XC6130/XC6131Series ETR02026-001 Watchdog Timeout Period Externally Adjustable Voltage Detector ■ GENERAL DESCRIPTION The XC6130/XC6131 series are voltage detectors with a watchdog function. The watchdog timeout time and release delay time can be set as desired using a single external capacitor. These voltage detectors are used for microprocessor monitoring, and when the power voltage reaches the detect voltage or an L→H pulse is not input to the watchdog pin within the watchdog timeout time, an L level signal is output from the RESETB pin. The XC6130 series has a manual reset function. When the manual reset pin is set to Low level at any desired timing, an L level signal is output from the RESETB pin. The XC6131 series has a watchdog ON/OFF function. By setting the EN pin to L level, the watchdog function can be turned OFF while the voltage detector that monitors the power voltage continues to operate. The MRB pin and EN pin are pulled up internally to VIN, and thus these pins can be left open when not used. ■APPLICATIONS ■FEATURES ●Microprocessor reset and malfunction monitoring circuitry ●Memory battery backup circuits ●Power-on reset circuits ●Power failure detection Operating Ambient Temperature : -40℃～+125℃ Operating Voltage Range : 1.5V～6.0V Detect Voltage Range : 1.6V～5.0V (±1.0％) Hysteresis Width : VDFL×5％ Temperature Characteristics : ±50ppm/℃ Output Configuration : N-channel open drain output Low Power Consumption : 8.1μA Detect 9.8μA Release 2.5μA Release (EN=L) Function : Manual Reset (XC6130) : Watchdog function OFF (XC6131) WD Timeout Time : 100ms (Cd=0.1μF) Release Delay Time : 100ms (Cd=0.1μF) (at power on) 10ms (Cd=0.1μF) (After Watchdog Timeout) Package : SOT-26 Environmentally Friendly : EU RoHS compliant, Pb free ■TYPICAL APPLICATION CIRCUIT ■TYPICAL PERFORMANCE CHARACTERISTICS XC6130 Series Cd=0.01μF, WD=RESETB=OPEN, Ta=25℃ EN=VSS(WD Function OFF) EN=VIN (WD Function ON) XC6131A301MR-G 14 WD Function ON WD Function OFF XC6131 Series Supply Current:ISS(μA) 12 10 8 6 4 2 0 0 1 2 3 4 Input Voltage:VIN(V) 5 6 * The above values do not include the current that flows to the EN pull-up resistance. 1/30 XC6130/XC6131 Series ■BLOCK DIAGRAM ●XC6130 Series Type A VIN RH RX + RMR RY RESET LOGIC RESETB Voltage Reference VSS MRB Cd LOGIC + - L→H PULSE DETECT LOGIC Voltage Reference RWD WD Cd ● XC6131 Series Type A VIN RH RX RY RESET LOGIC + RMR Voltage Reference VSS EN Cd LOGIC + L→H PULSE DETECT LOGIC Voltage Reference Cd RWD WD * Diodes inside the circuit are an ESD protection diode and a parasitic diode. 2/30 RESETB XC6130/XC6131 Series ■BLOCK DIAGRAM ● XC6131 Series Type B VIN RH RX + RY RESET LOGIC RESETB Voltage Reference VSS ENB Cd LOGIC RENB + L→H PULSE DETECT LOGIC Voltage Reference Cd RWD WD * Diodes inside the circuit are an ESD protection diode and a parasitic diode. 3/30 XC6130/XC6131 Series ■PRODUCT CLASSIFICATION ●Ordering Information XC6130①②③④⑤⑥-⑦ DESIGNATOR ① ②③ ④ ⑤⑥-⑦ (*1) (*1) ITEM SYMBOL TYPE Detect Voltage Detect Accuracy Package (Order Unit) A 16～50 1 MR-G DESCRIPTION MRB pin With pull-up resistor e.g. 1.6V → ②=1, ③=6 ±1.0％ SOT-26 (3000/Reel) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. XC6131①②③④⑤⑥-⑦ DESIGNATOR ITEM ① TYPE ②③ ④ ⑤⑥-⑦ (*1) (*1) Detect Voltage Detect Accuracy Package (Order Unit) SYMBOL A B 16～50 1 MR-G DESCRIPTION EN pin With pull up resistor ENB pin With pull down resistor e.g. 1.6V → ②=1, ③=6 ±1.0％ SOT-26 (3000/Reel) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. 4/30 XC6130/XC6131 Series ■PIN CONFIGURATION XC6130 series XC6131 series ■PIN ASSIGNMENT XC6130 Series PIN NUMBER PIN NAME FUNCTIONS 1 WD Watchdog Input 2 MRB Manual Reset Input 3 VIN Power Input 4 RESETB Reset Output 5 VSS Ground 6 Cd Adjustable Pin for Release Delay Time/Watchdog Timeout PIN NAME FUNCTIONS WD Watchdog Input EN Watchdog ON/OFF Control (XC6131A) ENB Watchdog ON/OFF Control (XC6131B) SOT-26 XC6131 Series PIN NUMBER SOT-26 1 2 3 VIN Power Input 4 RESETB Reset Output 5 VSS Ground 6 Cd Adjustable Pin for Release Delay Time/Watchdog Timeout 5/30 XC6130/XC6131 Series ■FUNCTION CHART 1) XC6130 Series VIN *2 VMRB *3 VWD *6 VRESETB *7 H H H L OPEN L⇔H H L L L L⇔H H L *1 H L L 