCD_BCAP_P, LCD_BCAP_N,
LCD_BEXT
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2.3 Memory Map
The EFM32G890 memory map is shown in Figure 2.2 (p. 8) , with RAM and Flash sizes for the
largest memory configuration.
Figure 2.2. EFM32G890 Memory Map with largest RAM and Flash sizes
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3 Electrical Characteristics
3.1 Test Conditions
3.1.1 Typical Values
The typical data are based on TAMB=25°C and VDD=3.0 V, as defined in Table 3.2 (p. 9) , by simulation and/or technology characterisation unless otherwise specified.
3.1.2 Minimum and Maximum Values
The minimum and maximum values represent the worst conditions of ambient temperature, supply voltage and frequencies, as defined in Table 3.2 (p. 9), by simulation and/or technology characterisation unless otherwise specified.
3.2 Absolute Maximum Ratings
The absolute maximum ratings are stress ratings, and functional operation under such conditions are
not guaranteed. Stress beyond the limits specified in Table 3.1 (p. 9) may affect the device reliability
or cause permanent damage to the device. Functional operating conditions are given in Table 3.2 (p.
9) .
Table 3.1. Absolute Maximum Ratings
Symbol
Parameter
Condition
Min
Typ
Max
TSTG
Storage temperature range
TS
Maximum soldering
temperature
VDDMAX
External main supply voltage
0
3.8 V
VIOPIN
Voltage on any I/O
pin
-0.3
VDD+0.3 V
-40
Unit
150
Latest IPC/JEDEC J-STD-020
Standard
1
°C
260 °C
Current per I/O pin
(sink)
100 mA
Current per I/O pin
(source)
-100 mA
IIOMAX
1
Based on programmed devices tested for 10000 hours at 150°C. Storage temperature affects retention of preprogrammed calibration values stored in flash. Please refer to the Flash section in the Electrical Characteristics for information on flash data retention for different temperatures.
3.3 General Operating Conditions
3.3.1 General Operating Conditions
Table 3.2. General Operating Conditions
Symbol
Parameter
TAMB
Ambient temperature range
VDDOP
Operating supply voltage
fAPB
Internal APB clock frequency
32 MHz
fAHB
Internal AHB clock frequency
32 MHz
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Min
Typ
-40
1.98
9
Max
Unit
85 °C
3.8 V
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3.4 Current Consumption
Table 3.3. Current Consumption
Symbol
IEM0
IEM1
IEM2
IEM3
IEM4
Parameter
EM0 current. No
prescaling. Running
prime number calculation code from
Flash. (Production
test condition = 14
MHz)
EM1 current (Production test condition = 14 MHz)
Condition
Min
Typ
Max
Unit
32 MHz HFXO, all peripheral
clocks disabled, VDD= 3.0 V
180
µA/
MHz
28 MHz HFRCO, all peripheral
clocks disabled, VDD= 3.0 V
181
206 µA/
MHz
21 MHz HFRCO, all peripheral
clocks disabled, VDD= 3.0 V
183
207 µA/
MHz
14 MHz HFRCO, all peripheral
clocks disabled, VDD= 3.0 V
185
211 µA/
MHz
11 MHz HFRCO, all peripheral
clocks disabled, VDD= 3.0 V
186
215 µA/
MHz
6.6 MHz HFRCO, all peripheral
clocks disabled, VDD= 3.0 V
191
218 µA/
MHz
1.2 MHz HFRCO, all peripheral
clocks disabled, VDD= 3.0 V
220
µA/
MHz
32 MHz HFXO, all peripheral
clocks disabled, VDD= 3.0 V
45
µA/
MHz
28 MHz HFRCO, all peripheral
clocks disabled, VDD= 3.0 V
47
62 µA/
MHz
21 MHz HFRCO, all peripheral
clocks disabled, VDD= 3.0 V
48
64 µA/
MHz
14 MHz HFRCO, all peripheral
clocks disabled, VDD= 3.0 V
50
69 µA/
MHz
11 MHz HFRCO, all peripheral
clocks disabled, VDD= 3.0 V
51
72 µA/
MHz
6.6 MHz HFRCO, all peripheral
clocks disabled, VDD= 3.0 V
56
83 µA/
MHz
1.2 MHz HFRCO. all peripheral
clocks disabled, VDD= 3.0 V
103
µA/
MHz
EM2 current with RTC
prescaled to 1 Hz, 32.768
kHz LFRCO, VDD= 3.0 V,
TAMB=25°C
0.9
1.5 µA
EM2 current with RTC
prescaled to 1 Hz, 32.768
kHz LFRCO, VDD= 3.0 V,
TAMB=85°C
3.0
6.0 µA
VDD= 3.0 V, TAMB=25°C
0.59
1.0 µA
VDD= 3.0 V, TAMB=85°C
2.75
5.8 µA
VDD= 3.0 V, TAMB=25°C
0.02
0.045 µA
VDD= 3.0 V, TAMB=85°C
0.25
0.7 µA
EM2 current
EM3 current
EM4 current
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3.4.1 EM0 Current Consumption
Figure 3.1. EM0 Current consumption while executing prime number calculation code from flash
with HFRCO running at 28 MHz
5.3
5.3
85.0°C
65.0°C
5.2
5.2
45.0°C
5.1
5.1
25.0°C
5.0
Idd [m A]
5.0°C
- 15.0°C
Idd [m A]
5.0
4.9
4.9
- 40.0°C
4.8
4.8
4.7
4.6
2.0
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
4.7
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
4.6
–40
3.8
–15
5
25
Tem perature [°C]
45
65
85
Figure 3.2. EM0 Current consumption while executing prime number calculation code from flash
with HFRCO running at 21 MHz
4.0
4.0
85.0°C
65.0°C
3.9
3.9
45.0°C
25.0°C
Idd [m A]
3.8
Idd [m A]
3.8
5.0°C
- 15.0°C
3.7
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
3.7
- 40.0°C
3.6
3.5
2.0
3.6
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
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3.4
3.6
3.5
–40
3.8
11
–15
5
25
Tem perature [°C]
45
65
85
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Figure 3.3. EM0 Current consumption while executing prime number calculation code from flash
with HFRCO running at 14 MHz
2.75
2.75
85.0°C
2.70
2.70
65.0°C
2.65
2.65
45.0°C
2.60
2.60
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
Idd [m A]
Idd [m A]
25.0°C
2.55
5.0°C
2.50
- 15.0°C
2.50
2.45
- 40.0°C
2.45
2.40
2.35
2.0
2.55
2.40
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
2.35
–40
3.8
–15
5
25
Tem perature [°C]
45
65
85
Figure 3.4. EM0 Current consumption while executing prime number calculation code from flash
with HFRCO running at 11 MHz
2.20
2.20
85.0°C
2.15
2.15
65.0°C
2.10
2.10
45.0°C
25.0°C
2.05
Idd [m A]
Idd [m A]
2.05
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
5.0°C
2.00
2.00
- 15.0°C
1.95
- 40.0°C
1.90
1.85
2.0
1.95
1.90
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
2015-05-22 - EFM32G890FXX - d0010_Rev1.90
3.4
3.6
1.85
–40
3.8
12
–15
5
25
Tem perature [°C]
45
65
85
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Figure 3.5. EM0 Current consumption while executing prime number calculation code from flash
with HFRCO running at 7 MHz
1.45
1.45
85.0°C
1.40
1.40
65.0°C
45.0°C
1.35
Idd [m A]
25.0°C
5.0°C
Idd [m A]
1.35
- 15.0°C
1.30
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
1.30
- 40.0°C
1.25
1.20
2.0
1.25
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
1.20
–40
3.8
–15
5
25
Tem perature [°C]
45
65
85
3.4.2 EM1 Current Consumption
Figure 3.6. EM1 Current consumption with all peripheral clocks disabled and HFRCO running
at 28 MHz
1.40
1.40
85.0°C
65.0°C
1.35
1.35
Vdd= 2.0V
Vdd= 2.4V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.4V
Vdd= 3.8V
45.0°C
25.0°C
1.30
1.30
- 15.0°C
- 40.0°C
1.25
1.20
1.15
2.0
Idd [m A]
Idd [m A]
5.0°C
1.25
1.20
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
2015-05-22 - EFM32G890FXX - d0010_Rev1.90
3.4
3.6
1.15
–40
3.8
13
–15
5
25
Tem perature [°C]
45
65
85
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Figure 3.7. EM1 Current consumption with all peripheral clocks disabled and HFRCO running
at 21 MHz
1.08
1.08
85.0°C
1.06
1.04
65.0°C
1.04
1.02
45.0°C
1.02
25.0°C
1.00
5.0°C
Idd [m A]
Idd [m A]
1.06
1.00
0.98
- 15.0°C
0.98
0.96
- 40.0°C
0.96
0.94
0.92
2.0
Vdd= 2.0V
Vdd= 2.4V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.4V
Vdd= 3.8V
0.94
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
0.92
–40
3.8
–15
5
25
Tem perature [°C]
45
65
85
Figure 3.8. EM1 Current consumption with all peripheral clocks disabled and HFRCO running
at 14 MHz
0.76
0.76
85.0°C
0.74
0.74
65.0°C
0.72
Vdd= 2.0V
Vdd= 2.4V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.4V
Vdd= 3.8V
0.72
25.0°C
0.70
5.0°C
Idd [m A]
Idd [m A]
45.0°C
0.70
- 15.0°C
0.68
0.68
- 40.0°C
0.66
0.64
2.0
0.66
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
2015-05-22 - EFM32G890FXX - d0010_Rev1.90
3.4
3.6
0.64
–40
3.8
14
–15
5
25
Tem perature [°C]
45
65
85
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Figure 3.9. EM1 Current consumption with all peripheral clocks disabled and HFRCO running
at 11 MHz
0.62
0.60
65.0°C
0.60
0.58
45.0°C
0.58
25.0°C
5.0°C
0.56
Vdd= 2.0V
Vdd= 2.4V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.4V
Vdd= 3.8V
Idd [m A]
85.0°C
Idd [m A]
0.62
0.56
- 15.0°C
- 40.0°C
0.54
0.52
2.0
0.54
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
0.52
–40
3.8
–15
5
25
Tem perature [°C]
45
65
85
Figure 3.10. EM1 Current consumption with all peripheral clocks disabled and HFRCO running
at 7 MHz
0.44
0.44
85.0°C
0.43
0.43
65.0°C
0.42
Vdd= 2.0V
Vdd= 2.4V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.4V
Vdd= 3.8V
0.42
0.41
0.41
25.0°C
0.40
5.0°C
- 15.0°C
0.39
Idd [m A]
Idd [m A]
45.0°C
0.40
0.39
- 40.0°C
0.38
0.38
0.37
0.37
0.36
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
2015-05-22 - EFM32G890FXX - d0010_Rev1.90
3.4
3.6
0.36
–40
3.8
15
–15
5
25
Tem perature [°C]
45
65
85
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3.4.3 EM2 Current Consumption
Figure 3.11. EM2 current consumption. RTC prescaled to 1kHz, 32.768 kHz LFRCO.
3.5
3.5
- 40.0°C
- 15.0°C
5.0°C
25.0°C
45.0°C
65.0°C
85.0°C
3.0
3.0
2.5
Idd [uA]
Idd [uA]
2.5
2.0
2.0
1.5
1.5
1.0
1.0
0.5
1.8
Vdd= 1.8V
Vdd= 2.2V
Vdd= 2.6V
Vdd= 3.0V
Vdd= 3.4V
Vdd= 3.8V
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
0.5
–40
3.8
–15
5
25
Tem perature [°C]
45
65
85
5
25
Tem perature [°C]
45
65
85
3.4.4 EM3 Current Consumption
Figure 3.12. EM3 current consumption.
3.0
3.0
- 40.0°C
- 15.0°C
5.0°C
25.0°C
45.0°C
65.0°C
85.0°C
2.5
2.5
2.0
Idd [uA]
Idd [uA]
2.0
1.5
1.5
1.0
1.0
0.5
0.5
0.0
1.8
Vdd= 1.8V
Vdd= 2.2V
Vdd= 2.6V
Vdd= 3.0V
Vdd= 3.4V
Vdd= 3.8V
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
2015-05-22 - EFM32G890FXX - d0010_Rev1.90
3.4
3.6
0.0
–40
3.8
16
–15
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3.4.5 EM4 Current Consumption
Figure 3.13. EM4 current consumption.
0.45
0.40
0.40
0.35
0.30
0.30
0.25
0.25
Idd [uA]
Idd [uA]
0.35
0.45
- 40.0°C
- 15.0°C
5.0°C
25.0°C
45.0°C
65.0°C
85.0°C
0.20
0.20
0.15
0.15
0.10
0.10
0.05
0.05
0.00
1.8
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
Vdd= 1.8V
Vdd= 2.2V
Vdd= 2.6V
Vdd= 3.0V
Vdd= 3.4V
Vdd= 3.8V
0.00
–40
3.8
–15
5
25
Tem perature [°C]
45
65
85
3.5 Transition between Energy Modes
The transition times are measured from the trigger to the first clock edge in the CPU.
