...the world's most energy friendly microcontrollers EFM32G800 DATASHEET F128 • ARM Cortex-M3 CPU platform • High Performance 32-bit processor @ up to 32 MHz • Memory Protection Unit • Wake-up Interrupt Controller • Flexible Energy Management System • 20 nA @ 3 V Shutoff Mode • 0.6 µA @ 3 V Stop Mode, including Power-on Reset, Brown-out Detector, RAM and CPU retention • 0.9 µA @ 3 V Deep Sleep Mode, including RTC with 32.768 kHz oscillator, Power-on Reset, Brown-out Detector, RAM and CPU retention • 45 µA/MHz @ 3 V Sleep Mode • 180 µA/MHz @ 3 V Run Mode, with code executed from flash • 128 KB Flash • 16 KB RAM • 90 General Purpose I/O pins • Configurable push-pull, open-drain, pull-up/down, input filter, drive strength • Configurable peripheral I/O locations • 16 asynchronous external interrupts • Output state retention and wake-up from Shutoff Mode • 8 Channel DMA Controller • 8 Channel Peripheral Reflex System (PRS) for autonomous inter-peripheral signaling • Hardware AES with 128/256-bit keys in 54/75 cycles • Timers/Counters • 3× 16-bit Timer/Counter • 3×3 Compare/Capture/PWM channels • Dead-Time Insertion on TIMER0 • 16-bit Low Energy Timer • 1× 24-bit Real-Time Counter • 3× 8-bit Pulse Counter • Watchdog Timer with dedicated RC oscillator @ 50 nA • Integrated LCD Controller for up to 4×40 segments • Voltage boost, adjustable contrast and autonomous animation • External Bus Interface for up to 4x64 MB of external memory mapped space • Communication interfaces • 3× Universal Synchronous/Asynchronous Receiver/Transmitter • UART/SPI/SmartCard (ISO 7816)/IrDA • Triple buffered full/half-duplex operation • 1× Universal Asynchronous Receiver/Transmitter • 2× Low Energy UART • Autonomous operation with DMA in Deep Sleep Mode 2 • I C Interface with SMBus support • Address recognition in Stop Mode • Ultra low power precision analog peripherals • 12-bit 1 Msamples/s Analog to Digital Converter • 8 single ended channels/4 differential channels • On-chip temperature sensor • 12-bit 500 ksamples/s Digital to Analog Converter • 2 single ended channels/1 differential channel • 2× Analog Comparator • Capacitive sensing with up to 16 inputs • Supply Voltage Comparator • Ultra efficient Power-on Reset and Brown-Out Detector • 2-pin Serial Wire Debug interface • 1-pin Serial Wire Viewer • Pre-Programmed UART Bootloader • Temperature range -40 to 85 ºC • Single power supply 1.98 to 3.8 V • Delivered as full wafer 32-bit ARM Cortex-M0+, Cortex-M3 and Cortex-M4 microcontrollers for: • Energy, gas, water and smart metering • Health and fitness applications • Smart accessories • Alarm and security systems • Industrial and home automation ...the world's most energy friendly microcontrollers 1 Ordering Information Table 1.1 (p. 2) shows the available EFM32G800 devices. Table 1.1. Ordering Information Ordering Code Flash (kB) RAM (kB) Max Speed (MHz) Supply Voltage (V) Temperature (ºC) Package EFM32G800F128G-D-D1I 128 16 32 1.98 - 3.8 -40 - 85 Wafer Visit www.silabs.com for information on global distributors and representatives. 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 2 www.silabs.com ...the world's most energy friendly microcontrollers 2 System Summary The EFM32G800 products are delivered in wafer form, but are otherwise identical to the EFM32G890 packaged parts. Please refer to the EFM32G890 datasheet for additional information. 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 3 www.silabs.com ...the world's most energy friendly microcontrollers 3 Pinout and Package Note Please refer to the application note "AN0002 EFM32 Hardware Design Considerations" for guidelines on designing Printed Circuit Boards (PCB's) for the EFM32G800. 3.1 Padout The EFM32G800 padout is shown in Figure 3.1 (p. 4) and Table 3.1 (p. 5). Alternate locations are denoted by "#" followed by the location number (Multiple locations on the same pad are split with "/"). Alternate locations can be configured in the LOCATION bitfield in the *_ROUTE register in the module in question. PA15 PE15 PE14 PE13 PE12 iovss_6 iovdd_6 PE11 PE10 PE9 PE8 PB15 PD13 PD12 PD11 PD10 PD9 PF9 PF8 PF7 PF6 iovdd_5 iovss_5 PF5 PF4 PF3 PF2 PF1 PF0 Figure 3.1. EFM32G800 Padout (top view, not to scale) 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 (X,Y): (- 1690, 1625) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 (X,Y): (0, 0) 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 PC15 PC14 PC13 PC12 PC11 PC10 PC9 PC8 PE7 PE6 PE5 PE4 PE3 PE2 PE1 PE0 NC iovss_4 dec_1 dec_0 iovdd_4 vdd_dreg vss_dreg PC7 PC6 PD8 PD7 PD6 PD5 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 PA0 PA1 PA2 PA3 PA4 PA5 PA6 iovdd_0 iovss_0 PD14 PD15 PB0 PB1 PB2 NC PB3 PB4 PB5 PB6 iovss_1 iovdd_1 NC PC0 PC1 PC2 PC3 PC4 PC5 PB7 PB8 (X,Y): (1690, 1625) (X,Y): (1690, - 1625) PA7 PA8 PA9 PA10 PA11 iovdd_2 iovss_2 PA12 PA13 PA14 reset PB9 PB10 PB11 PB12 avss_2 avdd_2 avdd_1 avss_1 PB13 PB14 iovss_3 iovdd_3 avss_0 avdd_0 PD0 PD1 PD2 PD3 PD4 (X,Y): (- 1690, - 1625) The pad coordinates represent the center of the pad opening relative to the die center. 