GlobalTop Technology Inc. Orchid-1 BLE Module Datasheet (Tape Reel) Data Sheet Part Number: Bcs-u1623 Revision: V0H This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. th No.16 Nan-ke 9 Rd, Science-Based Industrial Park, Tainan, 741, Taiwan, R.O.C. Tel: +886-6-5051268 / Fax: +886-6-5053381 / Email: [email protected] / Web: www.GlobalTop-tech.com GlobalTop Technology Orchid-1 Datasheet (Tape Reel) Document # Ver. V0H Version History Title: Subtitle: Doc Type: Revision V0A V0B V0C V0D V0E V0F V0G V0H GlobalTop Orchid-1 Datasheet (Tape Reel) BLE Module Datasheet Date Author Description 2013/11/05 Frank First Release 2014/02/24 Frank Modify Temperature Rang 2014/03/19 Yingjie Add 1.3,2.1.2.2.2.3,2.5 Update Orchid-1 picture 2014/04/25 Dylan Modify 1.3 System Block Diagram Modify 4.5 ESD Handling Modify 5.1 SMT Reflow Soldering Temperature Profile 2014/05/14 Yingjie Add 2.8 Operating conditions(UART) Modify TX,RX current Modify Power supply 2014/11/04 Yingjie Remove 2.9 Flow Control Add 2.10 and 2.11 item 2015/03/03 Dylan Modified Bluetooth v4.1 2015/03/12 Dylan Modify moisture coded card This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 2 GlobalTop Technology Orchid-1 Datasheet (Tape Reel) Document # Ver. V0H 3 Table of Contents 1. Functional Description ........................................................................................................... 4 1.1 Overview ...................................................................................................................... 4 1.2 System Block Diagram ................................................................................................. 5 1.3 Bluetooth Smart Stacks ................................................................................................ 5 2. Specifications ........................................................................................................................ 6 2.1 Mechanical Dimension ................................................................................................. 6 2.2 Recommended PCB Pad Layout .................................................................................. 7 2.3 Pin Configuration ......................................................................................................... 8 2.4 Pin Assignment ............................................................................................................. 9 2.5 Description of I/O Pin................................................................................................. 10 2.6 Specification ............................................................................................................... 12 2.7 Absolute Maximum Ratings ....................................................................................... 12 2.8 Operating Conditions .................................................................................................. 12 2.9 UART Setting Conditions ........................................................................................... 13 2.10 TX Power vs. HW Configuration Setting ................................................................. 13 2.11 RX/TX Current vs. HW Configuration Setting ........................................................ 13 3. Reference Design ..................................................................................................................14 3.1 Reference Design Circuit (Operation mode) .............................................................. 14 3.2 SPI Firmware Download ............................................................................................ 14 4. Packing and Handling ............................................................................................................15 4.1 Moisture Sensitivity.................................................................................................... 15 4.2 Tape Reel Packing Information .................................................................................. 16 4.3 Storage and Floor Life Guideline ............................................................................... 19 4.4 Drying ......................................................................................................................... 19 4.5 ESD Handling ............................................................................................................. 20 5. Reflow Soldering Temperature Profile ...................................................................................21 5.1 SMT Reflow Soldering Temperature Profile .............................................................. 21 5.2 Manual Soldering ....................................................................................................... 