SPPH4 2.2mm-travel Medium-sized Vertical Type Easy to use mid-size vertical type push switch Detector ■ Typical Specifications Items Specifications 0.1A 30V DC / 50BA 3V DC Contact resistance （Initial performance） 100mΩ max. Operating force Slide Rating（max.）（ / min.） （Resistive load） 2±1N 10,000 cycles（0.1A 30V DC） Travel （mm） Total travel （mm） Mounting method Poles Terminal type Operation Location lug Latching Non shorting 2.2 3 PC board 2 Straight Japan SPPH410100 With SPPH410200 Without Latching Momentary 100 6,000 SPPH420100 SPPH430100 With SPPH430200 Packing Specifications Dual-in-line Package Type Snap-in Product No. Export Power Momentary Minimum order unit（pcs.） Rotary Product Line Changeover timing Push Operating life with load Bulk Number of packages（pcs.） 1 case / export packing Export package measurements （mm） 1,200 6,000 400×270×290 Horizontal Type 1 case / Japan Dimensions Unit:mm Style With boss Vertical Type PC board mounting hole dimensions （Viewed from the direction A） A 6.5 4 3.3 2.5 (0.2) 8.5 4 3.3 2.5 3.5 0.8 5.4 6-ø0.9 hole ø1 0.3 5.4 For location lug ø1.2 hole 8.5 18 2.2(Travel) 3(Total travel) 11 2 (9.5) 3 2.5 2.5 PC board mounting surface Terminal No.3 0.5 2.5 2.5 Thickness of PC board t=1.6mm Terminal No.2 3 Terminal No. 1 Location lug Note Dimensions drawing is for type with location lugs. Circuit Diagram（Viewed from Direction A） （Common） Terminal Configuration Straight terminal Unit:mm Snap-in terminal 1 2 3 （Common） 0.3 (3.5) (3.5) 4 5 6 0.3 5.4 5.4 Refer to P.138 for soldering conditions. 129 Push Switches List of Varieties Vertical Detector Series SPEH SPEG SPEJ SPPH2 SPPH4 SPPH1 W 6 7.19 7 6 6.5 10 D 6 8.39 7 6.5 8.5 10 H 5 3.5 5.95 6.5 Travel（mm） — — 1.7 1 2.2 1.5 Total travel（mm） 1.6 1.1 1.7 1.5 3 2.5 Number of poles 1 1 2 2 Operating temperature range −40℃ to ＋90℃ −10℃ to ＋60℃ −40℃ to ＋85℃ −10℃ to ＋60℃ Automotive use ● — ● — Rating（max.） （Resistive load） 50mA 16V DC 1mA 5V DC 0.2A 14V DC 0.1A 12V DC Rating（min.） （Resistive load） 10μA 1V DC 50μA 3V DC — Operating life without load 100,000 cycles 400mΩ max. 30,000 cycles 500mΩ max. 10,000 cycles 150mΩ max. 10,000 cycles 50mΩ max. 10,000 cycles 100mΩ max. 10,000 cycles 40mΩ max. Operating life with load （at max. rated load） 100,000 cycles 400mΩ max. 30,000 cycles 500mΩ max. 10,000 cycles 150mΩ max. 10,000 cycles 50mΩ max. 10,000 cycles 100mΩ max. 10,000 cycles 40mΩ max. Initial contact resistance 200mΩ max. 200mΩ max. 150mΩ max. 30mΩ max. 100mΩ max. 20mΩ max. Insulation resistance 100MΩ min. 100V DC 3MΩ min. 100V DC 100MΩ min. 500V DC 100MΩ min. 500V DC Voltage proof 250V AC for 1minute 100V AC for 1minute 500V AC for 1minute 500V AC for 1minute Terminal strength — 0.5N for 1minute — 5N for 1minute Photo Slide Dimensions （mm） Push 8.5 Rotary Power — ● Dual-in-line Package Type Life cycle Durability Horizontal Type Vertical Type Electrical performance Mechanical Operating performance Actuator direction strength Pulling direction Environmental performance 50N 0.1A 30V DC 50μA 3V DC 49N 30N — — — Cold −40℃ 1,000h −20℃ 96h −40℃ 500h −20℃ 96h Dry heat 90℃ 1,000h 85℃ 96h 85℃ 500h 85℃ 96h Damp heat 60℃, 90 to 95% RH 1,000h Page 124 — 50N 40℃, 90 to 95% RH 60℃, 90 to 95% RH 96h 500h 125 126 10N — 40℃, 90 to 95%RH 96h 127 129 130 Push Switches Soldering Conditions・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 138 Push Switches Cautions・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 139 Note ● Indicates applicability to all products in the series. 114 Push Switches Soldering Conditions Detector Example of Reflow Soldering Condition 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement. 3. Temperature profile Push Temperature (˚C ) Slide 300 A max. B 200 D E 100 Rotary Room temperature Time (s) Pre-heating F max. C Power Dual-in-line Package Type Series（Reflow type） A（℃） 3s max. B（℃） C（s） D（℃） E（℃） F（s） 260 230 40 180 150 120 SPEG SPEJ SPEF SPEH Horizontal Type Notes 1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. Vertical Type Reference for Hand Soldering Series Soldering temperature Soldering time SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1 350±10℃ 3+1/0s SPED2, SPED4 350±10℃ 3±0.5s SPEJ 350±10℃ 4s max. SPEG, SPEF 350±5℃ 3s max. SPEH, SPPH2 350℃ max. 3s max. SPUJ 300±10℃ 3+1/0s Reference for Dip Soldering (For PC board terminal types) Series 138 For PC board 端子タイプに適用 Items Dip soldering Preheating temperature Preheating time Soldering temperature Duration of immersion SPPJ3 100℃ max. 60s max. 260±5℃ 5±1s SPUN 100℃ max. 60s max. 260±5℃ 10±1s SPUJ, SPPH2, SPPH4 — 260±5℃ 5±1s SPPJ2, SPPH1, SPED2, SPED4, SPEF — 260±5℃ 10±1s