2) XC6131A Series VIN *2 VEN *4 VWD *6 VRESETB *7 H H H L OPEN L⇔ H H L L L L⇔ H H H *1 H L L 3) XC6131B Series VIN *2 VENB *5 VWD *6 VRESETB *7 H H L L OPEN L⇔ H H L H L L⇔ H H H *1 H L L *1: Includes all WD logic (VWD=H, L, OPEN, H→L, L→H) *2: VIN=H indicates higher than the release voltage. VIN=L indicates lower than the detect voltage. *3: VMRB=H indicates MRB High Level Voltage. VMRB=L indicates MRB Low Level Voltage. Since MRB pin of XC6130 Series is pulled up internally, the open condition of MRB pin is acceptable when MR function is not required. *4: VEN=H indicates EN High Level Voltage. VEN=L indicates EN Low Level Voltage. The EN pin of the XC6131A Series is pulled up internally, enabling the WD function to be used with EN open. *5: VENB=H indicates ENB High Level Voltage. VENB=L indicates ENB Low Level Voltage. The ENB pin of the XC6131B Series is pulled down internally, enabling the WD function to be used with ENB open. *6: VWD=H indicates WD High Level Voltage. VWD=L indicates WD Low Level Voltage. *7: VRESETB=H indicates the release state. VRESETB=L indicates the detect state. 6/30 XC6130/XC6131 Series ■ ABSOLUTE MAXIMUM RATINGS Ta=25℃ XC6130 Series PARAMETER SYMBOL RATINGS UNITS Input Voltage VIN -0.3～+7.0 V WD Input Voltage VWD -0.3～+7.0 V MRB Input Voltage VMRB -0.3～+7.0 V (*1) V Cd Pin Voltage VCd Output Voltage VRESETB -0.3～+7.0 V Cd Pin Current ICd 10 mA Output Current IOUT 30 mA Power Dissipation SOT-26 -0.3～+VIN+0.3 or +7.0 Pd 250 mW Operating Ambient Temperature Topr -40～+125 ℃ Storage Temperature Tstg -55～+125 ℃ All voltages are described based on the VSS pin. (*1) The maximum value should be VIN+0.3 or +7.0 in the lowest. Ta=25℃ XC6131 Series PARAMETER SYMBOL RATINGS UNITS Input Voltage VIN -0.3～+7.0 V WD Input Voltage VWD -0.3～+7.0 V EN/ENB Input Voltage VEN/VENB -0.3～+7.0 V (*1) V Cd Pin Voltage VCd Output Voltage VRESETB -0.3～+7.0 V Cd Pin Current ICd 10 mA Output Current IOUT 30 mA Pd 250 mW Operating Ambient Temperature Topr -40～+125 ℃ Storage Temperature Tstg -55～+125 ℃ Power Dissipation SOT-26 -0.3～+VIN+0.3 or +7.0 All voltages are described based on the VSS pin. (*1) The maximum value should be VIN+0.3 or +7.0 in the lowest. 7/30 XC6130/XC6131 Series ■ELECTRICAL CHARACTERISTICS XC6130 Series PARAMETER SYMBOL Operating Voltage VIN Detect Voltage VDFL Temperature ∆VDFL/ Characteristics (∆Topr・VDFL) Hysteresis Ta=25℃ CONDITIONS VDF(T) (*1) Supply Current Iss =1.6～5.0V IRBOUT 1.5 - ×0.99 VDF(T) MAX. MIN. TYP. - 6.0 1.5 VDF(T) VDF(T) ×1.01 ×0.975 - - VDF(T) (*9) MAX. 6.0 VDF(T) ×1.025 UNITS V V ±50 ±50 - VDFL VDFL VDFL VDFL VDFL VDFL ×0.04 ×0.05 ×0.06 ×0.03 ×0.05 ×0.07 VIN=VDF(T) ×0.9V - 8.1 12.1 - 8.1 14.0 VIN=VDF(T) ×1.1V - 9.8 12.6 - 9.8 13.6 N-ch. VRESETB=0.3V 2.6 3.5 - 1.4 3.5 - VIN=2.0V (*2) 4.9 6.0 - 3.0 6.0 - VIN=3.0V (*3) 9.2 10.3 - 5.8 10.3 - VIN=4.0V (*4) 12.3 13.8 - 7.7 13.8 - - 0.01 0.1 - 0.01 1 V μA ② mA ③ μA ④ ILeak Cd Pin Sink Current Icd VIN=1.5V, VCd=0.7V 530 770 - 295 770 - tDR1 VIN=1.5V→VDF（T)×1.1V, Cd=0.01μF 8.5 10.0 11.5 7 10.0 12 tDR2 VIN=VDF（T)×1.1V, Cd=0.01μF 0.85 1.0 1.15 0.7 1.0 1.2 8.5 10.0 11.5 7 10.0 12 - 10.0 50 - 10.0 100 μs 100 - - 100 - - ns Time1 (*5) Release Delay Time2 (*6) Watchdog Timeout (*7) Period (*8) Detect Delay Time tWD tDF Watchdog Minimum Watchdog Watchdog Low Level Voltage Watchdog Pull-down Resistance MRB High Level Voltage MRB Low Level Voltage MRB Pull-up Resistance MRB Minimum Pulse Width VIN=VDF（T)×1.1V, Cd=0.01μF,WD=VSS VIN=VDF（T)×1.1V→1.5V, Cd=0.01μF ms ⑤ VIN=6.0V, tWDIN Pulse Width High Level Voltage VIN=6.0V,VRESETB=6.0 ppm /℃ Leak Current Release Delay CIRCUIT ① - -40℃≦Topr≦125℃ VIN=1.5V Output Current TYP. VDF(T) VHYS Width MIN. -40℃≦Ta≦125℃ Apply pulse from 6.0V to 0V to the WD pin. ⑥ VWDH VIN=VDF（T)×1.1V→6.0V VIN×0.7 - 6 VIN×0.7 - 6 V VWDL VIN=VDF（T)×1.1V→6.0V 0 - VIN×0.3 0 - VIN×0.3 V RWD VWD=6.0V, RWD=VWD/IWD 280 550 1100 220 550 1350 kΩ 1.3 - VIN 1.3 - VIN V 0 - 0.45 0 - 0.45 V 300 800 1200 230 800 1420 kΩ ⑨ 1.0 - - 1.0 - - μs ⑩ VMRH VIN=VDF（T)×1.1V～6.0V VMRL RMR VIN=6.0V, VMRB=0V, RMR=VIN/IMRB ⑦ ⑧ VIN=6.0V, tMRIN Apply pulse from 6.0V to 0V to the MRB pin. NOTE: *The WD pin and MRB pin are open unless otherwise