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 4 www.silabs.com ...the world's most energy friendly microcontrollers Table 3.1. Device Padout Wafer Pads and Coordinates Pad Alternate Functionality / Description X [µm] Y [µm] Analog EBI Timers Communication 1 PA0 -1640.0 1350.0 LCD_SEG13 EBI_AD09 #0 TIM0_CC0 #0/1 I2C0_SDA #0 2 PA1 -1640.0 1256.2 LCD_SEG14 EBI_AD10 #0 TIM0_CC1 #0/1 I2C0_SCL #0 3 PA2 -1640.0 1162.5 LCD_SEG15 EBI_AD11 #0 TIM0_CC2 #0/1 4 PA3 -1640.0 1068.8 LCD_SEG16 EBI_AD12 #0 TIM0_CDTI0 #0 U0_TX #2 5 PA4 -1640.0 975.0 LCD_SEG17 EBI_AD13 #0 TIM0_CDTI1 #0 U0_RX #2 6 PA5 -1640.0 881.2 LCD_SEG18 EBI_AD14 #0 TIM0_CDTI2 #0 LEU1_TX #1 7 PA6 -1640.0 787.5 LCD_SEG19 EBI_AD15 #0 8 IOVDD_0 -1640.0 693.8 Digital IO power supply 0. 9 IOVSS_0 -1640.0 600.0 Digital IO ground 0. 10 PD14 -1640.0 506.2 I2C0_SDA #3 11 PD15 -1640.0 412.5 I2C0_SCL #3 12 PB0 -1640.0 318.8 LCD_SEG32 TIM1_CC0 #2 13 PB1 -1640.0 225.0 LCD_SEG33 TIM1_CC1 #2 14 PB2 -1640.0 131.2 LCD_SEG34 TIM1_CC2 #2 15 NC -1640.0 37.5 16 PB3 -1640.0 -56.2 LCD_SEG20 PCNT1_S0IN #1 US2_TX #1 17 PB4 -1640.0 -150.0 LCD_SEG21 PCNT1_S1IN #1 US2_RX #1 18 PB5 -1640.0 -243.8 LCD_SEG22 US2_CLK #1 19 PB6 -1640.0 -337.5 LCD_SEG23 US2_CS #1 20 IOVSS_1 -1640.0 -431.2 Digital IO ground 1. 21 IOVDD_1 -1640.0 -525.0 Digital IO power supply 1. 22 NC -1640.0 -618.8 Do not connect. 23 PC0 -1640.0 -712.5 ACMP0_CH0 PCNT0_S0IN #2 US1_TX #0 24 PC1 -1640.0 -806.2 ACMP0_CH1 PCNT0_S1IN #2 US1_RX #0 25 PC2 -1640.0 -900.0 ACMP0_CH2 US2_TX #0 26 PC3 -1640.0 -993.8 ACMP0_CH3 US2_RX #0 27 PC4 -1640.0 -1087.5 ACMP0_CH4 LETIM0_OUT0 #3 PCNT1_S0IN #0 US2_CLK #0 28 PC5 -1640.0 -1181.2 ACMP0_CH5 LETIM0_OUT1 #3 PCNT1_S1IN #0 US2_CS #0 29 PB7 -1640.0 -1275.0 LFXTAL_P US1_CLK #0 30 PB8 -1640.0 -1368.8 LFXTAL_N US1_CS #0 31 PA7 -1415.0 -1575.0 LCD_SEG35 32 PA8 -1316.6 -1575.0 LCD_SEG36 TIM2_CC0 #0 33 PA9 -1218.2 -1575.0 LCD_SEG37 TIM2_CC1 #0 34 PA10 -1119.8 -1575.0 LCD_SEG38 TIM2_CC2 #0 35 PA11 -1021.4 -1575.0 LCD_SEG39 36 IOVDD_2 -923.0 -1575.0 Digital IO power supply 2. 37 IOVSS_2 -824.6 -1575.0 Digital IO ground 2. 38 PA12 -726.2 -1575.0 Pad # Pad Name Other CMU_CLK1 #0 CMU_CLK0 #0 LEU1_RX #1 Do not connect. LCD_BCAP_P 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 TIM2_CC0 #1 5 www.silabs.com ...the world's most energy friendly microcontrollers Wafer Pads and Coordinates Pad Alternate Functionality / Description X [µm] Y [µm] Analog 39 PA13 -627.9 -1575.0 LCD_BCAP_N TIM2_CC1 #1 40 PA14 -529.5 -1575.0 LCD_BEXT TIM2_CC2 #1 41 RESETn -431.1 -1575.0 42 PB9 -332.7 -1575.0 43 PB10 -234.3 -1575.0 44 PB11 -135.9 -1575.0 DAC0_OUT0 LETIM0_OUT0 #1 45 PB12 -37.5 -1575.0 DAC0_OUT1 LETIM0_OUT1 #1 46 AVSS_2 60.9 -1575.0 Analog ground 2. 47 AVDD_2 159.3 -1575.0 Analog power supply 2. 48 AVDD_1 257.7 -1575.0 Analog power supply 1. 49 AVSS_1 356.1 -1575.0 Analog ground 1. 50 PB13 454.5 -1575.0 HFXTAL_P LEU0_TX #1 51 PB14 552.9 -1575.0 HFXTAL_N LEU0_RX #1 52 IOVSS_3 651.2 -1575.0 Digital IO ground 3. 53 IOVDD_3 749.6 -1575.0 Digital IO power supply 3. 54 AVSS_0 848.0 -1575.0 Analog ground 0. 55 AVDD_0 946.4 -1575.0 Analog power supply 0. 56 PD0 1044.8 -1575.0 ADC0_CH0 PCNT2_S0IN #0 US1_TX #1 57 PD1 1143.2 -1575.0 ADC0_CH1 TIM0_CC0 #3 PCNT2_S1IN #0 US1_RX #1 58 PD2 1241.6 -1575.0 ADC0_CH2 TIM0_CC1 #3 US1_CLK #1 59 PD3 1340.0 -1575.0 ADC0_CH3 TIM0_CC2 #3 US1_CS #1 60 PD4 1438.4 -1575.0 ADC0_CH4 LEU0_TX #0 61 PD5 1640.0 -1350.0 ADC0_CH5 LEU0_RX #0 62 PD6 1640.0 -1252.8 ADC0_CH6 LETIM0_OUT0 #0 I2C0_SDA #1 63 PD7 1640.0 -1155.6 ADC0_CH7 LETIM0_OUT1 #0 I2C0_SCL #1 64 PD8 1640.0 -1058.3 65 PC6 1640.0 -961.1 ACMP0_CH6 LEU1_TX #0 I2C0_SDA #2 66 PC7 1640.0 -863.9 ACMP0_CH7 LEU1_RX #0 I2C0_SCL #2 67 VSS_DREG 1640.0 -766.7 Ground for on-chip voltage regulator. 68 VDD_DREG 1640.0 -669.4 Power supply for on-chip voltage regulator. 69 IOVDD_4 1640.0 -572.2 Digital IO power supply 4. 70 DEC_0 1640.0 -475.0 Decouple output for on-chip voltage regulator. 71 DEC_1 1640.0 -377.8 Decouple output for on-chip voltage regulator. 72 IOVSS_4 1640.0 -280.6 Digital IO ground 4. 73 NC 1640.0 -183.3 Do not connect. 