Product Data Sheet STW8B12B-NZ – Mid-Power LED Achieving the best system cost in Mid/High Power Mid-Power LED – 3020 Series STW8B12B-NZ (Cool, Neutral, Warm) RoHS Product Brief Description Features and Benefits • This White Colored surface-mount LED comes in standard package dimension. Package Size : 3.0x2.0x0.6mm • It has a substrate made up of a molded plastic reflector sitting on top of a lead frame. • • • • • • • The die is attached within the reflector cavity and the cavity is encapsulated by silicone. • Thermally Enhanced Package Design Mid Power to High Power up to 0.23W Max. Driving Current 80mA Compact Package Size High Color Quality with CRI Min.80(R9>0) RoHS compliant Key Applications • • • • • The package design coupled with careful selection of component materials allow these products to perform with high reliability. Replacement lamps Architectural Entertainment Commercial Industrial Table 1. Product Selection Table CCT Part Number Color Min. Typ. Max. STW8B12B-NZ Cool White 4700K 5600K 7000K STW8B12B-NZ Neutral White 3700K 4200K 4700K STW8B12B-NZ Warm White 2600K 3000K 3700K 1 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Table of Contents Index • Product Brief 1 • Product Performance & Characterization Guide 3 • Characteristics Graph 4 • Color Bin Structure 9 • Mechanical Dimensions 14 • Recommended Solder Pad 15 • Reflow Soldering Characteristics 16 • Emitter Tape & Reel Packaging 17 • Handling of Silicone Resin for LEDs 20 • Precaution For Use 21 • Company Information 24 2 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Product Performance & Characterization Guide Table 2. Characteristics, IF=60mA , Tj =25ºC, RH30% Value Parameter Symbol Unit Min. Typ. Max. Forward Current IF - 60 80 mA Forward Voltage[1] VF 2.9 - 3.3 V Luminous (3,700~7,000 K) Iv - 7.5 (22.5) - cd (lm) Luminous Intensity[1] (2,600~3,700 K) Iv - 6.8 (20.4) - cd (lm) CRI [1] Ra 80 - 90 Viewing Angle[2] 2Θ1/2 - 120 - Deg. Thermal resistance (J to S) [3] RθJ-S - 40 - ℃/W ESD Sensitivity(HBM) - Class 2 JESD22-A114-E Parameter Symbol Value Unit Forward Current IF 80 mA Power Dissipation PD 0.264 W Junction Temperature Tj 125 ºC Operating Temperature Topr -40 ~ + 100 ºC Storage Temperature Tstg -40 ~ + 100 ºC Intensity[1] Table 3. Absolute Maximum Ratings Notes : (1) Tolerance : VF :±0.2V, IV :±7%, Ra :±2, x,y :±0.007 (2) 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity (3) Thermal resistance : RthJS (Junction / solder) • • LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. All measurements were made under the standardized environment of Seoul Semiconductor. 3 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Characteristics Graph Fig 1. Color Spectrum, Tj = 25℃, RH30% IF=60mA 1.2 Neutral white Warm white Cool white Relative Radiant Power [%] 1.0 0.8 0.6 0.4 0.2 0.0 300 400 500 600 700 800 Wavelength(nm) Fig 2. Viewing Angle Distribution IF=60mA 0 1.01.0 30 0.80.8 0.60.6 60 0.40.4 0.20.2 0.00.0 -90 90 -60 0 -30 0.2 0.4 0.6 0.8 1.0 4 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Forward Current Characteristics Fig 3. Forward Voltage vs. Forward Current , T j=25℃ 0.08 Forward Current (A) 0.06 0.04 0.02 0.00 2.6 2.8 3.0 3.2 3.4 Forward Voltage(V) Fig 4. Forward Current vs. Relative Luminous Flux, T j=25℃ Relative Light Output 1.0 0.5 0.0 0 20 40 60 80 Forward Current(mA) 5 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Junction Temperature Characteristics Fig 5. Relative Light Output vs. Junction Temperature IF=60mA Relative Luminous Intensity 1.0 0.8 0.6 0.4 0.2 0.0 25 50 75 100 125 O Junction temperature Tj( C) Fig 6. Junction Temperature vs. Relative Forward Voltage IF=60mA Relative Forward Voltage 1.0 0.8 0.6 0.4 0.2 0.0 25 50 75 100 125 O Junction temperature Tj( C) 6 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Junction Temperature Characteristics Fig 7. Chromaticity Coordinate vs. Junction Temperature IF=60mA (4200K~7000K) 0.356 0.352 25 ℃ y 0.348 60 ℃ 0.344 80 ℃ 100 ℃ 0.340 0.336 0.328 0.330 0.332 0.334 0.336 0.338 0.340 0.342 x IF=60mA (2600K~4200K) 0.404 0.400 25 ℃ y 0.396 80 100 ℃ ℃ 60 ℃ 0.392 0.388 0.384 0.434 0.436 0.438 0.440 0.442 0.444 0.446 x 7 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Ambient Temperature