Kit Description

Kit Description
Rev. 1.10 / August 2015
ZAMC4100
Evaluation Kit and GUI Operation Manual
Automotive ASICs and Industrial ASSPs
Multi-Functional and Robust
ZAMC4100
Evaluation Kit and GUI Operation Manual
Important Notes
Restrictions in Use
ZMDI’s ZAMC4100 Evaluation Kit, consisting of the ZAMC4100 Evaluation Board, ZAMC4100 Adaptor Board, LIN
Communication Board, and the communication/calibration software, is designed for product evaluation, laboratory setup,
and application software development only.
ZMDI’s Evaluation Kit hardware and software must not be used for production or production test setups.
Disclaimer
Zentrum Mikroelektronik Dresden AG (ZMD AG) shall not be liable for any damages arising out of defects resulting from
(i) delivered hardware or software
(ii) non-observance of instructions contained in this manual and in any other documentation provided to user, or
(iii) misuse, abuse, use under abnormal conditions, or alteration by anyone other than ZMD AG.
To the extent permitted by law, ZMD AG hereby expressly disclaims and user expressly waives any and all warranties,
whether express, implied, or statutory, including, without limitation, implied warranties of merchantability and of fitness for a
particular purpose, statutory warranty of non-infringement, and any other warranty that may arise by reason of usage of
trade, custom, or course of dealing.
Important Equipment Warning: If not followed properly, these procedures can result
damage to the user’s equipment. Only trained professionals should connect equipment.
Ensure that all kit users have read and understood this document before using the kit.
Contents
1
Introduction ....................................................................................................................................................... 6
1.1. Contents of Kit ........................................................................................................................................... 6
1.1.1. ZAMC4100 Evaluation Board V1.1 (EVB) .......................................................................................... 6
1.1.2. ZAMC4100 Adaptor Board V1.0 ......................................................................................................... 7
1.1.3. LIN Communication Board V1.0 ......................................................................................................... 7
1.1.4. Segger J-LINK® Lite ARM® JTAG Debug Probe (Optional) .............................................................. 8
1.1.5. Software .............................................................................................................................................. 9
1.2. Required Equipment .................................................................................................................................. 9
1.2.1. Operation Without any Actual Load Connected .................................................................................. 9
1.2.2. Operation with Actual Loads Connected ............................................................................................ 9
1.3. Hardware Description .............................................................................................................................. 10
1.3.1. Evaluation Board Feature Overview ................................................................................................. 10
1.3.2. High Side Drivers (HS1-HS4) ........................................................................................................... 11
1.3.3. Half Bridge Drivers (HB1-HB4) and AIN1/AIN2 ................................................................................ 12
1.3.4. ECM Driver........................................................................................................................................ 13
1.3.5. Power Supply Unit (PSU) Circuit (VBAT) ......................................................................................... 14
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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Evaluation Kit and GUI Operation Manual
1.3.6. GPIO Interface .................................................................................................................................. 15
1.3.7. Linear Regulator................................................................................................................................ 15
1.3.8. JTAG Interface .................................................................................................................................. 16
1.3.9. Expansion Connector ........................................................................................................................ 16
1.3.10. LIN Bus ............................................................................................................................................. 17
1.3.11. AIN3 and AIN4 Sensor Port .............................................................................................................. 17
1.3.12. Adaptor Board ................................................................................................................................... 18
2 Kit Setup ......................................................................................................................................................... 19
2.1. Directions for Downloading and Installing the ZAMC4100 Evaluation Software ..................................... 19
2.1.1. PC Prerequisites ............................................................................................................................... 19
2.1.2. Installation of Keil™ µVision 4 IDE and Setup .................................................................................. 19
2.2. Hardware Setup ....................................................................................................................................... 23
2.2.1. Segger J-LINK® Lite ARM® JTAG Debug Probe Setup .................................................................. 23
2.2.2. Preparing the Segger J-LINK® Lite ARM® JTAG Debug Probe for Initial Operation ...................... 23
2.2.3. Keil™ ULINK2 Setup ........................................................................................................................ 26
2.2.4. Keil™ µVision4 Project Debugger Selection ..................................................................................... 27
2.2.5. EVB Hardware Pre-check ................................................................................................................. 29
2.2.6. Connecting the Hardware ................................................................................................................. 30
2.2.7. Step 2: Connect the LIN Communication Board to the PC via the USB Cable Type B .................... 30
2.3. Using the Graphical User Interface (GUI) ............................................................................................... 31
2.3.1. Starting the GUI ................................................................................................................................ 31
2.3.2. Connect to EVB................................................................................................................................. 34
2.3.3. Mirror Control and Visualization ........................................................................................................ 35
3 Related Documents ........................................................................................................................................ 44
4 Glossary ......................................................................................................................................................... 44
5 Document Revision History ............................................................................................................................ 45
Appendix A
Adaptor Board Schematic .............................................................................................................. 46
Appendix B
Evaluation Board Schematic.......................................................................................................... 47
Appendix C Bill of Materials .............................................................................................................................. 48
List of Figures
Figure 1.1
Figure 1.2
Figure 1.3
Figure 1.4
Figure 1.5
Figure 1.6
Figure 1.7
Figure 1.8
Figure 1.9
Figure 1.10
ZAMC4100 Evaluation Board ............................................................................................................. 6
ZAMC4100 Adaptor Board ................................................................................................................. 7
LIN Communication Board .................................................................................................................. 8
Segger J-LINK® Lite ARM® JTAG Debug Probe .............................................................................. 8
ZAMC4100 Evaluation Board with Adapter Board Installed – Connectors and Block Description .. 10
Evaluation Board Schematics Sections for the High Side Drivers ................................................... 11
Evaluation Board Schematics Sections for Half Bridge Drivers for Adjustment and AIN1/AIN2 ...... 12
Evaluation Board Schematics Section for the Folding Motor ........................................................... 13
Evaluation Board Schematics Section for the ECM Driver ............................................................... 13
Evaluation Board Schematics Section for PSU Circuit ..................................................................... 14
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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Evaluation Kit and GUI Operation Manual
Figure 1.11 Evaluation Board Schematics Section for the GPIO Buffer and Level Shifter ................................. 15
Figure 1.12 Evaluation Board Schematics Section for the 5V Linear Regulator ................................................. 15
Figure 1.13 Evaluation Board Schematics Section for the JTAG Interface ......................................................... 16
Figure 1.14 Schematics for the Expansion Connector ........................................................................................ 16
Figure 1.15 Evaluation Board Schematic Sections for the LIN Bus..................................................................... 17
Figure 1.16 Evaluation Board Schematics Sections for AIN3 and AIN4 ............................................................. 17
Figure 1.17 Evaluation Board Schematics Section for S_P and S_N ................................................................. 18
Figure 1.18 Top and Bottom Side of the Adaptor Board Shown Before and After Mounting the ZAMC4100 ..... 18
Figure 2.1 Keil™ µVision4 IDE Installation Window .......................................................................................... 20
Figure 2.2 ZAMC4100 SDK Installation Window ............................................................................................... 20
Figure 2.3 ZAMC4100 SDK Component Selection ............................................................................................ 21
Figure 2.4 FTDI Driver Setup ............................................................................................................................. 22
Figure 2.5 Segger J-LINK® Lite ARM® JTAG Debug Probe ............................................................................ 23
Figure 2.6 Starting the J-Link Configurator ........................................................................................................ 24
Figure 2.7 Starting J-Link Configurator Window ................................................................................................ 24
Figure 2.8 J-Link Configurator Firmware Update in Progress Window ............................................................. 25
Figure 2.9 Keil™ ULINK2 ................................................................................................................................... 26
Figure 2.10 Keil ULINK2 Jumper Position ........................................................................................................... 26
Figure 2.11 Keil™ µVision4 IDE Debugger Setup for the Keil™ ULINK2 ........................................................... 27
®
®
Figure 2.12 Keil™ µVision4 IDE Debugger Setup for the Segger J-LINK Lite ARM JTAG Probe ................... 28
Figure 2.13 ZAMC4100 Evaluation Board – Connector and Jumper Description ............................................... 29
Figure 2.14 Step 1: Hardware Setup ZAMC4100 Evaluation Board with LIN Communication Board................. 30
Figure 2.15 Step 2: Full Hardware Connection Diagram ..................................................................................... 30
Figure 2.16 Keil™ µVision4 IDE with ZAMC4100 Package Installed .................................................................. 31
Figure 2.17 License Agreement ........................................................................................................................... 32
Figure 2.18 ZAMC4100 GUI Main Window.......................................................................................................... 32
Figure 2.19 ZAMC4100 GUI Communication Setup ............................................................................................ 33
Figure 2.20 LED Indication................................................................................................................................... 34
Figure 2.21 GUI Connected ................................................................................................................................. 35
Figure 2.22 Description of Mirror Control Buttons ............................................................................................... 36
Figure 2.23 Effects of Clicking Buttons ................................................................................................................ 37
Figure 2.24 Mirror Folding/Unfolding ................................................................................................................... 38
Figure 2.25 Mirror Position ................................................................................................................................... 38
Figure 2.26 Location of J3 and J4 ........................................................................................................................ 39
Figure 2.27 “Mirror Temperature” Display and J5 for External Temperature Selection ...................................... 39
Figure 2.28 Simulation of the ECM Function ......................................................................................................... 40
Figure 2.29 Displaying the Registers Window ....................................................................................................... 41
Figure 2.30 Registers Window .............................................................................................................................. 41
Figure 2.31 Reading a Register ........................................................................................................................... 42
Figure 2.32 Writing to a Register ......................................................................................................................... 42
Figure 2.33 Accessing Bit Descriptions ............................................................................................................... 43
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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List of Tables
Table 2.1
Table 2.2
Table 5.1
Prerequisites ..................................................................................................................................... 19
Mirror Control Buttons ....................................................................................................................... 36
Bill of Materials.................................................................................................................................. 48
For more information, contact ZMDI via [email protected].
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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Evaluation Kit and GUI Operation Manual
1
Introduction
This manual describes the use of the ZAMC4100 Evaluation Kit and the ZAMC4100 Evaluation Software. It also
describes the setup of the Keil™ ULINK2 JTAG debugger/programmer (not included in kit).
1.1.
Contents of Kit
The kit is designed for the purpose of evaluating a typical rearview mirror application for the automotive industry.
However it can be used for other applications as well.
The ZAMC4100 Evaluation Kit includes the following as illustrated in Figure 2.14:

ZAMC4100 Evaluation Board V1.0 (EVB)
ZAMC4100 Adaptor Board V1.0
 LIN Communication Board V1.0
 USB cable
 Segger J-LINK® Lite ARM® JTAG debug probe* (optionally included in the Evaluation Kit depending on the
order code)

The kit also requires the ZAMC4100 Evaluation Software, which is downloaded from ZMDI’s website as described
in section 1.1.3.
1.1.1.
ZAMC4100 Evaluation Board V1.1 (EVB)
The EVB is a placeholder where all connections and measurements can be made. There is also a JTAG
connector mounted on it. The EVB provides header connectors for mounting the ZAM4100 Adaptor Board above
the EVB.
Figure 1.1 ZAMC4100 Evaluation Board
* J-Link® is a trademark of SEGGER Microcontroller GmbH & Co.; ARM® is a trademark of ARM, Ltd.
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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1.1.1.1. Differences between EVB V1.1 and V1.0
EVB v1.0 and EVB v1.1 are completely functionality compatible. The only difference is a modification of the JTAG
*
circuitry. The EVB v1.1 can function with versions of Keil™ µVision® greater than version 4.7 and also with the
Segger J-LINK® Lite ARM® JTAG debug probe.
1.1.2.
ZAMC4100 Adaptor Board V1.0
The ZAMC4100 Adaptor Board is a small printed circuit board (PCB) with the ZAMC4100 device soldered on it. It
is stacked on top on the EVB.
Important: The adapter board is designed so that it is impossible to stack it in an incorrect
position. If it does not fit, check the markings on both the Adaptor Board and EVB (look for pin
1 on both circuit boards).
Figure 1.2 ZAMC4100 Adaptor Board
1.1.3.
LIN Communication Board V1.0
The LIN Communication Board shown in Figure 1.3 is designed to provide simple LIN communication and a
power supply to the EVB.
Important Equipment Warning: The LIN Communication Board has limited power; i.e., it
can power the EVB if there are not any actual loads connected. In this case, only the LEDs
are powered.
* Keil™ µVision® is a trademark of ARM Ltd.
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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Figure 1.3 LIN Communication Board
1.1.4.
Segger J-LINK® Lite ARM® JTAG Debug Probe (Optional)
The Segger J-LINK® Lite ARM® debug probe is an optional component of the ZAMC4100 Evaluation Kit; i.e., the
kit can be ordered with or without the J-LINK® Lite ARM® JTAG Debug Probe. It allows programming and
debugging of the EVB. See section 2.2.2 for the set up instructions.
Important Note: The Segger J-LINK® Lite ARM® cannot be ordered separately from ZMDI.
Figure 1.4 Segger J-LINK® Lite ARM® JTAG Debug Probe
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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1.1.5.
Software
Software package is available for download from the ZAMC4100 product page www.zmdi.com/ZAMC4100 and
contains everything needed to start the evaluation of the ZAMC4100 as well as to start writing custom firmware.
The software package includes the following:





Drivers for the Evaluation Kit hardware
Demonstration software
Software Development Kit for the ZAMC4100 with examples and documentation
Demonstration graphical user interface (GUI)
Data sheet, application notes, and schematics for the EVB
Equipment Warning: Although there might be newer versions of the some of the drivers,
tools, or libraries available, it is highly recommended that those included in the software package be used initially.
1.2.
Required Equipment
Initially, the ZAMC4100 on the EVB is programmed with demonstration firmware so that upon delivery, it can be
used in one of two possible ways: with or without an actual load connected.
1.2.1.
Operation without any Actual Load Connected
The requirements when operating without actual loads connected (i.e., no mirror or load of any kind connected to
the load terminals) are as follows:





1.2.2.
One free USB 2.0 port
Microsoft® .NET Framework version 3.5 to run the GUI
Internet connection (for subsequent updates)
EVB programmed with demonstration firmware (as delivered with the kit)
LIN Communication Board
Operation with Actual Loads Connected
In addition to the previous requirements, when connecting actual loads to the EVB, it is imperative to use an
external power supply capable of powering all loads.
Important Equipment Warning: The LIN Communication Board is not capable of powering
external loads. If an attempt is made to operate with an external load without an external power
supply, it is possible to damage the USB port of the PC in use.
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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1.3.
1.3.1.
Hardware Description
Evaluation Board Feature Overview
Figure 1.5 ZAMC4100 Evaluation Board with Adapter Board Installed – Connectors and Block Description
VBAT
Linear
Regulator
LIN Bus
JTAG
ECM
HS4 Signal
HS3 Signal
HS2 Signal
HS1 Signal
Folding HB1
AIN1/AIN2
HB3/HB4
X/Y Mirror
Adjustment
Sensor Port
AIN3/AIN4
GPIO/LED
Note: HB2 is a shared half bridge.
Kit Description
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© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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1.3.2.
High Side Drivers (HS1-HS4)
Figure 1.6 Evaluation Board Schematics Sections for the High Side Drivers
Kit Description
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© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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1.3.3.
Half Bridge Drivers (HB1-HB4) and AIN1/AIN2
1.3.3.1. Mirror Adjustment (HB2, HB3 and HB4) and Mirror Position Sensing
The schematic sections shown on the left in Figure 1.7 have a typical 5A-rated header connector for an X and Y
axis mirror motor. The schematic on the right shows the two methods of generating the AIN1 and AIN2 signals;
e.g., for sensing the mirror position:

External potentiometer for X-Y feedback signal

On-board potentiometer
See Figure 2.13 for the locations of the following jumpers. Also see section 1.3.11 regarding AIN3 and AIN4.
Jumper J3 selects the source of the signal for AIN1 – on-board potentiometer or external voltage.
Jumper J4 is the same as J3 but for AIN2.
Jumpers J16 and J17 control the power supply for S_P and S_N respectively (see Figure 1.17 for the schematic
showing the jumpers).
Figure 1.7 Evaluation Board Schematics Sections for Half Bridge Drivers for Adjustment and AIN1/AIN2
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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1.3.3.2. Folding Motor
The schematic section shown in Figure 1.8 is for the folding motor header. It operates with a bi-directional current,
which opens and closes the side mirror.
Figure 1.8 Evaluation Board Schematics Section for the Folding Motor
1.3.4.
ECM Driver
Figure 1.9 shows the schematics section for the electrochromatic mirror (ECM) connection.
Figure 1.9 Evaluation Board Schematics Section for the ECM Driver
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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1.3.5.
Power Supply Unit (PSU) Circuit (VBAT)
Figure 1.10 shows the PSU circuit used on the EVB, which is a typical PSU circuit for meeting the specifications
given in the ZAMC4100 Data Sheet. Note that J1 can be used to measure current.
Figure 1.10 Evaluation Board Schematics Section for PSU Circuit
For high current, it is advisable to use a solder link on J1 rather than using a jumper (see Figure 2.13 for location).
The D1 diode is used to protect the board in the event that the power cable polarity is incorrectly fitted due to user
error.
Note: The EVB has a reverse polarity protection, which prevents the EVB from being damaged provided that the
voltage is within acceptable limits. If polarity of the power connection is incorrect, a red LED will turn on. If the
power polarity is correct, then a green LED will turn on.
Note: For proper kit operation, the power supply voltage should be approximately 12V.
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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1.3.6.
GPIO Interface
The GPIO pins are connected to U2 and U3, which are TXB0104D bidirectional voltage translators with automatic
direction sensing. For more information, refer to the data sheet of the manufacturer (Texas Instruments). The
TXB0104D is used to avoid excessive loading on the ZAMC4100 when driven by LEDs if it is powered by the
linear regulator (refer to the ZAMC4100 Data Sheet).
The J7 header allows the user to connect the buffered GPIO signal to an external device or to link the jumper to
an LED.
The J8 jumper selects whether the LEDs are to be turned on or off.
Figure 1.11 Evaluation Board Schematics Section for the GPIO Buffer and Level Shifter
1.3.7.
Linear Regulator
The linear regulator provides power for the ECM and GPIO buffer. This avoids unnecessary loading on the
ZAMC4100.
Figure 1.12 Evaluation Board Schematics Section for the 5V Linear Regulator
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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1.3.8.
JTAG Interface
The JTAG connector is based on standard pin layout and functions with the Keil™* ULINK2 JTAG debugger (not
included in the ZAMC4100 Evaluation Kit).
Figure 1.13 Evaluation Board Schematics Section for the JTAG Interface
1.3.9.
Expansion Connector
The expansion connection is optional. It should not be used; however, it can provide an additional header for the
GPIO lines.
Figure 1.14 Schematics for the Expansion Connector
*
Keil™ is a trademark of ARM, Ltd.
Kit Description
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© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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1.3.10.
LIN Bus
Figure 1.15 shows the LIN Bus connector. For any LIN communication, the J11 jumper should be on. Jumper J10
selects whether the pull-up resistor R35 is included or not. For jumper locations, see Figure 2.13.
Figure 1.15 Evaluation Board Schematic Sections for the LIN Bus
1.3.11.
AIN3 and AIN4 Sensor Port
The AIN3 and AIN4 sensor ports are highly versatile: each port has two jumper options as shown in Figure 1.16.
Jumpers J5 and J9 select whether an on-board or external sensor is used for AIN3 and AIN4 respectively. (See
Figure 2.13 for jumper locations.) If jumpers J16 and J17 are shunted, then the ADC reference power is externally
supplied as shown in Figure 1.17. Otherwise ADC power is generated internally by the ZAMC4100.
Note: In addition to shunting J16 and J17, the ADC configuration must also be changed via the GUI in order for
the external power supply to be used for the ADC.
Figure 1.16 Evaluation Board Schematics Sections for AIN3 and AIN4
Kit Description
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© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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Figure 1.17 Evaluation Board Schematics Section for S_P and S_N
1.3.12.
Adaptor Board
The Adaptor Board is used to connect the ZAMC4100 to the Evaluation Board. Figure 1.18 shows the board
before and after assembly.
Figure 1.18 Top and Bottom Side of the Adaptor Board Shown Before and After Mounting the ZAMC4100
Top Side
Bottom Side

The Adaptor Board has the following on-board PSU filtering capacitors:

C11 (47nF) is for CAP_1V8

C12 (47nF) is for CAP_3V3

C13 (47nF) is for CAP_MCU

C14 (220nF) is for CAP_5V0
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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2
Kit Setup
This section describes setting up the software and usage of the ZAMC4100 graphical user interface (GUI) with
the Evaluation Kit after the ZAMC4100 has been programmed with demonstration firmware. The full functions and
features of the GUI can be utilized in combination with the ZAMC4100 Evaluation Kit V1.1.
2.1.
Directions for Downloading and Installing the ZAMC4100 Evaluation Software
The software tools needed to use the ZAMC4100 Evaluation Kit are provided within a single software package,
which installs the ZAMC4100 SDK, drivers, and other components. This ZAMC4100 Evaluation Software package
is available for download from the ZAMC4100 product page at www.zmdi.com/zamc4100.
After downloading this zip file, extract the zip file contents. Complete the following steps to set up the software for
the kit in the order given.
2.1.1.
PC Prerequisites
The GUI is designed to run on a Microsoft ® Windows™ operating system; Windows XP or a newer version is
required. The supported resolution is 800x600 or higher. The GUI demonstrates all main functions of the
ZAMC4100 and allows READ and WRITE access to the registers of the ZAMC4100.
Table 2.1
Prerequisites
Software Tool Name
Microsoft Chart Control for
Microsoft® .Net Framework 3.5
Description
Chart Control is used by the GUI.
It can be downloaded from the following link:
http://www.microsoft.com/en-us/download/details.aspx?id=14422
This library must be installed prior the using the GUI.
If Microsoft® .Net Framework 3.5 is not installed on the user’s computer, it can be obtained from the Microsoft®
website.
Note that if a newer version of Microsoft .Net Framework is installed, it cannot be assumed that version 3.5 is
installed.
2.1.2.
Installation of Keil™ µVision 4 IDE and Setup
Download and install the trial version of Keil™ µVision 4 IDE from http://www.keil.com. Start the setup program
and follow the on-screen instructions.
Kit Description
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© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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Figure 2.1 Keil™ µVision4 IDE Installation Window
Click the “Next” button and follow the screen instructions.
2.1.2.1. Installation of ZAMC4100 SDK
Double-click ZAMC4100_SDK-1.0-setup_M.exe to begin the setup. Note: Because the setup installs device
drivers, this step requires administrative privileges on the user’s PC. The first screen displays ZMDI’s license
agreement as shown in Figure 2.2. It must be accepted by clicking the “I Agree” button in order setup to proceed.
Figure 2.2 ZAMC4100 SDK Installation Window
Important: This setup installs third party drivers with separate license agreements that must be accepted in order
to have those drivers installed.
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Next the ZAMC4100 SDK setup will ask which components are to be installed. The first two components are
mandatory, and they must be always installed. The other components are Microsoft .Net 3.5 and the ZAMC4100
SDK. For a first time installation, it is highly recommended that all components are selected. Select the components to be installed and press “Next.”
The setup will start the installation of the selected components and drivers.
Note: During the installation, the setup program will ask for a Keil™ µVision destination folder. Ensure that the
selected folder is correct.
Figure 2.3 ZAMC4100 SDK Component Selection
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Figure 2.4 FTDI Driver Setup
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2.2.
2.2.1.
Hardware Setup
Segger J-LINK® Lite ARM® JTAG Debug Probe Setup
This section describes setting up the Segger® J-LINK Lite ARM® JTAG debugger/programmer to function with
the ZAMC4100 Evaluation Board. The Segger J-LINK Lite ARM is an option for the ZAMC4100 Evaluation Kit,
and it is shown on Figure 2.5.
Figure 2.5 Segger J-LINK® Lite ARM® JTAG Debug Probe
Connect the 20-pin ribbon cable on the Segger® J-LINK Lite ARM® JTAG Debug Probe to the JTAG connector
(P2) shown in Figure 2.13. See section 1.3.8 for more information about P2.
2.2.2.
Preparing the Segger J-LINK® Lite ARM® JTAG Debug Probe for Initial Operation
This section describes the first startup of the Segger J-LINK® Lite ARM® JTAG Debug Probe. This step is
needed in order to get the latest version of the J-LINK® Lite ARM® firmware that supports the ZAMC4100.
Connect the Debug Probe to a free USB port on the user’s PC and wait while the drivers are automatically
installed; then from the Windows® start menu, start the J-Link Configurator.
Important recommendation: Check www.segger.com for updated drivers.
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Figure 2.6 Starting the J-Link Configurator
When the J-Link Configurator is started the following window will appear.
Figure 2.7 Starting J-Link Configurator Window
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The J-LINK® Lite ARM® probe is listed in the window. Check the check box and then click the “Update firmware
of the selected emulators” button. This will initiate the firmware update process.
Figure 2.8 J-Link Configurator Firmware Update in Progress Window
When the firmware update process is completed, the J-Link Configurator can be closed.
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2.2.3.
Keil™ ULINK2 Setup
This section describes setting up the Keil™ ULINK2 JTAG debugger/programmer to work with the ZAMC4100
Evaluation Board. The Keil™ ULINK2 (not included in the ZAMC4100 Evaluation Kit) is shown in Figure 2.9.
Figure 2.9 Keil™ ULINK2
Disassemble the Keil™ ULINK2 by unscrewing the bottom screw. There should be a jumper on the PCB. Ensure
that the jumper is at the same position as shown in Figure 2.10.
Connect the 20-pin ribbon cable on the Keil™ ULINK2 to the JTAG connector (P2) on the ZAMC4100 Evaluation
Board shown in Figure 2.13. See section 1.3.8 for more information about P2.
Figure 2.10 Keil ULINK2 Jumper Position
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2.2.4.
Keil™ µVision4 Project Debugger Selection
This section describes setting up the Keil™ µVision4 IDE to use either the Keil™ ULINK2 or the J-LINK® Lite
ARM® JTAG debug probe. First, show the project options from the Project/Options menu from the Keil™
µVision IDE and select the appropriate debugger/programmer. Figure 2.11 shows the correct settings for the
ULINK2, and Figure 2.12 shows the correct settings for the J-LINK® Lite ARM® JTAG debug probe.
Figure 2.11 Keil™ µVision4 IDE Debugger Setup for the Keil™ ULINK2
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®
®
Figure 2.12 Keil™ µVision4 IDE Debugger Setup for the Segger J-LINK Lite ARM JTAG Probe
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2.2.5.
EVB Hardware Pre-check
Before connecting the ZAMC4100 Evaluation Board, verify the correct jumper settings on the Evaluation Board.
The schematic of the Evaluation Board can be found in Appendix B of this document.
Figure 2.13 ZAMC4100 Evaluation Board – Connector and Jumper Description
J13: Connects ECM
LED to +5V
J12: Connects all HSx
LEDs to +5V
Jumper =ON
Jumper =ON
External Power Supply
Connector
J11: Connects the
LIN Signal from the
Communication Board
to the ZAMC4100
Jumper = ON
ECM Connector
LIN Connector
High Side 4 Connector
(turn signal)
J10: Connects
R32 to VBAT
Jumper OFF
High Side 2 Connector
(BSD lamp)
JTAG Connector
High Side 3 Connector
(puddle lamp)
High Side 1 Connector
(heater)
Half Bridge 1 Connector
(folding)
J4: AIN2 Signal Source
Selection: Set to internal
J16: Connects
S_P pin to +5V
Jumper=ON
AIN2 Connector
J17: Connects
S_N pin to GND
Half Bridge 3 Connector
(X axis)
Jumper=ON
J9: AIN4 Signal
Source Selection:
Set to internal
Half Bridge 4 Connector
(Y axis)
J5: AIN3 Signal
Source Selection:
Set to internal
AIN1 Connector
J3: AIN1 Signal
Source Selection:
Set to internal
Kit Description
August 4, 2015
J2: Connects
HB2 LEDs to +5V
Jumper= ON
J14: Connects
HB3 LEDs to +5V
Jumper= ON
J15: Connects
HB4 LEDs to +5V
Jumper= ON
AIN3 Connector
AIN4 Connector
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2.2.6.
Connecting the Hardware
This section describes how the boards should be connected in order to work with the demonstration GUI. Ensure
that power and the LIN communication lines between the EVB and LIN Communication Board are properly
connected. Polarity of the power supply and LIN ground connection should be checked as well.
Figure 2.14 Step 1: Hardware Setup ZAMC4100 Evaluation Board with LIN Communication Board
2.2.7.
Step 2: Connect the LIN Communication Board to the PC via the USB Cable Type B
Figure 2.15 shows the full hardware connection diagram. The computer must be Windows® based with
Microsoft®.Net Framework 3.5 installed.
Figure 2.15 Step 2: Full Hardware Connection Diagram
Important Equipment Warning: This diagram is valid ONLY if no loads are used. If loads are
used, then an external power supply must be used instead of the 12V supplied from the LIN
Communication Board.
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2.3.
Using the Graphical User Interface (GUI)
This section describes how to use the demonstration GUI. The GUI is designed to be easy to use and to
demonstrate basic features of the ZAMC4100.
2.3.1.
Starting the GUI
After the Keil™ µVision IDE and ZAMC4100 software package are installed, start the Keil™ µVision4 IDE by
clicking its icon and then select “Books” as shown in Figure 2.16.
Figure 2.16 Keil™ µVision4 IDE with ZAMC4100 Package Installed
Then double-click on “Start ZAMC4100 Demo Application.” If all prerequisites are set up, the demonstration GUI
will appear.
When the GUI is started for the first time, the license agreement dialog will be displayed. Click the “I agree”
checkbox and then the “Done” button. The license agreement can be viewed at any time by selecting Show
License from the Help menu.
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Figure 2.17 License Agreement
After the license has been accepted, the main window appears.
Figure 2.18 ZAMC4100 GUI Main Window
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When the GUI is started for the first time or if the configuration has been changed, the GUI will be in offline mode;
i.e., no communication with the Evaluation Kit has been established. The communication interface must be setup
up first. This is done by clicking the “Config...” button.
Figure 2.19 ZAMC4100 GUI Communication Setup
Select the following settings and then click “OK”:

The communication interface should be “FTDI LIN.”

