Color Bin Structure - Seoul Semiconductor

Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Achieving the best system cost in Mid/High Power
Mid-Power LED – 3020 Series
STW8B12B-NZ (Cool, Neutral, Warm)
RoHS
Product Brief
Description
Features and Benefits
•
This White Colored surface-mount LED
comes in standard package dimension.
Package Size : 3.0x2.0x0.6mm
•
It has a substrate made up of a molded
plastic reflector sitting on top of a lead
frame.
•
•
•
•
•
•
•
The die is attached within the reflector
cavity and the cavity is encapsulated by
silicone.
•
Thermally Enhanced Package Design
Mid Power to High Power up to 0.23W
Max. Driving Current 80mA
Compact Package Size
High Color Quality with CRI Min.80(R9>0)
RoHS compliant
Key Applications
•
•
•
•
•
The package design coupled with
careful selection of component
materials allow these products to
perform with high reliability.
Replacement lamps
Architectural
Entertainment
Commercial
Industrial
Table 1. Product Selection Table
CCT
Part Number
Color
Min.
Typ.
Max.
STW8B12B-NZ
Cool White
4700K
5600K
7000K
STW8B12B-NZ
Neutral White
3700K
4200K
4700K
STW8B12B-NZ
Warm White
2600K
3000K
3700K
1
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Table of Contents
Index
•
Product Brief
1
•
Product Performance & Characterization Guide
3
•
Characteristics Graph
4
•
Color Bin Structure
9
•
Mechanical Dimensions
14
•
Recommended Solder Pad
15
•
Reflow Soldering Characteristics
16
•
Emitter Tape & Reel Packaging
17
•
Handling of Silicone Resin for LEDs
20
•
Precaution For Use
21
•
Company Information
24
2
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Product Performance & Characterization Guide
Table 2. Characteristics, IF=60mA , Tj =25ºC, RH30%
Value
Parameter
Symbol
Unit
Min.
Typ.
Max.
Forward Current
IF
-
60
80
mA
Forward Voltage[1]
VF
2.9
-
3.3
V
Luminous
(3,700~7,000 K)
Iv
-
7.5
(22.5)
-
cd
(lm)
Luminous Intensity[1]
(2,600~3,700 K)
Iv
-
6.8
(20.4)
-
cd
(lm)
CRI [1]
Ra
80
-
90
Viewing Angle[2]
2Θ1/2
-
120
-
Deg.
Thermal resistance (J to S) [3]
RθJ-S
-
40
-
℃/W
ESD Sensitivity(HBM)
-
Class 2 JESD22-A114-E
Parameter
Symbol
Value
Unit
Forward Current
IF
80
mA
Power Dissipation
PD
0.264
W
Junction Temperature
Tj
125
ºC
Operating Temperature
Topr
-40 ~ + 100
ºC
Storage Temperature
Tstg
-40 ~ + 100
ºC
Intensity[1]
Table 3. Absolute Maximum Ratings
Notes :
(1) Tolerance : VF :±0.2V, IV :±7%, Ra :±2, x,y :±0.007
(2) 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity
(3) Thermal resistance : RthJS (Junction / solder)
•
•
LED’s properties might be different from suggested values like above and below tables if
operation condition will be exceeded our parameter range. Care is to be taken that power
dissipation does not exceed the absolute maximum rating of the product.
All measurements were made under the standardized environment of Seoul Semiconductor.