24 6. Contact Information..............................................................................................................24 This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. GlobalTop Technology Orchid-1 Datasheet (Tape Reel) Document # Ver. V0H 1. Functional Description 1.1 Overview Orchid-1 is a GlobalTop BluetoothTM low energy module, which utilizes CSR1010 –the CSR new generation BluetoothTM low energy chipset built with μEnergy platform, is designed specifically for the rapid development of cost-effective BluetoothTM low energy applications. It enables ultra low power connectivity and basic data transfer for applications previously limited by the power consumption, size constraints and complexity of other wireless standards. Orchid-1 provides everything required for BluetoothTM low energy product with RF communication, baseband, MCU, Memory, qualified BluetoothTM v4.1 stack and customer application running on a single mode module. Orchid-1 connects seamlessly while backward compatible to BLE version 4.0 devices. Due to its small size, outstanding performance at low power consumption and easy modular handling, Orchid-1 is leading the way for the new generation of BluetoothTM low energy (BLE) modules. Application Automotive Watches Healthcare Commercial Sports and fitness Asset management Home entertainment Human interface devices Office and mobile accessories Highlights and Features Bluetooth v 4.1 Single-mode Support master and slave modes PCB-Print antenna Bluetooth Smart Profile Stack Host stack including ATT, GATT, SMP, L2CAP, GAP AES-128 Encryption Engine G.top Profile Customization SPP (Serial Port Profile) Security Lighting Beacon with iBeacon Technology Radio Freq. Performance Transmit power: 7.5dBm Receiver sensitivity: -92.5dBm RF Data rate: 1Mbps. GFSK Mod. Peripheral Interfaces UART / SPI / I2C / GPIO Power Consumption Transmit / Receive 20mA@Peak Current (Typ.) Deep Sleep: 5uA (Typ.) Dimension 16 x 23 x 2.3 mm Working Temperature -20°C to +75°C This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 4 1.2 System Block Diagram Antenna 18 23 BLE Radio and Modem SAW I/O 7 6 UART VCC 21 8 9 16 15 14 LDO/Switch Regulators LED PWM MCU PIO GlobalTop Technology Inc. SEL WAKE RX TX GPIO4 GPIO3 GPIO2 GPIO1 GPIO0 Bcs-u1623 BLE Module Datasheet (Tape Reel) 16MHz Crystal 32.768KHz Crystal ROM/RAM AIO Clock Generation I2C/SPI 2 AIO2 3 AIO1 4 AIO0 1 SCL 24 SDA 10 CLK 11 MOSI 12 CSB 13 MISO Flash /EEPROM Revision: V0F 5,17,19,20,22 1.3 Bluetooth Smart Stacks Application Layer User App Device Generic Att. Profile (GATT) Manager Library Attribute Profile (ATT) Security Manager (SM) L2CAP Link Layer Control Hardware Software Radio Ctrl Digital Radio Control Physical Layer This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. th No.16 Nan-ke 9 Rd, Science-Based Industrial Park, Tainan, 741, Taiwan, R.O.C. Tel: +886-6-5051268 / Fax: +886-6-5053381 / Email: [email protected] / Web: www.GlobalToptech.com GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H 2. Specifications 2.1 Mechanical Dimension Dimension: (Unit: mm, Tolerance: +/- 0.2mm) This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 6 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H 2.2 Recommended PCB Pad Layout (Unit: mm, Tolerance: 0.1mm) (Top view) This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 7 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H 2.3 Pin Configuration (Top view) This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 8 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H 2.4 Pin Assignment Pin Name I/O Description & Note 1 SCL I/O I2C - Serial Clock Line 2 AIO2 I/O Analogue Input/Output 3 AIO1 I/O Analogue Input/Output 4 AIO0 I/O Analogue Input/Output 5 GND P Ground 6 TX O UART transmit data output 7 RX I UART receive data input 8 GPIO4 I/O Parallel Input/Output 9 GPIO3 I/O Parallel Input/Output 10 CLK I/O SPI clock 11 MOSI I SPI_ Master out Slave in 12 CSB I/O SPI chip select 13 MISO O SPI _ Master in Slave out 14 GPIO0 I/O Parallel Input/Output 15 GPIO1 I/O Parallel Input/Output 16 GPIO2 I/O Parallel Input/Output 17 GND P Ground 18 SEL I Operation mode / SPI interface enable 19 GND P Ground 20 GND P Ground 21 VCC PI Supply voltage 22 GND P Ground 23 WAKE I Operation mode /Wake-up interrupt (option) 24 SDA I/O I2C- Serial Data Line This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 9 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H 2.5 Description of I/O Pin GND, Pin5, 17, 19, 20, 22 Ground SCL, Pin1 I2C bus_ Serial Clock Line, followed I2C specification and can support 100 kHz and 400 kHz speed. AIO2, AIO1, AIO0, Pin2, 3, 4 These Pin are analogue general purpose I/O. The behavior of these I/O pins can be configured by customized firmware for different applications. Keeps it floating if not used. TX, Pin6 This is the UART transmit pin of the module which outputs data to Host. RX, Pin7 This is the UART receive pin of the module which is used to receive commands from Host. GPIO4, GPIO3, GPIO0, GPIO1, GPIO2, Pin 8, 9,14,15,16 These Pins are parallel general purpose I/O. The I/O behavior of this pin can be configured by custom firmware for different applications. Keep it floating if not used. CLK, Pin10 SPI bus_ Serial Clock