The LIN TX Frame ID should be 0x38.

The LIN RX Frame ID should be 0x39.
When the “OK” button is clicked, the message "New interface selected!” will be displayed in the log area at the
bottom of the screen. If instead the “Cancel” button is clicked, the message “Interface selection is cancelled” will
be displayed in the log area.
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2.3.2.
Connect to EVB
Connection to the EVB is established when the “Connect” button is clicked. When the connection is established,
the “Connect” button becomes disabled and the “Disconnect” button will be enabled. LED11 will flash as long as
the EVB is powered. This LED indicates that the demonstration firmware is running.
Figure 2.20 LED Indication
Note that in for order LED11 to flash, J8 must be shunted.
When the GUI is in operating mode, it communicates periodically with the EVB. This is indicated by the two
flashing LEDs on the LIN Communication Board. When the GUI is disconnected, the LEDs are off.
Figure 2.21 shows a typical screen when the GUI is connected to the EVB.
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Figure 2.21 GUI Connected
2.3.3.
Mirror Control and Visualization
The main window of the GUI is divided into three parts:

Mirror Control

Mirror Position

Mirror Temperature
The next sections give more detailed information about the purpose of each section of the screen.
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2.3.3.1. Mirror Control
This section is located on the left of the main window. It can be used to turn on/off all half bridges (HB1 to HB4)
and high side drivers (HS1 to HS4). Figure 2.22 and Table 2.2 provide detailed information about the functions of
the buttons.
Figure 2.22 Description of Mirror Control Buttons
Turn ON/OFF
High Side of
Half Bridge 4
Turn ON/OFF
Low Side of
Half Bridge 3
Turn ON/OFF
High Side of
Half Bridge 3
Folding Mirror
(Turn ON Low
Side of Half
Bridge 1)
Turn ON/OFF
Low Side of
Half Bridge 4
Unfolding Mirror
(Turn ON High
Side of Half
Bridge 1)
Turn ON/OFF
Turn Signal
(High Side 4)
Table 2.2
Turn ON/OFF
Heater Lamp
(High Side 1)
Turn ON/OFF
BSD Lamp
(High Side 2)
Turn ON/OFF
Puddle Lamp
(High Side 3)
Mirror Control Buttons
Note: the LEDs referred to in the table are located on the left side of the Evaluation Board adjacent to the edge connectors and
can be identified by the silkscreen labels on the board.
Action
Reaction
Click/Hold on the UP arrow
The high side of half bridge 4 and LED4 will be turned ON. When the button is
released, they will be turned OFF.
Click/Hold on the DOWN arrow
The low side of half bridge 4 and LED1 will be turned ON. When the button is
released, they will be turned OFF.
Click/Hold on the LEFT arrow
The high side of half bridge 3 and LED8 will be turned ON. When the button is
released, they will be turned OFF.
Click/Hold on the RIGHT arrow
The low side of half bridge 3 and LED6 will be turned ON. When the button is
released, they will be turned OFF.
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Action
Reaction
Click on the TURN SIGNAL
button
If the TURN SIGNAL is ON, then the button will be colored green and LED18 and
LED19 will be turned ON. Otherwise, the button will stay as its original color and the
LEDs will be turned OFF.
Click on the HEATER LAMP
If the HEATER LAMP is ON, then the button will be colored orange and LED22 and
LED26 will be turned ON. Otherwise, the button will stay as its original color and the
LEDs will be turned OFF.
button
Click on the BSD LAMP
button
Click on the PUDDLE LAMP
button
Click the FOLDING MIRROR
button
Click the UNFOLDING MIRROR
button
If the BSD LAMP is ON, then the button will be colored red and LED23 and LED24
will be turned ON. Otherwise, the button will stay as its original color and the LEDs
will be turned OFF.
If the PUDDLE LAMP is ON, then the button will be colored light blue and LED20 and
LED21 will be turned ON. Otherwise, the button will stay as its original color and the
LEDs will be turned OFF.
The high side of half bridge 1 and LED16 will be turned ON. When the mirror is fully
folded, they will be turned OFF.
Note: When the button is pushed, all other buttons are disabled except the UNFOLD
button, while the mirror is folded. The UNFOLD button can be pushed when the
mirror is fully folded.
The low side of half bridge 1 and LED17 will be turned ON. When the mirror is fully
unfolded, they will be turned OFF.
Note: When the button is pushed, all other buttons are disabled while the mirror is
not fully unfolded.
Figure 2.23 illustrates the effects of clicking the buttons.
Figure 2.23 Effects of Clicking Buttons
Turn Signal
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Heater Lamp
BSD Lamp
Puddle Lamp
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While the mirror is folding/unfolding, all other buttons are disabled as shown in Figure 2.24.
Figure 2.24 Mirror Folding/Unfolding
2.3.3.2. Mirror Position
The current position of the mirror is shown on the graph illustrated in Figure 2.24 and Figure 2.25. The position
can be changed via potentiometers RP1 for the X-axis and RP2 for the Y-axis if using the on-board potentiometers to simulate mirror signals (J3 and J4 should be in the RP1 and RP2 position as illustrated in Figure 2.26).
See “X/Y Mirror Adjustment” in Figure 1.5 for the location of RP1 and RP2.
Note that if an actual mirror with potentiometers is connected then J3 and J4 should be in the EXT position.
Figure 2.25 Mirror Position
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Figure 2.26 Location of J3 and J4
J4 selects on-board
potentiometer RP2 or
external signal for Y-axis
of mirror position
J3 selects on-board
potentiometer RP1 or
external signal for X-axis
of mirror position
2.3.3.3. Mirror Temperature
The “Mirror Temperature” section of the GUI shows the external temperature of the mirror in degrees Celsius.
This temperature can be measured by temperature sensor Q2 mounted on the Evaluation Board. To measure
and display the temperature via Q2, set J5 to the INT position.
Figure 2.27 “Mirror Temperature” Display and J5 for External Temperature Selection
Q2 On-Board
Temperature
Sensor
Kit Description
August 4, 2015
J5 selects the on-board temperature sensor
Q2 or the external temperature signal
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2.3.3.4. Electrochromatic Mirror
It is possible to test the ECM feature via the slider under the mirror graphic. Depending on the position of the
slider, the background color of the graphic will be different with a corresponding voltage difference on the ECM
output (see Figure 2.28).
Note: When the GUI is started, LED25 is on but it is dim. When the slider is moved, the ECM driver starts and the
LED adjacent to the ECM output should glow brightly. If the slider is moved so that the display becomes darker,
the LED becomes dimmer.
Figure 2.28 Simulation of the ECM Function
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2.3.3.5. Registers Window
The registers display feature is primarily intended for engineering purposes. It allows the user to view all the SBC
registers of the ZAMC4100, which are divided into several groups. To access this feature, click on Settings >
Registers on the top menu or press Ctrl+R.
Figure 2.29 Displaying the Registers Window
When this command is selected, all SBC registers are read, which takes a few seconds. Then a window similar to
Figure 2.30 is displayed. Refer to the ZAMC4100 Data Sheet for further details about the registers.
Figure 2.30 Registers Window
The ZAMC4100 registers available for display are divided into the following six groups. Click the group name to
display its registers. Figure 2.30 illustrates the display of registers in the “Global” group.

