CLD-AP90 Rev 0 Soldering & handling Cree XLamp XB-D LEDs ® ® Introduction Table of contents This application note applies to XLamp XB-D LEDs Handling XLamp XB-D LEDs..................................2 which have order codes in the following format. Circuit Board Preparation & Layouts.......................4 Case Temperature (Ts) Measurement Point..............4 XBDxxx-xx-xxxx-xxxxxxxxx Notes on Soldering XLamp XB-D LEDs....................5 WWW.CREE.COM/XLAMP Moisture Sensitivity.............................................6 This application note explains how XLamp XB-D LEDs XLamp XB-D LED Reflow Soldering Characteristics...7 and assemblies containing these LEDs should be Chemicals & Conformal Coatings...........................8 handled during manufacturing. Please read the entire Assembly Storage & Handling................................9 document to understand how to properly handle Tape and Reel - XB-D LEDs................................. 10 XLamp XB-D LEDs. Packaging & Labels............................................ 11 Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp xlamp XB-D led soldering & handling Handling XLamp XB-D LEDs Manual Handling Use tweezers to grab XLamp XB-D LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with fingers. Do not push on the lens. Do not apply more than 1000 g of shear force onto the lens. Excessive force on the lens could damage the LED. P CORRECT X WRONG Cree recommends the following at all times when handling XLamp XB-D LEDs or assemblies containing these LEDs: • Avoid putting excessive mechanical stress on the LED lens. • Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged, which would affect the optical performance of the LED. Whenever possible, Cree recommends the use of a pick & place tool to remove XLamp XB-D LEDs from the factory tape & reel packaging. 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks Copyright © 2010 of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 2 xlamp XB-D led soldering & handling 6 Pick & Place Nozzle 5 4 3 2 1 REVISONS NOTICE CONFIDENTIAL. THIS PLOT AND THE INFORMATION AINED WITHIN ARE THE PROPRIETARY AND IDENTIAL INFORMATION OF CREE, INC. THIS PLOT NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY THORIZED PERSON WITHOUTTHE WRITTEN CONSENT REE INC. REV BY DESCRIPTION DATE For pick and place nozzles coming into contact with silicone-covered LED components, Cree recommends nozzles DDS be A Initial Release 1/5/12 APP'D D. H. constructed of non-metallic materials. Cree and several of Cree’s customers have had good success using nozzles fabricated from Teflon or from 90d urethane. The following pick & place tool is specific to the XB Family LEDs. D All dimensions in mm. 2.500 +.100/-.000 4.500 1.125 5.500 C Add features as required to interface with customer's tool 4x 15.0° 2.500 +.100/-.000 4x R.200 2.300 ± .050 thru x 90° 2.400 +.050/-.000 B THIRD ANGLE PROJECTION UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .XX ± .25 .XXX ± .125 X° ± .5 ° FOR SHEET METAL PARTS ONLY .X ± 1.5 .XX ± .75 .XXX ± .25 X° ± .5 ° DATE DRAWN BY D. Seibel DATE APPROVED DATE 5 4 3 Phone (919) 313-5300 Fax (919) 313-5558 Don Hirsh 1/5/12 Delrin Tool, Pickup-XB-D SIZE FINAL PROTECTIVE FINISH SCALE 2 A TITLE MATERIAL SURFACE FINISH: 1.6 6 4600 Silicon Drive Durham, N.C 27703 1/5/12 CHECK C 13.000 REV. DRAWING NO. 12002494 A SHEET 1 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks Copyright © 2010 of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 3 OF 1 /1 xlamp XB-D led soldering & handling 2.45 2 C Circuit Board Preparation & Layouts R1.086 0.462 Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or soldering XLamp XB-D LEDs onto the PCB. 0.923 0.65 The diagram below shows the recommended PCB solder pad layout for XLamp XB-D LEDs. All dimensions in mm. 0.36 0.426 0.82 0.426 0.46 B 0.36 0.852 2.34 0.284 2.272 1.136 A 0.284 0.28 0.36 0.284 0.92 2.34 RECOMMENDED PCB SOLDER PADPad Recommended PCB Solder 2.272 RECOMMENDED STENCIL PATTERN Recommended Stencil Pattern (HATCHED AREA IS OPENING) THIRD ANGLE PROJECTION Case Temperature (Ts) Measurement Point 6 5 UNLESS OTHERWISE SPE DIMENSIONS ARE IN MILLIMETERS AND AFTER F TOLERANCE UNLESS SPE .XX ± .25 .XXX ± .125 X° ± .5 ° FOR SHEET METAL PARTS .X ± 1.5 .XX ± .75 .XXX ± .25 X° ± .5 ° SURFACE FINISH: 1.6 4 3 XLamp XB-D LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible. This measurement point is shown in the picture below. Thermocouple site if no separate pad Pad for thermocouple It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XB-D LED itself. In testing, Cree has found such a solder pad to have insignificant impact on the resulting Ts measurement. 