74 PE0 1640.0 -86.1 PCNT0_S0IN #1 U0_TX #1 75 PE1 1640.0 11.1 PCNT0_S1IN #1 U0_RX #1 Pad # Pad Name EBI Timers Communication Other Reset input, active low. To apply an external reset source to this pin, it is required to only drive this pin low during reset, and let the internal pull-up ensure that reset is released. CMU_CLK1 #1 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 6 www.silabs.com ...the world's most energy friendly microcontrollers Wafer Pads and Coordinates Pad Alternate Functionality / Description X [µm] Y [µm] 76 PE2 1640.0 108.3 ACMP0_O #1 77 PE3 1640.0 205.6 ACMP1_O #1 78 PE4 1640.0 302.8 LCD_COM0 US0_CS #1 79 PE5 1640.0 400.0 LCD_COM1 US0_CLK #1 80 PE6 1640.0 497.2 LCD_COM2 US0_RX #1 81 PE7 1640.0 594.4 LCD_COM3 US0_TX #1 82 PC8 1640.0 691.7 ACMP1_CH0 TIM2_CC0 #2 US0_CS #2 83 PC9 1640.0 788.9 ACMP1_CH1 TIM2_CC1 #2 US0_CLK #2 84 PC10 1640.0 886.1 ACMP1_CH2 TIM2_CC2 #2 US0_RX #2 85 PC11 1640.0 983.3 ACMP1_CH3 86 PC12 1640.0 1080.6 ACMP1_CH4 87 PC13 1640.0 1177.8 ACMP1_CH5 TIM0_CDTI0 #1/3 TIM1_CC0 #0 PCNT0_S0IN #0 88 PC14 1640.0 1275.0 ACMP1_CH6 TIM0_CDTI1 #1/3 TIM1_CC1 #0 PCNT0_S1IN #0 U0_TX #3 89 PC15 1640.0 1372.2 ACMP1_CH7 TIM0_CDTI2 #1/3 TIM1_CC2 #0 U0_RX #3 90 PF0 1415.0 1575.0 LETIM0_OUT0 #2 DBG_SWCLK #0/1 91 PF1 1313.0 1575.0 LETIM0_OUT1 #2 DBG_SWDIO #0/1 92 PF2 1210.9 1575.0 LCD_SEG0 EBI_ARDY #0 93 PF3 1108.9 1575.0 LCD_SEG1 EBI_ALE #0 TIM0_CDTI0 #2 94 PF4 1006.9 1575.0 LCD_SEG2 EBI_WEn #0 TIM0_CDTI1 #2 95 PF5 904.8 1575.0 LCD_SEG3 EBI_REn #0 TIM0_CDTI2 #2 96 IOVSS_5 802.8 1575.0 Digital IO ground 5. 97 IOVDD_5 700.7 1575.0 Digital IO power supply 5. 98 PF6 598.7 1575.0 LCD_SEG24 TIM0_CC0 #2 U0_TX #0 99 PF7 496.7 1575.0 LCD_SEG25 TIM0_CC1 #2 U0_RX #0 100 PF8 394.6 1575.0 LCD_SEG26 TIM0_CC2 #2 101 PF9 292.6 1575.0 LCD_SEG27 102 PD9 190.6 1575.0 LCD_SEG28 EBI_CS0 #0 103 PD10 88.5 1575.0 LCD_SEG29 EBI_CS1 #0 104 PD11 -13.5 1575.0 LCD_SEG30 EBI_CS2 #0 105 PD12 -115.6 1575.0 LCD_SEG31 EBI_CS3 #0 106 PD13 -217.6 1575.0 107 PB15 -319.6 1575.0 108 PE8 -421.7 1575.0 LCD_SEG4 EBI_AD00 #0 PCNT2_S0IN #1 109 PE9 -523.7 1575.0 LCD_SEG5 EBI_AD01 #0 PCNT2_S1IN #1 110 PE10 -625.7 1575.0 LCD_SEG6 EBI_AD02 #0 TIM1_CC0 #1 US0_TX #0 BOOT_TX 111 PE11 -727.8 1575.0 LCD_SEG7 EBI_AD03 #0 TIM1_CC1 #1 US0_RX #0 BOOT_RX 112 IOVDD_6 -829.8 1575.0 Pad # Pad Name Analog EBI Timers Communication Other US0_TX #2 CMU_CLK0 #1 DBG_SWO #1 ACMP1_O #0 DBG_SWO #0 Digital IO power supply 6. 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 7 www.silabs.com ...the world's most energy friendly microcontrollers Wafer Pads and Coordinates Pad Alternate Functionality / Description X [µm] Y [µm] 113 IOVSS_6 -931.9 1575.0 114 PE12 -1033.9 1575.0 115 PE13 -1135.9 116 PE14 117 118 Pad # Pad Name EBI Timers Communication LCD_SEG8 EBI_AD04 #0 TIM1_CC2 #1 US0_CLK #0 1575.0 LCD_SEG9 EBI_AD05 #0 US0_CS #0 -1238.0 1575.0 LCD_SEG10 EBI_AD06 #0 LEU0_TX #2 PE15 -1340.0 1575.0 LCD_SEG11 EBI_AD07 #0 LEU0_RX #2 PA15 -1442.0 1575.0 LCD_SEG12 EBI_AD08 #0 Analog Other Digital IO ground 6. ACMP0_O #0 3.2 Alternate Functionality Pinout A wide selection of alternate functionality is available for multiplexing to various pins. This is shown in Table 3.2 (p. 8). The table shows the name of the alternate functionality in the first column, followed by columns showing the possible LOCATION bitfield settings. Note Some functionality, such as analog interfaces, do not have alternate settings or a LOCATION bitfield. In these cases, the pinout is shown in the column corresponding to LOCATION 0. Table 3.2. Alternate functionality overview Alternate LOCATION Functionality 0 1 2 3 Description ACMP0_CH0 PC0 Analog comparator ACMP0, channel 0. ACMP0_CH1 PC1 Analog comparator ACMP0, channel 1. ACMP0_CH2 PC2 Analog comparator ACMP0, channel 2. ACMP0_CH3 PC3 Analog comparator ACMP0, channel 3. ACMP0_CH4 PC4 Analog comparator ACMP0, channel 4. ACMP0_CH5 PC5 Analog comparator ACMP0, channel 5. ACMP0_CH6 PC6 Analog comparator ACMP0, channel 6. ACMP0_CH7 PC7 Analog comparator ACMP0, channel 7. ACMP0_O PE13 ACMP1_CH0 PC8 Analog comparator ACMP1, channel 0. ACMP1_CH1 PC9 Analog comparator ACMP1, channel 1. ACMP1_CH2 PC10 Analog comparator ACMP1, channel 2. ACMP1_CH3 PC11 Analog comparator ACMP1, channel 3. ACMP1_CH4 PC12 Analog comparator ACMP1, channel 4. ACMP1_CH5 PC13 Analog comparator ACMP1, channel 5. ACMP1_CH6 PC14 Analog comparator ACMP1, channel 6. ACMP1_CH7 PC15 Analog comparator ACMP1, channel 7. ACMP1_O PF2 ADC0_CH0 PD0 Analog to digital converter ADC0, input channel number 0. ADC0_CH1 PD1 Analog to digital converter ADC0, input channel number 1. ADC0_CH2 PD2 Analog to digital converter ADC0, input channel number 2. PE2 Analog comparator ACMP0, digital output. PE3 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 Analog comparator ACMP1, digital output. 