Product Data Sheet ZC6 – Z-Power COB Superior high Flux for High Current System Z Power Chip on board – ZC series, ZC6 SDW01F1C, SDW81F1C 13.5 x 13.5 (㎟) RoHS Product Brief Description Features and Benefits • • The ZC(Z-Power Chip on board) series are High Flux and High Efficiency. • • • • • • It is COB (Chip On Board) series designed for easy to attach to lighting fixture directly without reflow process. • Super high Flux output and high Luminance Designed for high current operation Design flexibility MacAdam 3-step Lead Free product RoHS compliant ZC series' thermal management perform exceeds other power LED solutions. • • MacAdam 3 step, 4-step available including Key Applications ANSI. • • • Provide COB total solution available(Optic, reflector, holder etc.) • Bulb Architectural lighting Decorative / Pathway lighting The Z-Power LED is ideal light sources for general illumination applications, custom designed solutions, and high performance lights. Table 1. Product Selection Table CCT Part Number Color Min. Typ. Max. SDW01F1C Cool White 4700K 5300K 6000K SDW81F1C Warm White 3000K SDW81F1C Warm White 2700K Rev1.0, July 19, 2013 1 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Table of Contents Index • Product Brief • Table of Contents • Product Nomenclature (Labeling Information) • Performance Characteristics - Relative Spectral Distribution - Luminous Flux Characteristics - Forward Current Characteristics - Junction Temperature Characteristics - Ambient Temperature Characteristics • Color Bin Structure • Packaging Information - Mechanical Dimensions - Tray packaging structure - Packing (bag & box) • Handling of Silicone Resin for LEDs • Precaution For Use • Revision History • Company Information Rev1.0, July 19, 2013 2 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Product Nomenclature Table 2. Part Numbering System : X1X2X3 X4X5 X6X7 X8 Part Number Code Description Part Number X1 Company S X2 Package series D X3 Color Specification W0 White W8 CRI 80 X4 Value X5 Series number 1 X6 Lens type F Flat X7 PCB type 1 PCB X8 Revision number C New COB type Table 3. Lot Numbering System : Y1Y2Y3Y4Y5Y6 – Y7Y8Y9Y10 – Y11Y12Y13 Lot Number Code Description Y1Y2 Year Y3Y4 Month Y5Y6 Day Y7Y8Y9Y10 Mass order Y11Y12Y13 Tray No. Rev1.0, July 19, 2013 Lot Number 3 Value www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Performance Characteristics Table 4. Product Selection Guide, TA = 25ºC, RH30% CCT (K) [1] Part Number Typical Luminous Flux [2] ФV [3] (lm) Typical Forward Voltage (Vf) [4] CRI [5], Ra Viewing Angle (degrees) 2Θ ½ Typ. 180mA 320mA* 180mA 320mA* Min. Typ. SDW01F1C 5000 870 1390 37 38.5 70 120 SDW81F1C 3000 750 1200 37 38.5 80 120 SDW81F1C 2700 710 1130 37 38.5 80 120 Notes : 1. Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color coordinate : 0.01, CCT 5% tolerance. 2. SSC maintains a tolerance of ±7% on flux and power measurements. 3. ФV is the total luminous flux output as measured with an integrating sphere. 4. Tolerance is ±2.5V on forward voltage measurements. 