Table 3.4. Energy Modes Transitions
Symbol
Parameter
Min
Typ
Max
Unit
tEM10
Transition time from EM1 to EM0
0
HFCORECLK
cycles
tEM20
Transition time from EM2 to EM0
2
µs
tEM30
Transition time from EM3 to EM0
2
µs
tEM40
Transition time from EM4 to EM0
163
µs
3.6 Power Management
The EFM32G requires the AVDD_x, VDD_DREG and IOVDD_x pins to be connected together (with
optional filter) at the PCB level. For practical schematic recommendations, please see the application
note, "AN0002 EFM32 Hardware Design Considerations".
2015-05-22 - EFM32G890FXX - d0010_Rev1.90
17
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Table 3.5. Power Management
Symbol
Parameter
VBODextthr-
BOD threshold on
falling external supply voltage
VBODextthr+
BOD threshold on
rising external supply voltage
VPORthr+
Power-on Reset
(POR) threshold on
rising external supply voltage
tRESETdly
Delay from reset
is released until
program execution
starts
tRESET
negative pulse
length to ensure
complete reset of
device
CDECOUPLE
Voltage regulator
decoupling capacitor.
Condition
Min
Typ
Max
1.74
Unit
1.96 V
1.85
V
1.98 V
Applies to Power-on Reset,
Brown-out Reset and pin reset.
163
µs
50
ns
X5R capacitor recommended.
Apply between DECOUPLE pin
and GROUND
1
µF
3.7 Flash
Table 3.6. Flash
Symbol
Parameter
ECFLASH
Flash erase cycles
before failure
Condition
Min
TAMB<150°C
RETFLASH
Flash data retention
Typ
Max
Unit
20000
cycles
10000
h
TAMB<85°C
10
years
TAMB<70°C
20
years
µs
tW_PROG
Word (32-bit) programming time
20
tP_ERASE
Page erase time
20
20.4
20.8 ms
tD_ERASE
Device erase time
40
40.8
41.6 ms
IERASE
Erase current
IWRITE
Write current
VFLASH
Supply voltage during flash erase and
write
1.98
7
1
mA
7
1
mA
3.8 V
1
Measured at 25°C
3.8 General Purpose Input Output
Table 3.7. GPIO
Symbol
Parameter
VIOIL
Input low voltage
Condition
2015-05-22 - EFM32G890FXX - d0010_Rev1.90
Min
Typ
Max
Unit
1
0.30VDD
18
V
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Symbol
Parameter
VIOIH
Input high voltage
VIOOH
VIOOL
IIOLEAK
Output high voltage (Production test
condition = 3.0V,
DRIVEMODE =
STANDARD)
Output low voltage
(Production test
condition = 3.0V,
DRIVEMODE =
STANDARD)
Input leakage current
Condition
Min
Typ
Max
1
0.70VDD
Unit
V
Sourcing 0.1 mA, VDD=1.98 V,
GPIO_Px_CTRL DRIVEMODE
= LOWEST
0.80VDD
V
Sourcing 0.1 mA, VDD=3.0 V,
GPIO_Px_CTRL DRIVEMODE
= LOWEST
0.90VDD
V
Sourcing 1 mA, VDD=1.98 V,
GPIO_Px_CTRL DRIVEMODE
= LOW
0.85VDD
V
Sourcing 1 mA, VDD=3.0 V,
GPIO_Px_CTRL DRIVEMODE
= LOW
0.90VDD
V
Sourcing 6 mA, VDD=1.98 V,
GPIO_Px_CTRL DRIVEMODE
= STANDARD
0.75VDD
V
Sourcing 6 mA, VDD=3.0 V,
GPIO_Px_CTRL DRIVEMODE
= STANDARD
0.85VDD
V
Sourcing 20 mA, VDD=1.98 V,
GPIO_Px_CTRL DRIVEMODE
= HIGH
0.60VDD
V
Sourcing 20 mA, VDD=3.0 V,
GPIO_Px_CTRL DRIVEMODE
= HIGH
0.80VDD
V
Sinking 0.1 mA, VDD=1.98 V,
GPIO_Px_CTRL DRIVEMODE
= LOWEST
0.20VDD
V
Sinking 0.1 mA, VDD=3.0 V,
GPIO_Px_CTRL DRIVEMODE
= LOWEST
0.10VDD
V
Sinking 1 mA, VDD=1.98 V,
GPIO_Px_CTRL DRIVEMODE
= LOW
0.10VDD
V
Sinking 1 mA, VDD=3.0 V,
GPIO_Px_CTRL DRIVEMODE
= LOW
0.05VDD
V
Sinking 6 mA, VDD=1.98 V,
GPIO_Px_CTRL DRIVEMODE
= STANDARD
0.30VDD V
Sinking 6 mA, VDD=3.0 V,
GPIO_Px_CTRL DRIVEMODE
= STANDARD
0.20VDD V
Sinking 20 mA, VDD=1.98 V,
GPIO_Px_CTRL DRIVEMODE
= HIGH
0.35VDD V
Sinking 20 mA, VDD=3.0 V,
GPIO_Px_CTRL DRIVEMODE
= HIGH
0.25VDD V
High Impedance IO connected
to GROUND or VDD
2015-05-22 - EFM32G890FXX - d0010_Rev1.90
19
±0.1
±40 nA
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Symbol
Parameter
RPU
I/O pin pull-up resistor
40
kOhm
RPD
I/O pin pull-down resistor
40
kOhm
RIOESD
Internal ESD series
resistor
200
Ohm
tIOGLITCH
Pulse width of pulses to be removed
by the glitch suppression filter
tIOOF
VIOHYST
Condition
Min
Typ
Max
Unit
10
50 ns
GPIO_Px_CTRL DRIVEMODE
= LOWEST and load capacitance CL=12.5-25pF.
20+0.1CL
250 ns
GPIO_Px_CTRL DRIVEMODE
= LOW and load capacitance
CL=350-600pF
20+0.1CL
250 ns
Output fall time
I/O pin hysteresis
(VIOTHR+ - VIOTHR-)
VDD = 1.98 - 3.8 V
0.1VDD
V
1
If the GPIO input voltage is between 0.3VDD and 0.7VDD, the current consumption will increase.
2015-05-22 - EFM32G890FXX - d0010_Rev1.90
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Figure 3.14. Typical Low-Level Output Current, 2V Supply Voltage
5
0.20
4
Low- Level Output Current [m A]
Low- Level Output Current [m A]
0.15
0.10
3
2
0.05
1
- 40°C
25°C
85°C
0.00
0.0
0.5
1.5
1.0
Low- Level Output Voltage [V]
- 40°C
25°C
85°C
0
0.0
2.0
GPIO_Px_CTRL DRIVEMODE = LOWEST
0.5
1.5
1.0
Low- Level Output Voltage [V]
2.0
GPIO_Px_CTRL DRIVEMODE = LOW
45
20
40
35
Low- Level Output Current [m A]
Low- Level Output Current [m A]
15
10
30
25
20
15
5
10
5
- 40°C
25°C
85°C
0
0.0
0.5
1.5
1.0
Low- Level Output Voltage [V]
0
0.0
2.0
GPIO_Px_CTRL DRIVEMODE = STANDARD
2015-05-22 - EFM32G890FXX - d0010_Rev1.90
- 40°C
25°C
85°C
0.5
1.5
1.0
Low- Level Output Voltage [V]
2.0
GPIO_Px_CTRL DRIVEMODE = HIGH
21
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Figure 3.15. Typical High-Level Output Current, 2V Supply Voltage
0.00
0.0
- 40°C
25°C
85°C
- 40°C
25°C
85°C
–0.5
High- Level Output Current [m A]
High- Level Output Current [m A]
–0.05
–0.10
–1.0
–1.5
–0.15
–2.0
–0.20
0.0
1.5
0.5
1.0
High- Level Output Voltage [V]
–2.5
0.0
2.0
GPIO_Px_CTRL DRIVEMODE = LOWEST
1.5
0.5
1.0
High- Level Output Voltage [V]
2.0
GPIO_Px_CTRL DRIVEMODE = LOW
0
0
- 40°C
25°C
85°C
- 40°C
25°C
85°C
–10
High- Level Output Current [m A]
High- Level Output Current [m A]
–5
–10
–20
–30
–15
–40
–20
0.0
1.5
0.5
1.0
High- Level Output Voltage [V]
–50
0.0
2.0
GPIO_Px_CTRL DRIVEMODE = STANDARD
2015-05-22 - EFM32G890FXX - d0010_Rev1.90
1.5
0.5
1.0
High- Level Output Voltage [V]
2.0
GPIO_Px_CTRL DRIVEMODE = HIGH
22
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0.5
10
0.4
8
Low- Level Output Current [m A]
Low- Level Output Current [m A]
Figure 3.16. Typical Low-Level Output Current, 3V Supply Voltage
0.3
0.2
0.1
6
4
2
- 40°C
25°C
85°C
0.0
0.0
0.5
1.5
1.0
2.0
Low- Level Output Voltage [V]
2.5
- 40°C
25°C
85°C
0
0.0
3.0
GPIO_Px_CTRL DRIVEMODE = LOWEST
0.5
1.5
1.0
2.0
Low- Level Output Voltage [V]
2.5
3.0
GPIO_Px_CTRL DRIVEMODE = LOW
40
50
35
40
Low- Level Output Current [m A]
Low- Level Output Current [m A]
30
25
20
15
30
20
10
10
5
0
0.0
- 40°C
25°C
85°C
0.5
1.5
1.0
2.0
Low- Level Output Voltage [V]
2.5
- 40°C
25°C
85°C
0
0.0
3.0
GPIO_Px_CTRL DRIVEMODE = STANDARD
2015-05-22 - EFM32G890FXX - d0010_Rev1.90
0.5
1.5
1.0
2.0
Low- Level Output Voltage [V]
2.5
3.0
GPIO_Px_CTRL DRIVEMODE = HIGH
23
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Figure 3.17. Typical High-Level Output Current, 3V Supply Voltage
0.0
0
- 40°C
25°C
85°C
- 40°C
25°C
85°C
–1
High- Level Output Current [m A]
High- Level Output Current [m A]
–0.1
–0.2
–0.3
–2
–3
–4
–0.4
–5
–0.5
0.0
0.5
1.5
1.0
2.0
High- Level Output Voltage [V]
2.5
–6
0.0
3.0
GPIO_Px_CTRL DRIVEMODE = LOWEST
2.5
3.0
0
- 40°C
25°C
85°C
- 40°C
25°C
85°C
–10
High- Level Output Current [m A]
–10
High- Level Output Current [m A]
1.5
1.0
2.0
High- Level Output Voltage [V]
GPIO_Px_CTRL DRIVEMODE = LOW
0
–20
–30
–40
–50
0.0
0.5
–20
–30
–40
0.5
1.5
1.0
2.0
High- Level Output Voltage [V]
2.5
–50
0.0
3.0
GPIO_Px_CTRL DRIVEMODE = STANDARD
2015-05-22 - EFM32G890FXX - d0010_Rev1.90
0.5
1.5
1.0
2.0
High- Level Output Voltage [V]
2.5
3.0
GPIO_Px_CTRL DRIVEMODE = HIGH
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Figure 3.18. Typical Low-Level Output Current, 3.8V Supply Voltage
0.8
14
0.7
12
Low- Level Output Current [m A]
Low- Level Output Current [m A]
0.6
0.5
0.4
0.3
10
8
6
4
0.2
2
0.1
0.0
0.0
- 40°C
25°C
85°C
0.5
1.5
1.0
2.0
2.5
Low- Level Output Voltage [V]
3.0
- 40°C
25°C
85°C
0
0.0
3.5
1.5
1.0
2.0
2.5
Low- Level Output Voltage [V]
3.0
50
50
40
40
30
20
10
30
20
10
- 40°C
25°C
85°C
0
0.0
3.5
GPIO_Px_CTRL DRIVEMODE = LOW
Low- Level Output Current [m A]
Low- Level Output Current [m A]
GPIO_Px_CTRL DRIVEMODE = LOWEST
0.5
0.5
1.5
1.0
2.0
2.5
Low- Level Output Voltage [V]
3.0
- 40°C
25°C
85°C
0
0.0
3.5
GPIO_Px_CTRL DRIVEMODE = STANDARD
2015-05-22 - EFM32G890FXX - d0010_Rev1.90
0.5
1.5
1.0
2.0
2.5
Low- Level Output Voltage [V]
3.0
3.5
GPIO_Px_CTRL DRIVEMODE = HIGH
25
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Figure 3.19. Typical High-Level Output Current, 3.8V Supply Voltage
0.0
–0.1
0
- 40°C
25°C
85°C
–1
- 40°C
25°C
85°C
–2
High- Level Output Current [m A]
High- Level Output Current [m A]
–0.2
–0.3
–0.4
–0.5
–3
–4
–5
–6
–0.6
–7
–0.7
–0.8
0.0
–8
0.5
1.5
1.0
2.0
2.5
High- Level Output Voltage [V]
3.0
–9
0.0
3.5
GPIO_Px_CTRL DRIVEMODE = LOWEST
3.0
3.5
0
- 40°C
25°C
85°C
- 40°C
25°C
85°C
–10
High- Level Output Current [m A]
–10
High- Level Output Current [m A]
1.5
1.0
2.0
2.5
High- Level Output Voltage [V]
GPIO_Px_CTRL DRIVEMODE = LOW
0
–20
–30
–40
–50
0.0
0.5
–20
–30
–40
0.5
1.5
1.0
2.0
2.5
High- Level Output Voltage [V]
3.0
–50
0.0
3.5
GPIO_Px_CTRL DRIVEMODE = STANDARD
2015-05-22 - EFM32G890FXX - d0010_Rev1.90
0.5
1.5
1.0
2.0
2.5
High- Level Output Voltage [V]
3.0
3.5
GPIO_Px_CTRL DRIVEMODE = HIGH
26
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3.9 Oscillators
3.9.1 LFXO
Table 3.8. LFXO
Symbol
Parameter
Condition
Min
Typ
Max
Unit
fLFXO
Supported nominal
crystal frequency
ESRLFXO
Supported crystal
equivalent series resistance (ESR)
CLFXOL
Supported crystal
external load range
ILFXO
Current consumption for core and
buffer after startup.
