ZSSC30x6

Evaluation Kit Description
Rev. 1.10 / September 2014
ZSSC30x6
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
Mobile Sensing ICs
Smart and Mobile
ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
Contents
1
2
Introduction ......................................................................................................................................................... 4
Evaluation Kit Overview ..................................................................................................................................... 4
2.1. Installing the Software ................................................................................................................................. 5
2.1.1. Installing the USB Drivers ..................................................................................................................... 5
2.1.2. Installing ZSSC30x6 Evaluation Software ............................................................................................ 6
3 Evaluation Kit Hardware ..................................................................................................................................... 6
3.1. Communication Board ................................................................................................................................. 6
3.2. Evaluation Board ......................................................................................................................................... 8
3.3. IC Orientation for ZSSC3026/ZSSC3036 Adapter ...................................................................................... 9
3.4. Interface Selection .....................................................................................................................................10
3.5. Connectors ................................................................................................................................................11
3.6. Supply Voltage ..........................................................................................................................................12
3.6.1. Internal Supply Voltage .......................................................................................................................12
3.6.2. External Supply Voltage ......................................................................................................................12
4 Evaluation Kit Software ....................................................................................................................................14
4.1. Top Menu GUI Controls .............................................................................................................................15
4.2. Measurement Color Code .........................................................................................................................16
4.3. GUI Menu Bar ............................................................................................................................................17
4.3.1. Save/Load MTP Register Contents ....................................................................................................17
2
4.3.2. Scan I C™ Bus via the Scan I2C address Feature ............................................................................18
4.4. GUI – General Tab ....................................................................................................................................18
4.5. Data Logging .............................................................................................................................................19
4.5.1. Communication Log ............................................................................................................................19
4.6. GUI – MTP Tab .........................................................................................................................................21
4.7. GUI – EXT Tab ..........................................................................................................................................22
4.7.1. Get_Raw Commands ..........................................................................................................................23
4.7.2. Data Output Range .............................................................................................................................24
4.7.3. Setting up the Bridge Configuration for Calibration ............................................................................25
4.8. GUI – Calibration Tab ................................................................................................................................27
4.8.1. Calibration Input ..................................................................................................................................28
4.8.2. Calibration Output ...............................................................................................................................29
4.8.3. Calibration Process .............................................................................................................................30
5 Sensor Replacement Board (SRB) ..................................................................................................................33
6 Related Documents and Files ..........................................................................................................................34
7 Glossary ...........................................................................................................................................................34
8 Document Revision History ..............................................................................................................................35
Appendix A: Schematics Communication Board .....................................................................................................36
Appendix B: Schematic Evaluation Board ...............................................................................................................39
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
List of Figures
Figure 2.1
Figure 3.1
Figure 3.2
Figure 3.3
Figure 3.4
Figure 3.5
Figure 3.6
Figure 3.7
Figure 3.8
Figure 3.9
Figure 4.1
Figure 4.2
Figure 4.3
Figure 4.4
Figure 4.5
Figure 4.6
Figure 4.7
Figure 4.8
Figure 4.9
Figure 4.10
Figure 4.11
Figure 4.12
Figure 5.1
Figure 5.2
ZSSC30x6 Evaluation Kit Overview ..................................................................................................... 5
Components on the Top of the ZSSC30x6 Communication Board ...................................................... 7
Components on the Bottom of the ZSC30x6 Communication Board ................................................... 8
ZSSC30x6 Evaluation Board ................................................................................................................ 9
Orientation of the PQFN in the PQFN Adapter ..................................................................................... 9
Communication Interface Selection on CB and EB ............................................................................10
Connectors and the Pin Assignments at the CB ................................................................................11
Connectors and the Pin Assignments at EB .......................................................................................11
Jumper Settings on Communication Board for Internal Supply Voltage ............................................12
Jumper Settings on Communication Board for External Supply Voltage ...........................................13
GUI View after Opening the Evaluation Software ...............................................................................14
Structure of the GUI Menu Bar – ZSSC3026 Example ......................................................................17
2
I C™ Communication Example ..........................................................................................................19
2
I C™ Communication Structure for Example Communication Log ....................................................20
SPI Communication Example .............................................................................................................20
User-Accessible Memory, Addresses 00HEX through 17HEX ..........................................................21
Tab for Externally Defined Communication ........................................................................................22
External Bridge Measurement Configuration ......................................................................................26
Calibration Tab Structure ....................................................................................................................27
Calibration Point Definition .................................................................................................................29
Measuring a Calibration Data Point ....................................................................................................31
Coefficient Calculation ........................................................................................................................32
Sensor Replacement Board ................................................................................................................33
Resistance Network of the SRB .........................................................................................................33
List of Tables
Table 4.1
Table 4.2
Table 4.3
Table 4.4
Table 4.5
Table 4.6
Table 4.7
Table 4.8
Basic GUI Controls .............................................................................................................................15
Color Code for Bridge and Temperature Results ...............................................................................16
General Tab –Displays and Controls ..................................................................................................18
Get_Raw Commands .........................................................................................................................23
Data Output Ranges ...........................................................................................................................24
Calibration Types ................................................................................................................................28
Calibration Data Collection .................................................................................................................30
Calculate and Write Coefficients.........................................................................................................31
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
1
Introduction
This document describes the functionalities of the Evaluation Kits for the ZSSC3016, ZSSC3026, and ZSSC3036,
referred to here as the ZSSC30x6 Evaluation Kit. Note: Most illustrations show the ZSSC3026, but the content
applies to any ZSSC30x6 IC. This document covers the hardware components, the product specific configuration,
the evaluation software, and its handling. The software is designed for Windows®-based operating systems to
communicate with the ZSSC30x6 Evaluation Kit via the USB connection of the PC.
2
Evaluation Kit Overview
The ZSSC30x6 Evaluation Kit includes the following hardware components:

ZSSC30x6 Communication Board (CB)

ZSSC3016 Evaluation Board (EB)
Note: The same ZSSC3016 EB is used for all three kits.