8 www.silabs.com ...the world's most energy friendly microcontrollers Alternate LOCATION Functionality 0 1 2 3 Description ADC0_CH3 PD3 Analog to digital converter ADC0, input channel number 3. ADC0_CH4 PD4 Analog to digital converter ADC0, input channel number 4. ADC0_CH5 PD5 Analog to digital converter ADC0, input channel number 5. ADC0_CH6 PD6 Analog to digital converter ADC0, input channel number 6. ADC0_CH7 PD7 Analog to digital converter ADC0, input channel number 7. BOOT_RX PE11 Bootloader RX. BOOT_TX PE10 Bootloader TX. CMU_CLK0 PA2 PC12 Clock Management Unit, clock output number 0. CMU_CLK1 PA1 PD8 Clock Management Unit, clock output number 1. DAC0_OUT0 PB11 Digital to Analog Converter DAC0 output channel number 0. DAC0_OUT1 PB12 Digital to Analog Converter DAC0 output channel number 1. DBG_SWCLK PF0 PF0 DBG_SWDIO PF1 PF1 Debug-interface Serial Wire clock input. Note that this function is enabled to pin out of reset, and has a built-in pull down. Debug-interface Serial Wire data input / output. Note that this function is enabled to pin out of reset, and has a built-in pull up. Debug-interface Serial Wire viewer Output. DBG_SWO PF2 PC15 EBI_AD00 PE8 External Bus Interface (EBI) address and data input / output pin 00. EBI_AD01 PE9 External Bus Interface (EBI) address and data input / output pin 01. EBI_AD02 PE10 External Bus Interface (EBI) address and data input / output pin 02. EBI_AD03 PE11 External Bus Interface (EBI) address and data input / output pin 03. EBI_AD04 PE12 External Bus Interface (EBI) address and data input / output pin 04. EBI_AD05 PE13 External Bus Interface (EBI) address and data input / output pin 05. EBI_AD06 PE14 External Bus Interface (EBI) address and data input / output pin 06. EBI_AD07 PE15 External Bus Interface (EBI) address and data input / output pin 07. EBI_AD08 PA15 External Bus Interface (EBI) address and data input / output pin 08. EBI_AD09 PA0 External Bus Interface (EBI) address and data input / output pin 09. EBI_AD10 PA1 External Bus Interface (EBI) address and data input / output pin 10. EBI_AD11 PA2 External Bus Interface (EBI) address and data input / output pin 11. EBI_AD12 PA3 External Bus Interface (EBI) address and data input / output pin 12. EBI_AD13 PA4 External Bus Interface (EBI) address and data input / output pin 13. EBI_AD14 PA5 External Bus Interface (EBI) address and data input / output pin 14. EBI_AD15 PA6 External Bus Interface (EBI) address and data input / output pin 15. EBI_ALE PF3 External Bus Interface (EBI) Address Latch Enable output. EBI_ARDY PF2 External Bus Interface (EBI) Hardware Ready Control input. EBI_CS0 PD9 External Bus Interface (EBI) Chip Select output 0. EBI_CS1 PD10 External Bus Interface (EBI) Chip Select output 1. EBI_CS2 PD11 External Bus Interface (EBI) Chip Select output 2. EBI_CS3 PD12 External Bus Interface (EBI) Chip Select output 3. EBI_REn PF5 External Bus Interface (EBI) Read Enable output. EBI_WEn PF4 External Bus Interface (EBI) Write Enable output. 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 Note that this function is not enabled after reset, and must be enabled by software to be used. 9 www.silabs.com ...the world's most energy friendly microcontrollers Alternate LOCATION Functionality 0 1 2 3 Description HFXTAL_N PB14 High Frequency Crystal negative pin. Also used as external optional clock input pin. HFXTAL_P PB13 High Frequency Crystal positive pin. I2C0_SCL PA1 PD7 PC7 PD15 I2C0 Serial Clock Line input / output. I2C0_SDA PA0 PD6 PC6 PD14 I2C0 Serial Data input / output. LCD_BCAP_N PA13 LCD voltage booster (optional), boost capacitor, negative pin. If using the LCD voltage booster, connect a 22 nF capacitor between LCD_BCAP_N and LCD_BCAP_P. LCD_BCAP_P PA12 LCD voltage booster (optional), boost capacitor, positive pin. If using the LCD voltage booster, connect a 22 nF capacitor between LCD_BCAP_N and LCD_BCAP_P. LCD voltage booster (optional), boost output. If using the LCD voltage booster, connect a 1 uF capacitor between this pin and VSS. LCD_BEXT An external LCD voltage may also be applied to this pin if the booster is not enabled. PA14 If AVDD is used directly as the LCD supply voltage, this pin may be left unconnected or used as a GPIO. LCD_COM0 PE4 LCD driver common line number 0. LCD_COM1 PE5 LCD driver common line number 1. LCD_COM2 PE6 LCD driver common line number 2. LCD_COM3 PE7 LCD driver common line number 3. LCD_SEG0 PF2 LCD segment line 0. Segments 0, 1, 2 and 3 are controlled by SEGEN0. LCD_SEG1 PF3 LCD segment line 1. Segments 0, 1, 2 and 3 are controlled by SEGEN0. LCD_SEG2 PF4 LCD segment line 2. Segments 0, 1, 2 