MATERIAL DECLARATION SHEET Material Product Line Revision Date Revision RoHS Compliant MF-USMF Multifuse August 1, 2005 A Yes Breakdown of part (eg Lead, Ceramic body, coating, plating, additive) Material/substance name (eg.Sn alloy, Cu Copper) Material/ substance weight in grams (±0.1%) CAS No. / Int. Material Identifier /substance weight % Sum (%) No. 1 Carbon Black Carbon 0.0005362 2 Copper Plating Copper 0.0010310 3 Foil Copper 0.0068207 7440-50-8 Nickel 0.0003590 7440-02-0 1333-86-4 4 PCB Foil Copper 0.0008668 7440-50-8 5 Polymer Polyethylene Homopolymer 0.0004751 9002-88-4 Proprietary Additives 0.0000006 Epoxy 0.0024492 Glass Fiber 0.0016326 Nickel 0.0000678 Gold 0.0000008 Total Weight (Grams) 0.0142399 6 7 Prepreg Soldering Plating Total 3.77% 7.24% 47.90% 2.52% 6.09% 3.34% 0.00% 17.20% 11.47% 0.48% 0.01% 100% 3.77% 7.24% 50.42% 6.09% 3.34% 28.66% 0.48% 100%