ESR=30 kOhm, CL=10 pF,
LFXOBOOST in CMU_CTRL is
1
190
nA
tLFXO
Start- up time.
ESR=30 kOhm, CL=10 pF,
40% - 60% duty cycle has
been reached, LFXOBOOST in
CMU_CTRL is 1
400
ms
32.768
30
X
1
kHz
120 kOhm
25 pF
1
See Minimum Load Capacitance (CLFXOL) Requirement For Safe Crystal Startup in Configurator in Simplicity Studio
For safe startup of a given crystal, the Configurator tool in Simplicity Studio contains a tool to help
users configure both load capacitance and software settings for using the LFXO. For details regarding
the crystal configuration, the reader is referred to application note "AN0016 EFM32 Oscillator Design
Consideration".
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3.9.2 HFXO
Table 3.9. HFXO
Symbol
Parameter
fHFXO
Supported nominal
crystal Frequency
ESRHFXO
Min
Typ
The transconductance of the HFXO
input transistor at
crystal startup
CHFXOL
Supported crystal
external load range
Current consumption for HFXO after
startup
Startup time
Max
4
HFXOBOOST in CMU_CTRL
equals 0b11
Unit
32 MHz
Supported crystal
Crystal frequency 32 MHz
equivalent series reCrystal frequency 4 MHz
sistance (ESR)
gmHFXO
IHFXO
Condition
30
60 Ohm
400
1500 Ohm
20
mS
5
25 pF
4 MHz: ESR=400 Ohm,
CL=20 pF, HFXOBOOST in
CMU_CTRL equals 0b11
85
µA
32 MHz: ESR=30 Ohm,
CL=10 pF, HFXOBOOST in
CMU_CTRL equals 0b11
165
µA
32 MHz: ESR=30 Ohm,
CL=10 pF, HFXOBOOST in
CMU_CTRL equals 0b11
400
µs
tHFXO
Pulse width removed by glitch detector
1
4 ns
3.9.3 LFRCO
Table 3.10. LFRCO
Symbol
Parameter
fLFRCO
Oscillation frequency , VDD= 3.0 V,
TAMB=25°C
tLFRCO
Startup time not including software
calibration
150
µs
ILFRCO
Current consumption
190
nA
TCLFRCO
Temperature coefficient
VCLFRCO
Supply voltage coefficient
±15
TUNESTEPL-
Frequency step
for LSB change in
TUNING value
1.5
FRCO
Condition
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Min
Typ
31.29
Max
32.768
±0.02
28
Unit
34.24 kHz
%/°C
%/V
%
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42
42
40
40
38
38
Frequency [MHz]
Frequency [MHz]
Figure 3.20. Calibrated LFRCO Frequency vs Temperature and Supply Voltage
- 40°C
25°C
85°C
36
34
34
32
32
30
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
2.0 V
3.0 V
3.8 V
36
30
–40
3.8
–15
5
25
Tem perature [°C]
45
Typ
Max
65
85
3.9.4 HFRCO
Table 3.11. HFRCO
Symbol
fHFRCO
Parameter
Oscillation frequency, VDD= 3.0 V,
TAMB=25°C
Condition
Min
28 MHz frequency band
27.16
28
28.84 MHz
21 MHz frequency band
20.37
21
21.63 MHz
14 MHz frequency band
13.58
14
14.42 MHz
11 MHz frequency band
10.67
11
11.33 MHz
6.402
1
6.798 MHz
2
1.236 MHz
7 MHz frequency band
1 MHz frequency band
Settling time after
start-up
Unit
1.164
fHFRCO = 14 MHz
6.6
1.2
0.6
Cycles
25
Cycles
tHFRCO_settling
Settling time after
band switch
IHFRCO
Current consumption (Production test
condition = 14 MHz)
DCHFRCO
Duty cycle
TUNESTEPH-
Frequency step
for LSB change in
TUNING value
FRCO
fHFRCO = 28 MHz
106
190 µA
fHFRCO = 21 MHz
93
155 µA
fHFRCO = 14 MHz
77
120 µA
fHFRCO = 11 MHz
72
110 µA
fHFRCO = 6.6 MHz
63
90 µA
fHFRCO = 1.2 MHz
22
32 µA
50
51 %
3
%
fHFRCO = 14 MHz
48.5
0.3
1
For devices with prod. rev. < 19, Typ = 7MHz and Min/Max values not applicable.
For devices with prod. rev. < 19, Typ = 1MHz and Min/Max values not applicable.
3
The TUNING field in the CMU_HFRCOCTRL register may be used to adjust the HFRCO frequency. There is enough adjustment
range to ensure that the frequency bands above 7 MHz will always have some overlap across supply voltage and temperature. By
using a stable frequency reference such as the LFXO or HFXO, a firmware calibration routine can vary the TUNING bits and the
frequency band to maintain the HFRCO frequency at any arbitrary value between 7 MHz and 28 MHz across operating conditions.
2
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1.45
1.45
1.40
1.40
1.35
1.35
Frequency [MHz]
Frequency [MHz]
Figure 3.21. Calibrated HFRCO 1 MHz Band Frequency vs Supply Voltage and Temperature
1.30
- 40°C
25°C
85°C
1.25
1.20
1.30
1.25
1.20
1.15
1.15
1.10
1.10
1.05
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
1.05
–40
3.8
2.0 V
3.0 V
3.8 V
–15
5
25
Tem perature [°C]
45
65
85
6.70
6.70
6.65
6.65
6.60
6.60
Frequency [MHz]
Frequency [MHz]
Figure 3.22. Calibrated HFRCO 7 MHz Band Frequency vs Supply Voltage and Temperature
6.55
6.50
6.45
6.40
6.50
6.45
6.40
- 40°C
25°C
85°C
6.35
6.30
2.0
6.55
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
2.0 V
3.0 V
3.8 V
6.35
6.30
–40
3.8
–15
5
25
Tem perature [°C]
45
65
85
11.2
11.2
11.1
11.1
11.0
11.0
Frequency [MHz]
Frequency [MHz]
Figure 3.23. Calibrated HFRCO 11 MHz Band Frequency vs Supply Voltage and Temperature
10.9
10.8
10.8
10.7
10.6
2.0
10.9
10.7
- 40°C
25°C
85°C
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
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3.4
3.6
10.6
–40
3.8
30
2.0 V
3.0 V
3.8 V
–15
5
25
Tem perature [°C]
45
65
85
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14.2
14.2
14.1
14.1
14.0
14.0
Frequency [MHz]
Frequency [MHz]
Figure 3.24. Calibrated HFRCO 14 MHz Band Frequency vs Supply Voltage and Temperature
13.9
13.8
13.7
13.6
13.8
13.7
13.6
- 40°C
25°C
85°C
13.5
13.4
2.0
13.9
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
2.0 V
3.0 V
3.8 V
13.5
13.4
–40
3.8
–15
5
25
Tem perature [°C]
45
65
85
21.2
21.2
21.0
21.0
Frequency [MHz]
Frequency [MHz]
Figure 3.25. Calibrated HFRCO 21 MHz Band Frequency vs Supply Voltage and Temperature
20.8
20.6
20.4
20.8
20.6
20.4
- 40°C
25°C
85°C
20.2
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
2.0 V
3.0 V
3.8 V
20.2
–40
3.8
–15
5
25
Tem perature [°C]
45
65
85
Figure 3.26. Calibrated HFRCO 28 MHz Band Frequency vs Supply Voltage and Temperature
28.2
28.4
28.2
28.0
28.0
Frequency [MHz]
Frequency [MHz]
27.8
27.6
27.4
27.8
27.6
27.4
27.2
27.2
- 40°C
25°C
85°C
27.0
26.8
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
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3.4
3.6
2.0 V
3.0 V
3.8 V
27.0
26.8
–40
3.8
31
–15
5
25
Tem perature [°C]
45
65
85
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3.9.5 AUXHFRCO
Table 3.12. AUXHFRCO
Symbol
Parameter
Condition
Min
fAUXHFRCO
Oscillation frequency, VDD= 3.0 V,
TAMB=25°C
14 MHz frequency band
tAUXHFRCO_settlingSettling time after
start-up
fAUXHFRCO = 14 MHz
DCAUXHFRCO
fAUXHFRCO = 14 MHz
Duty cycle
Typ
13.580
Max
14.0
14.420 MHz
0.6
48.5
TUNESTEPAUX- Frequency step
for LSB change in
HFRCO
TUNING value
Unit
Cycles
50
51 %
1
%
0.3
1
The TUNING field in the CMU_AUXHFRCOCTRL register may be used to adjust the AUXHFRCO frequency. By using a stable
frequency reference such as the LFXO or HFXO, a firmware calibration routine can vary the TUNING bits and the frequency band
to maintain the AUXHFRCO frequency at any arbitrary value in the 14 MHz range across operating conditions.