Sensor Replacement Board (SRB)

Ribbon cable for the connection between the boards (14 pin)

ZSSC30x6 IC sample (DUT)

USB cable for the connection to a PC
The ZSSC30x6 Evaluation Software and the documentation are available on the ZMDI product web pages:



www.zmdi.com/zssc3016
www.zmdi.com/zssc3026
www.zmdi.com/zssc3036
The kit must be connected to a master, which is typically a PC.
The Evaluation Board provides a connector for connecting a sensor replacement device or a solder connection for
a soldering a sensor to 4 pads.
Schematics for the Communication Board are provided in Appendix A. Schematics for the Evaluation Board are in
Appendix B.
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
Figure 2.1
ZSSC30x6 Evaluation Kit Overview
The IC sample provided with the kit has the following package type depending on the product:

ZSSC3016: CDIP 18 package

ZSSC3026: PQFN 24 package inside an adapter, which will be plugged into the CDIP socket.

ZSSC3036: PQFN 24 package inside an adapter, which will be plugged into the CDIP socket.
2.1.
Installing the Software
The Evaluation Kit uses an FDTI controller on the Communication Board to handle the USB protocol, translate
2
communications, and synchronize communications with the I C™* and/or SPI interface.
2.1.1.
Installing the USB Drivers
Before installing the ZSSC30x6 Evaluation Software, the USB drivers for the FTDI device must be installed.
Download the drivers and corresponding installation guides from www.ftdichip.com/Drivers/D2XX.htm. The
Evaluation Software accesses the FTDI controller through the D2XX DLL. The drivers will not affect the operation
of any other USB peripherals. For installation of the drivers, the user’s system must meet these requirements:





x86-compatible PC
64 MB RAM
Hard drive with 20MB free space
USB port
Windows® 2000/XP/Vista/Windows® 7/Windows® 8
* I2C™ is a trademark of NXP.
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
2.1.2.
Installing ZSSC30x6 Evaluation Software
To install the ZSSC30x6 Evaluation Software on the user’s PC hard drive after unzipping the downloaded
ZSSC30x6 Evaluation Software zip file, navigate to the directory ZSSC30x6 EV SW_vXpxx (note: Xpxx refers to
the latest version number). Double click on the setup.exe file and follow the resulting standard installation
instructions, entering installation paths and identification as needed. The software automatically completes the
installation and creates an access link under Start -> All Programs -> ZMDI -> ZSSC30x6 Evaluation if the
defaults settings have been used.
3
Evaluation Kit Hardware
The delivered hardware consists primarily of two circuit boards: the ZSSC30x6 Communication Board and the
ZSSC3016 Evaluation Board. They are connected via the 14-pin ribbon cable. The Communication Board has a
USB interface for the connection to the master PC. The Evaluation Board has a CDIP 18 socket where the
sample IC (a.k.a. the DUT) must be inserted. An adapter is used for ZSSC3026 and ZSSC3036 samples.
3.1.
Communication Board
The ZSSC30x6 Communication Board has devices mounted on both sides. The components on the top side of
the PCB generate a stable supply voltage and an optional external programming voltage. See Figure 3.1.
2
There is a pin header for using a jumper to select either the I C™ or SPI communication protocol for communication with the DUT in the socket on the Evaluation Board. The ribbon cable connector that connects the
Communication Board to the Evaluation Board provides access to all communication signals; e.g., for an oscilloscope probe.
A metal potentiometer can be used to adjust the supply voltage in the typical range from 1.7V to 3.8V. Its initial
adjustment on delivery provides a voltage VDD ≈ 2.0V to 2.2V. The intensity of the adjacent LED is proportional to
the supply voltage.
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
Figure 3.1
Components on the Top of the ZSSC30x6 Communication Board
Set for transistor
level-shifter (K9)
SDA mode
selection(K7)
I2C/SPI
selection(K10)
Switchable pull-up
resistor (K11)
USB power
indication
LED
USB
B-type
connector
Full featured 14pin connector
(K4)
IC power indication
LED
Potentiometer for
adjusting VDD voltage
Select target voltage
(internal / external)(K5) External voltage
Evaluation Kit
September 29, 2014
Indication LED for Vpp
Voltage
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
On the bottom side of the Communication Board, the largest IC is the FTDI microcontroller for protocol handling.
There are also voltage regulators for the two variable voltages (VDD and VPP) and level shifters for communication signals.
Figure 3.2
Components on the Bottom of the ZSC30x6 Communication Board
USB controller
Level shifter (USB -> SPI/I2C)
Voltage
regulator
VDD supply
Voltage
regulator
controller FTDI
Voltage regulator
VPP voltage
3.2.
Level shifter (SPI/I2C ->USB)
Evaluation Board
The ZSSC30x6 Evaluation Board allows the user to use an oscilloscope to analyze all available signals to and
from the DUT and to select the communication interface for it via a jumper, which must match the setting on the
Communication Board. The Evaluation Board provides two alternatives for connecting a sensor or a sensor
replacement device: via a 16-pin square sensor connection terminal or by soldering a sensor with 4 pads on it to
an SMD footprint (see Figure 3.3).
The K1 and K2 pin header blocks (4 pins x 9 pins) adjacent to the DUT socket allow using a 2-pin jumper to
connect signal lines of the DUT (either of the 2 middle pins in each row of each header block) to either VSS (the
GND trace pin adjacent to the DUT) or VDD (the outer V_TGT trace pin, which is the supply voltage generated
from the Communication Board).
To connect the proper supply required for the DUT, use the red jumper to connect the DUT’s VDD signal line to
the V_TGT line as shown in Figure 3.3. Use the black jumper to connect the DUT’s VSS pin the GND line.
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
Figure 3.3
ZSSC30x6 Evaluation Board
Full featured 14-pin
connector (K10)
8-pin, 6-pin, 4-pin
connector
(K6,K5,K3)
Interface selection
I2C/SPI (K9)
VDD connection
jumper
VSS connection
jumper
Sensor connection
terminals (K7)
SMD pads for
soldering sensor (K8)
Note: The jumpers for the VDD and/or VSS connection might be missing on the delivered ZSSC30x6 Evaluation
Board. In this case, please insert the jumpers on the board as shown in Figure 3.5. They are mandatory for the
power supply for the IC sample.
3.3.
IC Orientation for ZSSC3026/ZSSC3036 Adapter
Figure 3.4 demonstrates the orientation for the ZSSC3026 or ZSSC3036 in the PQFN package adapter required
for proper function on the Evaluation Board.
Figure 3.4
Orientation of the PQFN in the PQFN Adapter
PQFN Adapter for ZSSC3026 and ZSSC3036
Pin 1 Orientation
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
3.4.
Interface Selection
Jumpers on the Communication Board must be set as shown in Figure 3.5. Further details for the signal path can
be found in the schematics in Appendix A.
The blue jumper on the Evaluation Board defines the protocol for the DUT in the following way:

Jumper on the “I2C” position → SEL = HIGH
2
For the I C™ selection, the jumper does not need to be connected. In this case, the SEL input to the DUT
is recognized as HIGH.

Jumper on the “SPI” position → SEL = LOW
For SPI, the interface jumper is required to pull the SEL signal to the LOW level.
Figure 3.5
Communication Interface Selection on CB and EB
Note: Interface settings on the CB and EB must match.
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
3.5.
Connectors
The connectors on the CB and EB are labeled. The kit must be assembled by the customer. When the ribbon
cable is connected correctly, it provides all possible signals between the microcontroller on the CB and the DUT
on the EB. The minimum signals required are VDD, VSS, SDA, and SCL; these lines can provide all options for
2
measurements and I C™ communication.
Figure 3.6 shows the pin assignment for the available connectors at the CB.
Figure 3.6
Connectors and the Pin Assignments at the CB
Figure 3.7
Connectors and the Pin Assignments at EB
Note: The signal names on the CB and EB do not match for some signals due to different origins for the boards;
nevertheless the actual signals are provided at the same pins at the corresponding connectors.
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
3.6.
Supply Voltage
The Evaluation Kit can be powered with an internal or external voltage supply for the DUT on the Evaluation
Board, which must be selected with the red jumper on the K5 pin header on the CB (see Figure 3.1). There are no
settings for selecting the supply source on the EB.
3.6.1.
Internal Supply Voltage
The internal VDD supply is generated by a regulator circuit on the CB. It is used as the HIGH level reference for
all signals that are necessary for communication with the DUT. If the red jumper on K5 is positioned as shown in
Figure 3.8 (“int” setting), then the DUT on the EB is supplied internally. With this setting, no external voltage input
is needed for the Evaluation Kit.
Figure 3.8
3.6.2.
Jumper Settings on Communication Board for Internal Supply Voltage
External Supply Voltage
An alternative for providing the supply voltage to the DUT is to input an external voltage supply source. Ensure
that the external voltage does not exceed the voltage supply specifications given in the ZMDI data sheet for the
DUT before connecting to the Evaluation Kit.
To use an external supply, set the K5 jumper as shown in Figure 3.9(“ext” setting). Connect the external voltage
to the 2-pin V_ext header that is immediately to the right of the K5 jumper with the orientation shown in Figure 3.9.
There are no adjustments for the external voltage on either the CB or EB.
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
Figure 3.9
Jumper Settings on Communication Board for External Supply Voltage
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
4
Evaluation Kit Software
When the ZSSC30x6 Evaluation Software (GUI) is activated, the left side of the first screen is the General tab,
which provides basic communication status (see Figure 4.1). The largest section of the screen is the main graph
area on the right, which is for displaying the measurement results over time. The data scale for temperature
output is on the right side of the main graph; the scale for bridge measurements is on the left. The x-axis
represents the number of measurement points at a given value in a run. Both y-axes display the corresponding
bridge/temperature value in a format selectable by the user.
Figure 4.1
GUI View after Opening the Evaluation Software
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September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
4.1.
Top Menu GUI Controls
At the top of the GUI screen is a banner for GUI controls that are always available. These include display fields at
the left for real-time single bridge and temperature measurement results. There are also additional controls with
the following descriptions and functions:
Table 4.1
Basic GUI Controls
Control
Description
Port button
The Port button allows closing and opening the USB communication port. This is useful
for making hardware changes (e.g., switching the DUT or jumper settings) without
exiting the GUI. It also indicates the current status. The button is green only if proper
communication has been established.
Status display field
Power On/Off icon
average values checkbox
The Status display field shows information related to the current GUI operation; e.g., if
calculated coefficients exceed the defined limits, the Status field displays the error.
The Power On/Off icon indicates whether the supply voltage is applied to the DUT in
the socket on the EB.
Checking the average values checkbox activates averaging of the measurement
results. The Select average length slider determines the number of measurements that
are taken to calculate the average result, which will then be displayed in the display
fields for measurement results and the main graph. Averaging extends the time until
the results appear in the GUI by the factor of adjusted average values. The results are
displayed in color instead of black font.
Select average length slider
Bridge graph/ Temp. graph
slider bars
log communication checkbox
Evaluation Kit
September 29, 2014
The output type for measurement results can be chosen or the associated graph can
be switched off with the Bridge graph and Temp graph slider bars. Raw measurements
are only provided in counts. After calibration, the °C- and the %- display are available.
[N] – Displays measurement results in counts.
[deg. C] – Displays measurement results in degrees Celsius. This option is only
available in Normal Mode where the measurements are linearized by coefficients.
[%] – Shows measurement results in percent, in relation to full-scale output (FSO)
(65535).
Off – No display of results for the associated graph
For some purposes such as debugging or documentation, it is helpful to log the
master-slave communication. To record this data, activate this checkbox, which results
in a dialog window for selecting the name and location for a .txt file where this information will be written. After the .txt log file is set up, it can be opened in the menu bar:
File->Communication Log
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
Control
Description
This button activates a cyclic bridge and/or temperature measurement. The
measurement mode is defined by the Raw / DSP Corrected measurement mode slider
bar to the left of this button.
Measurement Mode Slider
Conversion Time
Raw measurements must be configured either via the External Configuration section
under the EXT tab (see section 4.7), which is the recommended method, or by directly
writing a configuration into the BM_Config register. The raw data output provides the
results directly after AD conversion.
DSP Corrected position of the slider selects the configuration from the BM_Config
register for the measurement. The digital result after the ADC will be then processed
with the calculated coefficients. This measurement mode will provide valid results only
after a valid calibration of the ZSSC30x6.
This field indicates the period that is needed to complete a measurement command.
This period is defined by the conversion time of the ADC, the IC processing time, and
communication time between master and slave. Depending on the MSB/LSB
segmentation settings, the conversion time can vary significantly. The default value of
200ms suffices to establish an auto-zero-corrected measurement with a MSB/LSB
segmentation of 14/2. The conversion time can be derived from the ADC conversion
times specifications given in the ZSSC30x6 Data Sheet.
This button requests and reads the ZSSC30x6’s status byte and displays the result on
the LEDs on the General tab.
Reads the complete contents of the multiple-time programmable (MTP) memory of the
2
ZSSC30x6. The decoded basic bridge configuration and the I C™ address are
displayed on the General tab.
This button activates writing to the MTP of the ZSSC30x6. It will write only the
addresses for which the content is shown in red font on the MTP tab. In addition to
using the automatic data transfer from the Calibration tab and General tab, users can
also edit the values by double clicking on the value on the MTP tab page. The
ZSSC30x6 must be in Command Mode (CM) in order to write to the MTP; therefore the
software performs a power-on >power-off >Start CM sequence in the background.
After the write operation, the ZSSC30x6 will be set into Normal Mode again.
4.2.
Measurement Color Code
Bridge and temperature results are displayed in different colors. Different colors are also used for single and
averaged measurement results:
Table 4.2
Color Code for Bridge and Temperature Results
Color
Indication
Pink
Single bridge measurement.
Light Blue
Single temperature measurement.
Blue
Averaged bridge measurement.
Green
Averaged temperature measurement.
Red
Invalid measurement result. This could be due to a Conversion Time that is too short. In this case, bit 5 in
the status byte is set to ‘1’ and the Busy virtual LED on the General tab turns on. Another reason for an
invalid measurement result could be if ALU saturation is detected. In this case the Saturation LED turns on.
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
4.3.
GUI Menu Bar
Figure 4.2 shows the submenu items that are accessible under the menu bar of the GUI.
Figure 4.2
Structure of the GUI Menu Bar – ZSSC3026 Example
The File menu allows selecting options to load or save the MTP configuration and options for logging measurement data and communication data.
4.3.1.
Save/Load MTP Register Contents
Initially the customer memory pages are empty. If an identical memory configuration is needed for multiple ICs, it
is possible to save a given setup as a template. When the required MTP content is present in the MTP tab, select
File > Save MTP Config. The configuration file is created with an .eep extension, and it contains one decimal
value for each MTP address in each row.
To load a configuration file, select File > Load MTP Config. Note: The decimal values will be automatically displayed as hexadecimal values in the MTP tab. The loaded data is displayed in red font in the MTP tab and can be
written into the memory.
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
2
Scan I C™ Bus via the Scan I2C address Feature
4.3.2.
2
2
Another feature provided in the menu bar is the ability to scan the I C™ bus to determine the I C™ address of the
ZSSC30x6. Selecting Scan I2C address triggers the scan during which the ZSSC30x6 status is requested for
2
each address ranging from 00HEX to 7FHEX. When an I C™ address is acknowledged by the ZSSC30x6, the scan
stops, and this address is used for further communication during the current GUI session. The results of the scan
are indicated in the status window:
2