specified in the measurement conditions. (*1) VDF(T): Nominal detect voltage (*2) For VDF(T)＞2.0V products only. (*3) For VDF(T)＞3.0V products only. (*4) For VDF(T)＞4.0V products only. (*5) Until time when RESETB pin shows release status after VIN reached the release voltage. Release voltage (VDR) = Detect voltage (VDFL) + Hysteresis width (VHYS) (*6) The time to change the status of RESETB pin from the detect-status after the watchdog-timeout happens with the condition of WD=VSS. (*7) The time to change the status of RESETB pin from the release-status to the detect-status with the condition of WD=VSS. (*8) When VIN is changed during watchdog timeout time, until time when RESETB pin shows detect status after VIN reached the detect voltage. (*9) The ambient temperature range (-40℃≦Ta≦125℃) is design Value. 8/30 XC6130/XC6131 Series ■ELECTRICAL CHARACTERISTICS (Continued) XC6131A Series PARAMETER SYMBOL Operating Voltage VIN Detect Voltage VDFL Temperature ∆VDFL/ Characteristics (∆Topr・VDFL) Hysteresis Width Ta=25℃ CONDITIONS VDF(T) (*1) VHYS Iss (*2) VIN=VDF(T)×1.1V EN=L EN=H IRBOUT N-ch. VRESETB=0.3V MIN. TYP. MAX. 1.5 - 6.0 1.5 - 6.0 VDF(T) ±50 VDF(T) VDF(T) ×1.01 ×0.975 - - VDF(T) ±50 VDF(T) ×1.025 - VDFL VDFL VDFL VDFL VDFL VDFL ×0.04 ×0.05 ×0.06 ×0.03 ×0.05 ×0.07 - 8.1 12.1 - 8.1 14.0 - 2.5 3.5 - 2.5 5.0 - 9.8 12.6 - 9.8 13.6 2.6 3.5 - 1.4 3.5 - VIN=2.0V (*2) 4.9 6.0 - 3.0 6.0 - VIN=3.0V (*3) 9.2 10.3 - 5.8 10.3 - VIN=4.0V (*4) 12.3 13.8 - 7.7 13.8 - VIN=1.5V Output Current MAX. - VIN=VDF(T) ×0.9V Supply Current TYP. ×0.99 -40℃≦Topr≦125℃ (*10) MIN. VDF(T) =1.6～5.0V -40℃≦Ta≦125℃ V ppm /℃ μA ② mA ③ μA ④ ILeak - 0.01 0.1 - 0.01 Icd VIN=1.5V, VCd=0.7V 530 770 - 295 770 - tDR1 VIN=1.5V→VDF（T)×1.1V, Cd=0.01μF 8.5 10.0 11.5 7 10.0 12 tDR2 VIN=VDF（T)×1.1V, Cd=0.01μF 0.85 1.0 1.15 0.7 1.0 1.2 8.5 10.0 11.5 7 10.0 12 - 10.0 50 - 10.0 100 μs 100 - - 100 - - ns (*6) Release Delay Time2 (*7) Watchdog Timeout (*8) Period Detect Delay Time (*9) tWD VIN=VDF（T)×1.1V→1.5V, Cd=0.01μF tWDIN Apply pulse from 6.0V to 0V Watchdog Watchdog Low Level Voltage ms ⑤ VIN=6.0V, Pulse Width High Level Voltage Cd=0.01μF, WD=VSS tDF Watchdog Minimum VIN=VDF（T)×1.1V, ① V Leakage Current Time1 CIRCUIT V Cd Pin Sink Current Release Delay VIN=6.0V, VRESETB=6.0V UNITS to the WD pin. ⑥ VWDH VDF(T)×1.1V≦VIN≦6.0V VIN×0.7 - 6 VIN×0.7 - 6 V VWDL VDF(T)×1.1V≦VIN≦6.0V 0 - VIN×0.3 0 - VIN×0.3 V RWD VWD=6.0V, RWD=VWD/IWD 280 550 1100 220 550 1350 kΩ ⑦ 1.3 - VIN 1.3 - VIN V ⑧ Watchdog Pull-down Resistance EN High Level Voltage VENH EN Low Level Voltage VENL EN Pull-up Resistance REN VIN=VDF(T)×1.1V～6.0V VIN=6.0V, VEN=0V, REN=VIN/IEN 0 - 0.45 0 - 0.45 V 300 800 1200 230 800 1420 kΩ ⑨ NOTE: * The WD pin and EN pin are open unless otherwise specified in the measurement conditions. (*1) VDF(T): Nominal detect voltage (*2) Excludes the current that flows to EN pull-up resistance when EN = L. (*3) For VDF(T)＞2.0V products only. (*4) For VDF(T)＞3.0V products only. (*5) For VDF(T)＞4.0V products only. (*6) Until time when RESETB pin shows release status after VIN reached the release voltage. Release voltage (VDR) = Detect voltage (VDFL) + Hysteresis width (VHYS) (*7) The time to change the status of RESETB pin from the detect-status after the watchdog-timeout happens with the condition of WD=VSS. (*8) The time to change the status of RESETB pin from the release-status to the detect-status with the condition of WD=VSS. (*9) When VIN is changed during watchdog timeout time, until time when RESETB pin shows detect status after VIN reached the detect voltage. (*10) The ambient temperature range (-40℃≦Ta≦125℃) is design Value. 