3.9.6 ULFRCO
Table 3.13. ULFRCO
Symbol
Parameter
Condition
Min
Typ
Max
fULFRCO
Oscillation frequency
25°C, 3V
TCULFRCO
Temperature coefficient
0.05
%/°C
VCULFRCO
Supply voltage coefficient
-18.2
%/V
0.70
Unit
1.75 kHz
3.10 Analog Digital Converter (ADC)
Table 3.14. ADC
Symbol
Parameter
VADCIN
Input voltage range
Condition
Min
Single ended
Differential
VADCREFIN
Input range of external reference voltage, single ended
and differential
Typ
Max
Unit
0
VREF V
-VREF/2
VREF/2 V
1.25
VDD V
VADCREFIN_CH7 Input range of external negative reference voltage on
channel 7
See VADCREFIN
0
VDD - 1.1 V
VADCREFIN_CH6 Input range of external positive reference voltage on
channel 6
See VADCREFIN
0.625
VDD V
0
VDD V
VADCCMIN
Common mode input range
IADCIN
Input current
2pF sampling capacitors
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Symbol
Parameter
CMRRADC
Analog input common mode rejection
ratio
IADC
Average active current
CADCIN
Input capacitance
RADCIN
Input ON resistance
RADCFILT
Input RC filter resistance
CADCFILT
Input RC filter/decoupling capacitance
fADCCLK
ADC Clock Frequency
tADCCONV
Min
Typ
Max
Acquisition time
tADCACQVDD3
Required acquisition time for VDD/3
reference
Unit
65
dB
1 MSamples/s, 12 bit, external
reference
351
µA
1 MSamples/s, 12 bit, internal
reference
411
µA
10 kSamples/s 12 bit, internal
1.25 V reference, WARMUPMODE in ADCn_CTRL set to
0b00, ADC_CLK running at
13MHz
67
µA
10 kSamples/s 12 bit, internal
1.25 V reference, WARMUPMODE in ADCn_CTRL set to
0b01, ADC_CLK running at
13MHz
63
µA
10 kSamples/s 12 bit, internal
1.25 V reference, WARMUPMODE in ADCn_CTRL set to
0b10, ADC_CLK running at
13MHz
64
µA
2
pF
1
MOhm
10
250
kOhm
fF
13 MHz
6 bit
7
ADCCLK
Cycles
8 bit
11
ADCCLK
Cycles
12 bit
13
ADCCLK
Cycles
1
256 ADCCLK
Cycles
Conversion time
tADCACQ
tADCSTART
Condition
Programmable
2
µs
Startup time of reference generator
and ADC core in
NORMAL mode
5
µs
Startup time of reference generator
and ADC core in
1
µs
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Symbol
Parameter
Condition
Min
Typ
Max
Unit
KEEPADCWARM
mode
SNRADC
Signal to Noise Ratio (SNR)
1 MSamples/s, 12 bit, single
ended, internal 1.25V reference
59
dB
1 MSamples/s, 12 bit, single
ended, internal 2.5V reference
63
dB
1 MSamples/s, 12 bit, single
ended, VDD reference
65
dB
1 MSamples/s, 12 bit, differential, internal 1.25V reference
60
dB
1 MSamples/s, 12 bit, differential, internal 2.5V reference
65
dB
1 MSamples/s, 12 bit, differential, 5V reference
54
dB
1 MSamples/s, 12 bit, differential, VDD reference
67
dB
1 MSamples/s, 12 bit, differential, 2xVDD reference
69
dB
200 kSamples/s, 12 bit, single ended, internal 1.25V reference
62
dB
200 kSamples/s, 12 bit, single
ended, internal 2.5V reference
63
dB
200 kSamples/s, 12 bit, single
ended, VDD reference
67
dB
200 kSamples/s, 12 bit, differential, internal 1.25V reference
63
dB
200 kSamples/s, 12 bit, differential, internal 2.5V reference
66
dB
200 kSamples/s, 12 bit, differential, 5V reference
66
dB
69
dB
200 kSamples/s, 12 bit, differential, 2xVDD reference
70
dB
1 MSamples/s, 12 bit, single
ended, internal 1.25V reference
58
dB
1 MSamples/s, 12 bit, single
ended, internal 2.5V reference
62
dB
1 MSamples/s, 12 bit, single
ended, VDD reference
64
dB
1 MSamples/s, 12 bit, differential, internal 1.25V reference
60
dB
1 MSamples/s, 12 bit, differential, internal 2.5V reference
64
dB
1 MSamples/s, 12 bit, differential, 5V reference
54
dB
200 kSamples/s, 12 bit, differential, VDD reference
SINADADC
SIgnal-to-Noise
And Distortion-ratio
(SINAD)
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Symbol
Parameter
Condition
Min
Spurious-Free Dynamic Range (SFDR)
Max
Unit
1 MSamples/s, 12 bit, differential, VDD reference
66
dB
1 MSamples/s, 12 bit, differential, 2xVDD reference
68
dB
200 kSamples/s, 12 bit, single ended, internal 1.25V reference
61
dB
200 kSamples/s, 12 bit, single
ended, internal 2.5V reference
65
dB
200 kSamples/s, 12 bit, single
ended, VDD reference
66
dB
200 kSamples/s, 12 bit, differential, internal 1.25V reference
63
dB
200 kSamples/s, 12 bit, differential, internal 2.5V reference
66
dB
200 kSamples/s, 12 bit, differential, 5V reference
66
dB
68
dB
200 kSamples/s, 12 bit, differential, 2xVDD reference
69
dB
1 MSamples/s, 12 bit, single
ended, internal 1.25V reference
64
dBc
1 MSamples/s, 12 bit, single
ended, internal 2.5V reference
76
dBc
1 MSamples/s, 12 bit, single
ended, VDD reference
73
dBc
1 MSamples/s, 12 bit, differential, internal 1.25V reference
66
dBc
1 MSamples/s, 12 bit, differential, internal 2.5V reference
77
dBc
1 MSamples/s, 12 bit, differential, VDD reference
76
dBc
1 MSamples/s, 12 bit, differential, 2xVDD reference
75
dBc
1 MSamples/s, 12 bit, differential, 5V reference
69
dBc
200 kSamples/s, 12 bit, single ended, internal 1.25V reference
75
dBc
200 kSamples/s, 12 bit, single
ended, internal 2.5V reference
75
dBc
200 kSamples/s, 12 bit, single
ended, VDD reference
76
dBc
200 kSamples/s, 12 bit, differential, internal 1.25V reference
79
dBc
200 kSamples/s, 12 bit, differential, internal 2.5V reference
79
dBc
200 kSamples/s, 12 bit, differential, VDD reference
SFDRADC
Typ
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Symbol
Parameter
Condition
Min
Typ
200 kSamples/s, 12 bit, differential, 5V reference
200 kSamples/s, 12 bit, differential, VDD reference
68
200 kSamples/s, 12 bit, differential, 2xVDD reference
After calibration, single ended
VADCOFFSET
-4
Unit
78
dBc
79
dBc
79
dBc
0.3
4 mV
0.3
mV
Offset voltage
After calibration, differential
TGRADADCTH
Max
Thermometer output gradient
DNLADC
Differential non-linearity (DNL)
VDD = 3.0 V, external 2.5V reference
INLADC
Integral non-linearity (INL), End point
method
VDD = 3.0 V, external 2.5V reference
MCADC
No missing codes
-1
11.999
1
-1.92
mV/°C
-6.3
ADC
Codes/
°C
±0.7
4 LSB
±1.2
±3 LSB
12
bits
1
On the average every ADC will have one missing code, most likely to appear around 2048 ± n*512 where n can be a value in
the set {-3, -2, -1, 1, 2, 3}. There will be no missing code around 2048, and in spite of the missing code the ADC will be monotonic
at all times so that a response to a slowly increasing input will always be a slowly increasing output. Around the one code that is
missing, the neighbour codes will look wider in the DNL plot. The spectra will show spurs on the level of -78dBc for a full scale
input for chips that have the missing code issue.
The integral non-linearity (INL) and differential non-linearity parameters are explained in Figure 3.27 (p.
36) and Figure 3.28 (p. 37) , respectively.
Figure 3.27. Integral Non-Linearity (INL)
Digital ouput code
INL= | [(VD- VSS)/ VLSBIDEAL] - D| where 0 < D < 2 N - 1
4095
4094
4093
4092
Actual ADC
tranfer function
before offset and
gain correction
Actual ADC
tranfer function
after offset and
gain correction
INL Error
(End Point INL)
3
Ideal transfer
curve
2
1
VOFFSET
0
Analog Input
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Figure 3.28. Differential Non-Linearity (DNL)
Digital
ouput
code
DNL= | [(VD+ 1 - VD)/ VLSBIDEAL] - 1| where 0 < D < 2 N - 2
Full Scale Range
4095
4094
Example: Adjacent
input value VD+ 1
corrresponds to digital
output code D+ 1
4093
4092
Actual transfer
function with one
m issing code.
Example: Input value
VD corrresponds to
digital output code D
Code width = 2 LSB
DNL= 1 LSB
Ideal transfer
curve
5
0.5
LSB
Ideal spacing
between two
adjacent codes
VLSBIDEAL= 1 LSB
4
3
2
1
Ideal 50%
Transition Point
Ideal Code Center
0
Analog Input
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3.10.1 Typical performance
Figure 3.29. ADC Frequency Spectrum, Vdd = 3V, Temp = 25°C
1.25V Reference
2.5V Reference
2XVDDVSS Reference
5VDIFF Reference
VDD Reference
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Figure 3.30. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25°C
1.25V Reference
2.5V Reference
2XVDDVSS Reference
5VDIFF Reference
VDD Reference
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Figure 3.31. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25°C
1.25V Reference
2.5V Reference
2XVDDVSS Reference
5VDIFF Reference
VDD Reference
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Figure 3.32. ADC Absolute Offset, Common Mode = Vdd /2
5
2.0
Vref= 1V25
Vref= 2V5
Vref= 2XVDDVSS
Vref= 5VDIFF
Vref= VDD
4
1.5
2
1.0
Actual Offset [LSB]
Actual Offset [LSB]
3
VRef= 1V25
VRef= 2V5
VRef= 2XVDDVSS
VRef= 5VDIFF
VRef= VDD
1
0
–1
0.5
0.0
–2
–0.5
–3
–4
2.0
2.2
2.4
2.6
2.8
3.0
Vdd (V)
3.2
3.4
3.6
–1.0
–40
3.8
Offset vs Supply Voltage, Temp = 25°C
–15
5
45
25
Tem p (C)
65
85
Offset vs Temperature, Vdd = 3V
Figure 3.33. ADC Dynamic Performance vs Temperature for all ADC References, Vdd = 3V
79.4
71
2XVDDVSS
70
1V25
79.2
Vdd
69
79.0
67
5VDIFF
2V5
66
SFDR [dB]
SNR [dB]
68
Vdd
2V5
78.8
78.6
2XVDDVSS
78.4
65
78.2
64
63
–40
–15
5
25
Tem perature [°C]
45
65
5VDIFF
1V25
85
78.0
–40
Signal to Noise Ratio (SNR)
–15
5
25
Tem perature [°C]
45
65
85
Spurious-Free Dynamic Range (SFDR)
3.11 Digital Analog Converter (DAC)
Table 3.15. DAC
Symbol
Parameter
VDACOUT
Output voltage
range
VDACCM
IDAC
Condition
Min
Max
Unit
VDD voltage reference, single
ended
0
VDD V
VDD voltage reference, differential
-VDD
VDD V
0
VDD V
Output common
mode voltage range
Active current including references
for 2 channels
Typ
500 kSamples/s, 12bit
400
1
650 µA
100 kSamples/s, 12 bit
200
1
250 µA
1
25 µA
1 kSamples/s 12 bit
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Symbol
Parameter
SRDAC
Sample rate
fDAC
DAC clock frequency
Condition
Min
Typ
Max
500 ksamples/s
Continuous Mode
CYCDACCONV
Clock cyckles per
conversion
tDACCONV
Conversion time
tDACSETTLE
Settling time
SNRDAC
SNDRDAC
SFDRDAC
VDACOFFSET
VDACSHMDRIFT
Signal to Noise Ratio (SNR)
Signal to Noisepulse Distortion Ratio (SNDR)
Spurious-Free
Dynamic
Range(SFDR)
Unit
1000 kHz
Sample/Hold Mode
250 kHz
Sample/Off Mode
250 kHz
2
2
µs
5
µs
500 kSamples/s, 12 bit, single ended, internal 1.25V reference
58
dB
500 kSamples/s, 12 bit, single
ended, internal 2.5V reference
59
dB
500 kSamples/s, 12 bit, differential, internal 1.25V reference
58
dB
500 kSamples/s, 12 bit, differential, internal 2.5V reference
58
dB
500 kSamples/s, 12 bit, differential, VDD reference
59
dB
500 kSamples/s, 12 bit, single ended, internal 1.25V reference
57
dB
500 kSamples/s, 12 bit, single
ended, internal 2.5V reference
54
dB
500 kSamples/s, 12 bit, differential, internal 1.25V reference
56
dB
500 kSamples/s, 12 bit, differential, internal 2.5V reference
53
dB
500 kSamples/s, 12 bit, differential, VDD reference
55
dB
500 kSamples/s, 12 bit, single ended, internal 1.25V reference
62
dBc
500 kSamples/s, 12 bit, single
ended, internal 2.5V reference
56
dBc
500 kSamples/s, 12 bit, differential, internal 1.25V reference
61
dBc
500 kSamples/s, 12 bit, differential, internal 2.5V reference
55
dBc
500 kSamples/s, 12 bit, differential, VDD reference
60
dBc
After calibration, single ended
2
mV
After calibration, differential
2
mV
Offset voltage
Sample-hold mode
voltage drift
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Symbol
Parameter
Condition
Min
Typ
Max
Unit
DNLDAC
Differential non-linearity
±1
LSB
INLDAC
Integral non-linearity
±5
LSB
MCDAC
No missing codes
12
bits
1
Measured with a static input code and no loading on the output.
3.12 Analog Comparator (ACMP)
Table 3.16. ACMP
Symbol
Parameter
VACMPIN
Input voltage range
0
VDD V
VACMPCM
ACMP Common
Mode voltage range
0
VDD V
IACMP
Active current
Condition
Min
Typ
Current consumption of internal voltage reference
Unit
BIASPROG=0b0000, FULLBIAS=0 and HALFBIAS=1 in
ACMPn_CTRL register
55
600 nA
BIASPROG=0b1111, FULLBIAS=0 and HALFBIAS=0 in
ACMPn_CTRL register
2.82
12 µA
BIASPROG=0b1111, FULLBIAS=1 and HALFBIAS=0 in
ACMPn_CTRL register
195
520 µA
0
0.5 µA
Internal voltage reference,
LPREF=1
0.050
3 µA
Internal voltage reference,
LPREF=0
6
µA
0
12 mV
Internal voltage reference off.
Using external voltage reference
IACMPREF
Max
VACMPOFFSET
Offset voltage
BIASPROG= 0b1010, FULLBIAS=0 and HALFBIAS=0 in
ACMPn_CTRL register
VACMPHYST
ACMP hysteresis
Programmable
17
mV
CSRESSEL=0b00 in
ACMPn_INPUTSEL
39
kOhm
CSRESSEL=0b01 in
ACMPn_INPUTSEL
71
kOhm
CSRESSEL=0b10 in
ACMPn_INPUTSEL
104
kOhm
CSRESSEL=0b11 in
ACMPn_INPUTSEL
136
kOhm
RCSRES
tACMPSTART
Capacitive Sense
Internal Resistance
Startup time
-12
10 µs
The total ACMP current is the sum of the contributions from the ACMP and its internal voltage reference
as given in Equation 3.1 (p. 43) . IACMPREF is zero if an external voltage reference is used.
Total ACMP Active Current
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IACMPTOTAL = IACMP + IACMPREF
(3.1)
Figure 3.34. ACMP Characteristics, Vdd = 3V, Temp = 25°C, FULLBIAS = 0, HALFBIAS = 1
4.5
2.5
HYSTSEL= 0.0
HYSTSEL= 2.0
HYSTSEL= 4.0
HYSTSEL= 6.0
4.0
3.5
Response Tim e [us]
Current [uA]
2.0
1.5
1.0
3.0
2.5
2.0
1.5
1.0
0.5
0.5
0.0
4
8
ACMP_CTRL_BIASPROG
0
0.0
12
Current consumption, HYSTSEL = 4
0
2
4
6
8
10
ACMP_CTRL_BIASPROG
12
14
Response time
100
BIASPROG= 0.0
BIASPROG= 4.0
BIASPROG= 8.0
BIASPROG= 12.0
Hysteresis [m V]
80
60
40
20
0
0
1
2
4
3
ACMP_CTRL_HYSTSEL
5
6
7
Hysteresis
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3.13 Voltage Comparator (VCMP)
Table 3.17. VCMP
Symbol
Parameter
VVCMPIN
Input voltage range
VDD
V
VVCMPCM
VCMP Common
Mode voltage range
VDD
V
IVCMP
Condition
Min
Typ
Max
Unit
BIASPROG=0b0000 and
HALFBIAS=1 in VCMPn_CTRL
register
0.3
1 µA
BIASPROG=0b1111 and
HALFBIAS=0 in VCMPn_CTRL
register. LPREF=0.