and 3 are controlled by SEGEN0. LCD_SEG3 PF5 LCD segment line 3. Segments 0, 1, 2 and 3 are controlled by SEGEN0. LCD_SEG4 PE8 LCD segment line 4. Segments 4, 5, 6 and 7 are controlled by SEGEN1. LCD_SEG5 PE9 LCD segment line 5. Segments 4, 5, 6 and 7 are controlled by SEGEN1. LCD_SEG6 PE10 LCD segment line 6. Segments 4, 5, 6 and 7 are controlled by SEGEN1. LCD_SEG7 PE11 LCD segment line 7. Segments 4, 5, 6 and 7 are controlled by SEGEN1. LCD_SEG8 PE12 LCD segment line 8. Segments 8, 9, 10 and 11 are controlled by SEGEN2. LCD_SEG9 PE13 LCD segment line 9. Segments 8, 9, 10 and 11 are controlled by SEGEN2. LCD_SEG10 PE14 LCD segment line 10. Segments 8, 9, 10 and 11 are controlled by SEGEN2. LCD_SEG11 PE15 LCD segment line 11. Segments 8, 9, 10 and 11 are controlled by SEGEN2. LCD_SEG12 PA15 LCD segment line 12. Segments 12, 13, 14 and 15 are controlled by SEGEN3. LCD_SEG13 PA0 LCD segment line 13. Segments 12, 13, 14 and 15 are controlled by SEGEN3. LCD_SEG14 PA1 LCD segment line 14. Segments 12, 13, 14 and 15 are controlled by SEGEN3. LCD_SEG15 PA2 LCD segment line 15. Segments 12, 13, 14 and 15 are controlled by SEGEN3. LCD_SEG16 PA3 LCD segment line 16. Segments 16, 17, 18 and 19 are controlled by SEGEN4. LCD_SEG17 PA4 LCD segment line 17. Segments 16, 17, 18 and 19 are controlled by SEGEN4. LCD_SEG18 PA5 LCD segment line 18. Segments 16, 17, 18 and 19 are controlled by SEGEN4. LCD_SEG19 PA6 LCD segment line 19. Segments 16, 17, 18 and 19 are controlled by SEGEN4. 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 10 www.silabs.com ...the world's most energy friendly microcontrollers Alternate LOCATION Functionality 0 1 2 3 Description LCD_SEG20 PB3 LCD segment line 20. Segments 20, 21, 22 and 23 are controlled by SEGEN5. LCD_SEG21 PB4 LCD segment line 21. Segments 20, 21, 22 and 23 are controlled by SEGEN5. LCD_SEG22 PB5 LCD segment line 22. Segments 20, 21, 22 and 23 are controlled by SEGEN5. LCD_SEG23 PB6 LCD segment line 23. Segments 20, 21, 22 and 23 are controlled by SEGEN5. LCD_SEG24 PF6 LCD segment line 24. Segments 24, 25, 26 and 27 are controlled by SEGEN6. LCD_SEG25 PF7 LCD segment line 25. Segments 24, 25, 26 and 27 are controlled by SEGEN6. LCD_SEG26 PF8 LCD segment line 26. Segments 24, 25, 26 and 27 are controlled by SEGEN6. LCD_SEG27 PF9 LCD segment line 27. Segments 24, 25, 26 and 27 are controlled by SEGEN6. LCD_SEG28 PD9 LCD segment line 28. Segments 28, 29, 30 and 31 are controlled by SEGEN7. LCD_SEG29 PD10 LCD segment line 29. Segments 28, 29, 30 and 31 are controlled by SEGEN7. LCD_SEG30 PD11 LCD segment line 30. Segments 28, 29, 30 and 31 are controlled by SEGEN7. LCD_SEG31 PD12 LCD segment line 31. Segments 28, 29, 30 and 31 are controlled by SEGEN7. LCD_SEG32 PB0 LCD segment line 32. Segments 32, 33, 34 and 35 are controlled by SEGEN8. LCD_SEG33 PB1 LCD segment line 33. Segments 32, 33, 34 and 35 are controlled by SEGEN8. LCD_SEG34 PB2 LCD segment line 34. Segments 32, 33, 34 and 35 are controlled by SEGEN8. LCD_SEG35 PA7 LCD segment line 35. Segments 32, 33, 34 and 35 are controlled by SEGEN8. LCD_SEG36 PA8 LCD segment line 36. Segments 36, 37, 38 and 39 are controlled by SEGEN9. LCD_SEG37 PA9 LCD segment line 37. Segments 36, 37, 38 and 39 are controlled by SEGEN9. LCD_SEG38 PA10 LCD segment line 38. Segments 36, 37, 38 and 39 are controlled by SEGEN9. LCD_SEG39 PA11 LCD segment line 39. Segments 36, 37, 38 and 39 are controlled by SEGEN9. LETIM0_OUT0 PD6 PB11 PF0 PC4 Low Energy Timer LETIM0, output channel 0. LETIM0_OUT1 PD7 PB12 PF1 PC5 Low Energy Timer LETIM0, output channel 1. LEU0_RX PD5 PB14 PE15 LEUART0 Receive input. LEU0_TX PD4 PB13 PE14 LEUART0 Transmit output. Also used as receive input in half duplex communication. LEU1_RX PC7 PA6 LEUART1 Receive input. LEU1_TX PC6 PA5 LEUART1 Transmit output. Also used as receive input in half duplex communication. LFXTAL_N PB8 Low Frequency Crystal (typically 32.768 kHz) negative pin. Also used as an optional external clock input pin. LFXTAL_P PB7 Low Frequency Crystal (typically 32.768 kHz) positive pin. PCNT0_S0IN PC13 PE0 PC0 Pulse Counter PCNT0 input number 0. PCNT0_S1IN PC14 PE1 PC1 Pulse Counter PCNT0 input number 1. 