MATERIAL DATA SHEET Material MT3225 Series Product Line Multilayer Chip Bead Date 04-December-2004 NO. Construction element Material group Material Weight (g) Materials CAS If applicable Average mass (%) 1 Core Ferrite 0.0429 Fe203 ------ 100 Copper Oxide ------ Business Confidential Nickel Oxide ------- Zinc Oxide 01314-13-2 Lead Oxide 1317-36-8 Ag 7440-22-4 67 100 Ni 7440-02-0 33 2 Pad Terminal Electrode 0.0016 Sum (%) 3 Solder plate Solder plate 0.0015 Sn 7440-31-5 100 4 Circuit Silver 0.0040 Ag 7440-22-4 100 Total weight 0.0505 Headquarters Riverside CA www.bourns.com Traces page 1 of 1