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks Copyright © 2010 of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 4 xlamp XB-D led soldering & handling Notes on Soldering XLamp XB-D LEDs XLamp XB-D LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the PCB on a hotplate and following the reflow soldering profile listed on the previous page. Do not wave solder XLamp XB-D LEDs. Do not hand solder XLamp XB-D LEDs. P CORRECT X WRONG P CORRECT Solder Paste Paste Type Solder Type Cree strongly recommends using “no clean” solder paste with XLamp XB-D LEDs so that cleaning the PCB after reflow Cree strongly recommends using “no clean” solder paste with XLamp MPL-EZW LEDs that cleaning the PCB after reflow Indiumso Corporation of America® Part number 82676 soldering is not required. Cree uses the following • Sn62/Pb36/Ag2 solder pastecomposition internally: soldering is not required. Cree uses the following solder paste internally. • Flux: NC-SMQ92J Indium Corporation of America Part number 82676 Sn62/Pb36/Ag2 composition Solder Paste Thickness Flux: NC-SMQ92J Cree recommends the following solder paste compositions: SnPbAg, SnAgCu and SnAg. The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results Cree recommends the following solder paste compositions: SnPbAg, SnAgCu and SnAg. using solder thickness that results in a 3-mil (75-μm) bond line. Solder Paste Thickness P X The choice of solder and the application method will dictate the specific WRONG amount of CORRECT solder. For the most consistent results an automated dispensing system or a solder stencil printer isInc.recommended. Cree has seen positive results using solder thickness that results 2012 Cree, Copyright © 2010 All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at in a post reflow 3-mil (75µm) bond line. www.cree.com. 5 xlamp XB-D led soldering & handling After Soldering After soldering, allow XLamp XB-D LEDs to return to room temperature before subsequent handling. Handling of the device, especially around the lens, before cooling could result in damage to the LED. Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. This can be done by X-ray or by shearing selected devices from the circuit board. The solder should appear completely re-flown (no solder grains evident). The solder areas should show minimum evidence of voids on the backside of the package and the PCB. Cleaning PCBs After Soldering Cree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary, Cree recommends the use of isopropyl alcohol (IPA). Do not use ultrasonic cleaning. Moisture Sensitivity In testing, Cree has found XLamp XB-D LEDs to have unlimited floor life in conditions ≤ 30 ºC / 85% relative humidity (RH). However, Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LEDs to the resealable moisture-barrier bag and closing the bag immediately after use. Moisture testing included a 168-hour soak at 85 ºC / 85% RH followed by 3 reflow cycles, with visual and electrical inspections at each stage. 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks Copyright © 2010 of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 6 xlamp XB-D led soldering & handling XLamp XB-D LED Reflow Soldering Characteristics In testing, Cree has found XLamp XB-D LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline is offered as a starting point and may require adjustment for certain PCB designs and configurations of reflow soldering equipment. Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Lead-Based Solder Lead-Free Solder 3 °C/second max. 3 °C/second max. Preheat: Temperature Min (Tsmin) 100 °C 150 °C Preheat: Temperature Max (Tsmax) 150 °C 200 °C 60-120 seconds 60-180 seconds 183 °C 217 °C 60-150 seconds 60-150 seconds 215 °C 260 °C 10-30 seconds 20-40 seconds 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp) Ramp-Down Rate Time 25 °C to Peak Temperature Note: All temperatures refer to topside of the package, measured on the package body surface. 