Status window message for a successful I C™ scan: Valid I2C address found: 0xXX!
2
Status window message for an I C™ scan without slave acknowledge: No valid I2C address found!
2
The I C™ address information is lost if the GUI or the communication port is closed. The communication to the
2
ZSSC30x6 with an I C™ address other than 00HEX can also be established by typing it manually in the menu bar
item interface setup by selecting Interface Setup > I2C Slave Address.
4.4.
GUI – General Tab
Table 4.3
General Tab –Displays and Controls
Control
Description
2
After reading the MTP, the display shows the I C™ address that is saved in the memory. If a
new address is entered in the window and the Copy adjusted settings to MTP button is
clicked, the new value is shown in red color on the MTP tab.
The bridge configuration area provides settings of the analog signal path and AD conversion.
The drop-down menus contain the available setting values.
Changing the parameter values here does not automatically apply them to measurements. It
is possible to apply the adjusted settings and use them for raw data collection. There are
different commands for performing raw measurements. Some of the commands use the configuration from the BM_Config register (A0HEX, A2HEX); others (A1HEX, A3HEX) are configured
via the interface. For a full description of raw measurement commands, refer to Table 4.4.
For configuration via the interface, click on the Copy adjusted settings for Raw Data Acquisition button, which automatically displays the EXT tab (see section 4.7) and transfers the
present settings to the external configuration section.
The Copy adjusted settings to MTP button copies the present settings to the MTP tab. The
settings can then be written to the MTP memory (see section 4.6).
The communication status section evaluates the status byte information sent from the sample.
It provides following information via the virtual LEDs:
Powered indicates if the device is powered. If the LED is off, it does not automatically mean
2
that VDD is not supplied. For example, the LED will be off if the I C™ communication is
2
attempted with an I C™ address different from the address programmed in the IC’s memory.
CMD Mode shows whether the IC is in Command Mode.
Test Mode shows whether the IC is in Test Mode (not intended for users)
Busy indicates if processing of the last command is finished. If it is, the LED is off.
Memory Error displays whether the checksum-based integrity check passed or failed. In the
default state of the kit, this LED should be on. Recommended approach: after writing memory
data (bridge configuration, coefficients…), write the signature over the memory content via the
MTP Write Completion (Checksum) button on the MTP tab. After a subsequent power-onreset sequence, the integrity check should pass and the LED should turn off.
Saturation: This LED is on if the DSP core saturates; e.g., if the internal signal correction
result exceeds the limits of the internal arithmetic unit.
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4.5.
Data Logging
The ZSSC30x6 Evaluation Kit software provides the option to log measurement and communication data as
described in Table 4.1.
4.5.1.
Communication Log
2
Communication with the IC can be logged for both the I C™and SPI interface. Use the log communication
checkbox on the General tab for recording the data stream. Choose a path for which the user has writing
permission for storing the log file. Open the log file via the menu bar: File -> Communication Log. The resulting
text file is an ASCII file and can be imported into Microsoft® Excel.
2
4.5.1.1. I C™ log
2
Figure 4.3 shows a short example of the I C™ communication recorded in a log file.
Figure 4.3
2
I C™ Communication Example
2
The log file maps only the transferred data, not the specific frame conditions for I C™, such as START or STOP
conditions or acknowledges. Communication commands that are not available to the user are not logged. This
also applies to the SPI communication log.
The Evaluation Kit uses DF 5 (data fetch 5) by default. This means READ data from the slave has a 5-byte
structure. In the example shown in Figure 4.3, a raw bridge measurement is done in two steps:


Start Command Mode (A9HEX). After this command, it is not necessary to read; however, the Evaluation Kit
software sends a command to read the status byte to obtain the most current status of the IC. In the
second and fourth rows of the example above, the status byte of 4c is returned in the response to the
master sending the slave address with the read/write bit (R/ ) set to read.
Get_Raw auto-zero corrected bridge data (A3HEX).
2
2
2
I C™ interface properties correspond to the NXP I C™ bus specification. For the I C™ log example data, the
sections of the data frame structure are explained in Figure 4.4. In this illustration for communication frames,
START conditions are indicated with S; STOP conditions are shown as P; and acknowledges are shown with A.
For information about communication frame structure, see the data sheet (see section 6).
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Figure 4.4
2
I C™ Communication Structure for Example Communication Log
Write command from master to slave
data frame (hex)
00
a3
Command
Data in bits
0000000
02
48
end
Measurement configuration
0
10100011
00000010
01001000
I2C frame
Read data from slave by master
data frame (hex)
01
4c
Status
0000000
1
01001100
e0
0a
00
00
end
Measurement result
11100000
00001010
00000000
00000000
4.5.1.2. SPI Log
Communication via SPI is accomplished with the single pins for input and output (MOSI and MISO respectively).
The MOSI data always consists of 3 bytes; MISO data is always 5 bytes.
2
The example shown in Figure 4.5 has the same command sequence as the I C™ example. The difference is the
F0HEX command, which is sent in the Evaluation Kit each time before reading the MISO signal. This is due to
ZMDI’s hardware/software setup for the kit. It is not required for the final user application.
Figure 4.5
SPI Communication Example
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4.5.1.3. Measurement Log
Measurement data can be recorded as well. In raw measurement mode, the results are logged in counts, but they
are not calculated as percentage (bridge) or degree Celsius (temperature). If the IC is calibrated, the DSPcorrected bridge results are provided in counts and percentage based on the output range. The temperature
results are logged in counts and degree Celsius numbers.
4.6.
GUI – MTP Tab
The MTP tab shows the current memory data of the user’s page. The data is displayed in four hexadecimal digits
for each of the 24 addresses in the MTP. To display the memory contents in the MTP table, read the complete
memory by clicking on the Read MTP (all) button. The resulting message in the status window at the top right of
the GUI should be “MTP Read OK.” Subsequent changes in this table are indicated with red font so that the user
is aware that this data does not correspond with the IC’s data.
As shown in Figure 4.6, the first column is the address number; the second column comprises the data in the
register. The description name for the corresponding register is given in the third column. The forth column is a
single digit, which indicates whether an internal data correction has been asserted. Each 16-bit register displayed
is also written to a redundant register. With each reading process, the origin and the redundant register are
compared bitwise. If they do not agree, the correction bit in the fourth column will be set.
Figure 4.6
User-Accessible Memory, Addresses 00HEX through 17HEX
MTP addresses
MTP data
Register name
Correction bit
Changed register content
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Clicking the MTP Write Completion (Checksum) button at the bottom of the MTP tab triggers the signature
generation and writing over the current memory contents. Therefore it should be the last step to be done after
bridge measurement configuration, coefficient calculation, and writing. Once the checksum has been written, the
Memory Error LED turns off after repowering the IC (see Table 4.3).
Additional features on the MTP tab are the user memory page number and the INC CUST Page button for
increasing the memory page. Each IC provides four customer pages; therefore it is possible to increase the CUST
Page index three times.
For the MTP write(sel), MTP Write Completion (Checksum), and INC CUST Page buttons, the IC must be in
Command Mode, so the Command Mode is accessed and then exited by the software in the background.
4.7.
GUI – EXT Tab
The EXT tab is divided into two sections. The upper tab area is for communication with the IC with single
commands selectable from the drop-down menu. This section is considered as an additional communication
option but it is not necessary for typical user purposes. The lower part of this tab is relevant for the external bridge
configuration and temperature. “External” in this context means that the configuration does not have to be written
to the memory. It can be transmitted with the measurement command over the communication interface. All
commands defined in the EXTERNAL CONFIGURATION section are Get_Raw measurement requests.
Figure 4.7
Tab for Externally Defined Communication
Direct command section
Raw measurement configuration section
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In the “Bridge” and “Temperature” sections, the Type window defines the Get_Raw command and the Data
window selects the measurement configuration if required.
Example: In the “Bridge” section, an entry of 0x3 in the Type field and 0x024A in the Data field corresponds to the
GetRaw command 0xA3 024A.
4.7.1.
Get_Raw Commands
Eight Get_Raw commands for data acquisition are available, depending on the measurement type and the source
of the configuration; however, there are basically only two different commands: the single measurement and the
auto-zero measurement, which selects the ADC offset. These are applied to the bridge and temperature
measurements with different configuration origins.
All measurement command options are described in the Table 4.4.
Table 4.4
Get_Raw Commands
Command
Measurement
AFE Configuration Register
A0HEX + 0000HEX
BM – Bridge Measurement
BM_Config
A1HEX + ssssHEX
BM – Bridge Measurement
ssss is the user’s configuration setting for the
measurement provided via the interface. The
format and purpose of configuration bits must
be consistent with the definitions given in the
BM_Config register.
A2HEX + 0000HEX
BM-AZBM – Auto-Zero corrected Bridge
Measurement
BM_Config
A3HEX + ssssHEX
BM-AZBM – Auto-Zero corrected Bridge
Measurement
ssss is the user’s configuration setting for the
measurement provided via the interface. The
format and purpose of configuration bits must
be equal to the definitions for BM_Config.
A4HEX + 0000HEX
TM – Temperature Measurement
ZMDI-defined register.
A5HEX + ssssHEX
TM – Temperature Measurement
ssss is the user’s configuration setting for the
measurement provided via the interface. The
format and purpose of configuration bits must
be consistent with the definitions given in the
BM_Config register for temperature
measurements (bits [15:13] will be ignored).
A6HEX + 0000HEX
TM-AZTM – Auto-Zero corrected Temperature
Measurement
A7HEX + ssssHEX
TM-AZTM – Auto-Zero corrected Temperature
Measurement
Evaluation Kit
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ZMDI-defined register.
ssss is the user’s configuration setting for the
measurement provided via the interface. The
format and purpose of configuration bits must
be consistent with the definitions given in the
BM_Config register for temperature
measurements (bits [15:13] will be ignored).
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4.7.2.
Data Output Range
Raw measurement results display AD-converted data, without passing through the digital signal processor (DSP).
Here, the ADC offset adjustment and the measurement methods determine the raw data output range. The
expected output range is dynamically shown in the GUI, below the configured parameter of the EXT tab.
Output data in Normal Mode is digitally compensated and adjusted to the full-scale output of 16 bits if the device
has been calibrated correctly.
Table 4.5
Data Output Ranges
Raw Modes
BM – Bridge Measurement
AZBM – Auto-Zero Bridge Measurement
TM – Temperature Measurement
AZTM – Auto-Zero Temperature Measurement
Input Range
Data Output
ADC
Offset
-1/16 to 15/16
1/16
…
…
-8/16 to 8/16
Min
Max
0
61439
8/16
0
32767
-1/16 to 15/16
1/16
-4096
61439
…
…
-8/16 to 8/16
8/16
-32768
32767
-1/16 to 15/16
1/16
0
61439
…
…
-8/16 to 8/16
8/16
0
32767
-1/16 to 15/16
1/16
-4096
61439
…
…
-8/16 to 8/16
8/16
-32768
32767
-1/16 to 15/16
1/16
0
65535
…
…
-8/16 to 8/16
8/16
0
65535
Normal Mode
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4.7.3.
Setting up the Bridge Configuration for Calibration
If the sensor characteristics are known, the bridge measurement settings can be defined in the General tab.
These parameters are