5. Tolerance is ±2 on CRI measurements. * Calculated performance values are for reference only. Rev1.0, July 19, 2013 4 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Performance Characteristics Table 5. Characteristics, TA = 25ºC, RH30% Value Parameter Symbol Unit Min. Typ. Max. Forward Current IF - 0.18 0.32 A Power Dissipation Pd - 6.7 12.3 W Tj - - 125 ºC Operating Temperature Topr -40 - 85 ºC Storage Temperature Tstg -40 - 100 ºC Thermal resistance (J to S) [2] RθJ-S - 1.4 - K/W ESD Sensitivity(HBM) [3] - - - ±8 kV Junction Temperature [1] Notes : 1. IF 320mA 2. At thermal Resistance, J to S means junction to COB’s metal pcb bottom. 3. A zener diode is included to protect the product from ESD. Rev1.0, July 19, 2013 5 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Relative Spectral Distribution Fig 1. Color Spectrum, Ta = 25℃, IF = 180mA, RH30% Cool white Warm white Relative Radiant Power [%] 1.0 0.8 0.6 0.4 0.2 0.0 300 400 500 600 700 800 Wavelength [nm] Rev1.0, July 19, 2013 6 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Luminous Flux Characteristics Fig 2. Radiant pattern, IF = 180mA 1.1 1.0 Relative Intensity [%] 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angular Displacement [degrees] Rev1.0, July 19, 2013 7 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Forward Current Characteristics Fig 3. Forward Voltage vs. Forward Current , Ta=25℃ 0.4 Forward Current [A] 0.3 0.2 0.1 0.0 10 15 20 25 30 35 40 Forward Volatage [V] Fig 4. Forward Current vs. Relative Luminous Flux, Ta=25℃ 200 Relative luminous flux [%] 180 160 140 120 100 80 60 40 20 0 0 50 100 150 200 250 300 350 400 Forward Current [mA] Rev1.0, July 19, 2013 8 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Forward Current Characteristics Fig 5. Forward Current vs. CIE X, Y Shift , Ta=25℃ (Warm white) 0.02 CIE(X) CIE(Y) Relative variation 0.01 0.00 -0.01 -0.02 0 50 100 150 200 250 300 350 Forward Current [mA] Rev1.0, July 19, 2013 9 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Junction Temperature Characteristics Fig 6. Relative Light Output vs. Junction Temperature, IF=180mA 120 Relative luminous flux [%] 100 80 60 40 20 0 40 60 80 100 120 o Junction Temperature [ C] Fig 7. Junction Temp. vs. CIE X, Y Shift, IF=180mA (Warm white) 0.02 CIE(X) CIE(Y) Relative variation 0.01 0.00 -0.01 -0.02 25 50 75 100 125 150 o Junction Temperature [ C] Rev1.0, July 19, 2013 10 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Ambient Temperature Characteristics Fig 8. Maximum Forward Current vs. Ambient Temperature, Tj(max.) = 125℃, IF=0.32A 400 Maximum Current [mA] 350 300 250 200 Rth(j-a)=2.6K/W 150 Rth(j-a)=4.0K/W Rth(j-a)=5.4K/W 100 50 0 0 20 40 60 80 100 120 o Ambient Temperature [ C] Rev1.0, July 19, 2013 11 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Color Bin Structure Table 6. Bin Code description Luminous Flux (lm) @ IF = 180mA Part Number SDW01F1C SDW81F1C Rev1.0, July 19, 2013 Bin Code Min. Max. C 700 800 D 800 900 E 900 B2 Color Chromaticity Coordinate @ IF = 350mA Typical Forward Voltage (Vf) Bin Code Min. Max. D 32.0 36.0 1100 E 36.0 40.0 635 700 D 32.0 36.0 C 700 800 D 800 900 E 36.0 40.0 Refer to page.13 Refer to page.14 12 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Color Bin Structure CIE Chromaticity Diagram (Cool white), Ta=25℃, IF=180mA 0.38 ANSI 4700K 5000K 0.37 C1 5300K C0 CIE Y 0.36 C3 5600K 0.35 B1 C2 6000K 0.34 B0 B3 B2 B5 C5 C4 B4 0.33 0.32 0.31 0.32 0.33 0.34 0.35 0.36 CIE X