9/30 XC6130/XC6131 Series ■ELECTRICAL CHARACTERISTICS (Continued) XC6131B Series PARAMETER SYMBOL Operating Voltage VIN Detect Voltage VDFL Temperature ∆VDFL/ Characteristics (∆Topr・VDFL) Hysteresis Width VHYS Ta=25℃ CONDITIONS VDF(T) (*1) Iss =1.6～5.0V IRBOUT N-ch. VRESETB=0.3V - - ENB=H (*2) ENB=L VIN=1.5V Output Current 1.5 ×0.99 -40℃≦Topr≦125℃ VIN=VDF(T)×1.1V TYP. VDF(T) VIN=VDF(T) ×0.9V Supply Current MIN. VDF(T) ±50 -40℃≦Ta≦125℃ MAX. MIN. TYP. - 6.0 1.5 VDF(T) VDF(T) ×1.01 ×0.975 - - VDF(T) ±50 (*10) MAX. 6.0 VDF(T) ×1.025 - VDFL VDFL VDFL VDFL VDFL VDFL ×0.04 ×0.05 ×0.06 ×0.03 ×0.05 ×0.07 - 8.1 12.1 - 8.1 14.0 - 2.5 3.5 - 2.5 5.0 - 9.8 12.6 - 9.8 13.6 2.6 3.5 - 1.4 3.5 - VIN=2.0V (*2) 4.9 6.0 - 3.0 6.0 - VIN=3.0V (*3) 9.2 10.3 - 5.8 10.3 - VIN=4.0V (*4) 12.3 13.8 - 7.7 13.8 - - 0.01 0.1 - 0.01 Leakage Current ILeak Cd Pin Sink Current Icd VIN=1.5V, VCd=0.7V 530 770 - 295 770 - tDR1 VIN=1.5V→VDF（T)×1.1V, Cd=0.01μF 8.5 10.0 11.5 7 10.0 12 tDR2 VIN=VDF（T)×1.1V, Cd=0.01μF 0.85 1.0 1.15 0.7 1.0 1.2 Release Delay Time1 (*6) Release Delay Time2 (*7) Watchdog Timeout (*8) Period Detect Delay Time (*9) tWD tDF Watchdog Minimum Watchdog Watchdog Low Level Voltage VIN=VDF（T)×1.1V, Cd=0.01μF, WD=VSS VIN=VDF（T)×1.1V→1.5V, Cd=0.01μF CIRCUIT V V ppm /℃ ① V μA ② mA ③ μA ④ ms ⑤ 8.5 10.0 11.5 7 10.0 12 - 10.0 50 - 10.0 100 μs 100 - - 100 - - ns VIN=6.0V, tWDIN Pulse Width High Level Voltage VIN=6.0V, VRESETB=6.0V UNITS Apply pulse from 6.0V to 0V to the WD pin. ⑥ VWDH VDF(T)×1.1V≦VIN≦6.0V VIN×0.7 - 6 VIN×0.7 - 6 V VWDL VDF(T)×1.1V≦VIN≦6.0V 0 - VIN×0.3 0 - VIN×0.3 V RWD VWD=6.0V, RWD=VWD/IWD 280 550 1100 220 550 1350 kΩ ⑦ 1.3 - VIN 1.3 - VIN V ⑧ 0 - 0.45 0 - 0.45 V 300 800 1200 230 800 1420 kΩ Watchdog Pull-down Resistance ENB High Level Voltage VENBH ENB Low Level Voltage VENBL ENB Pull-down Resistance RENB VIN=VDF（T)×1.1V～6.0V VENB=6.0V, RENB=VENB/IENB NOTE: *The WD pin and ENB pin are open unless otherwise specified in the measurement conditions. (*1) VDF(T): Nominal detect voltage (*2) Excludes the current that flows to the EN pull-down resistance when ENB = H. (*3) For VDF(T)＞2.0V products only. (*4) For VDF(T)＞3.0V products only. (*5) For VDF(T)＞4.0V products only. (*6) Until time when RESETB pin shows release status after VIN reached the release voltage. Release voltage (VDR) = Detect voltage (VDFL) + Hysteresis width (VHYS) (*7) The time to change the status of RESETB pin from the detect-status after the watchdog-timeout happens with the condition of WD=VSS. (*8) The time to change the status of RESETB pin from the release-status to the detect-status with the condition of WD=VSS. (*9) When VIN is changed during watchdog timeout time, until time when RESETB pin shows detect status after VIN reached the detect voltage. (*10) The ambient temperature range (-40℃≦Ta≦125℃) is design Value. 10/30 ⑨ XC6130/XC6131 Series ■ TEST CIRCUITS CIRCUIT① CIRCUIT② CIRCUIT③ CIRCUIT④ CIRCUIT⑤ VIN 100ｋΩ MRB/EN/ENB RESETB Cd WD VSS Waveform Measure Point 11/30 XC6130/XC6131 Series ■ TEST CIRCUITS (Continued) CIRCUIT⑥ VIN 100ｋΩ MRB/EN/ENB RESETB Cd WD Waveform Measure Point VSS tWDIN WD VIN×0.7 VIN×0.3 RESETB (VDFL) tDR2 tWD CIRCUIT⑦ CIRCUIT⑧ CIRCUIT⑨ IMRB IEN IENB VIN A MRB/EN/ENB RESETB Cd WD VSS CIRCUIT⑩ tMRIN MRB MRB VIN RESETB Cd WD 12/30 100ｋΩ VSS Waveform Measure Point RESETB （VDFL) tDR2 tDR2 XC6130/XC6131 Series ■OPERATIONAL EXPLANATION In the XC6130/XC6131 Series, the voltage divided by RH, RX, and RY connected to the VIN pin is compared to the internal reference voltage by the comparator, and the resulting output signal drives the watchdog logic and output driver. The VIN pin voltage is gradually lowered, and when the VIN pin voltage reaches the detect voltage, H→L level signal is output to the reset output pin (VDFL type). VIN RH RX + RMR RY RESET LOGIC RESETB Voltage Reference VSS MRB Cd LOGIC + - L→H PULSE DETECT LOGIC Voltage Reference RWD WD Cd XC6130 Series <Output signal of reset output pin> If the VIN pin voltage is below the detect voltage, the reset output pin outputs H→L level signal. After the VIN pin voltage reaches the release voltage, the reset output pin holds L level during release delay time1 (tDR1). If a start signal is not input to the WD pin within the watchdog timeout time, the reset output pin holds L level during release delay time 2 (tDR2) and then outputs H level signal. <Hysteresis> If the internal comparator outputs L level signal, the PMOS transistor connected in parallel to RH turns ON and the hysteresis circuit activates. The hysteresis voltage width is obtained from the difference between the detect voltage and the release voltage. The hysteresis width is (VDFL×0.05) V (TYP.). <WD pin> A watchdog timer is used to detect abnormal operation and runaway in a microprocessor. If “L→H” signal is not input from the microprocessor within the watchdog timeout time, the reset output pin holds the detect state during release delay time 2 (tDR2), and then L → H level signal is output to the reset output pin. In addition, the watchdog pin is pulled down internally to VSS, and when the watchdog pin is OPEN, a reset signal is output after the watchdog timeout time. The watchdog timeout time (tWD) can be set using the equation below. 