Characteristics Fig 8. Maximum Forward Current vs. Ambient Temperature 0.10 Forward Current (A) 0.08 Rth(J-a) = 200 'C/W 0.06 0.04 0.02 0.00 -40 -20 0 20 40 60 80 100 120 O Ambient Temperature ( C) 8 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Color Bin Structure Table 4. Bin Code description Luminous Intensity Iv (mcd) Part Number STW8B12BNZ Luminous Flux Φv (lm) [1] Bin Code Min. Max. Min. Max. P5 6500 7000 19.5 21.0 Q0 7000 7500 21.0 22.5 Q5 7500 8000 22.5 24.0 Color Chromaticity Coordinate @ IF = 60mA Refer to page.10 Typical Forward Voltage (VF) @ IF = 60mA Bin Code Min. Max. Y3 2.9 3.0 Z1 3.0 3.1 Z2 3.1 3.2 Z3 3.2 3.3 Available Ranks Table 5. Intensity rank distribution CCT CIE IV Rank 6000~7000 K A P5 Q0 Q5 5300~6000 K B P5 Q0 Q5 4700~5300 K C P5 Q0 Q5 4200~4700 K D P5 Q0 Q5 3700~4200 K E P5 Q0 Q5 3200~3700 K F P5 Q0 Q5 2900~3200 K G P5 Q0 Q5 2600~2900 K H P5 Q0 Q5 Notes : (1) Calculated performance values are for reference only. (2) All measurements were made under the standardized environment of Seoul Semiconductor. (3) Seoul Semiconductor sorts the LED package according to the luminous intensity IV. 9 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Color Bin Structure Fig 9. CIE Chromaticity Diagram Tj=25℃, IF=60mA G H F E D C B A (1) Energy Star binning applied to all 2600~7000K. (2) Measurement Uncertainty of the Color Coordinates : ± 0.007 10 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Color Bin Structure <IF=60mA, Tj=25℃> 4700k 5000k CC22 5300k CC21 5600k CC10 CB22 6000k CC24 CB21 6500k CB10 CA22 CC23 CB24 CC11 7000k CA21 CA10 CA23 CA10 CA24 CB23 CB11 CA11 CA11 CA21 CA22 CA23 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3087 0.3292 0.3080 0.3299 0.3028 0.3304 0.3115 0.3393 0.3048 0.3209 0.3162 0.3365 0.3166 0.3384 0.3115 0.3393 0.3205 0.3481 0.3131 0.3290 0.3171 0.3285 0.3178 0.3277 0.3131 0.3290 0.3213 0.3371 0.3146 0.3187 0.3101 0.3216 0.3098 0.3200 0.3048 0.3209 0.3131 0.3290 0.3068 0.3113 CA24 CB10 CB11 CB21 CB22 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3131 0.3290 0.3257 0.3435 0.3252 0.3444 0.3207 0.3462 0.3292 0.3539 0.3213 0.3371 0.3328 0.3498 0.3333 0.3518 0.3292 0.3539 0.3376 0.3616 0.3221 0.3261 0.3326 0.3406 0.3331 0.3398 0.3293 0.3423 0.3371 0.3493 0.3146 0.3187 0.3260 0.3347 0.3256 0.3331 0.3215 0.3353 0.3293 0.3423 CB23 CB24 CC10 CC11 CC21 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3215 0.3353 0.3293 0.3423 0.3420 0.3579 0.3415 0.3588 0.3376 0.3616 0.3293 0.3423 0.3371 0.3493 0.3492 0.3637 0.3499 0.3657 0.3463 0.3687 0.3294 0.3306 0.3366 0.3369 0.3481 0.3536 0.3484 0.3524 0.3452 0.3557 0.3222 0.3243 0.3294 0.3306 0.3414 0.3483 0.3407 0.3461 0.3371 CC22 CC23 CC24 B24 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3463 0.3687 0.3371 0.3492 0.3451 0.3557 0.3551 0.3760 0.3451 0.3557 0.3532 0.3623 0.3532 0.3623 0.3440 0.3427 0.3514 0.3487 0.3451 0.3557 0.3366 0.3369 0.3440 0.3428 11 0.3493 B24 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Color Bin Structure <IF=60mA, Tj=25℃> 3700k 4000k CE22 4200k 4500k CE21 CE10 CD22 4700k CE24 CD21 CE23 CD10 CD24 CE11 CD23 CD11 CD10 CD11 CD21 CD22 CD23 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3589 0.3685 0.3560 0.3557 0.3528 0.3599 0.3641 0.3805 0.3530 0.3601 0.3665 0.3742 0.3580 0.3697 0.3548 0.3736 0.3736 0.3874 0.3616 0.3663 0.3637 0.3622 0.3681 0.3771 0.3641 0.3805 0.3703 0.3726 0.3590 0.3521 0.3573 0.3579 0.3645 0.3618 0.3616 0.3663 0.3616 0.3663 0.3511 0.3465 CD24 CE10 CE11 CE21 CE22 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3616 0.3663 0.3764 0.3713 0.3746 0.3689 0.3703 0.3726 0.3828 0.3803 0.3703 0.3726 0.3793 0.3828 0.3784 0.3841 0.3736 0.3874 0.3871 0.3959 0.3670 0.3578 0.3890 0.3887 0.3914 0.3922 0.3871 0.3959 0.4006 0.4044 0.3590 0.3521 0.3854 0.3768 0.3865 0.3762 0.3828 0.3803 0.3952 0.3880 CE23 CE24 CIE X CIE Y CIE X CIE Y 0.3670 0.3578 0.3784 0.3647 0.3703 0.3726 0.3828 0.3803 0.3828 0.3803 0.3952 0.3880 0.3784 0.3647 0.3898 0.3716 12 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Color Bin Structure <IF=60mA, Tj=25℃> 2600k 2700k 2900k CH22 3000k 3200k CH21 CG22 CG21 3500k CH10 CF22 3700k CG10 CF21 CH24 CH23 CF10 CG24 CG23 CH11 CF24 CG11 CF23 CF11 CF10 CF11 CF21 CF22 CF23 