Line. This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 10 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H MOSI, Pin11 SPI bus_ Master out Slave in. CSB, Pin12 SPI bus_Chip select. MISO, Pin13 SPI bus_ Master in Slave out. SEL, Pin18 The pin is used to set the operation mode (4.7K Ohm to GND) or SPI Mode (4.7K Ohm to VCC) . Please make sure the SEL setting here as below. SEL(Pin18) Pull low Pull high Operation Mode SPI Mode (for Firmware download) VCC, Pin21 The main DC power supply of the module, the voltage should be kept between from 1.8V to 3.6V (Typical: 3V). WAKE, Pin23 The pin is connected to ground via 4.7Kohm. SDA, Pin24 I2C bus_ Serial Data Line, follow I2C specification and can support 100 kHz and 400 kHz speed. This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 11 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H 2.6 Specification Description BLE Solution CSR 1010 Frequency 2402-2480MHz Sensitivity -92.5dBm(chipset ability) Power Output 7.5dBm(chipset ability) RF Data rate 1Mbps, GFSK, 250KHz deviation Channel Spacing 2MHz Modulation GFSK Power Supply 2.5V to 3.6V@20mA(Typ.) Current Consumption Deep Sleep: 5μA (Typ.) RX / TX active :20mA@ peak current (Typ.) Working Temperature -20 °C to +75 °C Storage Temperature -30 °C to +85 °C Dimension 16 x23 x 2.3 mm, SMD Weight 1.3g 2.7 Absolute Maximum Ratings The voltage applied for VCC should not exceed 3.6VDC. Power Supply Voltage Symbol Min. Typ. Max. Unit VCC 2.5 3.0 3.6 V 2.8 Operating Conditions Condition Min. Typ. Max. Unit GPIO Input L Level VCC=1.8~3.6V -0.4 － 0.3xVCC V GPIO Input H Level VCC=1.8~3.6V 0.7xVCC － VCC+0.4 V GPIO Output L Level VCC=1.8~3.6V - － 0.4 V GPIO Output H Level VCC=1.8~3.6V 0.75xVCC － - V AIO Input Voltage - 0 － 1.35 V AIO Output Voltage - 0 － 1.35 V This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 12 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H 2.9 UART Setting Conditions Parameter Baud rate Possible Values Minimum 1200 baud (≤2%Error) 9600 baud (≤1%Error) Maximum 2Mbaud (≤1%Error) Parity － None, Odd or Even Number of stop bits － 1 or 2 Bits per byte － 8 2.10 TX Power vs. HW Configuration Setting 2.11 RX/TX Current vs. HW Configuration Setting This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 13 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H 3. Reference Design This chapter introduces the reference schematic design for the best performance. Additional tips and cautions on design are detail documented on Application Note, which is available upon request. 3.1 Reference Design Circuit (Operation mode) Note: 1. Ferrite bead L1 is added for power noise reduction. You may use other component with impedance of 600Ω at 100 MHz, IDC Max. 200mA. 2. C1, C2 and C3 bypass capacitors should be placed in proximity to the module. 3. Damping resistors R1 and R2 can be modified based on system application for EMI. 3.2 SPI Firmware Download Note: 1. Ferrite bead L1 is added for power noise reduction. You may use other component with impedance of 600Ω at 100 MHz, IDC Max. 200mA. 2. C1, C2 and C3 bypass capacitors should be placed in proximity to the module. ※If you need more support and information on antenna implementation, please contact us at [email protected]. This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 14 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H 4. Packing and Handling BLE modules, like any other SMD devices, are sensitive to moisture, electrostatic discharge, and temperature. By following the standards outlined in this document for GlobalTop BLE modules storage and handling, it is possible to reduce the chances of them being damaged during production set-up. This document will go through the basics on how GlobalTop packages its modules to ensure they arrive at their destination without any damages and deterioration to performance quality. It includes cautionary notes for prior to the surface mount process. Please read the sections II to V carefully to avoid permanent damages due to moisture intake. BLE modules contain highly sensitive electronic circuits and are electronic sensitive devices. Improper handling without ESD protections may lead to permanent damages to the modules. Please read section VI for more details. 4.1 Moisture Sensitivity GlobalTop BLE modules are moisture sensitive, and must be pre-baked before going through the solder reflow process. It is important to know that: GlobalTop BLE modules must complete solder reflow process in 72 hours after pre-baking. This maximum time is otherwise known as “Floor Life” If the waiting time has exceeded 72 hours, it is possible for the module to suffer damages during the solder reflow process such as cracks and delaminating of the SMD pads due to excess moisture pressure. This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 15 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H 4.2 Tape Reel Packing Information 750pcs/Reel Spec: H: 44.5±1.5, T: 2.2±0.2 D: 99±1.5 Note: 13”Reel, Material: P.S Unit: (mm) Figure 1: Reel