Spec. No. : C588C3 Issued Date : 2011.01.05 Revised Date : Page No. : 1/7 CYStech Electronics Corp. ESD protected N-CHANNEL Enhancement Mode MOSFET MTN1012ZC3 BVDSS ID RDSON(TYP) Description • Low voltage drive, 1.8V • Easy to use in parallel • High speed switching • ESD protected device • Pb-free package Symbol 20V 0.7A 300mΩ@4.5V/0.6A 340mΩ@2.5V/0.5A 420mΩ@1.8V/0.4A Outline MTN1012ZC3 SOT-523 D G G：Gate S：Source D：Drain S Absolute Maximum Ratings (Ta=25°C) Parameter Symbol BVDSS Drain-Source Voltage Gate-Source Voltage Continuous Drain Current VGS TA=25°C TA=70°C Pulsed Drain Current Total Power Dissipation ID IDM TA=25°C TA=70°C Operating Junction and Storage Temperature Range Thermal Resistance, Junction-to-Ambient PD Tj ; Tstg Rth,ja Limits 20 ±12 0.7 0.4 1 *1 270 160 -55~+150 463 Unit V V A A mW °C °C/W Note : *1. Pulse Width ≤ 300μs, Duty cycle ≤2% MTN1012ZC3 CYStek Product Specification Spec. No. : C588C3 Issued Date : 2011.01.05 Revised Date : Page No. : 2/7 CYStech Electronics Corp. Electrical Characteristics (Ta=25°C) Symbol Static BVDSS VGS(th) IGSS IDSS ID(ON) RDS(ON) Min. Typ. Max. Unit 20 0.3 0.7 - 300 340 420 1 0.8 ±1 1 5 360 420 560 - V V mA 70 20 8 1.06 0.18 0.32 18 20 70 25 1.38 26 28 110 40 0.65 1.2 GFS Dynamic Ciss Coss Crss Qg Qgs Qgd td(ON) tr td(OFF) tf Source-Drain Diode *VSD - Test Conditions S VGS=0, ID=100μA VDS=VGS, ID=250μA VGS=±12V, VDS=0 VDS=16V, VGS=0 VDS=16V, VGS=0, TJ=85°C VDS≧5V, VGS=4.5V VGS=4.5V, ID=600mA VGS=2.5V, ID=500mA VGS=1.8V, ID=400mA VDS=10V, ID=400mA pF VDS=10V, VGS=0, f=1MHz nC VDS=10V, VGS=4.5V, ID=0.6A ns VDD=10V, ID=0.5A, VGEN=4.5V, RL=20Ω, RG=1Ω V VGS=0V, IS=150mA μA A mΩ *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% Ordering Information Device MTN1012ZC3 MTN1012ZC3 Package SOT-523 (Pb-free) Shipping Marking 3000 pcs / Tape & Reel X CYStek Product Specification CYStech Electronics Corp. Spec. No. : C588C3 Issued Date : 2011.01.05 Revised Date : Page No. : 3/7 Typical Characteristics MTN1012ZC3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C588C3 Issued Date : 2011.01.05 Revised Date : Page No. : 4/7 Typical Characteristics(Cont.) MTN1012ZC3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C588C3 Issued Date : 2011.01.05 Revised Date : Page No. : 5/7 Reel Dimension Carrier Tape Dimension MTN1012ZC3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C588C3 Issued Date : 2011.01.05 Revised Date : Page No. : 6/7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. MTN1012ZC3 CYStek Product Specification Spec. No. : C588C3 Issued Date : 2011.01.05 Revised Date : Page No. : 7/7 CYStech Electronics Corp. SOT-523 Dimension Marking: 3 X 1 2 3-Lead SOT-523 Plastic Surface Mounted Package CYStek Package Code: C3 Style: Pin 1.Gate 2.Source 3.Drain *: Typical Inches Min. Max. 0.028 0.035 0.000 0.004 0.028 0.031 0.006 0.010 0.010 0.014 0.004 0.008 0.059 0.067 DIM A A1 A2 b1 b2 c D Millimeters Min. Max. 0.700 0.900 0.000 0.100 0.700 0.800 0.150 0.250 0.250 0.350 0.100 0.200 1.500 1.700 DIM E E1 e e1 L L1 θ Inches Min. Max. 0.028 0.035 0.057 0.069 0.020* 0.035 0.043 0.016 REF 0.010 0.018 0° 8° Millimeters Min. Max. 0.700 0.900 1.450 1.750 0.500* 0.900 1.100 0.400 REF 0.260 0.460 0° 8° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTN1012ZC3 CYStek Product Specification