22
30 µA
NORMAL
10
µs
Single ended
10
mV
Differential
10
mV
17
mV
Active current
tVCMPREF
Startup time reference generator
VVCMPOFFSET
Offset voltage
VVCMPHYST
VCMP hysteresis
tVCMPSTART
Startup time
10 µs
The VDD trigger level can be configured by setting the TRIGLEVEL field of the VCMP_CTRL register in
accordance with the following equation:
VCMP Trigger Level as a Function of Level Setting
VDD Trigger Level=1.667V+0.034 ×TRIGLEVEL
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3.14 LCD
Table 3.18. LCD
Symbol
Parameter
fLCDFR
Frame rate
NUMSEG
Number of segments supported
VLCD
LCD supply voltage
range
Condition
Min
Max
30
Unit
200 Hz
4×40
Internal boost circuit enabled
2.0
seg
3.8 V
Display disconnected, static mode, framerate 32 Hz, all
segments on.
250
nA
550
nA
0
µA
Internal voltage boost on,
boosting from 2.2 V to 3.0 V.
8.4
µA
VBLEV of LCD_DISPCTRL
register to LEVEL0
3.0
V
VBLEV of LCD_DISPCTRL
register to LEVEL1
3.08
V
VBLEV of LCD_DISPCTRL
register to LEVEL2
3.17
V
VBLEV of LCD_DISPCTRL
register to LEVEL3
3.26
V
VBLEV of LCD_DISPCTRL
register to LEVEL4
3.34
V
VBLEV of LCD_DISPCTRL
register to LEVEL5
3.43
V
VBLEV of LCD_DISPCTRL
register to LEVEL6
3.52
V
VBLEV of LCD_DISPCTRL
register to LEVEL7
3.6
V
ILCD
Steady state current
consumption.
Display disconnected, quadruplex mode, framerate 32
Hz, all segments on, bias
mode to ONETHIRD in
LCD_DISPCTRL register.
Internal voltage boost off
ILCDBOOST
Steady state Current contribution of
internal boost.
VBOOST
Typ
Boost Voltage
The total LCD current is given by Equation 3.3 (p. 46) . ILCDBOOST is zero if internal boost is off.
Total LCD Current Based on Operational Mode and Internal Boost
ILCDTOTAL = ILCD + ILCDBOOST
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3.15 I2C
Table 3.19. I2C Standard-mode (Sm)
Symbol
Parameter
Min
Typ
Max
fSCL
SCL clock frequency
tLOW
SCL clock low time
4.7
µs
tHIGH
SCL clock high time
4.0
µs
tSU,DAT
SDA set-up time
250
0
Unit
100
1
kHz
ns
2,3
tHD,DAT
SDA hold time
8
3450
ns
tSU,STA
Repeated START condition set-up time
4.7
µs
tHD,STA
(Repeated) START condition hold time
4.0
µs
tSU,STO
STOP condition set-up time
4.0
µs
tBUF
Bus free time between a STOP and START condition
4.7
µs
1
For the minimum HFPERCLK frequency required in Standard-mode, see the I2C chapter in the EFM32G Reference Manual.
The maximum SDA hold time (tHD,DAT) needs to be met only when the device does not stretch the low time of SCL (tLOW).
3
-9
When transmitting data, this number is guaranteed only when I2Cn_CLKDIV < ((3450*10 [s] * fHFPERCLK [Hz]) - 4).
2
Table 3.20. I2C Fast-mode (Fm)
Symbol
Parameter
Min
Typ
fSCL
SCL clock frequency
tLOW
SCL clock low time
1.3
µs
tHIGH
SCL clock high time
0.6
µs
tSU,DAT
SDA set-up time
100
ns
tHD,DAT
SDA hold time
tSU,STA
Repeated START condition set-up time
0.6
µs
tHD,STA
(Repeated) START condition hold time
0.6
µs
tSU,STO
STOP condition set-up time
0.6
µs
tBUF
Bus free time between a STOP and START condition
1.3
µs
0
8
Max
Unit
400
1
2,3
900
kHz
ns
1
For the minimum HFPERCLK frequency required in Fast-mode, see the I2C chapter in the EFM32G Reference Manual.
The maximum SDA hold time (tHD,DAT) needs to be met only when the device does not stretch the low time of SCL (tLOW).
3
-9
When transmitting data, this number is guaranteed only when I2Cn_CLKDIV < ((900*10 [s] * fHFPERCLK [Hz]) - 4).
2
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Table 3.21. I2C Fast-mode Plus (Fm+)
Symbol
Parameter
Min
Typ
Max
Unit
fSCL
SCL clock frequency
tLOW
SCL clock low time
0.5
µs
tHIGH
SCL clock high time
0.26
µs
tSU,DAT
SDA set-up time
50
ns
tHD,DAT
SDA hold time
8
ns
tSU,STA
Repeated START condition set-up time
0.26
µs
tHD,STA
(Repeated) START condition hold time
0.26
µs
tSU,STO
STOP condition set-up time
0.26
µs
tBUF
Bus free time between a STOP and START condition
0.5
µs
1
0
1000
kHz
1
For the minimum HFPERCLK frequency required in Fast-mode Plus, see the I2C chapter in the EFM32G Reference Manual.
3.16 Digital Peripherals
Table 3.22. Digital Peripherals
Symbol
Parameter
Condition
Min
IUSART
USART current
USART idle current, clock enabled
IUART
UART current
ILEUART
Typ
Max
Unit
7.5
µA/
MHz
UART idle current, clock enabled
5.63
µA/
MHz
LEUART current
LEUART idle current, clock enabled
150
nA
II2C
I2C current
I2C idle current, clock enabled
6.25
µA/
MHz
ITIMER
TIMER current
TIMER_0 idle current, clock
enabled
8.75
µA/
MHz
ILETIMER
LETIMER current
LETIMER idle current, clock
enabled
150
nA
IPCNT
PCNT current
PCNT idle current, clock enabled
100
nA
IRTC
RTC current
RTC idle current, clock enabled
100
nA
ILCD
LCD current
LCD idle current, clock enabled
100
nA
IAES
AES current
AES idle current, clock enabled
2.5
µA/
MHz
IGPIO
GPIO current
GPIO idle current, clock enabled
5.31
µA/
MHz
IEBI
EBI current
EBI idle current, clock enabled
1.56
µA/
MHz
IPRS
PRS current
PRS idle current
2,81
µA/
MHz
IDMA
DMA current
Clock enable
8.12
µA/
MHz
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4 Pinout and Package
Note
Please refer to the application note "AN0002 EFM32 Hardware Design Considerations" for
guidelines on designing Printed Circuit Boards (PCB's) for the EFM32G890.
4.1 Pinout
The EFM32G890 pinout is shown in Figure 4.1 (p. 49) and Table 4.1 (p. 49). Alternate locations
are denoted by "#" followed by the location number (Multiple locations on the same pin are split with "/").
Alternate locations can be configured in the LOCATION bitfield in the *_ROUTE register in the module
in question.
Figure 4.1. EFM32G890 Pinout (top view, not to scale)
Table 4.1. Device Pinout
Pin Alternate Functionality / Description
Pin #
BGA112 Pin#
and Name
Pin Name
Analog
EBI
A1
PE15
LCD_SEG11
EBI_AD07 #0
LEU0_RX #2
A2
PE14
LCD_SEG10
EBI_AD06 #0
LEU0_TX #2
A3
PE12
LCD_SEG8
EBI_AD04 #0
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TIM1_CC2 #1
49
Communication
Other
US0_CLK #0
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Pin Alternate Functionality / Description
Pin #
BGA112 Pin#
and Name
Pin Name
Analog
EBI
Timers
A4
PE9
LCD_SEG5
EBI_AD01 #0
PCNT2_S1IN #1
A5
PD10
LCD_SEG29
EBI_CS1 #0
A6
PF7
LCD_SEG25
A7
PF5
LCD_SEG3
EBI_REn #0
TIM0_CDTI2 #2
A8
PF4
LCD_SEG2
EBI_WEn #0
TIM0_CDTI1 #2
A9
PE4
LCD_COM0
A10
PC14
ACMP1_CH6
TIM0_CDTI1 #1/3
TIM1_CC1 #0
PCNT0_S1IN #0
U0_TX #3
A11
PC15
ACMP1_CH7
TIM0_CDTI2 #1/3
TIM1_CC2 #0
U0_RX #3
DBG_SWO #1
B1
PA15
LCD_SEG12
EBI_AD08 #0
B2
PE13
LCD_SEG9
EBI_AD05 #0
US0_CS #0
ACMP0_O #0
B3
PE11
LCD_SEG7
EBI_AD03 #0
TIM1_CC1 #1
US0_RX #0
BOOT_RX
B4
PE8
LCD_SEG4
EBI_AD00 #0
PCNT2_S0IN #1
B5
PD11
LCD_SEG30
EBI_CS2 #0
B6
PF8
LCD_SEG26
TIM0_CC2 #2
B7
PF6
LCD_SEG24
TIM0_CC0 #2
B8
PF3
LCD_SEG1
B9
PE5
LCD_COM1
B10
PC12
ACMP1_CH4
B11
PC13
ACMP1_CH5
C1
PA1
LCD_SEG14
EBI_AD10 #0
TIM0_CC1 #0/1
I2C0_SCL #0
C2
PA0
LCD_SEG13
EBI_AD09 #0
TIM0_CC0 #0/1
I2C0_SDA #0
C3
PE10
LCD_SEG6
EBI_AD02 #0
TIM1_CC0 #1
US0_TX #0
C4
PD13
C5
PD12
LCD_SEG31
EBI_CS3 #0
C6
PF9
LCD_SEG27
C7
VSS
C8
PF2
LCD_SEG0
C9
PE6
LCD_COM2
C10
PC10
ACMP1_CH2
C11
PC11
ACMP1_CH3
D1
PA3
LCD_SEG16
EBI_AD12 #0
TIM0_CDTI0 #0
D2
PA2
LCD_SEG15
EBI_AD11 #0
TIM0_CC2 #0/1
D3
PB15
D4
VSS
D5
IOVDD_6
Digital IO power supply 6.
D6
PD9
LCD_SEG28
TIM0_CC1 #2
Communication
Other
U0_RX #0
US0_CS #1
EBI_ALE #0
U0_TX #0
TIM0_CDTI0 #2
US0_CLK #1
CMU_CLK0 #1
TIM0_CDTI0 #1/3
TIM1_CC0 #0
PCNT0_S0IN #0
CMU_CLK1 #0
BOOT_TX
Ground.
ACMP1_O #0
DBG_SWO #0
EBI_ARDY #0
US0_RX #1
TIM2_CC2 #2
US0_RX #2
US0_TX #2
U0_TX #2
CMU_CLK0 #0
Ground.
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Pin Alternate Functionality / Description
Pin #
BGA112 Pin#
and Name
Pin Name
Analog
EBI
Timers
Communication
D7
IOVDD_5
Digital IO power supply 5.
D8
PF1
D9
PE7
LCD_COM3
D10
PC8
ACMP1_CH0
TIM2_CC0 #2
US0_CS #2
D11
PC9
ACMP1_CH1
TIM2_CC1 #2
US0_CLK #2
E1
PA6
LCD_SEG19
EBI_AD15 #0
E2
PA5
LCD_SEG18
EBI_AD14 #0
TIM0_CDTI2 #0
LEU1_TX #1
E3
PA4
LCD_SEG17
EBI_AD13 #0
TIM0_CDTI1 #0
U0_RX #2
E4
PB0
LCD_SEG32
E8
PF0
LETIM0_OUT0 #2
E9
PE0
PCNT0_S0IN #1
U0_TX #1
E10
PE1
PCNT0_S1IN #1
U0_RX #1
E11
PE3
F1
PB1
LCD_SEG33
TIM1_CC1 #2
F2
PB2
LCD_SEG34
TIM1_CC2 #2
F3
PB3
LCD_SEG20
PCNT1_S0IN #1
US2_TX #1
F4
PB4
LCD_SEG21
PCNT1_S1IN #1
US2_RX #1
F8
VDD_DREG
Power supply for on-chip voltage regulator.
F9
VSS_DREG
Ground for on-chip voltage regulator.
F10
PE2
F11
DECOUPLE
G1
PB5
LCD_SEG22
US2_CLK #1
G2
PB6
LCD_SEG23
US2_CS #1
G3
VSS
G4
IOVDD_0
Digital IO power supply 0.
G8
IOVDD_4
Digital IO power supply 4.
G9
VSS
G10
PC6
ACMP0_CH6
LEU1_TX #0
I2C0_SDA #2
G11
PC7
ACMP0_CH7
LEU1_RX #0
I2C0_SCL #2
H1
PC0
ACMP0_CH0
H2
PC2
ACMP0_CH2
H3
PD14
H4
PA7
LCD_SEG35
H5
PA8
LCD_SEG36
H6
VSS
H7
IOVDD_3
H8
PD8
H9
PD5
LETIM0_OUT1 #2
Other
DBG_SWDIO #0/1
US0_TX #1
LEU1_RX #1
TIM1_CC0 #2
DBG_SWCLK #0/1
ACMP1_O #1
ACMP0_O #1
Decouple output for on-chip voltage regulator. An external capacitance of size CDECOUPLE is required at this pin.