3
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Characteristics Graph
Fig 1. Color Spectrum, Tj = 25℃, RH30%
IF=60mA
1.2
Neutral white
Warm white
Cool white
Relative Radiant Power [%]
1.0
0.8
0.6
0.4
0.2
0.0
300
400
500
600
700
800
Wavelength(nm)
Fig 2. Viewing Angle Distribution
IF=60mA
0
1.01.0
30
0.80.8
0.60.6
60
0.40.4
0.20.2
0.00.0
-90
90
-60
0
-30
0.2
0.4
0.6
0.8
1.0
4
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Forward Current Characteristics
Fig 3. Forward Voltage vs. Forward Current , T j=25℃
0.08
Forward Current (A)
0.06
0.04
0.02
0.00
2.6
2.8
3.0
3.2
3.4
Forward Voltage(V)
Fig 4. Forward Current vs. Relative Luminous Flux, T j=25℃
Relative Light Output
1.0
0.5
0.0
0
20
40
60
80
Forward Current(mA)
5
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Junction Temperature Characteristics
Fig 5. Relative Light Output vs. Junction Temperature
IF=60mA
Relative Luminous Intensity
1.0
0.8
0.6
0.4
0.2
0.0
25
50
75
100
125
O
Junction temperature Tj( C)
Fig 6. Junction Temperature vs. Relative Forward Voltage
IF=60mA
Relative Forward Voltage
1.0
0.8
0.6
0.4
0.2
0.0
25
50
75
100
125
O
Junction temperature Tj( C)
6
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Junction Temperature Characteristics
Fig 7. Chromaticity Coordinate vs. Junction Temperature
IF=60mA
(4200K~7000K)
0.356
0.352
25 ℃
y
0.348
60 ℃
0.344
80 ℃
100 ℃
0.340
0.336
0.328
0.330
0.332
0.334
0.336
0.338
0.340
0.342
x
IF=60mA
(2600K~4200K)
0.404
0.400
25 ℃
y
0.396
80
100 ℃ ℃
60 ℃
0.392
0.388
0.384
0.434
0.436
0.438
0.440
0.442
0.444
0.446
x
7
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Ambient Temperature Characteristics
Fig 8. Maximum Forward Current vs. Ambient Temperature
0.10
Forward Current (A)
0.08
Rth(J-a) = 200 'C/W
0.06
0.04
0.02
0.00
-40
-20
0
20
40
60
80
100
120
O
Ambient Temperature ( C)
8
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Color Bin Structure
Table 4. Bin Code description
Luminous Intensity
Iv (mcd)
Part Number
STW8B12BNZ
Luminous Flux
Φv (lm) [1]
Bin
Code
Min.
Max.
Min.
Max.
P5
6500
7000
19.5
21.0
Q0
7000
7500
21.0
22.5
Q5
7500
8000
22.5
24.0
Color
Chromaticity
Coordinate
@ IF = 60mA
Refer to
page.10
Typical Forward
Voltage (VF) @ IF =
60mA
Bin
Code
Min.
Max.
Y3
2.9
3.0
Z1
3.0
3.1
Z2
3.1
3.2
Z3
3.2
3.3
Available Ranks
Table 5. Intensity rank distribution
CCT
CIE
IV Rank
6000~7000 K
A
P5
Q0
Q5
5300~6000 K
B
P5
Q0
Q5
4700~5300 K
C
P5
Q0
Q5
4200~4700 K
D
P5
Q0
Q5
3700~4200 K
E
P5
Q0
Q5
3200~3700 K
F
P5
Q0
Q5
2900~3200 K
G
P5
Q0
Q5
2600~2900 K
H
P5
Q0
Q5
Notes :
(1) Calculated performance values are for reference only.
(2) All measurements were made under the standardized environment of Seoul Semiconductor.
(3) Seoul Semiconductor sorts the LED package according to the luminous intensity IV.
9
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Color Bin Structure
Fig 9. CIE Chromaticity Diagram Tj=25℃, IF=60mA
G
H
F
E
D
C
B
A
(1) Energy Star binning applied to all 2600~7000K.
(2) Measurement Uncertainty of the Color Coordinates : ± 0.007
10
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Color Bin Structure
<IF=60mA, Tj=25℃>
4700k
5000k
CC22
5300k
CC21
5600k
CC10
CB22
6000k
CC24
CB21
6500k
CB10
CA22
CC23
CB24
CC11
7000k
CA21
CA10
CA23
CA10
CA24
CB23
CB11
CA11
CA11
CA21
CA22
CA23
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3087
0.3292
0.3080
0.3299
0.3028
0.3304
0.3115
0.3393
0.3048
0.3209
0.3162
0.3365
0.3166
0.3384
0.3115
0.3393
0.3205
0.3481
0.3131
0.3290
0.3171
0.3285
0.3178
0.3277
0.3131
0.3290
0.3213
0.3371
0.3146
0.3187
0.3101
0.3216
0.3098
0.3200
0.3048
0.3209
0.3131
0.3290
0.3068
0.3113
CA24
CB10
CB11
CB21
CB22
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3131
0.3290
0.3257
0.3435
0.3252
0.3444
0.3207
0.3462
0.3292
0.3539
0.3213
0.3371
0.3328
0.3498
0.3333
0.3518
0.3292
0.3539
0.3376
0.3616
0.3221
0.3261
0.3326
0.3406
0.3331
0.3398