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 11 www.silabs.com ...the world's most energy friendly microcontrollers Alternate LOCATION Functionality 0 1 2 3 Description PCNT1_S0IN PC4 PB3 Pulse Counter PCNT1 input number 0. PCNT1_S1IN PC5 PB4 Pulse Counter PCNT1 input number 1. PCNT2_S0IN PD0 PE8 Pulse Counter PCNT2 input number 0. PCNT2_S1IN PD1 PE9 Pulse Counter PCNT2 input number 1. TIM0_CC0 PA0 PA0 PF6 PD1 Timer 0 Capture Compare input / output channel 0. TIM0_CC1 PA1 PA1 PF7 PD2 Timer 0 Capture Compare input / output channel 1. TIM0_CC2 PA2 PA2 PF8 PD3 Timer 0 Capture Compare input / output channel 2. TIM0_CDTI0 PA3 PC13 PF3 PC13 Timer 0 Complimentary Deat Time Insertion channel 0. TIM0_CDTI1 PA4 PC14 PF4 PC14 Timer 0 Complimentary Deat Time Insertion channel 1. TIM0_CDTI2 PA5 PC15 PF5 PC15 Timer 0 Complimentary Deat Time Insertion channel 2. TIM1_CC0 PC13 PE10 PB0 Timer 1 Capture Compare input / output channel 0. TIM1_CC1 PC14 PE11 PB1 Timer 1 Capture Compare input / output channel 1. TIM1_CC2 PC15 PE12 PB2 Timer 1 Capture Compare input / output channel 2. TIM2_CC0 PA8 PA12 PC8 Timer 2 Capture Compare input / output channel 0. TIM2_CC1 PA9 PA13 PC9 Timer 2 Capture Compare input / output channel 1. TIM2_CC2 PA10 PA14 PC10 Timer 2 Capture Compare input / output channel 2. U0_RX PF7 PE1 PA4 PC15 UART0 Receive input. U0_TX PF6 PE0 PA3 PC14 UART0 Transmit output. Also used as receive input in half duplex communication. US0_CLK PE12 PE5 PC9 USART0 clock input / output. US0_CS PE13 PE4 PC8 USART0 chip select input / output. US0_RX PE11 PE6 PC10 USART0 Asynchronous Receive. USART0 Synchronous mode Master Input / Slave Output (MISO). US0_TX PE10 PE7 USART0 Asynchronous Transmit.Also used as receive input in half duplex communication. PC11 USART0 Synchronous mode Master Output / Slave Input (MOSI). US1_CLK PB7 PD2 USART1 clock input / output. US1_CS PB8 PD3 USART1 chip select input / output. US1_RX PC1 PD1 USART1 Asynchronous Receive. USART1 Synchronous mode Master Input / Slave Output (MISO). US1_TX PC0 USART1 Asynchronous Transmit.Also used as receive input in half duplex communication. PD0 USART1 Synchronous mode Master Output / Slave Input (MOSI). US2_CLK PC4 PB5 USART2 clock input / output. US2_CS PC5 PB6 USART2 chip select input / output. US2_RX PC3 PB4 USART2 Asynchronous Receive. USART2 Synchronous mode Master Input / Slave Output (MISO). US2_TX PC2 USART2 Asynchronous Transmit.Also used as receive input in half duplex communication. PB3 USART2 Synchronous mode Master Output / Slave Input (MOSI). 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 12 www.silabs.com ...the world's most energy friendly microcontrollers 3.3 GPIO Pinout Overview The specific GPIO pins available in EFM32G800 is shown in Table 3.3 (p. 13) . Each GPIO port is organized as 16-bit ports indicated by letters A through F, and the individual pin on this port is indicated by a number from 15 down to 0. Table 3.3. GPIO Pinout Port Pin 15 Pin 14 Pin 13 Pin 12 Pin 11 Pin 10 Pin 9 Pin 8 Pin 7 Pin 6 Pin 5 Pin 4 Pin 3 Pin 2 Pin 1 Pin 0 Port A PA15 PA14 PA13 PA12 PA11 PA10 PA9 PA8 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 Port B PB15 PB14 PB13 PB12 PB11 PB10 PB9 PB8 PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0 Port C PC15 PC14 PC13 PC12 PC11 PC10 PC9 PC8 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0 Port D PD15 PD14 PD13 PD12 PD11 PD10 PD9 PD8 PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0 Port E PE15 PE14 PE13 PE12 PE11 PE10 PE9 PE8 PE7 PE6 PE5 PE4 PE3 PE2 PE1 PE0 Port F - - - - - - PF9 PF8 PF7 PF6 PF5 PF4 PF3 PF2 PF1 PF0 3.4 Bonding Instructions All pads should be bonded out, with the exception of the pads labeled “NC” and listed as “Do not connect” in Table 3.1 (p. 5) . Gold bond wires are recommended for these devices. Both voltage regulator output decouple pads (DEC_0, DEC_1) must be bonded out and electrically connected on the PCB. In the packaged devices, both of these pads are bonded to a single DECOUPLE pin. 3.5 Wafer Description Table 3.4. Wafer and Die Information Parameter Value Device Family EFM32G (Gecko) Wafer Diameter 8 in Die Dimensions (Outer edge of seal ring) 3380 µm × 3250 µm Wafer Thickness (No backgrind) 725 µm ±15 µm (28.54 mil ±1 mil) Wafer Identification Notch Scribe Street Width 80 µm × 80 µm Die Per Wafer 1 Contact sales for information Passivation Standard Wafer Packaging Detail Wafer Jar Bond Pad Dimensions 65 µm (parallel to die edge) × 66 µm Bond Pad Pitch Minimum 81 µm Maximum Processing Temperature 250°C Electronic Die Map Format .txt 1 Note: This is the Expected Known Good Die yielded per wafer and represents the batch order quantity (one wafer). 