Dimension This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 16 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H Ao Bo Ko W P F 16.4±0.10 23.5±0.10 2.8±0.10 44±0.30 24±0.10 20.2±0.10 Unit: (mm) Figure 2: Tape Dimension This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 17 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H The moisture color coded card provides an insight to the relative humidity in percentage (RH). When the BLE modules are taken out, it should be around or lower than 30% RH level. Outside each electrostatic bag is a caution label for moisture sensitive device. Figure 3: Example of moisture color coded card and caution label This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 18 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H 4.3 Storage and Floor Life Guideline Since GlobalTop BLE modules must undergo solder-reflow process in 72 hours after it has gone through pre-baking procedure, therefore if it is not used by then, it is recommended to store the BLE modules in dry places such as dry cabinet. The approximate shelf life for GlobalTop BLE modules packages is 6 months from the bag seal date, when store in a non-condensing storage environment (<30°C/60% RH) It is important to note that it is a required process for GlobalTop BLE modules to undergo pre-baking procedures, regardless of the storage condition. 4.4 Drying Because the vapor pressures of moisture inside the BLE modules increase greatly when it is exposed to high temperature of solder reflow, in order to prevent internal delaminating, cracking of the devices, or the “popcorn” phenomenon, it is a necessary requirement for GlobalTop BLE module to undergo pre-baking procedure before any high temperature or solder reflow process. The recommendation baking time for GlobalTop BLE modules is as follows: 60°C for 8 to 12 hours Once baked, the module’s floor life will be “reset”, and has additional 72 hours in normal factory condition to undergo solder reflow process. Please limit the number of times the BLE modules undergoes baking processes as repeated baking process has an effect of reducing the wetting effectiveness of the SMD pad contacts. This applies to all SMT devices. Oxidation Risk: Baking SMD packages may cause oxidation and/or inter metallic growth of the terminations, which if excessive can result in solder ability problems during board assembly. The temperature and time for baking SMD packages are therefore limited by solder ability considerations. The cumulative bake time at a temperature greater than 90°C and up to 125°C shall not exceed 96 hours. Bake temperatures higher than 125°C are now allowed. This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 19 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H 4.5 ESD Handling Please carefully follow the following precautions to prevent severe damage to BLE modules. GlobalTop BLE modules are sensitive to electrostatic discharges, and thus are Electrostatic Sensitive Devices (ESD). Careful handling of the BLE modules, must follow the standard ESD safety practices: Unless there is a galvanic coupling between the local GND and the PCB GND, then the first point of contact when handling the PCB shall always be between the local GND and PCB GND. Please do not touch the mounted PCB antenna to prevent electrostatic discharge from the RF input This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 20 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H 5. Reflow Soldering Temperature Profile The following reflow temperature profile was evaluated by GlobalTop and has been proven to be reliable qualitatively. Please contact us beforehand if you plan to solder this component using a deviated temperature profile as it may cause significant damage to our module and your device. All the information in this sheet can only be used only for Pb-free manufacturing process. 5.1 SMT Reflow Soldering Temperature Profile (Reference Only) Average ramp-up rate (25 ~ 150°C): 3°C/sec. max. Average ramp-up rate (270°C to peak): 3°C/sec. max. Preheat: 175 ± 25°C, 60 ~ 120 seconds Temperature maintained above 217°C: 60~150 seconds Peak temperature: 250 +0/-5°C, 20~40 seconds Ramp-down rate: 6°C/sec. max. Time 25°C to peak temperature: 8 minutes max. Peak:250+0/-5°C °C Slop:3°C /sec. max. Slop:6°C /sec. max. (217°C to peak) 217°C Preheat: 175±5°C 60 ~120 sec. 20 ~ 40 sec. 60 ~150 sec. Slop:3°C /sec. max. 25°C Time (sec) This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 21 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Details Before proceeding with the reflowsoldering process, the BLE module must be pre-baked. Document # Ver. V0H Suggestions Pre-bake Time: 6 Hours @ 60°±5°C or Notes The maximum tolerated temperature for the tray is 100°C. 4 Hours @ 70°±5°C After the pre-baking process, please make sure the temperature is sufficiently cooled down to 35°C or below in order to prevent any tray deformation. Because PCBA (along with the PCB antenna) is highly endothermic during the reflow-soldering process, extra care must be paid to the BLE module's solder joint to see if there are any signs of cold weld(ing) or false welding. The parameters of the reflow temperature must be set accordingly to module’s reflowsoldering temperature profile. Double check to see if the surrounding components around the BLE module are displaying symptoms of cold weld(ing) or false welding. 