0.3293
0.3423
0.3371
0.3493
0.3146
0.3187
0.3260
0.3347
0.3256
0.3331
0.3215
0.3353
0.3293
0.3423
CB23
CB24
CC10
CC11
CC21
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3215
0.3353
0.3293
0.3423
0.3420
0.3579
0.3415
0.3588
0.3376
0.3616
0.3293
0.3423
0.3371
0.3493
0.3492
0.3637
0.3499
0.3657
0.3463
0.3687
0.3294
0.3306
0.3366
0.3369
0.3481
0.3536
0.3484
0.3524
0.3452
0.3557
0.3222
0.3243
0.3294
0.3306
0.3414
0.3483
0.3407
0.3461
0.3371
CC22
CC23
CC24
B24
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3463
0.3687
0.3371
0.3492
0.3451
0.3557
0.3551
0.3760
0.3451
0.3557
0.3532
0.3623
0.3532
0.3623
0.3440
0.3427
0.3514
0.3487
0.3451
0.3557
0.3366
0.3369
0.3440
0.3428
11
0.3493
B24
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Color Bin Structure
<IF=60mA, Tj=25℃>
3700k
4000k
CE22
4200k
4500k
CE21
CE10
CD22
4700k
CE24
CD21
CE23
CD10
CD24
CE11
CD23
CD11
CD10
CD11
CD21
CD22
CD23
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3589
0.3685
0.3560
0.3557
0.3528
0.3599
0.3641
0.3805
0.3530
0.3601
0.3665
0.3742
0.3580
0.3697
0.3548
0.3736
0.3736
0.3874
0.3616
0.3663
0.3637
0.3622
0.3681
0.3771
0.3641
0.3805
0.3703
0.3726
0.3590
0.3521
0.3573
0.3579
0.3645
0.3618
0.3616
0.3663
0.3616
0.3663
0.3511
0.3465
CD24
CE10
CE11
CE21
CE22
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3616
0.3663
0.3764
0.3713
0.3746
0.3689
0.3703
0.3726
0.3828
0.3803
0.3703
0.3726
0.3793
0.3828
0.3784
0.3841
0.3736
0.3874
0.3871
0.3959
0.3670
0.3578
0.3890
0.3887
0.3914
0.3922
0.3871
0.3959
0.4006
0.4044
0.3590
0.3521
0.3854
0.3768
0.3865
0.3762
0.3828
0.3803
0.3952
0.3880
CE23
CE24
CIE X
CIE Y
CIE X
CIE Y
0.3670
0.3578
0.3784
0.3647
0.3703
0.3726
0.3828
0.3803
0.3828
0.3803
0.3952
0.3880
0.3784
0.3647
0.3898
0.3716
12
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Color Bin Structure
<IF=60mA, Tj=25℃>
2600k
2700k
2900k
CH22
3000k
3200k
CH21
CG22
CG21
3500k
CH10
CF22
3700k
CG10
CF21
CH24
CH23
CF10
CG24
CG23
CH11
CF24
CG11
CF23
CF11
CF10
CF11
CF21
CF22
CF23
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4006
0.3829
0.3981
0.3800
0.3996
0.4015
0.4146
0.4089
0.3943
0.3853
0.4051
0.3954
0.4040
0.3966
0.4146
0.4089
0.4299
0.4165
0.4082
0.3920
0.4159
0.4007
0.4186
0.4037
0.4082
0.3920
0.4223
0.3990
0.4017
0.3751
0.4108
0.3878
0.4116
0.3865
0.3943
0.3853
0.4082
0.3920
0.3889
0.3690
CF24
CG10
CG11
CG21
CG22
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4082
0.3920
0.4267
0.3946
0.4243
0.3922
0.4299
0.4165
0.4430
0.4212
0.4223
0.3990
0.4328
0.4079
0.4324
0.4100
0.4430
0.4212
0.4562
0.4260
0.4147
0.3814
0.4422
0.4113
0.4451
0.4145
0.4345
0.4033
0.4468
0.4077
0.4017
0.3751
0.4355
0.3977
0.4361
0.3964
0.4223
0.3990
0.4345
0.4033
CG23
CG24
CH10
CH11
CH21
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4223
0.3990
0.4345
0.4033
0.4502
0.4020
0.4477
0.3998
0.4562
0.4260
0.4345
0.4033
0.4468
0.4077
0.4576
0.4158
0.4575
0.4182
0.4687
0.4289
0.4259
0.3853
0.4373
0.3893
0.4667
0.4180
0.4697
0.4211
0.4585
0.4104
0.4147
0.3814
0.4259
0.3853
0.4588
0.4041
0.4591
0.4025
0.4468
CH22
CH23
CH24
B24
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4687
0.4289
0.4468
0.4077
0.4585
0.4104
0.4813
0.4319
0.4585
0.4104
0.4703
0.4132
0.4703
0.4132
0.4483
0.3919
0.4593
0.3944
0.4585
0.4104
0.4373
0.3893
0.4483
0.3919
13
0.4077
B24
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Mechanical Dimensions
Package
Marking
Side View
Top View
Bottom View
Circuit
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) Undefined tolerance is ±0.2mm
14
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Recommended Solder Pad
[Recommended Solder Pattern]
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) This drawing without tolerances are for reference only
(4) Undefined tolerance is ±0.1mm
15
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Reflow Soldering Characteristics
IPC/JEDEC J-STD-020
Table 8.