6 tWD＝Cd×10 -6 6 Example: When Cd is 0.1μF, tWD=0.1×10 ×10 = 100ms (TYP.) 13/30 XC6130/XC6131 Series ■OPERATIONAL EXPLANATION (Continued) <Release delay time 1> When power is added on the VIN, the time from the point that VIN reaches the release voltage until the reset output pin reaches the release voltage is release delay time 1 (tDR1). Release delay time 1 (tDR1) can be set using the equation below. tDR1=Cd×10 6 -6 6 Example: When Cd is 0.1μF, tDR1= 0.1×10 ×10 =100ms (TYP.) <Release delay time 2> Release delay time 2 (tDR2) is the duration of the detect state until the watchdog timer restarts when “L → H” signal is not input to the WD pin within the watchdog timeout time. Release delay time 2 (tDR2) can be set using the equation below. tDR2=Cd×10 5 -6 5 Example: When Cd is 0.1μF, tDR2=0.1×10 ×10 =10ms (TYP.) <Detect delay time> The detect delay time (tDF) is the time until the VIN pin voltage drops to the detect voltage and the reset output pin enters the detect state. <MRB pin> *XC6130 Series The MRB pin voltage can be input to force the signal of the reset output pin to the detect state. When the MRB pin voltage input reaches an H→L level signal, an H→L level signal is output to the reset output pin. After the MRB pin voltage reaches L→H level, the reset output pin holds the detect state during release delay time 1(tDR1). <EN pin> *XC6131A Series If the watchdog function will not be used, the EN pin can be set to L level to forcibly stop only the watchdog function and keep the voltage detector operating. When using the watchdog function, use the EN pin at H level. If the input voltage and EN pin voltage reach L→H level, the reset output pin holds the detect state during release delay time 1 (tDR1). (Refer to Timing Chart 2, ①) If the input voltage is higher than the release voltage and the EN pin voltage reaches L→H level, the watchdog function recovers. (Refer to Timing Chart 2, ②) <ENB Pin> *XC6131B Series When the watchdog function is not used, the ENB pin can be set to H level to keep the voltage detector operating and forcibly stop only the watchdog function. To use the watchdog function, use the ENB pin at L level. When the input voltage and ENB pin voltage reach H→L level, the reset output pin holds the detect state during release delay time 1 (tDR1). (Refer to Timing Chart 3, ①) When the input voltage is higher than the release voltage and the ENB pin voltage reaches H→L level, the watchdog function recovers. (Refer to Timing Chart 3, ②) 14/30 XC6130/XC6131 Series ■OPERATIONAL EXPLANATION (Continued) <Timing Chart 1> XC6130 Series 15/30 XC6130/XC6131 Series ■OPERATIONAL EXPLANATION (Continued) <Timing Chart 2> XC6131A Series VIN VDR Level VDF Level VIN Pin Wave Form Hysterisis Range Min.Operating Voltage GND EN Pin Wave Form EN GND tWD>tWDIN WD WD Pin Wave Form tWD tWD tWD tWD GND Cd Pin Wave Form Cd HIGH Level Cd Low Level GND RESETB Pin Wave Form VDR Level VDF Level Min.Operating Voltage GND Unstable tDR1 ① 16/30 tDR2 tDR2 tDR2 ② XC6130/XC6131 Series ■OPERATIONAL EXPLANATION(Continued) <Timing Chart 3> XC6131B Series VIN VDR Level VDF Level VIN Pin Wave Form Hysterisis Range Min.Operating Voltage GND ENB ENB Pin Wave Form GND tWD>tWDIN WD WD Pin Wave Form tWD tWD tWD tWD GND Cd Pin Wave Form Cd HIGH Level Cd Low Level GND RESETB Pin Wave Form VDR Level VDF Level Min.Operating Voltage GND Unstable tDR1 ① tDR2 tDR2 tDR2 ② 17/30 XC6130/XC6131 Series ■NOTES ON USE 1. Use this IC within the absolute maximum ratings. Risk of deterioration or damage if the absolute maximum ratings are exceeded during temporary or transient voltage drops or voltage jumps. 