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 13 www.silabs.com ...the world's most energy friendly microcontrollers 3.5.1 Environmental Bare silicon die are susceptible to mechanical damage and may be sensitive to light. When bare die must be used in an environment exposed to light, it may be necessary to cover the top and sides with an opaque material. For additional Quality and Environmental information, please see: http://www.silabs.com/support/quality/pages/default.aspx. 3.6 Wafer Storage Guidelines It is necessary to conform to appropriate wafer storage practices to avoid product degradation or contamination. • • • • Wafers may be stored for up to 18 months in the original packaging supplied by Silicon Labs. Wafers must be stored at a temperature of 18 - 24 °C. Wafers must be stored in a humidity-controlled environment with a relative humidity of <30% Wafers should be stored in a clean, dry, inert atmosphere (e.g. nitrogen or clean, dry air). 3.7 Failure Analysis (FA) Guidelines Certain conditions must be met for Silicon Laboratories to perform Failure Analysis on devices sold in wafer form. • In order to conduct failure analysis on a device in a customer-provided package, Silicon Laboratories must be provided with die assembled in an industry standard package that is pin compatible with existing packages Silicon Laboratories offers for the device. Initial response time for FA requests that meet these requirements will follow the standard FA guidelines for packaged parts. • If retest of the entire wafer is requested, Silicon Laboratories must be provided with the whole wafer. Silicon Laboratories cannot retest any wafers that have been sawed, diced, backgrind or are on tape. Initial response time for FA requests that meet these requirements will be 3 weeks. 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 14 www.silabs.com ...the world's most energy friendly microcontrollers 4 Chip Marking, Revision and Errata 4.1 Errata Please see the errata document for EFM32G800 for description and resolution of device erratas. This document is available in Simplicity Studio and online at: http://www.silabs.com/support/pages/document-library.aspx?p=MCUs--32-bit 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 15 www.silabs.com ...the world's most energy friendly microcontrollers 5 Revision History 5.1 Revision 1.90 May 22nd, 2015 Added clarification on conditions for INLADC and DNLADC parameters. Corrected EM2 current consumption condition in Electrical Characteristics section. Added AUXHFRCO to block diagram and Electrical Characteristics. Updated HFRCO table in the Electrical Characteristics section. Updated EM0, EM2, EM3, and EM4 maximum current specifications in the Electrical Characteristics section. Updated the Output Low Voltage maximum for sinking 20 mA with VDD = 3.0 V in the Electrical Characteristics section. Updated the Input Leakage Current maximum in the Electrical Characteristics section. Updated the minimum and maximum frequency specifications for the LFRCO, HFRCO, and AUXHFRCO in the Electrical Characteristics section. Updated the maximum current consumption of the HFRCO in the Electrical Characteristics section. Updated the maximum current consumption of the HFRCO in the Electrical Characteristics section. Added some minimum ADC SNR, SNDR, and SFDR specifications in the Electrical Characteristics section. Added some minimum and maximum ADC offset voltage, DNL, and INL specifications in the Electrical Characteristics section. Added maximum DAC current specifications in the Electrical Characteristics section. Added maximum ACMP current and maximum and minimum offset voltage specifications in the Electrical Characteristics section. Added maximum VCMP current and updated typical VCMP current specifications in the Electrical Characteristics section. Updated references to energyAware Designer to Configurator. 5.2 Revision 1.10 December 12th, 2014 Added recommendation to use gold bond wire. 5.3 Revision 1.00 October 15th, 2014 Initial release. 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 16 www.silabs.com ...the world's most energy friendly microcontrollers A Disclaimer and Trademarks A.1 Disclaimer Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Laboratories products are generally not intended for military applications. Silicon Laboratories products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. A.2 Trademark Information Silicon Laboratories Inc., Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, CMEMS®, EFM, EFM32, EFR, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem®, Precision32®, ProSLIC®, SiPHY®, USBXpress® and others are trademarks or registered trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders. 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 17 www.silabs.com ...the world's most energy friendly microcontrollers B Contact Information Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701 Please visit the Silicon Labs Technical Support web page: http://www.silabs.com/support/pages/contacttechnicalsupport.aspx and register to submit a technical support request. 