Bridge Gain: The analog gain is realized in two different amplifier stages. The possible gain factors of
these two stages are selectable in the drop-down menu. Recommendation: Choose the bridge gain as high
as possible in order to take full advantage of the ADCs’ dynamic range.
Bridge Polarity: The IC has the capability to switch the polarity of the sensor input INP and INN. This
setting is only valid if the differential sensor signal has a higher negative voltage output range than the
positive one:
if ( abs(Vmax) < abs (Vmin)) ) Bridge Polarity = 1
else Bridge Polarity = 0
Bridge ADC segmentation: A second-order charge-balancing analog-to-digital converter (ADC) is used to
convert the amplifier signal. To allow optimizing the trade-off between conversion time and resolution, the
conversion is split into a MSB coarse conversion and an LSB fine conversion.
Bridge Range Shift: Depending on the sensor output, the ADC can be adjusted by a programmable offset
from 1/16 to 8/16 of ADC’s reference voltage.
The most appropriate gain (and offset) setup for a specific sensor element can be determined by using the
following steps:
1) Collect the sensor element’s characteristic, statistical data (over temperature, ambient sensor parameters,
and production tolerances):
a. Minimum differential output voltage:
Vmin
b. Maximum differential output voltage:
Vmax
2) If Vmin and Vmax have different signs (normally: Vmax is positive and Vmin is negative), then the required
ADC offset shift can be selected using the ratio: RatioOffset = |Vmin| / (Vmax – Vmin)
Then, the respective offset setup (A2D_offset) is the nearest integer of multiples of 1/16 in the range of
th
1/16 to 8/16 (refer to the data sheet; see section 6): A2D_offset = Round_to_x16 {RatioOffset}.
3) Determine which of the two following cases is valid, with Vref = Vrefp – Vrefn = 0.94·VDDB,min ~ 1.5V:
a. If RatioOffset – A2D_offset ≤ 0 then calculate the theoretical optimum gain:
Gainopt =(1 – A2D_offset)  Vref / Vmax
b. If RatioOffset – A2D_offset > 0 then calculate the theoretical optimum gain:
Gainopt = A2D_offset  Vref / |Vmin|
4) Select the setup gain (Gainsetup) as the nearest gain to Gainopt where Gainsetup ≤ Gainopt.
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After setting up the bridge measurement configuration in the General tab, it can be assigned to the EXT tab via
the Copy adjusted settings for Raw Data Acquisition button. The bridge settings appear now coded as a hexadecimal 16-bit number in the Data window of the “Bridge” section (see Figure 4.8). The configuration entered here
is valid for further calibration processes.
Figure 4.8
External Bridge Measurement Configuration
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4.8.
GUI – Calibration Tab
The primary purpose of the Calibration tab is the overview of the calibration data and the resulting coefficients.
This tab is divided in two sections: the input and the output of the calibration process (see Figure 4.9).
Figure 4.9
Calibration Tab Structure
Calibration output: coefficients
Calibration point distribution
in the measurement range
Calibration input: - calibration type
- calibration table with measurement points
Calibration temperature range definition
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4.8.1.
Calibration Input
The data input section is located in the lower left of the Calibration tab. In this table, data points are defined with
their reference information for bridge and temperature and the corresponding measurement results. Above the
calibration point table, the calibration type can be selected in a drop-down menu. Available calibration types are
described in Table 4.6.
Table 4.6
Calibration Types
Type
Calculated Coefficients
Number of Data
Points Required
Bridge
Temp
2 Point
OFFSET_B, GAIN_B
2
0
3 Point
OFFSET_B,GAIN_B, SOT_B
3
0
3 Point
OFFSET_T,GAIN_T, SOT_T
0
3
4 Point
OFFSET_B, GAIN_B, TCO, TCG, OFFSET_T, GAIN_T
2
2
5 Point
OFFSET_B, GAIN_B, TCO, OFFSET_T, GAIN_T, SOT_TCO, SOT_B, SOT_T
3
3
6 Point
OFFSET_B,GAIN_B, TCO, TCG, OFFSET_T, GAIN_T,SOT_TCO, SOT_TCG, SOT_T
2
3
7 Point
OFFSET_B,GAIN_B, TCO, TCG, OFFSET_T, GAIN_T,SOT_TCO, SOT_TCG,SOT_T,
SOT_B
3
3
Depending on calibration type, the corresponding number of calibration points are displayed in the main graph to
indicate the coverage of the measurement range. The “Calibration Points” table contains the relevant points for
coefficient calculation.
Entry descriptions for the calibration table:
P[%] – P stands for the bridge sensor measurement. The point should be entered as a percent of the full
measurement range for the bridge sensor measurement.
P[N] – Raw bridge measurement result in counts.
T[°C] – Temperature in degree Celsius.
T[N] – Raw temperature measurement result in counts.
Example: If the final application is specified from 800 to 1200 mbar, then 5% is 820 mbar and 95% is 1180.
Assuming the temperature range is from –40 to 80 degree Celsius, the initial calibration table for a 7-point
calibration could be defined as it is shown in Figure 4.10.
Note: The definition of the temperature range in the calibration must be entered at the bottom of the Calibration
tab. The degree Celsius entries in the “Calibration Points” table must match the range definition.
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Figure 4.10
4.8.2.
Calibration Point Definition
Calibration Output