2. If a resistance is added between the power and the VIN pin, the flowthrough current when the IC operates will cause the VIN pin voltage to drop and the IC may malfunction. 3. When raising the input voltage from the minimum operating voltage or less, if changed suddenly, the release delay time may become short. 4. Sufficiently reinforce the VIN and GND lines, as power noise may cause malfunctioning of the watchdog function and voltage detector. It is recommended that a capacitor be added between VIN and GND. 5. Enter “H” level, or “L” level should be fed to MRB and EN/ENB pin. 6. To ensure stable operation of the watchdog function, be sure to add a capacitor at the Cd pin. The release delay time and watchdog timeout time are affected by the accuracy and temperature characteristics of the Cd pin capacitor. 7. If the Cd pin capacitor is unable to discharge to the ground level during recovery after a power interruption, the release delay may become noticeably shorter. Exercise caution. 8. The output voltage at detection is determined by the pull-up resistance connected to RESETB pin. Select the resistance based on the following considerations: At detection: VRESETB=(Vpull-Up)/(1+Rpull/RON) Vpull-Up: Voltage after pull-up (*1) (*3) RON : ON resistance of N-ch driver （calculated from VRESETB/IRBOUT1 in electrical characteristics） Example calculation: (*2) -3 When VIN=2.0V , RON=0.3/6.7×10 ≒44.8Ω（MAX.）. If you wish to make the VRESETB voltage at detection 0.1V or lower with Vpull-Up=3.0V, Rpull=(Vpull-Up /VRESETB-1)×RON=(3/0.1-1)×44.8≒1.3kΩ, and thus to make the output voltage at detection 0.1V or less under the above conditions, the pull-up resistance must be 1.3kΩ or higher. (*1) The smaller VIN is, the larger RON becomes. When selecting VIN, calculate using the lowest value of the input voltage range you will use. (*3) IRBOUT1 specified in the electrical characteristics is the value at Ta=25℃. IRBOUT1 varies depending on the ambient temperature. To select the pull-up resistance taking ambient temperature into account, please calculate IRBOUT with the MIN. value of the ambient temperature range of -40℃≦Ta≦125℃. (*2) At release: VRESETB = (Vpull-Up)/(1+Rpull/ROFF) Vpull-Up: Voltage after pull-up ROFF: Resistance value 60MΩ（MIN.） when N-ch driver is OFF (calculated from VRESETB/ILEAK in electrical characteristics) Calculation example: If you wish to make VRESETB 5.99V or higher with Vpull-Up=6.0V 6 Rpull=(Vpull-Up/VRESETB-1)×ROFF=(6/5.99-1)×60×10 ≒100kΩ, and thus to make the output voltage 5.99V or higher at release under the above conditions, the pull-up resistance must be 100kΩ or less. 9. We place importance on improving our products and increasing reliability. However, please design safety into the device and system, including fail-safe design and post-aging treatment. 18/30 XC6130/XC6131 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) Detect, Release Voltage vs. Ambient Temperature XC6130,XC6131 (V DF(T )=1.6V) XC6130,XC6131 (V DF(T )=3.0V) 3.20 Detect, Release Voltage : VDFL, V DR (V) Detect, Release Voltage : VDFL, V DR (V) 1.700 1.675 VDR 1.650 1.625 1.600 VDFL 1.575 1.550 3.15 VDR 3.10 3.05 3.00 VDFL 2.95 -50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150 Ambient Temperature : Ta ( ℃) Ambient Temperature : Ta (℃) (2) Detect, Release Voltage vs. Input Voltage XC6130,XC6131 (V DF(T )=5.0V) XC6130,XC6131 (V DF(T )=1.6V) Rpull-up=100kΩ 6 5.25 OutPut Voltage : VRESETB (V) Detect, Release Voltage : VDFL, V DR (V) 5.30 VDR 5.20 5.15 5.10 5.05 5.00 ↓ : V DF側 ↑ : V DR側 5 4 Ta=-40℃ 3 Ta=25℃ Ta=85℃ 2 Ta=125℃ 1 VDFL 0 4.95 -50 -25 0 25 50 75 100 125 0 150 1 2 3 XC6130,XC6131 (V DF(T )=3.0V) Rpull-up=100kΩ 6 ↓ : V DF側 ↑ : V DR側 4 Ta=-40℃ 3 Ta=25℃ Ta=85℃ 2 Ta=125℃ 1 Rpull-up=100kΩ 6 Output Voltage : V RESETB (V) Output Voltage : V RESETB (V) 5 XC6130,XC6131 (V DF(T )=5.0V) 6 5 4 Input Voltage : V IN (V) Ambient Temperature : Ta ( ℃) ↓ : V DF側 ↑ : V DR側 5 4 3 Ta=-40℃ Ta=25℃ 2 Ta=85℃ 1 Ta=125℃ 0 0 0 1 2 3 Input Voltage : V IN (V) 4 5 6 0 1 2 3 4 5 6 Input Voltage : V IN (V) 19/30 XC6130/XC6131 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3) Supply Current vs. Input Voltage XC6130 (V DF(T)=1.6V) XC6130 (V DF(T )=3.0V) 20 20 18 Ta=25℃ 14 Ta=85℃ 12 Ta=125℃ Supply Current : ISS (μA) Supply Current : ISS (μA) 18 Ta=-40℃ 16 10 8 6 4 Ta=-40℃ 16 Ta=25℃ 14 Ta=85℃ 12 Ta=125℃ 10 8 6 4 2 2 0 0 0 1 2 3 4 5 6 0 1 2 4 18 Ta=25℃ 14 Ta=85℃ 12 Ta=125℃ Supply Current : ISS (μA) Ta=-40℃ 16 10 8 6 -40℃ 16 25℃ 14 85℃ 12 125℃ 10 8 6 4 4 2 2 0 0 0 1 2 3 4 5 0 6 1 2 Input Voltage: V IN (V) 3 4 20 EN=V IN (XC6131A) ENB=V SS (XC6131B) 20 Ta=-40℃ 18 16 Ta=25℃ 16 Ta=25℃ 14 Ta=85℃ 14 Ta=85℃ 12 Ta=125℃ 12 Ta=125℃ Supply Current : ISS (μA) Supply Current : ISS (μA) 6 XC6131 (V DF(T)=5.0V) EN=V IN (XC6131A) ENB=V SS (XC6131B) 18 5 Input Voltage: V IN (V) XC6131 (V DF(T )=3.0V) 10 8 6 4 2 Ta=-40℃ 10 8 6 4 2 0 0 0 1 2 3 Input Voltage: V IN (V) 20/30 6 EN=V IN (XC6131A) ENB=V SS (XC6131B) 20 20 18 5 XC6131 (V DF(T)=1.6V) XC6130 (V DF(T)=5.0V) Supply Current : ISS (μA) 3 Input Voltage: V IN (V) Input Voltage: V IN (V) 4 5 6 0 1 2 3 Input Voltage: V IN (V) 4 5 6 XC6130/XC6131 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3) Supply Current vs. Input Voltage (Continued) XC6131 (V DF(T )=3.0V) XC6131 (V DF(T)=1.6V) EN=V SS (XC6131A) ENB=V IN (XC6131B) 10 Supply Current : ISS (μA) 10 Ta=-40℃ 8 Ta=25℃ Supply Current : ISS (μA) Ta=85℃ Ta=125℃ 4 2 1 2 3 4 5 Ta=85℃ 6 Ta=125℃ 4 2 0 0 Ta=-40℃ 8 Ta=25℃ 6 EN=V SS (XC6131A) ENB=V IN (XC6131B) 0 6 0 Input Voltage: V IN (V) 1 2 3 4 5 6 Input Voltage: V IN (V) XC6131 (V DF(T)=5.0V) EN=V SS (XC6131A) ENB=V IN (XC6131B) 10 Supply Current : ISS (μA) 8 6 4 Ta=-40℃ Ta=25℃ Ta=85℃ 2 Ta=125℃ 0 0 1 2 3 4 5 6 Input Voltage: V IN (V) (4) Output Current vs. VRESETB (5) Output Current vs. Input Voltage XC6130,XC6131 XC6130,XC6131 Ta=25℃ 30 V IN=4.0V 25 Output Current : IRBOUT (mA) 25 Output Current : IRBOUT (mA) V RESETB =0.3V 30 20 V IN=3.0V 15 10 V IN=2.0V 5 Ta=-40℃ Ta=25℃ 20 Ta=85℃ Ta=125℃ 15 10 5 V IN=1.5V 0 0 0.0 0.1 0.2 0.3 0.4 0.5 V RESETB (V) 0.6 0.7 0.8 0.9 1.0 0 1 2 3 4 5 Input Voltage : VIN (V) 21/30 XC6130/XC6131 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (6) Cd Sink Current vs. Ambient Temperature XC6130,XC6131 V Cd=0.7V Cd Pin Sink Current : cd I (mA) 5 4 V IN=4.5V 3 2 V IN=1.5V 1 0 -50 -25 0 25 50 75 100 125 150 Ambient Temperature : Ta (℃) (7) Release Delay Time1 vs. Ambient Temperature XC6130,XC6131 XC6130,XC6131 V IN=1.5V →V DF×1.1 Cd=0.01μF 12 10 8 6 4 2 V IN=1.5V →V DF×1.1 Cd=0.1μF 140 Release delay Time1 : tDR1 (ms) Release delay Time1 : tDR1 (ms) 14 0 120 100 80 60 40 20 0 -50 -25 0 25 50 75 100 125 150 -50 -25 0 Ambient Temperature : Ta ( ℃) 25 50 75 100 125 150 Ambient Temperature : Ta (℃) (8) Release Delay Time2 vs. Ambient Temperature XC6130,XC6131 XC6130,XC6131 V IN=V DF×1.1 Cd=0.01μF 1.2 1.0 0.8 0.6 0.4 0.2 0.0 V IN=V DF×1.1 Cd=0.1μF 14 Release delay Time2 : tDR2 (ms) Release delay Time2 : tDR2 (ms) 1.4 12 10 8 6 4 2 0 -50 -25 0 25 50 75 Ambient Temperature : Ta (℃) 22/30 100 125 150 -50 -25 0 25 50 75 Ambient Temperature : Ta ( ℃) 100 125 150 XC6130/XC6131 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (9) Watchdog Timeout Period vs. Ambient Temperature XC6130,XC6131 XC6130,XC6131 V IN=V DF×1.1 Cd=0.01μF 12 10 8 6 4 2 V IN=V DF×1.1 Cd=0.1μF 140 Watchdog Timeout Period : tWD (ms) Watchdog Timeout Period : tWD (ms) 14 120 100 0 80 60 40 20 0 -50 -25 0 25 50 75 100 125 150 -50 -25 0 25 Ambient Temperature : Ta ( ℃) (10) WD High Level Threshold Voltage vs. Ambient Temperature 75 100 125 150 (11) WD Low Level Threshold Voltage vs. Ambient Temperature XC6130,XC6131 XC6130,XC6131 6.0 WD LowLevel Threshold Voltage : V WDL (V) 6.0 WD HighLevel Threshold Voltage : VWDH (V) 50 Ambient Temperature : Ta ( ℃) 5.0 4.0 V IN=6.0V 3.0 2.0 V IN=1.76V 1.0 0.0 5.0 4.0 V IN=6.0V 3.0 2.0 V IN=1.76V 1.0 0.0 -50 -25 0 25 50 75 Ambient Temperature : Ta (℃) 100 125 150 -50 -25 0 25 50 75 100 125 150 Ambient Temperature : Ta ( ℃) 23/30 XC6130/XC6131 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (12) MRB High Level Threshold Voltage vs. Ambient Temperature (13) MRB Low Level Threshold Voltage vs. Ambient Temperature XC6130A XC6130A 1.2 MRB LowLevel Threshold Voltage : V MRL (V) MRB HighLevel Threshold Voltage : VMRH (V) 1.2 1.1 V IN=6.0V 1.0 0.9 0.8 0.7 V IN=1.76V 0.6 0.5 1.1 1.0 0.9 V IN=6.0V 0.8 0.7 0.6 V IN=1.76V 0.5 -50 -25 0 25 50 75 100 