3 Special attentions are needed for PCBA board during reflow-soldering to see if there are any symptoms of bending or deformation to the PCBA board, possibility due to the weight of the module. If so, this will cause concerns at the latter half of the production process. A loading carrier fixture must be used with PCBA if the reflow soldering process is using rail conveyors for the production. If there is any bending or deformation to the PCBA board, this might causes the PCBA to collide into one another during the unloading process. 4 Before the PCBA is going through the reflow-soldering process, the production operators must check by eyesight to see if there are positional offset to the module, because it will be difficult to readjust after the module has gone through reflow-soldering process. The operators must check by eyesight and readjust the position before reflow-soldering process. If the operator is planning to readjust the module position, please do not touch the PCB antenna Before handling the PCBA, they must be cooled to 35°C or below after they have gone through the reflow-soldering process, in order to prevent positional shift that might occur when the module is still hot. 1. Can use electric fans behind the Reflow machine to cool them down. 2. Cooling the PCBA can prevent the module from shifting due to fluid effect. 1 2 5 -- This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 22 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H Other Cautionary Notes on Reflow-Soldering Process: 1. Module must be pre-baked before going through SMT solder reflow process. 2. The usage of solder paste should follow “first in first out” principle. Opened solder paste needs to be monitored and recorded in a timely fashion manner (refer to IPQC standards for related documentation and examples) 3. Temperature and humidity must be controlled within SMT production line and storage area. Temperature of 23°C, 60±5% RH humidity is recommended. (please refer to IPQC standards for related documentation and examples) 4. When performing solder paste printing, please notice if the amount of solder paste is in excess or insufficient, as both conditions may lead to defects such as electrical shortage, empty solder and etc. 5. Make sure the vacuum mouthpiece is able to bear the weight of the BLE module to prevent positional shift during the loading process. 6. Before the PCBA is going through the reflow-soldering process, the operators should check by eyesight to see if there are positional offset to the module. 7. The reflow temperature and its profile data must be measured before the SMT process and match the levels and guidelines set by IPQC. 8. If SMT protection line is running a double-sided process for PCBA, please process BLE module during the second pass only to avoid repeated reflow exposures of the BLE modules. Please contact GlobalTop beforehand if you must process BLE modules during the 1st pass of double-side process. Figure 4: Place BLE modules right-side up when running reflow-solder process, do not invert. This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 23 GlobalTop Technology Bcs-u1623 Datasheet (Tape Reel) Document # Ver. V0H 5.2 Manual Soldering Soldering iron: Heat Temperature: under 380°C Time: under 3 sec. Notes: 1. Please do not directly touch the soldering pads on the surface of the PCB board, in order to prevent further oxidation 2. The solder paste must be defrosted to room temperature before use so it can return to its optimal working temperature. The time required for this procedure is unique and dependent on the properties of the solder paste used. 3. The steel plate must be properly assessed before and after use, so its measurement stays strictly within the specification set by SOP. 4. Please watch out for the spacing between soldering joint, as excess solder may cause electrical shortage 5. Please exercise with caution and do not use extensive amount of flux due to possible siphon effects on neighboring components, which may lead to electrical shortage. 6. Please do not use the heat gun for long periods of time when removing the shielding or inner components of the BLE module, as it is very likely to cause a shift to the inner components and will leads to electrical shortage. 6. Contact Information GlobalTop Technology Inc. Address: No.16 Nan-ke 9th Road Science-based Industrial Park, Tainan 741, Taiwan Tel: +886-6-5051268 Fax: +886-6-5053381 Website: www.gtop-tech.com Email: sales@gtop -tech.com This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice. Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved. 24