Global

Drivers

ADC

LIN PHY

PWM

Analog
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The registers window allows SBC registers to be read and/or written.
For only reading a register, click the “Read” button next to the register. If the operation is successful, then the
background of the register value will change to a green color as shown in Figure 2.31.
Figure 2.31 Reading a Register
There are two ways modify a value:

Type the hexadecimal or decimal value in the “Register Value” field, and then press the Enter key.

Check/uncheck the bits. A check represents a logical 1.
Modifying a value does not initiate a WRITE operation. The “Write” button must be clicked for the value to be
written into the corresponding register.
For example, if the value 0x0F is written into the HSDCTRL register then the LEDs for all high sides (LED18,
LED19, LED23, LED24, LED20, LED21, LED22, and LED26) should be turned ON.
Figure 2.32 Writing to a Register
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Furthermore the register display window offers a detailed description about the function of each bit in the register.
To access this information for a bit, hold the mouse pointer over the bit. The following information is provided in a
tool-tip:

Short and full name of the bit

The definitions of each of its two possible states

Type of access permitted for the bit
Figure 2.33 Accessing Bit Descriptions
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3
Related Documents
Note: X_xy refers to the current revision of the document.
Document
File Name
ZAMC4100 Datasheet
ZAMC4100_Data_Sheet_revX_xy.pdf
ZAMC4100 Application Kit Description
ZAMC4100_Application_Kit_Description_revX_xy.pdf
Visit the ZAMC4100 product page www.zmdi.com/zamc4100 on ZMDI’s website www.zmdi.com or contact your
nearest sales office for the latest version of these documents.
4
Glossary
Term
Description
AMC
Actuator and Motor Controller
BSD Lamp
Blind Spot Detection
(The BSD lamp is lit when there is an object (e.g., another vehicle) in the driver’s blind spot.)
ECM
Electrochromatic Mirror
EVB
Evaluation Board
GPIO
General-Purpose Input/Output
GUI
Graphical User Interface
HB
Half Bridge
HS
High Side
JTAG
Based on IEEE 1149.1 Standard Test Access Port and Boundary-Scan Architecture
LS
Low Side
PSU
Power Supply Unit
SBC
System Basis Chip
Kit Description
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5
Document Revision History
Revision
Date
Description
1.00
June 4, 2015
First release.
1.10
August 4, 2015
Update for new contents for GUI zip and GUI setup.
Addition of J-LINK® Lite® ARM description.
Updates for new revision 1.1 of the ZAMC4100 Evaluation Board, including figures,
schematics, and BOM.
Sales and Further Information
www.zmdi.com
[email protected]
Zentrum Mikroelektronik
Dresden AG
Global Headquarters
Grenzstrasse 28
01109 Dresden, Germany
ZMD America, Inc.
1525 McCarthy Blvd., #212
Milpitas, CA 95035-7453
USA
Central Office:
Phone +49.351.8822.306
Fax
+49.351.8822.337
USA Phone 1.855.275.9634
Phone +1.408.883.6310
Fax
+1.408.883.6358
European Technical Support
Phone +49.351.8822.7.772
Fax
+49.351.8822.87.772
DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice.
Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The
information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer,
licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or
in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any
customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for
any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty,
tort (including negligence), strict liability, or otherwise.
European Sales (Stuttgart)
Phone +49.711.674517.55
Fax
+49.711.674517.87955
Kit Description
August 4, 2015
Zentrum Mikroelektronik
Dresden AG, Japan Office
2nd Floor, Shinbashi Tokyu Bldg.
4-21-3, Shinbashi, Minato-ku
Tokyo, 105-0004
Japan
ZMD FAR EAST, Ltd.
3F, No. 51, Sec. 2,
Keelung Road
11052 Taipei
Taiwan
Phone +81.3.6895.7410
Fax
+81.3.6895.7301
Phone +886.2.2377.8189
Fax
+886.2.2377.8199
Zentrum Mikroelektronik
Dresden AG, Korea Office
U-space 1 Building
Unit B, 906-1
660, Daewangpangyo-ro
Bundang-gu, Seongnam-si
Gyeonggi-do, 463-400
Korea
Phone +82.31.950.7679
Fax
+82.504.841.3026
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
45 of 51
ZAMC4100
Evaluation Kit and GUI Operation Manual
Appendix A
Adaptor Board Schematic
Vss
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
31
29
27
25
23
21
19
17
15
13
11
9
7
5
3
1
P7
PINS 49-64
Vss
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
HB2a
VSS3
HB1b
VDDE2
VDDE3
HS1a
VDDE4
VDDE5
HS2
HS1b
VDDE6
VDDE7
HB1a
HS3
VSS2
HB2b
TCK
TMS
TDO
TDI
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
NC4
CAP_MCU
CAP_3V3
CAP_1V8
ZAMC4100
P10