Ground.
Ground.
PCNT0_S0IN #2
US1_TX #0
US2_TX #0
I2C0_SDA #3
TIM2_CC0 #0
Ground.
Digital IO power supply 3.
CMU_CLK1 #1
ADC0_CH5
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Pin Alternate Functionality / Description
Pin #
BGA112 Pin#
and Name
Pin Name
Analog
H10
PD6
H11
EBI
Timers
Communication
Other
ADC0_CH6
LETIM0_OUT0 #0
I2C0_SDA #1
PD7
ADC0_CH7
LETIM0_OUT1 #0
I2C0_SCL #1
J1
PC1
ACMP0_CH1
PCNT0_S1IN #2
US1_RX #0
J2
PC3
ACMP0_CH3
J3
PD15
J4
PA12
LCD_BCAP_P
TIM2_CC0 #1
J5
PA9
LCD_SEG37
TIM2_CC1 #0
J6
PA10
LCD_SEG38
TIM2_CC2 #0
J7
PB9
J8
PB10
J9
PD2
ADC0_CH2
TIM0_CC1 #3
US1_CLK #1
J10
PD3
ADC0_CH3
TIM0_CC2 #3
US1_CS #1
J11
PD4
ADC0_CH4
LEU0_TX #0
K1
PB7
LFXTAL_P
US1_CLK #0
K2
PC4
ACMP0_CH4
LETIM0_OUT0 #3
PCNT1_S0IN #0
K3
PA13
LCD_BCAP_N
TIM2_CC1 #1
K4
VSS
K5
PA11
K6
RESETn
Reset input, active low.
To apply an external reset source to this pin, it is required to only drive this pin low during reset, and let the internal pull-up ensure
that reset is released.
K7
AVSS_1
Analog ground 1.
K8
AVDD_2
Analog power supply 2.
K9
AVDD_1
Analog power supply 1.
K10
AVSS_0
Analog ground 0.
K11
PD1
ADC0_CH1
L1
PB8
LFXTAL_N
L2
PC5
ACMP0_CH5
LETIM0_OUT1 #3
PCNT1_S1IN #0
L3
PA14
LCD_BEXT
TIM2_CC2 #1
L4
IOVDD_1
Digital IO power supply 1.
L5
PB11
DAC0_OUT0
LETIM0_OUT0 #1
L6
PB12
DAC0_OUT1
LETIM0_OUT1 #1
L7
AVSS_2
L8
PB13
HFXTAL_P
LEU0_TX #1
L9
PB14
HFXTAL_N
LEU0_RX #1
L10
AVDD_0
Analog power supply 0.
L11
PD0
ADC0_CH0
US2_RX #0
I2C0_SCL #3
US2_CLK #0
Ground.
LCD_SEG39
TIM0_CC0 #3
PCNT2_S1IN #0
US1_RX #1
US1_CS #0
US2_CS #0
Analog ground 2.
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4.2 Alternate Functionality Pinout
A wide selection of alternate functionality is available for multiplexing to various pins. This is shown in
Table 4.2 (p. 53) . The table shows the name of the alternate functionality in the first column, followed
by columns showing the possible LOCATION bitfield settings.
Note
Some functionality, such as analog interfaces, do not have alternate settings or a LOCATION bitfield. In these cases, the pinout is shown in the column corresponding to LOCATION 0.
Table 4.2. Alternate functionality overview
Alternate
LOCATION
Functionality
0
1
2
3
Description
ACMP0_CH0
PC0
Analog comparator ACMP0, channel 0.
ACMP0_CH1
PC1
Analog comparator ACMP0, channel 1.
ACMP0_CH2
PC2
Analog comparator ACMP0, channel 2.
ACMP0_CH3
PC3
Analog comparator ACMP0, channel 3.
ACMP0_CH4
PC4
Analog comparator ACMP0, channel 4.
ACMP0_CH5
PC5
Analog comparator ACMP0, channel 5.
ACMP0_CH6
PC6
Analog comparator ACMP0, channel 6.
ACMP0_CH7
PC7
Analog comparator ACMP0, channel 7.
ACMP0_O
PE13
ACMP1_CH0
PC8
Analog comparator ACMP1, channel 0.
ACMP1_CH1
PC9
Analog comparator ACMP1, channel 1.
ACMP1_CH2
PC10
Analog comparator ACMP1, channel 2.
ACMP1_CH3
PC11
Analog comparator ACMP1, channel 3.
ACMP1_CH4
PC12
Analog comparator ACMP1, channel 4.
ACMP1_CH5
PC13
Analog comparator ACMP1, channel 5.
ACMP1_CH6
PC14
Analog comparator ACMP1, channel 6.
ACMP1_CH7
PC15
Analog comparator ACMP1, channel 7.
ACMP1_O
PF2
ADC0_CH0
PD0
Analog to digital converter ADC0, input channel number 0.
ADC0_CH1
PD1
Analog to digital converter ADC0, input channel number 1.
ADC0_CH2
PD2
Analog to digital converter ADC0, input channel number 2.
ADC0_CH3
PD3
Analog to digital converter ADC0, input channel number 3.
ADC0_CH4
PD4
Analog to digital converter ADC0, input channel number 4.
ADC0_CH5
PD5
Analog to digital converter ADC0, input channel number 5.
ADC0_CH6
PD6
Analog to digital converter ADC0, input channel number 6.
ADC0_CH7
PD7
Analog to digital converter ADC0, input channel number 7.
BOOT_RX
PE11
Bootloader RX.
BOOT_TX
PE10
Bootloader TX.
CMU_CLK0
PA2
PC12
Clock Management Unit, clock output number 0.
CMU_CLK1
PA1
PD8
Clock Management Unit, clock output number 1.
DAC0_OUT0
PB11
Digital to Analog Converter DAC0 output channel number 0.
DAC0_OUT1
PB12
Digital to Analog Converter DAC0 output channel number 1.
PE2
Analog comparator ACMP0, digital output.
PE3
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Analog comparator ACMP1, digital output.
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Alternate
LOCATION
Functionality
0
1
2
3
Description
Debug-interface Serial Wire clock input.
DBG_SWCLK
PF0
PF0
DBG_SWDIO
PF1
PF1
Note that this function is enabled to pin out of reset, and has a built-in pull
down.
Debug-interface Serial Wire data input / output.
Note that this function is enabled to pin out of reset, and has a built-in pull up.
Debug-interface Serial Wire viewer Output.
DBG_SWO
PF2
PC15
EBI_AD00
PE8
External Bus Interface (EBI) address and data input / output pin 00.
EBI_AD01
PE9
External Bus Interface (EBI) address and data input / output pin 01.
EBI_AD02
PE10
External Bus Interface (EBI) address and data input / output pin 02.
EBI_AD03
PE11
External Bus Interface (EBI) address and data input / output pin 03.
EBI_AD04
PE12
External Bus Interface (EBI) address and data input / output pin 04.
EBI_AD05
PE13
External Bus Interface (EBI) address and data input / output pin 05.
EBI_AD06
PE14
External Bus Interface (EBI) address and data input / output pin 06.
EBI_AD07
PE15
External Bus Interface (EBI) address and data input / output pin 07.
EBI_AD08
PA15
External Bus Interface (EBI) address and data input / output pin 08.
EBI_AD09
PA0
External Bus Interface (EBI) address and data input / output pin 09.
EBI_AD10
PA1
External Bus Interface (EBI) address and data input / output pin 10.
EBI_AD11
PA2
External Bus Interface (EBI) address and data input / output pin 11.
EBI_AD12
PA3
External Bus Interface (EBI) address and data input / output pin 12.
EBI_AD13
PA4
External Bus Interface (EBI) address and data input / output pin 13.
EBI_AD14
PA5
External Bus Interface (EBI) address and data input / output pin 14.
EBI_AD15
PA6
External Bus Interface (EBI) address and data input / output pin 15.
EBI_ALE
PF3
External Bus Interface (EBI) Address Latch Enable output.
EBI_ARDY
PF2
External Bus Interface (EBI) Hardware Ready Control input.
EBI_CS0
PD9
External Bus Interface (EBI) Chip Select output 0.
EBI_CS1
PD10
External Bus Interface (EBI) Chip Select output 1.
EBI_CS2
PD11
External Bus Interface (EBI) Chip Select output 2.
EBI_CS3
PD12
External Bus Interface (EBI) Chip Select output 3.
EBI_REn
PF5
External Bus Interface (EBI) Read Enable output.
EBI_WEn
PF4
External Bus Interface (EBI) Write Enable output.
HFXTAL_N
PB14
High Frequency Crystal negative pin. Also used as external optional clock input pin.
HFXTAL_P
PB13
High Frequency Crystal positive pin.
I2C0_SCL
PA1
PD7
PC7
PD15
I2C0 Serial Clock Line input / output.
I2C0_SDA
PA0
PD6
PC6
PD14
I2C0 Serial Data input / output.
LCD_BCAP_N
PA13
LCD voltage booster (optional), boost capacitor, negative pin. If using the
LCD voltage booster, connect a 22 nF capacitor between LCD_BCAP_N and
LCD_BCAP_P.
LCD_BCAP_P
PA12
LCD voltage booster (optional), boost capacitor, positive pin. If using the
LCD voltage booster, connect a 22 nF capacitor between LCD_BCAP_N and
LCD_BCAP_P.
LCD_BEXT
PA14
LCD voltage booster (optional), boost output. If using the LCD voltage booster, connect a 1 uF capacitor between this pin and VSS.
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Alternate
LOCATION
Functionality
0
1
2
3
Description
An external LCD voltage may also be applied to this pin if the booster is not
enabled.
If AVDD is used directly as the LCD supply voltage, this pin may be left unconnected or used as a GPIO.
LCD_COM0
PE4
LCD driver common line number 0.
LCD_COM1
PE5
LCD driver common line number 1.
LCD_COM2
PE6
LCD driver common line number 2.
LCD_COM3
PE7
LCD driver common line number 3.
LCD_SEG0
PF2
LCD segment line 0. Segments 0, 1, 2 and 3 are controlled by SEGEN0.
LCD_SEG1
PF3
LCD segment line 1. Segments 0, 1, 2 and 3 are controlled by SEGEN0.
LCD_SEG2
PF4
LCD segment line 2. Segments 0, 1, 2 and 3 are controlled by SEGEN0.
LCD_SEG3
PF5
LCD segment line 3. Segments 0, 1, 2 and 3 are controlled by SEGEN0.
LCD_SEG4
PE8
LCD segment line 4. Segments 4, 5, 6 and 7 are controlled by SEGEN1.
LCD_SEG5
PE9
LCD segment line 5. Segments 4, 5, 6 and 7 are controlled by SEGEN1.
LCD_SEG6
PE10
LCD segment line 6. Segments 4, 5, 6 and 7 are controlled by SEGEN1.
LCD_SEG7
PE11
LCD segment line 7. Segments 4, 5, 6 and 7 are controlled by SEGEN1.
LCD_SEG8
PE12
LCD segment line 8. Segments 8, 9, 10 and 11 are controlled by SEGEN2.
LCD_SEG9
PE13
LCD segment line 9. Segments 8, 9, 10 and 11 are controlled by SEGEN2.
LCD_SEG10
PE14
LCD segment line 10. Segments 8, 9, 10 and 11 are controlled by SEGEN2.
LCD_SEG11
PE15
LCD segment line 11. Segments 8, 9, 10 and 11 are controlled by SEGEN2.
LCD_SEG12
PA15
LCD segment line 12. Segments 12, 13, 14 and 15 are controlled by
SEGEN3.
LCD_SEG13
PA0
LCD segment line 13. Segments 12, 13, 14 and 15 are controlled by
SEGEN3.
LCD_SEG14
PA1
LCD segment line 14. Segments 12, 13, 14 and 15 are controlled by
SEGEN3.
LCD_SEG15
PA2
LCD segment line 15. Segments 12, 13, 14 and 15 are controlled by
SEGEN3.
LCD_SEG16
PA3
LCD segment line 16. Segments 16, 17, 18 and 19 are controlled by
SEGEN4.
LCD_SEG17
PA4
LCD segment line 17. Segments 16, 17, 18 and 19 are controlled by
SEGEN4.
LCD_SEG18
PA5
LCD segment line 18. Segments 16, 17, 18 and 19 are controlled by
SEGEN4.
LCD_SEG19
PA6
LCD segment line 19. Segments 16, 17, 18 and 19 are controlled by
SEGEN4.
LCD_SEG20
PB3
LCD segment line 20. Segments 20, 21, 22 and 23 are controlled by
SEGEN5.
LCD_SEG21
PB4
LCD segment line 21. Segments 20, 21, 22 and 23 are controlled by
SEGEN5.
LCD_SEG22
PB5
LCD segment line 22. Segments 20, 21, 22 and 23 are controlled by
SEGEN5.
LCD_SEG23
PB6
LCD segment line 23. Segments 20, 21, 22 and 23 are controlled by
SEGEN5.