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 18 www.silabs.com ...the world's most energy friendly microcontrollers Table of Contents 1. Ordering Information .................................................................................................................................. 2 2. System Summary ...................................................................................................................................... 3 3. Pinout and Package .................................................................................................................................. 4 3.1. Padout .......................................................................................................................................... 4 3.2. Alternate Functionality Pinout ............................................................................................................ 8 3.3. GPIO Pinout Overview ................................................................................................................... 13 3.4. Bonding Instructions ...................................................................................................................... 13 3.5. Wafer Description .......................................................................................................................... 13 3.6. Wafer Storage Guidelines ............................................................................................................... 14 3.7. Failure Analysis (FA) Guidelines ...................................................................................................... 14 4. Chip Marking, Revision and Errata .............................................................................................................. 15 4.1. Errata ......................................................................................................................................... 15 5. Revision History ...................................................................................................................................... 16 5.1. Revision 1.90 ............................................................................................................................... 16 5.2. Revision 1.10 ............................................................................................................................... 16 5.3. Revision 1.00 ............................................................................................................................... 16 A. Disclaimer and Trademarks ....................................................................................................................... 17 A.1. Disclaimer ................................................................................................................................... 17 A.2. Trademark Information ................................................................................................................... 17 B. Contact Information ................................................................................................................................. 18 B.1. ................................................................................................................................................. 18 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 19 www.silabs.com ...the world's most energy friendly microcontrollers List of Figures 3.1. EFM32G800 Padout (top view, not to scale) ................................................................................................ 4 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 20 www.silabs.com ...the world's most energy friendly microcontrollers List of Tables 1.1. 3.1. 3.2. 3.3. 3.4. Ordering Information ................................................................................................................................ 2 Device Padout ....................................................................................................................................... 5 Alternate functionality overview .................................................................................................................. 8 GPIO Pinout ........................................................................................................................................ 13 Wafer and Die Information ...................................................................................................................... 13 2015-05-22 - EFM32G800FXX - d0322_Rev1.90 21 www.silabs.com