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
31
29
27
25
23
21
19
17
15
13
11
9
7
5
3
1
PINS 33-48
47nF
C13
Vss
47nF
C12
47nF
C11
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
P12
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
PINS 1-16
VDDE1
NC6
VSS4
HB3
EC_RES
EC_M
VSS5
HS4
CAP_CP
LIN
VSS_LIN
VSS_IO
STO
VSSD2
TEST
TRSTN
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
U1
VDDE8
NC1
NC2
VSS1
HB4
NC3
AIN3/TEMP1
VSSA
AIN4/TEMP2
S_N
AIN2
AIN1
S_P
CAP_5V0
VSSD1
VDDE
P9
ThPad
65
Vss
C14
C2
220nF
August 4, 2015
C3
10u/50V 100n/50V
Vss
Kit Description
PINS 17-32
Vss
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
46 of 51
ZAMC4100
Evaluation Kit and GUI Operation Manual
Appendix B Evaluation Board Schematic
MIRROR MOTOR Y AXIS
PSU CIRCUIT
5V LINEAR REGULATOR
68nF
VBAT
C4
1uF
4
5V
R11
2.2k
C5
1uF
LED5
IRF7470
CAP_CP
green
Vss
TDI
30 1%
BUF_3V3
TRSTNX
TDIX
TMSX
TCKX
30 1%
TDOX
30 1%
R14
30 1%
TMS
R13
TCK
R17
TDO
R18
1
1
4.7k
100k
100k
TRSTNR10
30 1%
10A
Vbat
2
4
6
8
10
12
14
16
18
20
P1
Mirror_Y
TP2
ANALOG INPUT AIN1 AND AIN2
S_P
P4
TP3
3
2
J3
RP1
10k
Header 10X2
Vss
D3
AIN1
Vss
KS12Vx
C7
6.8nF
SS14
1
2
3
Ext / Int
Vss
1
2
HB4
HB2a
HB2b
P2
1
3
5
7
9
11
13
15
17
19
1
VOUT
NC
VIN
SS14
TP13
GND
8
1
7
6
5 VDDEd
CTL
D4
D3
D2
D1
5
S1
S2
S3
G
HB2a
2.2k
LED4
Yellow
R9
1
C6
Q1
3
2
VBAT
1
2
3
4
100k
BA05CC0WFP
100k
U1
D2
R8
J2
R1
LED1
Green
CAP_3V3
R3 R4 R5 R6 R7
R16
4.7M
TP1
1
VDDE
Vss
FUSE1
2
1
FORWARD/REVERSE
ACTIVITY LEDS
JTAG
4.7R
68nF
R15
2.2k
P3
BAT54
1
LED2
green
D1
R2
C1
Power
LED3
red
Amp. meter
J1
Vss
Reversed polarity
Vss
AIN1_Ext
1
S_N
P5
1
2
3
S_P
J4
3
RP2
10k
AIN2_Ext
Ext / Int
1
TP4
AIN2
ANALOG INPUT AIN3 AND AIN4
2
C8
1
6.8nF
VSS
HB3
EC_RES
EC_M
VSS
HS4
CAP_CP
LIN
VSS_LIN
VSS_IO
STO
VSSD
TEST
TRSTN
R20 2.2k
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
Vss
Vss
Vss
Vss
31
29
27
25
23
21
19
17
15
13
11
9
7
5
3
1
CAP_MCU
CAP_3V3
CAP_1V8
Vss
J6
1
2
3
4
5
6
7
1
2
3
4
5
6
7
8
Vcca Vccb
A1
B1
A2
B2
A3
B3
A4
B4
NC1 NC2
Gnd OE
14
13
12
11
10
9
8
PINS 17-32
U3
Vcca Vccb
A1
B1
A2
B2
A3
B3
A4
B4
NC1 NC2
Gnd OE
14
13
12
11
10
9
8
R22 2.2k
J7
GPIO0X
GPIO1X
GPIO2X
GPIO3X
GPIO4X
GPIO5X
GPIO6X
GPIO7X
C11
100nF
1
2
3
4
5
6
7
8
R23 2.2k
R24 2.2k
R25 2.2k
R26 2.2k
R27 2.k
CON8
C14
47uF
2
C9
1nF
1
RED
P8
AIN3_Ext
TP12
LED10
RED
LED11
RED
TP5
1
HB2a
2.2k
LED8
Yellow
HB3
HB2a
HB2b
1
2
P11
Mirror_X
S_N
LED12
RED
J14
R19
LED6
Green
1
2
3
LED9
FOLDING MOTOR
LED13
RED
FORWARD/REVERSE
ACTIVITY LEDS
LED14
RED
LED15
J8
TP6
1
S_P
GPIO LEDs ON/OFF
R29
33k 1%
3
2
AIN4
NTC1
33K 25C
NB12M00333
C12
1nF
1
2
P14
1
P13
Folding
1
2
3
TURN SIGNAL
AIN4_Ext
5V
TP7
1
TP11
LED18
LED19
YELLOW
YELLOW
R31
S_N
C15
100nF
HB2a
2.2k
LED17
Yellow
HB1a
HB1b
HB2a
HB2b
10k 1%
TXB0104D
J15
R28
LED16
Green
J9
R30
Vss
Vss
J16
+
AIN3
LED7
R21 2.2k RED
C10
100nF
Vss
TXB0104D
1
2
3
4
5
6
7
5V
RED
AIN3
VSSA
AIN4
S_N
AIN2
AIN1
S_P
CAP_5V0
VSSD
VDDE
VSS
HB4
VDDEd
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
P12
U2
Vss
CON8
PINS 33-48
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
PINS 1-16
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
TCK
TMS
TDO
TDI
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
Ext / Int
GPIO BUFFER & LEVEl SHIFTER
P10
Ext / Int
P9
FORWARD/REVERSE
ACTIVITY LEDS
3
Temp Sensor
(2.2mV/K)
1
HB2a
VSS
HB1b
VDDEd
VDDEd
HS1a
VDDEd
VDDEd
HS2
HS1b
VDDEd
VDDEd
HB1a
HS3
VSS
HB2b
MIRROR MOTOR X AXIS
J5
Q2
2N2222
PINS 49-64
1
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
P7
31
29
27
25
23
21
19
17
15
13
11
9
7
5
3
1
VDDEd
S_N
S_P
SW_GND
2.2k
1
2
HS4
J17
P15
Turn Signal
Vss
Vss
PUDDLE LAMP
TP8
1
EXPANSION CONNECTOR
HEATER
X1
LIN BUS
GPIO6X
GPIO7X
VBAT
J10
LINx
R35
1k
J11
LIN
C13
1n/50V
VSS_LIN
Vss
1
TP14
LINx
1
2
P19
LIN
GPIO3X
GPIO5X
GPIO4X
GPIO2X
GPIO1X
GPIO0X
SCKx
MISOx
MOSIx
SS/x
SDAx
SCLx
Vppx
KS12Vx
12Px
KS5Vx
5Px
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
Red
Red
R33
HS1b
HS1a
LED21
R32
WHITE
WHITE
1
2
1
2
HS3
P17
Heater
Vss
TP15
TP9
1
LED23
LED24
R34
RED
RED
1
2
Vss
ECM MIRROR
5V
R36
D6
3.3V
1k
EC_RES
EC_M
LED25
J13
SW_GND
Blue
R37
47R /1W
1
2
Vss
X3
Vss
Kit Description
August 4, 2015
Vss
TP10
X4
Vss
Vss
P20
J12
Vss
Vss
Vss
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
SW_GND
2.2k
HS2
Vss
ECM
X2
P16
Puddle Lamp
Vss
BSD LAMP
Vss
Vss
SW_GND
2.2k
SW_GND
2.2k
1
CON50A
LED26
1
D7x
D6x
D5x
D4x
D3x
Tr_D2x
TXD
RXD
TRIGx
Rx/Txx
LINwinx
ADCx
OWIx
LED22
LED20
47 of 51
P18
BSD Lamp
ZAMC4100
Evaluation Kit and GUI Operation Manual
Appendix C Bill of Materials
Table 5.1 Bill of Materials
Note: Components marked with an asterisk (*) are for the Adapter Board.
No
Name
Value
Type
Package
Manufacturer
Supplier
Order Code
Pieces
1
U1
BA05CC0WFP ROHM
SMD
5.0V±2% 1A, LDO 0.5V, Vinmax=25V,
ON/OFF
TO252-5
Rohm
Comet
BA05CC0WFP ROHM SMD
1
2
U2, U3
TXB0104D
IC, SM, LOGIC, TRANSLATOR
