SPEG Hollow Slider Momentary Type Hollow type supporting designs such as LED illumination Detector ■ Typical Specifications Items Specifications 1mA 5V DC / 50BA 3V DC Contact resistance（Initial/After operating life） 200mΩ max. / 500mΩ max. Operating forces 2.16N Without load 30,000 cycles With load 30,000 cycles（1mA 5V DC） Poles 1.1 1 Minimum order unit（pcs.） Ground terminal Without Export 1,200 4,800 Product No. SPEG110100 SPEG120100 Power With Japan Rotary Product Line Push Operating life Total travel （mm） Slide Rating（max.）（ / min.） （Resistive load） Packing Specifications Unit:mm Number of packages（pcs.） 1 reel 1 case /Japan 1 case /export packing Tape width （mm） 1,200 2,400 4,800 24 Export package measurements （mm） 428×413×172 Reel size Unit:mm Style PC board mounting hole dimensions In case of using ground terminal $ ③ Frame for mounting Vertical Type ① Horizontal Type Dimensions Dual-in-line Package Type Taping $ ② ④ Total Travel Position High of product In case of not using ground terminal Circuit Diagram Note ① ③ ② ④ Above dimensions indicate“with ground terminal”version. Refer to P.138 for soldering conditions. 125 Push Switches List of Varieties Vertical Detector Series SPEH SPEG SPEJ SPPH2 SPPH4 SPPH1 W 6 7.19 7 6 6.5 10 D 6 8.39 7 6.5 8.5 10 H 5 3.5 5.95 6.5 Travel（mm） — — 1.7 1 2.2 1.5 Total travel（mm） 1.6 1.1 1.7 1.5 3 2.5 Number of poles 1 1 2 2 Operating temperature range −40℃ to ＋90℃ −10℃ to ＋60℃ −40℃ to ＋85℃ −10℃ to ＋60℃ Automotive use ● — ● — Rating（max.） （Resistive load） 50mA 16V DC 1mA 5V DC 0.2A 14V DC 0.1A 12V DC Rating（min.） （Resistive load） 10μA 1V DC 50μA 3V DC — Operating life without load 100,000 cycles 400mΩ max. 30,000 cycles 500mΩ max. 10,000 cycles 150mΩ max. 10,000 cycles 50mΩ max. 10,000 cycles 100mΩ max. 10,000 cycles 40mΩ max. Operating life with load （at max. rated load） 100,000 cycles 400mΩ max. 30,000 cycles 500mΩ max. 10,000 cycles 150mΩ max. 10,000 cycles 50mΩ max. 10,000 cycles 100mΩ max. 10,000 cycles 40mΩ max. Initial contact resistance 200mΩ max. 200mΩ max. 150mΩ max. 30mΩ max. 100mΩ max. 20mΩ max. Insulation resistance 100MΩ min. 100V DC 3MΩ min. 100V DC 100MΩ min. 500V DC 100MΩ min. 500V DC Voltage proof 250V AC for 1minute 100V AC for 1minute 500V AC for 1minute 500V AC for 1minute Terminal strength — 0.5N for 1minute — 5N for 1minute Photo Slide Dimensions （mm） Push 8.5 Rotary Power — ● Dual-in-line Package Type Life cycle Durability Horizontal Type Vertical Type Electrical performance Mechanical Operating performance Actuator direction strength Pulling direction Environmental performance 50N 0.1A 30V DC 50μA 3V DC 49N 30N — — — Cold −40℃ 1,000h −20℃ 96h −40℃ 500h −20℃ 96h Dry heat 90℃ 1,000h 85℃ 96h 85℃ 500h 85℃ 96h Damp heat 60℃, 90 to 95% RH 1,000h Page 124 — 50N 40℃, 90 to 95% RH 60℃, 90 to 95% RH 96h 500h 125 126 10N — 40℃, 90 to 95%RH 96h 127 129 130 Push Switches Soldering Conditions・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 138 Push Switches Cautions・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 139 Note ● Indicates applicability to all products in the series. 114 Push Switches Soldering Conditions Detector Example of Reflow Soldering Condition 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement. 3. Temperature profile Push Temperature (˚C ) Slide 300 A max. B 200 D E 100 Rotary Room temperature Time (s) Pre-heating F max. C Power Dual-in-line Package Type Series（Reflow type） A（℃） 3s max. B（℃） C（s） D（℃） E（℃） F（s） 260 230 40 180 150 120 SPEG SPEJ SPEF SPEH Horizontal Type Notes 1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. Vertical Type Reference for Hand Soldering Series Soldering temperature Soldering time SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1 350±10℃ 3+1/0s SPED2, SPED4 350±10℃ 3±0.5s SPEJ 350±10℃ 4s max. SPEG, SPEF 350±5℃ 3s max. SPEH, SPPH2 350℃ max. 3s max. SPUJ 300±10℃ 3+1/0s Reference for Dip Soldering (For PC board terminal types) Series 138 For PC board 端子タイプに適用 Items Dip soldering Preheating temperature Preheating time Soldering temperature Duration of immersion SPPJ3 100℃ max. 60s max. 260±5℃ 5±1s SPUN 100℃ max. 60s max. 260±5℃ 10±1s SPUJ, SPPH2, SPPH4 — 260±5℃ 5±1s SPPJ2, SPPH1, SPED2, SPED4, SPEF — 260±5℃ 10±1s