125 150 -50 -25 0 25 Ambient Temperature : Ta ( ℃) (14) EN High Level Threshold Voltage vs. Ambient Temperature 100 125 150 XC6131A 1.2 EN LowLevel Threshold Voltage : V ENL (V) 1.2 EN HighLevel Threshold Voltage : VENH (V) 75 (15) EN Low Level Threshold Voltage vs. Ambient Temperature XC6131A 1.1 V IN=6.0V 1.0 0.9 0.8 V IN=1.76V 0.7 0.6 0.5 1.1 1.0 0.9 V IN=6.0V 0.8 0.7 0.6 V IN=1.76V 0.5 -50 -25 0 25 50 75 100 125 -50 150 -25 0 25 50 75 100 125 150 Ambient Temperature : Ta ( ℃) Ambient Temperature : Ta ( ℃) (16) ENB High Level Threshold Voltage vs. Ambient Temperature (17) ENB Low Level Threshold Voltage vs. Ambient Temperature XC6131B XC6131B 1.2 ENB LowLevel Threshold Voltage : V ENBL (V) 1.2 ENB HighLevel Threshold Voltage : VENBH (V) 50 Ambient Temperature : Ta ( ℃) 1.1 V IN=6.0V 1.0 0.9 0.8 V IN=1.76V 0.7 0.6 0.5 1.1 1.0 0.9 V IN=6.0V 0.8 0.7 0.6 V IN=1.76V 0.5 -50 -25 0 25 50 75 Ambient Temperature : Ta ( ℃) 24/30 100 125 150 -50 -25 0 25 50 75 Ambient Temperature : Ta ( ℃) 100 125 150 XC6130/XC6131 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (18) MRB Pull-up Resistance vs. Ambient Temperature (19) EN Pull-up Resistance vs. Ambient Temperature XC6131A 1000 1000 900 900 EN Pull-up Resistance : REN (kΩ) MRB Pull-up Resistance : RMR (kΩ) XC6130A 800 700 600 500 400 800 700 600 500 400 300 300 -50 -25 0 25 50 75 100 125 -50 150 -25 0 (20) ENB Pull-down Resistance vs. Ambient Temperature 50 75 100 125 150 (21) WD Pull-up Resistance vs. Ambient Temperature XC6131B XC6130,XC6131 1000 1000 900 900 WD Pull-down Resistance : RWD (kΩ) ENB Pull-up Resistance : RENB (kΩ) 25 Ambient Temperature : Ta (℃) Ambient Temperature : Ta (℃) 800 700 600 500 400 300 800 700 600 500 400 300 -50 -25 0 25 50 75 Ambient Temperature : Ta (℃) 100 125 150 -50 -25 0 25 50 75 100 125 150 Ambient Temperature : Ta (℃) 25/30 XC6130/XC6131 Series ■PACKAGING INFORMATION ●SOT-26 (unit: mm) 2.9±0.2 +0.1 0.4 -0.05 +0.1 0.4 -0.05 6 5 4 0～0.1 1234 1 2 (0.95) 3 (0.95) +0.1 0.15 -0.05 1.0 2.4 ●SOT-26 Reference Pattern Layout (unit: mm) 26/30 XC6130/XC6131 Series ■PACKAGING INFORMATION (Continued) ●SOT-26 Power Dissipation (Toprmax+125℃) Power dissipation data for the SOT-26 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition 40.0 Condition: Mount on a board Ambient: Natural convection Soldering: Board: 28.9 Lead (Pb) free 2 Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area Through-hole Glass Epoxy (FR-4) 1.6mm 4 x 0.8 Diameter 2.54 1.4 2.5 Material: Thickness: 40.0 28.9 In top and back faces (Board of SOT-26 is used) Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Board Mount (Tjmax=125℃) Ambient Temperature (℃) Power Dissipation Pd (mW) 25 600 85 240 Thermal Resistance (℃/W) 166.67 Power Dissipation : Pd（mW） Pd vs Ta (Ta=125℃) 700 600 500 400 300 200 100 0 25 45 65 85 105 Ambient Temperature : Ta（℃） 125 27/30 XC6130/XC6131 Series ■MARKING RULE ●XC6130 ① represents products series SOT-26 6 ① 1 5 ② ③ 2 4 ④ ⑤ 3 MARK PRODUCT SERIES 4 XC6130******-G ② represents type of detector and detect voltage MARK DETECT VOLTAGE (V) 1 1.6～2.0 2 2.1～3.0 3 3.1～4.0 4 4.1～5.0 PRODUCT TYPE PRODUCT SERIES A XC6130A*****-G ③ represents detect voltage MARK DETECT VOLTAGE (V) MARK DETECT VOLTAGE (V) 1 2 x.1 x.2 6 7 x.6 x.7 3 x.3 8 x.8 4 x.4 9 x.9 5 x.5 0 x.0 ④⑤ represents production lot number 01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order. (G, I, J, O, Q, W excluded) * No character inversion used. 28/30 XC6130/XC6131 Series ■MARKING RULE (Continued) ●XC6131 ① represents products series SOT-26 6 ① 1 5 ② ③ 2 4 ④ ⑤ 3 MARK PRODUCT SERIES 4 XC6131******-G ② represents type of detector and detect voltage MARK DETECT VOLTAGE (V) A 1.6～2.0 B 2.1～3.0 C 3.1～4.0 D 4.1～5.0 E 1.6～2.0 F 2.1～3.0 H 3.1～4.0 K 4.1～5.0 PRODUCT TYPE PRODUCT SERIES A XC6131A*****-G B XC6131B*****-G ③ represents detect voltage MARK DETECT VOLTAGE (V) MARK DETECT VOLTAGE (V) 1 2 x.1 x.2 6 7 x.6 x.7 3 x.3 8 x.8 4 x.4 9 x.9 5 x.5 0 x.0 ④⑤ represents production lot number 01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order. (G, I, J, O, Q, W excluded) * No character inversion used. 29/30 XC6130/XC6131 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 30/30