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4006 0.3829 0.3981 0.3800 0.3996 0.4015 0.4146 0.4089 0.3943 0.3853 0.4051 0.3954 0.4040 0.3966 0.4146 0.4089 0.4299 0.4165 0.4082 0.3920 0.4159 0.4007 0.4186 0.4037 0.4082 0.3920 0.4223 0.3990 0.4017 0.3751 0.4108 0.3878 0.4116 0.3865 0.3943 0.3853 0.4082 0.3920 0.3889 0.3690 CF24 CG10 CG11 CG21 CG22 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4082 0.3920 0.4267 0.3946 0.4243 0.3922 0.4299 0.4165 0.4430 0.4212 0.4223 0.3990 0.4328 0.4079 0.4324 0.4100 0.4430 0.4212 0.4562 0.4260 0.4147 0.3814 0.4422 0.4113 0.4451 0.4145 0.4345 0.4033 0.4468 0.4077 0.4017 0.3751 0.4355 0.3977 0.4361 0.3964 0.4223 0.3990 0.4345 0.4033 CG23 CG24 CH10 CH11 CH21 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4223 0.3990 0.4345 0.4033 0.4502 0.4020 0.4477 0.3998 0.4562 0.4260 0.4345 0.4033 0.4468 0.4077 0.4576 0.4158 0.4575 0.4182 0.4687 0.4289 0.4259 0.3853 0.4373 0.3893 0.4667 0.4180 0.4697 0.4211 0.4585 0.4104 0.4147 0.3814 0.4259 0.3853 0.4588 0.4041 0.4591 0.4025 0.4468 CH22 CH23 CH24 B24 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4687 0.4289 0.4468 0.4077 0.4585 0.4104 0.4813 0.4319 0.4585 0.4104 0.4703 0.4132 0.4703 0.4132 0.4483 0.3919 0.4593 0.3944 0.4585 0.4104 0.4373 0.3893 0.4483 0.3919 13 0.4077 B24 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Mechanical Dimensions Package Marking Side View Top View Bottom View Circuit Notes : (1) All dimensions are in millimeters. (2) Scale : none (3) Undefined tolerance is ±0.2mm 14 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Recommended Solder Pad [Recommended Solder Pattern] Notes : (1) All dimensions are in millimeters. (2) Scale : none (3) This drawing without tolerances are for reference only (4) Undefined tolerance is ±0.1mm 15 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Reflow Soldering Characteristics IPC/JEDEC J-STD-020 Table 8. Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Caution (1) Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. (2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. (3) Die slug is to be soldered. (4) When soldering, do not put stress on the LEDs during heating. (5) After soldering, do not warp the circuit board. 16 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Emitter Tape & Reel Packaging ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : Max 4,000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10˚ to the carrier tape. (4) Package : P/N, Manufacturing data Code No. and Quantity to be indicated on a damp proof Package. 17 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Emitter Tape & Reel Packaging Reel Aluminum Bag Outer Box 18 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Product Nomenclature Table 6. Part Numbering System : X1X2X3X4X5X6X7X8-X9X10 Part Number Code Description Part Number Value X1 Company S X2 Top View LED series T X3X4 Color Specification W8 CRI 80 X5 Package series B B series X6X7 Characteristic code 12 X8 Revision B X9X10 Internal Code Table 7. Lot Numbering System :Y1Y2Y3Y4Y5Y6Y7Y8Y9Y10–Y11Y12Y13Y14Y15Y16Y17 Lot Number Code Description Lot Number Y1Y2 Year Y3 Month Y4Y5 Day Y6 Top View LED series Y7Y8Y9Y10 Mass order Y11Y12Y13Y14Y15Y16Y17 Internal Number 19 Value www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this. product with acid or sulfur material in sealed space. 20 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Precaution for Use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant. The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant changes, components should be dried for 10-12hr at 60±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. 21 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Precaution for Use (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14) Attaching LEDs, do not use adhesives that outgas organic vapor. (15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (16) Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment) 22 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires. - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device 23 www.seoulsemicon.com Product Data Sheet STW8B12B-NZ – Mid-Power LED Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. 24 www.seoulsemicon.com