LCD_SEG24
PF6
LCD segment line 24. Segments 24, 25, 26 and 27 are controlled by
SEGEN6.
LCD_SEG25
PF7
LCD segment line 25. Segments 24, 25, 26 and 27 are controlled by
SEGEN6.
LCD_SEG26
PF8
LCD segment line 26. Segments 24, 25, 26 and 27 are controlled by
SEGEN6.
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Alternate
LOCATION
Functionality
0
1
2
3
Description
LCD_SEG27
PF9
LCD segment line 27. Segments 24, 25, 26 and 27 are controlled by
SEGEN6.
LCD_SEG28
PD9
LCD segment line 28. Segments 28, 29, 30 and 31 are controlled by
SEGEN7.
LCD_SEG29
PD10
LCD segment line 29. Segments 28, 29, 30 and 31 are controlled by
SEGEN7.
LCD_SEG30
PD11
LCD segment line 30. Segments 28, 29, 30 and 31 are controlled by
SEGEN7.
LCD_SEG31
PD12
LCD segment line 31. Segments 28, 29, 30 and 31 are controlled by
SEGEN7.
LCD_SEG32
PB0
LCD segment line 32. Segments 32, 33, 34 and 35 are controlled by
SEGEN8.
LCD_SEG33
PB1
LCD segment line 33. Segments 32, 33, 34 and 35 are controlled by
SEGEN8.
LCD_SEG34
PB2
LCD segment line 34. Segments 32, 33, 34 and 35 are controlled by
SEGEN8.
LCD_SEG35
PA7
LCD segment line 35. Segments 32, 33, 34 and 35 are controlled by
SEGEN8.
LCD_SEG36
PA8
LCD segment line 36. Segments 36, 37, 38 and 39 are controlled by
SEGEN9.
LCD_SEG37
PA9
LCD segment line 37. Segments 36, 37, 38 and 39 are controlled by
SEGEN9.
LCD_SEG38
PA10
LCD segment line 38. Segments 36, 37, 38 and 39 are controlled by
SEGEN9.
LCD_SEG39
PA11
LCD segment line 39. Segments 36, 37, 38 and 39 are controlled by
SEGEN9.
LETIM0_OUT0
PD6
PB11
PF0
PC4
Low Energy Timer LETIM0, output channel 0.
LETIM0_OUT1
PD7
PB12
PF1
PC5
Low Energy Timer LETIM0, output channel 1.
LEU0_RX
PD5
PB14
PE15
LEUART0 Receive input.
LEU0_TX
PD4
PB13
PE14
LEUART0 Transmit output. Also used as receive input in half duplex communication.
LEU1_RX
PC7
PA6
LEUART1 Receive input.
LEU1_TX
PC6
PA5
LEUART1 Transmit output. Also used as receive input in half duplex communication.
LFXTAL_N
PB8
Low Frequency Crystal (typically 32.768 kHz) negative pin. Also used as an
optional external clock input pin.
LFXTAL_P
PB7
Low Frequency Crystal (typically 32.768 kHz) positive pin.
PCNT0_S0IN
PC13
PE0
PC0
Pulse Counter PCNT0 input number 0.
PCNT0_S1IN
PC14
PE1
PC1
Pulse Counter PCNT0 input number 1.
PCNT1_S0IN
PC4
PB3
Pulse Counter PCNT1 input number 0.
PCNT1_S1IN
PC5
PB4
Pulse Counter PCNT1 input number 1.
PCNT2_S0IN
PD0
PE8
Pulse Counter PCNT2 input number 0.
PCNT2_S1IN
PD1
PE9
Pulse Counter PCNT2 input number 1.
TIM0_CC0
PA0
PA0
PF6
PD1
Timer 0 Capture Compare input / output channel 0.
TIM0_CC1
PA1
PA1
PF7
PD2
Timer 0 Capture Compare input / output channel 1.
TIM0_CC2
PA2
PA2
PF8
PD3
Timer 0 Capture Compare input / output channel 2.
TIM0_CDTI0
PA3
PC13
PF3
PC13
Timer 0 Complimentary Deat Time Insertion channel 0.
TIM0_CDTI1
PA4
PC14
PF4
PC14
Timer 0 Complimentary Deat Time Insertion channel 1.
TIM0_CDTI2
PA5
PC15
PF5
PC15
Timer 0 Complimentary Deat Time Insertion channel 2.
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Alternate
LOCATION
Functionality
0
1
2
3
Description
TIM1_CC0
PC13
PE10
PB0
Timer 1 Capture Compare input / output channel 0.
TIM1_CC1
PC14
PE11
PB1
Timer 1 Capture Compare input / output channel 1.
TIM1_CC2
PC15
PE12
PB2
Timer 1 Capture Compare input / output channel 2.
TIM2_CC0
PA8
PA12
PC8
Timer 2 Capture Compare input / output channel 0.
TIM2_CC1
PA9
PA13
PC9
Timer 2 Capture Compare input / output channel 1.
TIM2_CC2
PA10
PA14
PC10
Timer 2 Capture Compare input / output channel 2.
U0_RX
PF7
PE1
PA4
PC15
UART0 Receive input.
U0_TX
PF6
PE0
PA3
PC14
UART0 Transmit output. Also used as receive input in half duplex communication.
US0_CLK
PE12
PE5
PC9
USART0 clock input / output.
US0_CS
PE13
PE4
PC8
USART0 chip select input / output.
US0_RX
PE11
PE6
PC10
USART0 Asynchronous Receive.
USART0 Synchronous mode Master Input / Slave Output (MISO).
US0_TX
PE10
PE7
USART0 Asynchronous Transmit.Also used as receive input in half duplex
communication.
PC11
USART0 Synchronous mode Master Output / Slave Input (MOSI).
US1_CLK
PB7
PD2
USART1 clock input / output.
US1_CS
PB8
PD3
USART1 chip select input / output.
US1_RX
PC1
PD1
USART1 Asynchronous Receive.
USART1 Synchronous mode Master Input / Slave Output (MISO).
US1_TX
PC0
USART1 Asynchronous Transmit.Also used as receive input in half duplex
communication.
PD0
USART1 Synchronous mode Master Output / Slave Input (MOSI).
US2_CLK
PC4
PB5
USART2 clock input / output.
US2_CS
PC5
PB6
USART2 chip select input / output.
US2_RX
PC3
PB4
USART2 Asynchronous Receive.
USART2 Synchronous mode Master Input / Slave Output (MISO).
US2_TX
PC2
USART2 Asynchronous Transmit.Also used as receive input in half duplex
communication.
PB3
USART2 Synchronous mode Master Output / Slave Input (MOSI).
4.3 GPIO Pinout Overview
The specific GPIO pins available in EFM32G890 is shown in Table 4.3 (p. 57) . Each GPIO port is
organized as 16-bit ports indicated by letters A through F, and the individual pin on this port is indicated
by a number from 15 down to 0.
Table 4.3. GPIO Pinout
Port
Pin
15
Pin
14
Pin
13
Pin
12
Pin
11
Pin
10
Pin
9
Pin
8
Pin
7
Pin
6
Pin
5
Pin
4
Pin
3
Pin
2
Pin
1
Pin
0
Port A
PA15
PA14
PA13
PA12
PA11
PA10
PA9
PA8
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
Port B
PB15
PB14
PB13
PB12
PB11
PB10
PB9
PB8
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
Port C
PC15
PC14
PC13
PC12
PC11
PC10
PC9
PC8
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
Port D
PD15
PD14
PD13
PD12
PD11
PD10
PD9
PD8
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
Port E
PE15
PE14
PE13
PE12
PE11
PE10
PE9
PE8
PE7
PE6
PE5
PE4
PE3
PE2
PE1
PE0
Port F
-
-
-
-
-
-
PF9
PF8
PF7
PF6
PF5
PF4
PF3
PF2
PF1
PF0
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4.4 BGA112 Package
Figure 4.2. BGA112
Note:
1. The dimensions in parenthesis are reference.
2. Datum 'C' and seating plane are defined by the crown of the solder balls.
3. All dimensions are in millimeters.
The BGA112 Package uses SAC105 solderballs.
All EFM32 packages are RoHS compliant and free of Bromine (Br) and Antimony (Sb).
For additional Quality and Environmental information, please see:
http://www.silabs.com/support/quality/pages/default.aspx
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5 PCB Layout and Soldering
5.1 Recommended PCB Layout
Figure 5.1. BGA112 PCB Land Pattern
b
a
e
d
Table 5.1. BGA112 PCB Land Pattern Dimensions (Dimensions in mm)
Symbol
Dim. (mm)
a
0.35
b
0.80
d
8.00
e
8.00
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Figure 5.2. BGA112 PCB Solder Mask
b
a
e
d
Table 5.2. BGA112 PCB Solder Mask Dimensions (Dimensions in mm)
Symbol
Dim. (mm)
a
0.48
b
0.80
d
8.00
e
8.00
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Figure 5.3. BGA112 PCB Stencil Design
b
a
e
d
Table 5.3. BGA112 PCB Stencil Design Dimensions (Dimensions in mm)
1.
2.
3.
4.
5.
6.
Symbol
Dim. (mm)
a
0.33
b
0.80
d
8.00
e
8.00
The drawings are not to scale.
All dimensions are in millimeters.
All drawings are subject to change without notice.
The PCB Land Pattern drawing is in compliance with IPC-7351B.
Stencil thickness 0.125 mm.
For detailed pin-positioning, see Figure 4.2 (p. 58) .
5.2 Soldering Information
The latest IPC/JEDEC J-STD-020 recommendations for Pb-Free reflow soldering should be followed.
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6 Chip Marking, Revision and Errata
6.1 Chip Marking
In the illustration below package fields and position are shown.
Figure 6.1. Example Chip Marking (top view)
6.2 Revision
The revision of a chip can be determined from the "Revision" field in Figure 6.1 (p. 62) .
6.3 Errata
Please see the errata document for EFM32G890 for description and resolution of device erratas. This
document is available in Simplicity Studio and online at:
http://www.silabs.com/support/pages/document-library.aspx?p=MCUs--32-bit
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7 Revision History
7.1 Revision 1.90
May 22nd, 2015
Added clarification on conditions for INLADC and DNLADC parameters.
Corrected EM2 current consumption condition in Electrical Characteristics section.
Added AUXHFRCO to block diagram and Electrical Characteristics.
Updated HFRCO table in the Electrical Characteristics section.
Updated EM0, EM2, EM3, and EM4 maximum current specifications in the Electrical Characteristics
section.
Updated the Output Low Voltage maximum for sinking 20 mA with VDD = 3.0 V in the Electrical Characteristics section.
Updated the Input Leakage Current maximum in the Electrical Characteristics section.
Updated the minimum and maximum frequency specifications for the LFRCO, HFRCO, and AUXHFRCO
in the Electrical Characteristics section.
Updated the maximum current consumption of the HFRCO in the Electrical Characteristics section.
Updated the maximum current consumption of the HFRCO in the Electrical Characteristics section.
Added some minimum ADC SNR, SNDR, and SFDR specifications in the Electrical Characteristics section.
Added some minimum and maximum ADC offset voltage, DNL, and INL specifications in the Electrical
Characteristics section.
Added maximum DAC current specifications in the Electrical Characteristics section.
Added maximum ACMP current and maximum and minimum offset voltage specifications in the Electrical
Characteristics section.
Added maximum VCMP current and updated typical VCMP current specifications in the Electrical Characteristics section.
Updated references to energyAware Designer to Configurator.
7.2 Revision 1.80
July 2nd, 2014
Corrected single power supply voltage minimum value from 1.85V to 1.98V.
Updated current consumption.
Updated transition between energy modes.
Updated power management data.
Updated GPIO data.
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Updated LFXO, HFXO, HFRCO and ULFRCO data.
Updated LFRCO and HFRCO plots.
Updated ACMP data.
7.3 Revision 1.71
November 21st, 2013
Updated figures.
Updated errata-link.
Updated chip marking.
Added link to Environmental and Quality information.
Re-added missing DAC-data.
7.4 Revision 1.70
September 30th, 2013
Added I2C characterization data.
Corrected GPIO operating voltage from 1.8 V to 1.85 V.
Corrected the ADC resolution from 12, 10 and 6 bit to 12, 8 and 6 bit.
Updated Environmental information.
Updated trademark, disclaimer and contact information.
Other minor corrections.
7.5 Revision 1.60
June 28th, 2013
Updated PCB Land Pattern, PCB Solder Mask and PCB Stencil Design figures.
Updated power requirements in the Power Management section.
Removed minimum load capacitance figure and table. Added reference to application note.
Other minor corrections.
7.6 Revision 1.50
September 11th, 2012
Updated the HFRCO 1 MHz band typical value to 1.2 MHz.
Updated the HFRCO 7 MHz band typical value to 6.6 MHz.
Corrected BGA solder balls material from Sn96.5/Ag3/Cu0.5 to SAC105.
Other minor corrections.
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7.7 Revision 1.40
February 27th, 2012
Updated Power Management section.
Corrected operating voltage from 1.8 V to 1.85 V.
Corrected TGRADADCTH parameter.
Corrected BGA112 package drawing.
Updated PCB land pattern, solder mask and stencil design.
7.8 Revision 1.30
May 20th, 2011
Updated LFXO load capacitance section.
