IA NT Features CO M PL ■ *R oH S ■ ■ ■ ■ Applications Fast tripping resettable circuit protection Surface mount packaging for automated assembly Small footprint size (1210) RoHS compliant* Agency recognition*: Game consoles PC motherboards USB current-limiting compliance IEEE 1394 ports Mobile phones Digital cameras ■ ■ ■ ■ ■ ■ T V Rheinland MF-USMF Series - PTC Resettable Fuses Electrical Characteristics Ihold Model MF-USMF005 MF-USMF010 MF-USMF020 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150* V max. Volts I max. Amps 30 30 30 6 13.2 6 6 6 10 10 10 40 40 40 40 40 Itrip Max. Time To Trip Resistance Amperes at 23 °C Hold Trip Ohms at 23 °C RMin. R1Max. 0.05 0.10 0.20 0.35 0.50 0.75 1.10 1.50 2.800 0.800 0.400 0.200 0.180 0.070 0.050 0.030 0.15 0.30 0.40 0.75 1.00 1.50 2.20 3.00 50.000 15.000 5.000 1.300 0.900 0.450 0.210 0.110 Amperes at 23 °C Seconds at 23 °C 0.25 0.50 8.00 8.00 8.00 8.00 5.00 5.00 1.50 0.60 0.02 0.20 0.10 0.10 1.00 5.00 Tripped Power Dissipation Watts at 23 °C Typ. 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 *UL approval pending. Environmental Characteristics Operating Temperature ......................................-40 °C to +85 °C Maximum Device Surface Temperature in Tripped State ................................................125 °C Passive Aging......................................................+85 °C, 1000 hours ....................................±5 % typical resistance change Humidity Aging....................................................+85 °C, 85 % R.H. 1000 hours ..................±5 % typical resistance change Thermal Shock ....................................................+85 °C to -40 °C, 20 times ........................±10 % typical resistance change Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change Condition A Test Procedures And Requirements For Model MF-USMF Series Test Test Conditions Accept/Reject Criteria Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description Resistance ......................................In still air @ 23 °C............................................................Rmin ≤ R ≤ R1max Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T ≤ max. time to trip (seconds) Hold Current ..................................30 min. at Ihold ..............................................................No trip Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning Solderability ....................................ANSI/J-STD-002 ............................................................95 % min. coverage UL File Number ..................................E174545 http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545 CSA File Number ..............................CA110338 http://directories.csa-international.org/ Under “Certification Record” and “File Number” enter 110338-0-000 TÜV Certificate Number ....................R 02057213 http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213 Thermal Derating Chart - Ihold (Amps) Ambient Operating Temperature Model MF-USMF005 MF-USMF010 MF-USMF020 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150 -40 °C 0.08 0.15 0.32 0.51 0.76 1.10 1.60 2.30 -20 °C 0.07 0.13 0.28 0.46 0.66 0.97 1.42 2.02 0 °C 0.06 0.12 0.24 0.40 0.58 0.86 1.26 1.76 23 °C 0.05 0.10 0.20 0.34 0.48 0.72 1.10 1.43 40 °C 0.04 0.09 0.18 0.30 0.42 0.64 0.94 1.24 50 °C 0.04 0.08 0.16 0.27 0.38 0.58 0.86 1.11 60 °C 0.03 0.07 0.14 0.24 0.35 0.55 0.80 1.00 70 °C 0.03 0.06 0.12 0.22 0.29 0.47 0.70 0.85 85 °C 0.02 0.05 0.10 0.18 0.23 0.39 0.58 0.65 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-USMF Series - PTC Resettable Fuses Product Dimensions A Model Min. 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) MF-USMF005 MF-USMF010 MF-USMF020 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150 B Max. 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) Min. 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) C Max. 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) Packaging: 3000 pcs. per reel. Top and Bottom View A Min. 0.80 (0.031) 0.80 (0.031) 0.80 (0.031) 0.55 (0.022) 0.55 (0.022) 0.55 (0.022) 0.55 (0.022) 0.40 (0.016) D Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) Max. 1.1 (0.043) 1.1 (0.043) 1.1 (0.043) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) UNIT = Side View Recommended Pad Layout C 1.0 ± 0.05 (.039 ± .002) 1.0 ± 0.05 (.039 ± .002) 2.5 ± 0.1 (.098 ± .004) B 2.0 ± 0.1 (.079 ± .004) MM (INCHES) Terminal material: Electroless Ni under immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH max. D Solder Reflow Recommendations 300 Preheating Soldering Cooling Temperature (°C) 250 200 150 100 50 0 160–220 10–20 Time (seconds) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 120 Notes: • MF-USMF models cannot be wave soldered. • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. • Compatible with Pb and Pb-free solder reflow profiles. MF-USMF Series - PTC Resettable Fuses How to Order Typical Time to Trip at 23 °C 100 MF - USMF 010 - 2 MF-USMF010 Time to Trip (Seconds) 10 Multifuse® Product Designator MF-USMF075 MF-USMF110 MF-USMF035 MF-USMF050 MF-USMF150 Series USMF = 1210 Surface Mount Component Hold Current, Ihold 005-150 (0.05-1.50 Amps) 1 Packaging Packaged per EIA 481-1 -2 = Tape and Reel MF-USMF005 0.1 Typical Part Marking Represents total content. Layout may vary. 0.01 0.001 0.1 1 10 100 Fault Current (Amps) 6 A PART IDENTIFICATION: MF-USMF005 = 0 MF-USMF010 = 1 MF-USMF020 = 2 MF-USMF035 = 3 MF-USMF050 = 4 MF-USMF075 = 5 MF-USMF110 = 6 MF-USMF150 = 8 BIWEEKLY DATE CODE: WEEK 1 AND 2 = A WEEK 51 AND 52 = Z The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. Circuit Protection Division Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com MF-USMF SERIES, REV. C, 01/06 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-USMF Series Tape and Reel Specifications MF-USMF Series per EIA 481-2 Tape Dimensions W 8.0 ± 0.3 (0.315 ± 0.012) P0 4.0 ± 0.1 (0.157 ± 0.004) P1 P2 4.0 ± 0.1 (0.157 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) A0 2.76 ± 0.10 (0.109 ± 0.004) B0 3.50 ± 0.10 (0.138 ± 0.004) 4.35 (0.171) 1.5 + 0.1/-0.0 (0.059 + 0.004/-0) 3.5 ± 0.05 (0.138 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) B1 max. D0 F E1 6.25 (0.246) 0.6 (0.024) 0.1 (0.004) E2 min. T max. T1 max. 1.07 ± 0.10 (0.042 ± 0.004) K0 390 (15.35) 160 (6.30) Leader min. Trailer min. Reel Dimensions 185 (7.283) 50 (1.97) A max. N min. 8.4 + 1.5/ -0.0 (0.331 + 0.059/-0.0) 14.4 (0.567) W1 W2 max. UNIT = P0 T D0 P2 MM (INCHES) E1 W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 P1 A0 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. W1(MEASURED AT HUB)