B0 CIE x 0.3207 0.3212 0.3293 0.3292 B1 CIE y 0.3462 0.3389 0.3461 0.3539 CIE x 0.3292 0.3293 0.3373 0.3376 CIE y 0.3384 0.3306 0.3369 0.3451 CIE x 0.3222 0.3226 0.3295 0.3294 CIE y 0.3616 0.3534 0.3601 0.3687 CIE x 0.3463 0.3456 0.3539 0.3552 CIE y 0.3514 0.3428 0.3487 0.3578 CIE x 0.3366 0.3364 0.3433 0.3440 B5 CIE x 0.3293 0.3294 0.3366 0.3369 CIE y 0.3243 0.3178 0.3234 0.3306 CIE x 0.3294 0.3295 0.3364 0.3366 CIE y 0.3687 0.3601 0.3669 0.3760 CIE x 0.3373 0.3369 0.3448 0.3456 CIE y 0.3369 0.3288 0.3345 0.3428 CIE x 0.3440 0.3433 0.3500 0.3514 CIE x 0.3293 0.3293 0.3369 0.3373 CIE y 0.3306 0.3234 0.3288 0.3369 CIE x 0.3200 0.3207 0.3292 0.3290 CIE y 0.3534 0.3451 0.3514 0.3601 CIE x 0.3456 0.3448 0.3526 0.3539 CIE y 0.3428 0.3345 0.3400 0.3487 CIE x 0.3381 0.3376 0.3463 0.3470 CIE x 0.3217 0.3222 0.3294 0.3293 CIE y 0.3572 0.3462 0.3539 0.3656 CIE x 0.3290 0.3292 0.3376 0.3381 CIE y 0.3601 0.3514 0.3578 0.3669 CIE x 0.3369 0.3366 0.3440 0.3448 CIE y 0.3740 0.3616 0.3687 0.3810 CIE x 0.3470 0.3463 0.3552 0.3572 CIE y 0.3316 0.3243 0.3306 0.3384 B9 C3 C7 13 B4 CIE y 0.3461 0.3384 0.3451 0.3534 B8 C2 C6 Rev1.0, July 19, 2013 B3 CIE y 0.3389 0.3316 0.3384 0.3461 B7 C1 C5 CIE x 0.3448 0.3440 0.3514 0.3526 CIE x 0.3212 0.3217 0.3293 0.3293 B6 C0 CIE x 0.3376 0.3373 0.3456 0.3463 B2 CIE y 0.3539 0.3461 0.3534 0.3616 CIE y 0.3656 0.3539 0.3616 0.3740 C4 C8 CIE y 0.3451 0.3369 0.3428 0.3514 C9 CIE y 0.3810 0.3687 0.3760 0.3891 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Color Bin Structure CIE Chromaticity Diagram (Warm white), Ta=25℃, IF=180mA 0.46 3-step (G10, H10) 4-step (G11, H11) ANSI 0.44 2600K 2700K 2900K 3000K G22 CIE Y H22 H21 3200K 0.42 H11 G21 H10 G11 G10 0.40 H23 H24 G24 G23 0.38 0.36 0.42 0.44 0.46 0.48 CIE X 3-STEP G10 CIE x 0.4267 0.4328 0.4422 0.4355 4-STEP H10 CIE y 0.3946 0.4079 0.4113 0.3977 CIE x 0.4502 0.4576 0.4667 0.4588 G11 CIE y 0.4020 0.4158 0.4180 0.4041 CIE x 0.4242 0.4322 0.4449 0.4359 H11 CIE y 0.3919 0.4096 0.4141 0.396 CIE x 0.4475 0.4573 0.4695 0.4589 CIE y 0.3814 0.3990 0.4011 0.3922 0.3943 0.3853 CIE x 0.4259 0.4302 0.4361 0.4406 0.4468 0.4373 CIE y 0.3893 0.4077 0.4090 0.3998 0.4012 0.3919 CIE x 0.4483 0.4534 0.4591 0.4644 0.4703 0.4593 CIE y 0.3994 0.4178 0.4207 0.4021 ANSI G21 CIE x 0.4223 0.4299 0.4430 0.4387 0.4324 0.4284 G22 CIE y 0.3990 0.4165 0.4212 0.4122 0.4100 0.4011 CIE x 0.4406 0.4451 0.4387 0.4430 0.4562 0.4468 CIE y 0.4077 0.4260 0.4289 0.4197 0.4182 0.4090 CIE x 0.4644 0.4697 0.4636 0.4687 0.4810 0.4703 H21 CIE x 0.4468 0.4562 0.4687 0.4636 0.4575 0.4526 G23 CIE y 0.4055 0.4145 0.4122 0.4212 0.4260 0.4077 CIE x 0.4147 0.4223 0.4284 0.4243 0.4302 0.4259 CIE y 0.4118 0.4211 0.4197 0.4289 0.4319 0.4132 CIE x 0.4373 0.4468 0.4526 0.4477 0.4534 0.4483 H22 Rev1.0, July 19, 2013 G24 H23 14 CIE y 0.3853 0.3943 0.3964 0.4055 0.4077 0.3893 H24 CIE y 0.3919 0.4012 0.4025 0.4118 0.4132 0.3944 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Mechanical Dimensions Circuit Cathode X 12 X 12 Anode Notes : 1. 2. 3. All dimensions are in millimeters. Scale : none Undefined tolerance is ±0.2mm Rev1.0, July 19, 2013 15 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Tray Packing Structure Notes : 1. 2. 