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Caution
(1) Reflow soldering is recommended not to be done more than two times. In the case of more than
24 hours passed soldering after first, LEDs will be damaged.
(2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable,
suitable tools must be used.
(3) Die slug is to be soldered.
(4) When soldering, do not put stress on the LEDs during heating.
(5) After soldering, do not warp the circuit board.
16
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Emitter Tape & Reel Packaging
( Tolerance: ±0.2, Unit: mm )
(1) Quantity : Max 4,000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape
Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of
10˚ to the carrier tape.
(4) Package : P/N, Manufacturing data Code No. and Quantity to be indicated on a damp proof Package.
17
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Emitter Tape & Reel Packaging
Reel
Aluminum Bag
Outer Box
18
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Product Nomenclature
Table 6. Part Numbering System : X1X2X3X4X5X6X7X8-X9X10
Part Number Code
Description
Part Number
Value
X1
Company
S
X2
Top View LED series
T
X3X4
Color Specification
W8
CRI 80
X5
Package series
B
B series
X6X7
Characteristic code
12
X8
Revision
B
X9X10
Internal Code
Table 7. Lot Numbering System :Y1Y2Y3Y4Y5Y6Y7Y8Y9Y10–Y11Y12Y13Y14Y15Y16Y17
Lot Number Code
Description
Lot Number
Y1Y2
Year
Y3
Month
Y4Y5
Day
Y6
Top View LED series
Y7Y8Y9Y10
Mass order
Y11Y12Y13Y14Y15Y16Y17
Internal Number
19
Value
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form
of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be
prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These
conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust.
As mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be
assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this.
product with acid or sulfur material in sealed space.
20
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Precaution for Use
(1) Storage
To avoid the moisture penetration, we recommend store in a dry box with a desiccant.
The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of
RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant
changes, components should be dried for 10-12hr at 60±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication.
These products are dangerous if they are burned or shredded in the process of disposal.
It is also dangerous to drink the liquid or inhale the gas generated by such products when
chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring
the package temperature.
(10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should
be used for storage.
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Precaution for Use
(11) The appearance and specifications of the product may be modified for improvement without
notice.
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
(13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures
can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic
energy. The result can be a significant loss of light output from the fixture. Knowledge of the
properties of the materials selected to be used in the construction of fixtures can help prevent
these issues.
(14) Attaching LEDs, do not use adhesives that outgas organic vapor.
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF.
If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.
(16) Similar to most Solid state devices;
LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS).
Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects.
a. ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact. While most ESD events are considered harmless, it can be an expensive problem in
many industrial environments during production and storage. The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as:
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event.
One or more recommended work area suggestions:
- Ionizing fan setup
- ESD table/shelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options:
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls:
- Humidity control (ESD gets worse in a dry environment)
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Precaution for Use
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation.)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary, but there are some
common signs that will indicate an EOS event has occurred:
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires.
- This damage usually appears due to the thermal stress produced during the EOS event.
c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
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Product Data Sheet
STW8B12B-NZ – Mid-Power LED
Company Information
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide
selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting,
Home appliance, signage and back lighting markets. The company is the world’s fifth
largest LED supplier, holding more than 10,000 patents globally, while offering a wide range
of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s
first commercially produced AC LED, and "Acrich MJT - Multi-Junction Technology" a
proprietary family of high-voltage LEDs.
The company’s broad product portfolio includes a wide array of package and device choices
such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and
through-hole type LEDs as well as custom modules, displays, and sensors.
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products.
With respect to any examples or hints given herein, any typical values stated herein and/or
any information regarding the application of the device, Seoul Semiconductor hereby
disclaims any and all warranties and liabilities of any kind, including without limitation,
warranties of non-infringement of intellectual property rights of any third party. The
appearance and specifications of the product can be changed to improve the quality and/or
performance without notice.
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