MATERIAL DATA SHEET Material CM252016 Series Product Line Wirewound Chip Inductor Date 19-July-2004 No. Construction Element Material Group Material Weight (g) 1 Core Ferrite 0.005 2 Solder Internal Connection 0.001 3 4 330K Pad Solder Plate Terminal Electrode Terminal Solder 0.005 0.001 5 Wire Coated Wire 0.006 6 Adhesive Epoxy 0.001 7 Coating Resin 0.004 Total Weight 0.023 Headquarters Riverside CA Material CAS If applicable Average Mass (%) Sum (%) Copper (II) Oxide Zinc Oxide Nickel Oxide Cobalttetraoxide Ferric Oxide 1317-38-0 1314-13-2 1313-99-1 1308-06-1 1333-86-4 6 20 12 0.2 61.8 100 Tin 7440-31-5 1 100 Lead Silver Phosphor Bronze Tin Copper Copper Polyurethane Resin Epoxy Others Epoxy Resin Phenol Novolac Antimony Trichloride Brominated epoxy Fused Silica 7439-92-1 7440-22-4 7440-31-5 7440-58-8 7440-50-8 25068-38-6 29690-82-2 9003-35-4 1309-64-4 40039-93-8 60676-86-0 97.3 1.7 100 99.3 0.7 95 5 55 45 17.5 10 2.5 2.5 67.5 www.bourns.com Remark RoHS exempted: High-melting point solder 100 100 100 100 page 1 of 1