The upper left section in the Calibration tab is the coefficient table, where the coefficients are displayed after
calculation. If one of the coefficients exceeds the range limit, its value appears as a red number. In this case, the
status window displays “Coefficients Range ERROR!”
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4.8.3.
Calibration Process
The following process for data collection describes one measurement point acquisition, representative for all
calibration points. A detailed description for the calibration flow can be found in the document ZSSC30x6
Application Note – Calibration Sequence and DLL (see section 6).
Table 4.7
Calibration Data Collection
Step
Description
Location
1
Connect the Evaluation Board to a PC and make all necessary connections from the
Evaluation Board to the ZSSC30x6 IC.
2
Start the Evaluation Software.
3
Create a calibration setup for the user’s system that is consistent with the sensor’s
characteristics. Click the Copy adjusted settings for Raw Data Acquisition button to enter
the current configuration in the EXT tab as described in Figure 4.8.
Alternatively, a pre-defined default setup can be loaded (see section 4.3.1).
General tab
4
Ensure that the default and recommended measurement types (command) for data
acquisition are selected:
Bridge: GetRaw Type: 3
Temperature: GetRaw Type: 6
EXT tab
5
Choose the calibration type via the Type drop-down menu.
Calibration tab
6
Set up the desired bridge sensor and temperature conditions so that the measurement
can be performed in a stable state. Enter the reference conditions P[%] and T[°C] in the
corresponding rows in the Calibration Points table.
Calibration tab
7
Select the row where the present measurement data should be entered by clicking one
of the row numbers from 1 to 7. Click on the Get Point P[N], T[N] button to trigger a
single measurement. The measurement results will be automatically displayed the table
(see Figure 4.11).
Calibration tab
8
The data for the remaining calibration points must be filled in the table by repeating the
steps 6 and 7 for each point.
Calibration tab
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Figure 4.11
Measuring a Calibration Data Point
First row selected
Trigger measurement
After the calibration point acquisition is completed, the coefficients calculation can be performed. Completion of
the calibration process is described in the following steps. Figure 4.12 illustrates these steps with blue arrows.
Table 4.8
Calculate and Write Coefficients
Step
Description
Location
1
Calculate the coefficients via the Calculate Coefficients button. The coefficients will be
displayed in the “Calculation Coefficients” table.
Calibration tab
2
Transfer the new coefficients to the MTP table by clicking on the Put Coefficients button. The
values are concurrently selected for writing (turning red).
Calibration tab
3
For DSP-corrected bridge measurement, the BM_Config register must contain the same
configuration as during calibration, so click on the Copy adjusted setting to MTP button. The
coded configuration appears red-colored in BM_Config.
General tab
4
Write the new coefficients into the MTP via the Write MTP(sel). Read the MTP contents to
ensure that the coefficients have been written to the memory.
MTP tab
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Step
Description
5
The final step after a successful calibration and coefficients writing is to generate and write
the checksum over the user memory. The MTP Write Completion (Checksum) button triggers
the IC internal calculation of the checksum and writes it in the Signature Cust register.
6
Finished! After the next reset of the IC, the new coefficients will be used to calculate the
output values if the measurement mode slider is switched to the DSP Corrected position. In
the General tab the Memory Error LED is off.
Figure 4.12
Location
MTP tab
Coefficient Calculation
Collected data for calibration
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5
Sensor Replacement Board (SRB)
In addition to the Evaluation Kit, a sensor replacement board
can be ordered. It allows the customer to do the first steps with
the ZSSC30x6 without a final application sensor module. The
sensor replacement board consists of two potentiometers
between the positive and negative sensor line, which can be
adjusted to represent the change in resistance of a sensor.
One is for the coarse resistance regulation; the other for the
fine adjustment. See Figure 5.1.
Figure 5.1
Sensor Replacement Board
The SRB has an internal resistance of approximately 2kΩ. The specific resistance values between the single pins
are given in Figure 5.2.
Figure 5.2
Resistance Network of the SRB
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6
Related Documents and Files
ZSSC30x6 Documents
File Name
ZSSC3016 Data Sheet
ZSSC3016_Data_Sheet_Rev_X_xy.pdf
ZSSC3016 Feature Sheet
ZSSC3016_Feature_Sheet_Rev_X_xy.pdf
ZSSC3026 Data Sheet
ZSSC3026_Data_Sheet_Rev_X_xy.pdf
ZSSC3026 Feature Sheet
ZSSC3026_Feature_Sheet_Rev_X_xy.pdf
ZSSC3036 Data Sheet
ZSSC3036_Data_Sheet_Rev_X_xy.pdf
ZSSC3036 Feature Sheet
ZSSC3016_Feature_Sheet_Rev_X_xy.pdf
ZSSC30x6 Application Note – Application Circuits
ZSSC30x6_Application_Circuit_Rev_X_xy.pdf
ZSSC30x6 Application Note – Calibration Sequence and DLL
ZSSC30x6_Calibration_Rev_X_xy.pdf
Visit the following ZSSC30x6 product pages on ZMDI’s website www.zmdi.com or contact your nearest sales
office for the latest version of these documents:

www.zmdi.com/zssc3016

www.zmdi.com/zssc3026

www.zmdi.com/zssc3036
7
Glossary
Term
Description
A2D
Analog-to-digital
ACK
Acknowledge (interface’s protocol indicator for successful data/command transfer)
ADC
Analog-to-Digital Converter or Conversion
AZ
Auto-Zero (unspecific)
AZS
Auto-Zero Measurement for Sensor Bridge Path
AZT
Auto-Zero Measurement for Temperature Path
CDIP
Ceramic Dual-Inline Package
CLK
Clock
DF
Data Fetch (this is a command type)
DLL
Dynamic-Link Library
DUT
Device Under Test
DSP
Digital Signal Processor (digital configuration, calibration, calculation, communication unit)
FSO
Full Scale Output (value in percent relative to the ADC maximum output code; resolution dependent)
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
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ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
Term
Description
LSB
Least Significant Bit (“fine” portion of the converted signal)
MSB
Most Significant Bit (“coarse” portion of the converted signal)
MTP
Multiple Time Programmable
NACK
Not Acknowledge (interface’s protocol indicator for unsuccessful data/command transfer)
PCB
Printed Circuit Board
POR
Power-On-Reset
PQFN
Power Quad Flat No Leads
SM
Signal Measurement
SOT
Second-Order Term
SRB
Sensor Replacement Board
TM
Temperature Measurement
8
Document Revision History
Revision.
Date
Description
1.00
January 18, 2014
First release
1.10
September 29, 2014
Addition of jumper setting information.
Update for imagery for cover and headers.
Minor edits for clarity.
Update for contact information.
Sales and Further Information
www.zmdi.com
[email protected]
Zentrum Mikroelektronik
Dresden AG
Global Headquarters
Grenzstrasse 28
01109 Dresden, Germany
ZMD America, Inc.
1525 McCarthy Blvd., #212
Milpitas, CA 95035-7453
USA
Central Office:
Phone +49.351.8822.306
Fax
+49.351.8822.337
USA Phone 1.855.275.9634
Phone +1.408.883.6310
Fax
+1.408.883.6358
European Technical Support
Phone +49.351.8822.7.772
Fax
+49.351.8822.87.772
DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice.
Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The
information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer,
licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or
in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any
customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for
any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty,
tort (including negligence), strict liability, or otherwise.
European Sales (Stuttgart)
Phone +49.711.674517.55
Fax
+49.711.674517.87955
Evaluation Kit
September 29, 2014
Zentrum Mikroelektronik
Dresden AG, Japan Office
2nd Floor, Shinbashi Tokyu Bldg.
4-21-3, Shinbashi, Minato-ku
Tokyo, 105-0004
Japan
ZMD FAR EAST, Ltd.
3F, No. 51, Sec. 2,
Keelung Road
11052 Taipei
Taiwan
Phone +81.3.6895.7410
Fax
+81.3.6895.7301
Phone +886.2.2377.8189
Fax
+886.2.2377.8199
Zentrum Mikroelektronik
Dresden AG, Korea Office
U-space 1 Building
11th Floor, Unit JA-1102
670 Sampyeong-dong
Bundang-gu, Seongnam-si
Gyeonggi-do, 463-400
Korea
Phone +82.31.950.7679
Fax
+82.504.841.3026
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
35 of 39
ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
Appendix A: Schematics Communication Board
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
36 of 39
ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
37 of 39
ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
38 of 39
ZSSC30x6 Evaluation Kit
Low Power, High Resolution 16-Bit Sensor Signal Conditioner
Appendix B: Schematic Evaluation Board
Evaluation Kit
September 29, 2014
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.10
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
39 of 39