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks Copyright © 2010 of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 7 xlamp XB-D led soldering & handling Chemicals & Conformal Coatings Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application Note (www.cree.com/products/pdf/XLamp_Chemical_Comp.pdf). The video at www.youtube. com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer. Recommended Cleaning Solutions Cree has found the following chemicals to be safe to use with XLamp XB-D LEDs. • Water • Isopropyl alcohol (IPA) Chemicals Tested as Harmful In general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to XLamp XB-D LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp XB-D LEDs. The fumes from even small amounts of the chemicals may damage the LEDs. • Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene) • Methyl acetate or ethyl acetate (i.e., nail polish remover) • Cyanoacrylates (i.e., “Superglue”) • Glycol ethers (including Radio Shack® Precision Electronics Cleaner - dipropylene glycol monomethyl ether) • Formaldehyde or butadiene (including Ashland PLIOBOND® adhesive) Potential of Silver Tarnishing XLamp XB-D LEDs contain silver plated parts that may tarnish (turn black) over time when exposed to oxidizing substances such as sulfur, chlorine, or other halogen compounds. Oxidation of the leads can reduce the ability to make a good solder connection and affect the light output of the LED. Exposure to oxidizing substances can come from materials used near the LED during manufacturing or from the air around the LEDs during storage. To reduce the potential of tarnishing for XLamp XB-D LEDs, Cree recommends that customers minimize exposure of the LEDs to oxidizing substances at all times, including dry box storage, manufacturing and product testing. Potential sources of oxidizing substances include paper, air filters, some cleaning chemicals, cardboard boxes and rubber antistatic mats. 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks Copyright © 2010 of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 8 xlamp XB-D led soldering & handling Assembly Storage & Handling Do not stack PCBs or assemblies containing XLamp XB-D LEDs so that anything rests on the LED lens. Force applied to the LED lens may result in the lens being knocked off. PCBs or assemblies containing XLamp XB-D LEDs should be stacked in a way to allow at least 2 cm clearance above the LED lens. Do not use bubble wrap directly on top of XLamp XB-D LEDs. Force from the bubble wrap can potentially damage the LED. P CORRECT P CORRECT X WRONG 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks Copyright © 2010 of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 9 6 5 4 3 2 REVISONS NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT OF CREE INC. REV A DESCRIPTION B Released D xlamp XB-D led soldering & handling D Tape and Reel - XB-D LEDs All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. 1.5±.1 4.0±.1 8.0±.1 1.75±.10 All dimensions in mm. 2.5±.1 Cathode Side 1.50 +.10/-.00 C +.3 12.0 .0 1.75 ±.10 4.00 ±.10 2.00 ±.10 B B Anode Side (denoted by + and circle) 12.00 Nominal 12.30 Max 10.25 ±.10 User Feed Direction END START 8.00 ±.10 B .30 ± .10 5.50 ±.10 1.50 ± .10 A Loaded Pockets (1,000 Lamps) Trailer 160mm (min) of 2.000 +/-.10 empty pockets sealed with tape (20 pockets min.) Leader 400mm (min) of REFERENCE empty pockets with VENDOR PART NUMBER 020246 at least 100mm sealed by tape (50 empty pockets min.) SECTION B-B User Feed Direction THIRD ANGLE PROJECTION Notes: 1. 10 sprocket hole pitch cumulative tolerance ± 0.2mm UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .XX ± .25 .XXX ± .125 X° ± .5 ° FOR SHEET METAL PARTS ONLY .X ± 1.5 .XX ± .75 .XXX ± .25 X° ± .5 ° DATE DRAWN BY D. CRONIN DATE APPROVED DATE TITLE Carrier Tape, 25 MATERIAL SIZE FINAL PROTECTIVE FINISH SCALE SURFACE FINISH: 1.6 6 5 4 3 Cover Tape 10/23/11 CHECK C DRAWING NO. 4.000 2 Pocket Tape 13mm 7" 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks Copyright © 2010 of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 10 2402-00 xlamp XB-D led soldering & handling Packaging & Labels Dessicant Desiccant (inside bag) (inside bag) Humidity Indicator Humidity Indicator Card (inside bag)bag) (inside The diagrams below show the packaging and labels Cree will use to ship XLamp XB-D LEDs. XLamp XB-D LEDs are shipped in tape loaded on a reel. Each moisture barrier bag contains only one reel. Each box may Vacuum-Sealed contain multiple reels. Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label Bin with Cree Bin CREE Code & Barcode Label Code, Qty, Lot # Label with Cree Bin Label with Customer P/N, Qty, Lot #, PO## Code, Qty, Lot Label CREE Binwith Code Cree Bin & Barcode LabelLot # Code, Qty, Label with Cree Bin Label with Customer P/N, Qty,Qty, Lot #, Lot PO # # Code, Patent Label Patent Label Label with Customer Order Code, Qty, Reel ID, PO # Label with Customer Order Code, Qty, Reelwith ID,Customer PO # Label Order Code, Qty, Reel ID, PO# Label with Cree Bin Code, Qty, Lot # 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks Copyright © 2010 of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 11