7.9 Revision 1.20
December 17th, 2010
Increased max storage temperature.
Added data for <150°C and <70°C on Flash data retention.
Changed latch-up sensitivity test description.
Added IO leakage current.
Added Flash current consumption.
Updated HFRCO data.
Updated LFRCO data.
Added graph for ADC Absolute Offset over temperature.
Added graph for ADC Temperature sensor readout.
7.10 Revision 1.11
November 17th, 2010
Corrected maximum DAC clock speed for continuous mode.
Added DAC sample-hold mode voltage drift rate.
Added pulse widths detected by the HFXO glitch detector.
Added power sequencing information to Power Management section.
7.11 Revision 1.10
September 13th, 2010
Added typical values for RADCFILT and CADCFILT.
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Added two conditions for DAC clock frequency; one for sample/hold and one for sample/off.
Added RoHS information and specified leadframe/solderballs material.
Added Serial Bootloader to feature list and system summary.
Updated ADC characterization data.
Updated DAC characterization data.
Updated RCO characterization data.
Updated ACMP characterization data.
Updated VCMP characterization data.
7.12 Revision 1.00
April 23rd, 2010
ADC_VCM line removed.
Added pinout illustration and additional pinout table.
Changed "Errata" chapter. Errata description moved to separate document.
Document changed status from "Preliminary".
Updated "Electrical Characteristics" chapter.
7.13 Revision 0.85
February 19th, 2010
Renamed DBG_SWV pin to DBG_SWO.
7.14 Revision 0.83
January 25th, 2010
Updated errata section.
Specified flash word width in Section 3.7 (p. 18) .
Added Capacitive Sense Internal Resistor values in Section 3.12 (p. 43) .
7.15 Revision 0.82
December 9th, 2009
Updated contact information.
ADC current consumption numbers updated in Section 3.10 (p. 32) .
Updated LCD supply voltage range in Section 3.14 (p. 46) .
7.16 Revision 0.81
November 20th, 2009
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Section 3.1 (p. 9) updated.
Storage temperature in Section 3.2 (p. 9) updated.
Temperature coefficient of band-gap reference in Section 3.6 (p. 17) added.
Erase times in Section 3.7 (p. 18) updated.
Definitions of DNL and INL added in Figure 3.27 (p. 36) and Figure 3.28 (p. 37) .
Section 3.14 (p. 46) added.
Current consumption of digital peripherals added in Section 3.16 (p. 48) .
Pinout information in Table 4.1 (p. 49) corrected.
Updated errata section.
7.17 Revision 0.80
Initial preliminary revision, October 19th, 2009
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A Disclaimer and Trademarks
A.1 Disclaimer
Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation
of all peripherals and modules available for system and software implementers using or intending to use
the Silicon Laboratories products. Characterization data, available modules and peripherals, memory
sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and
do vary in different applications. Application examples described herein are for illustrative purposes only.
Silicon Laboratories reserves the right to make changes without further notice and limitation to product
information, specifications, and descriptions herein, and does not give warranties as to the accuracy
or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright
licenses granted hereunder to design or fabricate any integrated circuits. The products must not be
used within any Life Support System without the specific written consent of Silicon Laboratories. A "Life
Support System" is any product or system intended to support or sustain life and/or health, which, if it
fails, can be reasonably expected to result in significant personal injury or death. Silicon Laboratories
products are generally not intended for military applications. Silicon Laboratories products shall under no
circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological
or chemical weapons, or missiles capable of delivering such weapons.
A.2 Trademark Information
Silicon Laboratories Inc., Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, CMEMS®,
EFM, EFM32, EFR, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem®, Precision32®, ProSLIC®, SiPHY®, USBXpress® and others are trademarks or registered
trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products
or brand names mentioned herein are trademarks of their respective holders.
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B Contact Information
Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78701
Please visit the Silicon Labs Technical Support web page:
http://www.silabs.com/support/pages/contacttechnicalsupport.aspx
and register to submit a technical support request.
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Table of Contents
1. Ordering Information .................................................................................................................................. 2
2. System Summary ...................................................................................................................................... 3
2.1. System Introduction ......................................................................................................................... 3
2.2. Configuration Summary .................................................................................................................... 6
2.3. Memory Map ................................................................................................................................. 8
3. Electrical Characteristics ............................................................................................................................. 9
3.1. Test Conditions .............................................................................................................................. 9
3.2. Absolute Maximum Ratings .............................................................................................................. 9
3.3. General Operating Conditions ........................................................................................................... 9
3.4. Current Consumption ..................................................................................................................... 10
3.5. Transition between Energy Modes .................................................................................................... 17
3.6. Power Management ....................................................................................................................... 17
3.7. Flash .......................................................................................................................................... 18
3.8. General Purpose Input Output ......................................................................................................... 18
3.9. Oscillators .................................................................................................................................... 27
3.10. Analog Digital Converter (ADC) ...................................................................................................... 32
3.11. Digital Analog Converter (DAC) ...................................................................................................... 41
3.12. Analog Comparator (ACMP) .......................................................................................................... 43
3.13. Voltage Comparator (VCMP) ......................................................................................................... 45
3.14. LCD .......................................................................................................................................... 46
3.15. I2C ........................................................................................................................................... 47
3.16. Digital Peripherals ....................................................................................................................... 48
4. Pinout and Package ................................................................................................................................. 49
4.1. Pinout ......................................................................................................................................... 49
4.2. Alternate Functionality Pinout .......................................................................................................... 53
4.3. GPIO Pinout Overview ................................................................................................................... 57
4.4. BGA112 Package .......................................................................................................................... 58
5. PCB Layout and Soldering ........................................................................................................................ 59
5.1. Recommended PCB Layout ............................................................................................................ 59
5.2. Soldering Information ..................................................................................................................... 61
6. Chip Marking, Revision and Errata .............................................................................................................. 62
6.1. Chip Marking ................................................................................................................................ 62
6.2. Revision ...................................................................................................................................... 62
6.3. Errata ......................................................................................................................................... 62
7. Revision History ...................................................................................................................................... 63
7.1. Revision 1.90 ............................................................................................................................... 63
7.2. Revision 1.80 ............................................................................................................................... 63
7.3. Revision 1.71 ............................................................................................................................... 64
7.4. Revision 1.70 ............................................................................................................................... 64
7.5. Revision 1.60 ............................................................................................................................... 64
7.6. Revision 1.50 ............................................................................................................................... 64
7.7. Revision 1.40 ............................................................................................................................... 65
7.8. Revision 1.30 ............................................................................................................................... 65
7.9. Revision 1.20 ............................................................................................................................... 65
7.10. Revision 1.11 .............................................................................................................................. 65
7.11. Revision 1.10 .............................................................................................................................. 65
7.12. Revision 1.00 .............................................................................................................................. 66
7.13. Revision 0.85 .............................................................................................................................. 66
7.14. Revision 0.83 .............................................................................................................................. 66
7.15. Revision 0.82 .............................................................................................................................. 66
7.16. Revision 0.81 .............................................................................................................................. 66
7.17. Revision 0.80 .............................................................................................................................. 67
A. Disclaimer and Trademarks ....................................................................................................................... 68
A.1. Disclaimer ................................................................................................................................... 68
A.2. Trademark Information ................................................................................................................... 68
B. Contact Information ................................................................................................................................. 69
B.1. ................................................................................................................................................. 69
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List of Figures
2.1. Block Diagram ....................................................................................................................................... 3
2.2. EFM32G890 Memory Map with largest RAM and Flash sizes .......................................................................... 8
3.1. EM0 Current consumption while executing prime number calculation code from flash with HFRCO running at 28
MHz ........................................................................................................................................................ 11
3.2. EM0 Current consumption while executing prime number calculation code from flash with HFRCO running at 21
MHz ........................................................................................................................................................ 11
3.3. EM0 Current consumption while executing prime number calculation code from flash with HFRCO running at 14
MHz ........................................................................................................................................................ 12
3.4. EM0 Current consumption while executing prime number calculation code from flash with HFRCO running at 11
MHz ........................................................................................................................................................ 12
3.5. EM0 Current consumption while executing prime number calculation code from flash with HFRCO running at 7
MHz ........................................................................................................................................................ 13
3.6. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 28 MHz .............................. 13
3.7. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 21 MHz .............................. 14
3.8. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 14 MHz .............................. 14
3.9. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 11 MHz .............................. 15
3.10. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 7 MHz .............................. 15
3.11. EM2 current consumption. RTC prescaled to 1kHz, 32.768 kHz LFRCO. ....................................................... 16
3.12. EM3 current consumption. ................................................................................................................... 16
3.13. EM4 current consumption. ................................................................................................................... 17
3.14. Typical Low-Level Output Current, 2V Supply Voltage ................................................................................ 21
3.15. Typical High-Level Output Current, 2V Supply Voltage ................................................................................ 22
3.16. Typical Low-Level Output Current, 3V Supply Voltage ................................................................................ 23
3.17. Typical High-Level Output Current, 3V Supply Voltage ................................................................................ 24
3.18. Typical Low-Level Output Current, 3.8V Supply Voltage .............................................................................. 25
3.19. Typical High-Level Output Current, 3.8V Supply Voltage ............................................................................. 26
3.20. Calibrated LFRCO Frequency vs Temperature and Supply Voltage .............................................................. 29
3.21. Calibrated HFRCO 1 MHz Band Frequency vs Supply Voltage and Temperature ............................................ 30
3.22. Calibrated HFRCO 7 MHz Band Frequency vs Supply Voltage and Temperature ............................................ 30
3.23. Calibrated HFRCO 11 MHz Band Frequency vs Supply Voltage and Temperature ........................................... 30
3.24. Calibrated HFRCO 14 MHz Band Frequency vs Supply Voltage and Temperature ........................................... 31
3.25. Calibrated HFRCO 21 MHz Band Frequency vs Supply Voltage and Temperature ........................................... 31
3.26. Calibrated HFRCO 28 MHz Band Frequency vs Supply Voltage and Temperature ........................................... 31
3.27. Integral Non-Linearity (INL) ................................................................................................................... 36
3.28. Differential Non-Linearity (DNL) .............................................................................................................. 37
3.29. ADC Frequency Spectrum, Vdd = 3V, Temp = 25°C ................................................................................. 38
3.30. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25°C ................................................................... 39
3.31. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25°C ............................................................... 40
3.32. ADC Absolute Offset, Common Mode = Vdd /2 ........................................................................................ 41
3.33. ADC Dynamic Performance vs Temperature for all ADC References, Vdd = 3V .............................................. 41
3.34. ACMP Characteristics, Vdd = 3V, Temp = 25°C, FULLBIAS = 0, HALFBIAS = 1 ............................................. 44
4.1. EFM32G890 Pinout (top view, not to scale) ............................................................................................... 49
4.2. BGA112 .............................................................................................................................................. 58
5.1. BGA112 PCB Land Pattern ..................................................................................................................... 59
5.2. BGA112 PCB Solder Mask ..................................................................................................................... 60
5.3. BGA112 PCB Stencil Design ................................................................................................................... 61
6.1. Example Chip Marking (top view) ............................................................................................................. 62
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List of Tables
1.1. Ordering Information ................................................................................................................................ 2
2.1. Configuration Summary ............................................................................................................................ 7
3.1. Absolute Maximum Ratings ...................................................................................................................... 9
3.2. General Operating Conditions ................................................................................................................... 9
3.3. Current Consumption ............................................................................................................................. 10
3.4. Energy Modes Transitions ...................................................................................................................... 17
3.5. Power Management ............................................................................................................................... 18
3.6. Flash .................................................................................................................................................. 18
3.7. GPIO .................................................................................................................................................. 18
3.8. LFXO .................................................................................................................................................. 27
3.9. HFXO ................................................................................................................................................. 28
3.10. LFRCO .............................................................................................................................................. 28
3.11. HFRCO ............................................................................................................................................. 29
3.12. AUXHFRCO ....................................................................................................................................... 32
3.13. ULFRCO ............................................................................................................................................ 32
3.14. ADC .................................................................................................................................................. 32
3.15. DAC .................................................................................................................................................. 41
3.16. ACMP ............................................................................................................................................... 43
3.17. VCMP ............................................................................................................................................... 45
3.18. LCD .................................................................................................................................................. 46
3.19. I2C Standard-mode (Sm) ...................................................................................................................... 47
3.20. I2C Fast-mode (Fm) ............................................................................................................................ 47
3.21. I2C Fast-mode Plus (Fm+) .................................................................................................................... 48
3.22. Digital Peripherals ............................................................................................................................... 48
4.1. Device Pinout ....................................................................................................................................... 49
4.2. Alternate functionality overview ................................................................................................................ 53
4.3. GPIO Pinout ........................................................................................................................................ 57
5.1. BGA112 PCB Land Pattern Dimensions (Dimensions in mm) ......................................................................... 59
5.2. BGA112 PCB Solder Mask Dimensions (Dimensions in mm) ......................................................................... 60
5.3. BGA112 PCB Stencil Design Dimensions (Dimensions in mm) ....................................................................... 61
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List of Equations
3.1. Total ACMP Active Current ..................................................................................................................... 43
3.2. VCMP Trigger Level as a Function of Level Setting ..................................................................................... 45
3.3. Total LCD Current Based on Operational Mode and Internal Boost ................................................................. 46
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