SOIC14
TEXAS INS
Farnell
1607890
2
3
TP1 to
TP15
KEYSTONE 5006
Keystone
Comet
KEYSTONE 5006
15
4
D1
BAT54C SMD (SOT23)
Schottky 30V 2x200mA 5ns 10pF, konf C
SOT23
Comet
BAT54C SMD (SOT23)
1
5
D2, D3
1N5819 (SS14)
40V 1A UFM0.6V/1A IFM30A IR1mA,
Schottky
SMA
Yangjie
Comet
1N5819(SS14) SMD YJ
2
6
D6
BZV55C3V3
500 mW 5% 3.3V minimelf
SOD80C
Vishay
Comet
BZV55C3V3
1
7
LED2, 5,
1, 6, 16,
HI-20129UG-T
Green LED
0805
HITANO
MT1
7419
5
8
LED4, 8,
17, 18, 19
HI-2012HY-T
Yellow LED
0805
HITANO
MT1
8832
5
9
LED3, 7,
9-15, 22,
23, 24
HI-2012HRF-T
Red LED
0805
HITANO
MT1
7418
12
10
LED20, 21
UE-ST170NW1-10T
White LED
0805
HITANO
MT1
8222
2
11
LED25
KP-2012QBC-D
2.0x1.2mm (0805), 100 mcd/20mA,
BLUE
0805
Kingbright
Comet
KP-2012QBC-D
1
12
RP1, 2
PNZ 10Z A 10K
PNZ 10Z A 10K lin 20%
10x11mm
vert.
ISKRA
Comet
PNZ 10Z A 10K
2
13
Knob for
RP
KNOB PNZ10 393 BLACK
PNZ 10/11Z A, black
ISKRA
Comet
KNOB PNZ10 393 BLACK
2
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
48 of 51
ZAMC4100
Evaluation Kit and GUI Operation Manual
No
Name
Value
Type
Package
Manufacturer
Supplier
Order Code
Pieces
14
C2 *
10uF / 50V
SMD/SMT CAP, MLCC, 1210, 50V X7R
10uF 10%
1210
Taiyo Yuden
Mouser
963-UMK325AB7106KM-T
1
15
C3 *
C0805 100nF 50V X7R
SAMSU
100nF 50V X7R +-10%
0805
Samsung
Comet
C0805 100nF 50V X7R
SAMSU
1
16
C14 *
C0805 220nF 50V X7R
SAMSU
220nF 50V X7R +-10%
0805
Samsung
Comet
C0805 220nF 50V X7R
SAMSU
1
17
C11, C12,
C13 *
C0805 47nF 50V X7R
SAMSUN
47nF 50V X7R +-10%
0805
Samsung
Comet
C0805 47nF 50V X7R
SAMSUN
3
18
C4, C5
C0805 1.0uF 50V X7R
SAMSUNG
1.0uF 50V X7R +-10%
0805
Samsung
Comet
C0805 1.0uF 50V X7R
SAMSUNG
2
19
C10, C11,
C15
C0805 100nF 50V X7R
SAMSU
100nF 50V X7R +-10%
0805
Samsung
Comet
C0805 100nF 50V X7R
SAMSU
3
20
C7, C8
C0805 6.8nF 50V X7R
SAMSU
6.8nF 50V X7R +-10%
0805
Samsung
Comet
C0805 6.8nF 50V X7R
SAMSU
2
21
C1, C6
C0805 68nF 50V X7R
SAMSUN
68nF 50V X7R +-10%
0805
Samsung
Comet
C0805 68nF 50V X7R
SAMSUN
2
22
C9, C12,
C13
C0805 1.0nF 50V X7R
SAMSU
1.0nF 50V X7R +-10%
0805
Samsung
Comet
C0805 1.0nF 50V X7R
SAMSU
3
23
C14
CE 100uF 16V SMD
Fujicon
El. cap. CS 20%, -40~85°C;
D6.3xL5.4mm, base 6.6mm
El. cap
6.3mm
Fujicon
Comet
CE 100uF 16V SMD
Fujicon
1
24
R2
R0805 4.7R 1%
RES SMD 0805 1% 4.7R 1/8W
0805
Uni ohm
Comet
R0805 4.7R 1%
1
25
R16
R0805 4.7M 5%
RES SMD 0805 5% 200ppm 4.7M 1/8W
0805
Uni ohm
Comet
R0805 4.7M 5%
1
26
R1, R11,
R12, R15,
R19, R28,
R31-R34,
R36
R0805 2.2K 1%
RES SMD 0805 1% 100ppm 2.2K 1/8W
0805
Uni ohm
Comet
R0805 2.2K 1%
11
27
R7
R0805 4.7K 1%
RES SMD 0805 1% 100ppm 4.7K 1/8W
0805
Uni ohm
Comet
R0805 4.7K 1%
1
28
R29
R0805 33K 1%
RES SMD 0805 1% 100ppm 33K 1/8W
0805
Uni ohm
Comet
R0805 33K 1%
1
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
49 of 51
ZAMC4100
Evaluation Kit and GUI Operation Manual
No
Name
Value
Type
Package
Manufacturer
Supplier
Order Code
Pieces
29
R30
R0805 10K 1%
RES SMD 0805 1% 100ppm 10K 1/8W
0805
Uni ohm
Comet
R0805 10K 1%
1
30
R3-R6
R0805 100K 1%
RES SMD 0805 1% 100ppm 100K 1/8W
0805
Uni ohm
Comet
R0805 100K 1%
5
31
R8, R9
R0805 1.0R 1% YAG/ASJ
RES SMD 0805 1% 100ppm 1R 1/8W
0805
Comet
R0805 1.0R 1% YAG/ASJ
2
32
R10, R13,
R14, R17,
R18
R0805 30R 1% YAG/ASJ
RES SMD 0805 1% 100ppm 30R 1/8W
0805
Comet
R0805 30R 1% YAG/ASJ
5
33
R20-R27,
R35
R0805 1.0K 1% YAG/ASJ
RES SMD 0805 1% 100ppm 1K 1/8W
0805
Comet
R0805 1.0K 1% YAG/ASJ
9
34
R37
R1WCF 47R
Resistor carbon film 1W(5x12) 5%
450ppm 47R
Trh
12.7mm
UniOhm
Comet
R1WCF 47R
1
35
NTC1
THERMISTOR, NTC, 33K
THERMISTOR, NTC, 33K
0805
AVX
Farnell
2103182
1
36
Q1
IRF7470
IRF7470, N channel
SO8
International
Rectifier
Farnell
9102868
1
37
Q2
P2N2222AG
P2N2222AG, NPN
TO92
ON SEMI
Farnell
1611371
1
38
J8
JSA41G0
SWITCH, JUMPER, SPST, 1A, 100V,
THD
2.54mm
ITW
PANCON
Farnell
1386703
3
39
P7, P9,
P10, P12
BL6.72Z
HEADER, SOCKET, 2.54MM, 72WAY
2x16x2.54
mm
Fisher
Farnell
9728929
4
40
P2
BH20S
Box Header Connector 2х10
2x10x2.54
mm
Cvilux
Comet
BH20S
1
41
J1, J2, J3,
J4, J5, J6,
J7, J9,
J10, J11,
J12
HN1X40
Single row pin header 1x40 , 2.54mm
1x40x2.54
mm
Cvilux
Comet
HN1X40
1
42
X1
HN2X20
Double row pin header 2x20, 2.54mm
2x20x2.54
mm
Cvilux
Comet
HN2X20
2
43
X2, X3, X4
Shorting Link
LINK, SHORTING, 0.4", PK25
10.16mm
pitch
Harwin
Farnell
175319
3
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
50 of 51
ZAMC4100
Evaluation Kit and GUI Operation Manual
No
Name
Value
Type
Package
Manufacturer
Supplier
Order Code
Pieces
44
Jumper
hood
MJ14
Jumper 2.54/14mm
-
Cvilux
Comet
MJ14
7
45
P4, P5,
P8, P14,
P20
DG15V-3.5 3P
8A 300V AC AWG28-16 3. 5mm
3x3.5mm
Degson
Comet
DG15V-3.5 3P
5
46
P1, P3,
P11, P13,
P15, P16,
P17, P18,
P19
DG15V-3.5 2P
8A 300V AC AWG28-16 3. 5mm
2x3.5mm
Degson
Comet
DG15V-3.5 2P
9
Kit Description
August 4, 2015
© 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
51 of 51