TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: [email protected] Web: www.taisaw.com SAW Filter 343.5 MHz SMD 5.0mmX7.0mm MODEL NO.: TB0621A Rev No.1 A. MAXIMUM RATING: RoHS Compliant Lead free Lead-free soldering 1. Operating Temperature: -10°C to +70°C 2. Storage Temperature: -40°C to +85°C 3. Maximum Input Power : 10dBm B. ELECTRICAL CHARACTERISTICS: 1. Ambient Temperature: 25 ° Item Min. Typical Max. MHz - 343.5 - dB - 11.2 14.0 MHz - 4.7 - Amplitude Ripple (Fc ± 1.6 MHz) dB - 0.5 1.0 Group Delay Ripple (Fc ± 1.6 MHz) nS - 40 100 Triple transit suppression nS 30 45 - 40 35 35 40 54 50 45 50 - - -0.036 - Center frequency Fc Insertion loss at Fc Bandwidth at –3.0dB Attenuation (Reference level from minimum Insertion loss ) 243.5MHz ~ 334.5MHz 334.5MHz ~338.5MHz 348.5MHz ~352.5MHz 352.5MHz ~443.5MHz Temp Coefficient dB dB dB dB ppm/° C2 TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 2 C. FREQUENCY CHARACTERISTICS : (1) S21 Response:(span 150MHz) Fig1. Horizontal: 5MHz/Div Vertical: 10dB/Div (2) S21 Response:(span 10MHz) Fig2. Horizontal: 1MHz/Div Vertical: 1dB/Div Vertical: 100ns/Div TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 3 D. MEASUREMENT CIRCUIT 1. Single ended input 50 ohm to Single ended Output 50 ohm : L1=56nH L2=47nH C1=20pF C2=18pF E.OUTLINE DRAWING: 6 2 1 Pin J : RF Input Pin D : RF Output PinA, B,C,D,E,F,G,H : Ground Unit: mm □ : Week Code (Follow the table from planner each year) △ : Product / Year Code Year 2005 2009 2006 2010 2007 2011 2008 2012 Product Code B b B b TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 4 F. PCB Footprint Unit: mm G. PACKING: 1. REEL DIMENSION TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 5 2. TAPE DIMENSION 6 2 1 360 340 320 300 280 260 240 220 200 180 160 140 120 100 80 60 40 20 280 260 240 220 200 180 160 140 120 100 80 60 40 20 0 Temp ( Deg C) H. RECOMMENDED REFLOW PROFILE : Time (Sec) TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 6