2/7 TAI-SAW TECHNOLOGY CO., LTD. Crystal Unit SMD 2.0x1.6 24MHz MODEL NO.: TZ1760A REV. NO.: 1 Revise: Rev. Rev. Page Rev. Account Date 1 N/A Initial release 11/16/11’ N/A TAI-SAW TECHNOLOGY CO., LTD. Ref. No. Revised by Naco Kuo TST DCC Release document 3/7 TAI-SAW TECHNOLOGY CO., LTD. Crystal Unit SMD 2.0x1.6 24MHz MODEL NO.: TZ1760A REV. NO.: 1 Features: z z z z Surface Mount Hermetic Package Excellent Reliability Performance Good Frequency Perturbation and Stability over temperature Ultra Miniature Package RoHS Compliant Lead free Lead-free soldering Description and Applications: Surface mount 2.0mmx1.6mm crystal unit for use in wireless communications devices, especially for a need of ultra miniature package for mobility. Electrical Specifications: TZ1760A Specification Nominal Frequency 24.000000 MHz Mode of Oscillation Fundamental Storage Temperature Range -40°C to +90°C Operating Temperature Range -30°C to +85°C Frequency Stability over Operating Temperature Range +/-15 ppm (referred to the value at 25°C) Frequency Make Tolerance (FL) +/-10 ppm @ 25°C +/- 3°C Equivalent Series Resistance (ESR) 80 Ω max Nominal Drive Level 10uW typical and 100uW max Shunt Capacitance (Co) 5.0 pF max Load Capacitance (CL) 12 pF Insulation Resistance 500 MΩ min./DC 100V Marking Laser Marking Unit Weight 5.7mg+/-0.5mg TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 4/7 Mechanical Dimensions (mm): Recommended Land Pattern: (unit: mm) Marking: Line 1: XX; Frequency (24) Line 2: T; Traceable Code + D; date Code of Year/Month TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 5/7 Date Code Table: Year/Month Year/Month 1 2 3 4 5 6 7 8 9 10 11 12 2009 n p q r s t u v w x y z 2010 A B C D E F G H J K L M 2011 N P Q R S T U V W X Y Z 2012 a b c d e f g h i j k m 2013 n p q r s t u v w x y z 2014 A B C D E F G H J K L M 2015 N P Q R S T U V W X Y Z 2016 a b c d e f g h i j k m 2017 n p q r s t u v w x y z 2018 A B C D E F G H J K L M 2019 N P Q R S T U V W X Y Z 2020 a b c d e f g h i j k m 2021 n p q r s t u v w x y z Reel Dimensions (mm): Tape Dimensions (mm): TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 6/7 [NOTE]: 1. Unless otherwise specified tolerance on dimension +/-0.1 mm. 2. Material: conductive polystyrene with color black. 3. 10 pitch cumulative tolerance +/-0.2 mm. Packing Quantity/Packing: 3K pcs maximum per reel Reflow Profile: Note: 1.Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec 2. Temperature: 217+/-5 deg C; Time: 90~100 sec TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 7/7 Reliability Specifications Test name Reference standard Test process / method Mechanical characteristics resistance to Soldering heat (IR reflow) Temp./ Duration : 260°C /10sec ×2 times Total time : 4min.(IR-reflow) Vibration Total peak amplitude : 1.5mm Vibration frequency : 10 to 55 Hz Sweep period : 1.0 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. directions : 3 impacts per axis Acceleration : 3000g's, +20/-0 % Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine Solder Temperature:265±5°C Duration time: 5±0.5 seconds. Mechanical Shock Solderability EIAJED-4701 -300(301)M(II) MIL-STD 202F method 201A MIL-STD 202F method 213C MIL-STD 883G method 2003 Environmental characteristics Thermal Shock Humidity test Dry heat ( Aging test ) PCT test Heat cycle conditions -55 ℃ (30min) ←→ * cycle time : 10 times 125 ℃ (30min) Temperature : 70 ± 2 °C Relative humidity : 90~95% Duration : 96 hours Temperature : 125 ± 2 °C Duration : 168 hours 2 MIL-STD 883G method 1010.7 MIL-STD 202F method 103B 5 Pressure: 2.06kg/cm (2.03*10 pa) Temperature : 121 ± 2 °C Relative humidity : 100% Duration : 24 hours TAI-SAW TECHNOLOGY CO., LTD. MIL-STD 883G method 1008.2 condition C EIAJED-4701-3 B-123A TST DCC Release document