3. Quantity : 30pcs/Tray All dimensions are in millimeters (tolerance : ±0.3) Scale none Rev1.0, July 19, 2013 16 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Packaging (Bag and box) 1. Moisture-proof bag *1,2 X9 X10 X11X12X13 30 X1 X2 X3 X4 X5 X6 X7X8 - Desiccant - Humidity Indicator 2. Outer Box Structure 1 SIDE X9 X10 X11X12X13 1 X1 X2 X3 X4 X5 X6 X7X8 Notes : 1. Heat Sealed after packing (Use Zipper Bag) 2. Quantity : 1Tray(30pcs) /Bag : Max 2 Bag /Box(ⓒ80), Max 4 Bag /Box(ⓒ142) Rev1.0, July 19, 2013 17 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of wire. (4) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (5) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (6) Avoid leaving fingerprints on silicone resin parts. Rev1.0, July 19, 2013 18 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Precaution for Use (1) Storage To avoid the moisture penetration, we recommend storing Power LEDs in a dry box with a desiccant. The recommended storage temperature range is 5C to 30C and a maximum humidity of 50%. (2) Use Precaution after Opening the Packaging. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 week or the color of the desiccant changes. (3) For manual soldering SSC recommends the soldering condition (ZC series product is not adaptable to reflow process) a. Use lead-free soldering b. Soldering should be implemented using a soldering equipment at temperature lower than 350°C. c. Before proceeding the next step, product temperature must be stabilized at room temperature. (4) Components should not be mounted on warped (non coplanar) portion of PCB. (5) Radioactive exposure is not considered for the products listed here in. (6) It is dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (7) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (8) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (9) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with vacuum atmosphere should be used for storage. (10) The appearance and specifications of the product may be modified for improvement without notice. (11) Long time exposure of sun light or occasional UV exposure will cause silicone discoloration. (12) Attaching LEDs, do not use adhesive that outgas organic vapor. (13) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (14) Please do not touch any of the circuit board, components or terminals with bare hands or metal while circuit is electrically active. (15) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. Rev1.0, July 19, 2013 19 www.seoulsemicon.com Product Data Sheet ZC6 – Z-Power COB Revision History Revision Date Page 1.0 2013-07-12 All Remarks Initial release of preliminary data sheet applied Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, deep UV LEDs, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich, high-brightness LEDs, mid-power LEDs, side-view LEDs, through-hole type LED lamps, custom displays, and sensors. The company is vertically integrated from epitaxial growth and chip manufacture in it’s fully owned subsidiary, Seoul Optodevice, through packaged LEDs and LED modules in three Seoul Semiconductor manufacturing facilities. Seoul Optodevice also manufactures a wide range of unique deep-UV wavelength devices. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. Rev1.0, July 19, 2013 20 www.seoulsemicon.com