CYStech Electronics Corp. 10Amp. Superfast High Voltage Rectifiers MSR1060E2 Features IF(AV) VRRM IFSM trr Tj VF(Max) • 175℃ operating junction temperature • Low leakage current • Superfast recovery time • Low switching loss, high efficiency • High forward surge capability • High temperature soldering guaranteed : 260℃/40s, 0.25”(6.35mm) from case • Pb-free lead plating package Spec. No. : C484E2 Issued Date : 2011.03.22 Revised Date : 2011.03.29 Page No. : 1/4 10A 600V 110A 30ns 175°C 2.5V Mechanical Data • Case: TO-220AC molded plastic • Mounting Position: Any • Weight: 1.85 grams, 0.065 ounce approximately • Terminals: Pure tin plated, solderable per J-STD-002 and JESD22-B102 • Epoxy: UL 94V-0 rate flame retardant • Polarity : As marked. Equivalent Circuit MSR1060E2 Outline TO-220AC K MSR1060E2 A CYStek Product Specification CYStech Electronics Corp. Spec. No. : C484E2 Issued Date : 2011.03.22 Revised Date : 2011.03.29 Page No. : 2/4 Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. resistive or inductive load. Single phase, half wave, 60Hz, For capacitive load, derate current by 20%.) Parameter Maximum Recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage TC=25°C Maximum instantaneous forward voltage at IF=10A TC=125°C Maximum Average forward rectified current @ TC=140℃ Non-repetitive peak forward surge current @ 8.3ms single half sine wave superimposed on rated load (JEDEC method) VR=600 V, TC=25℃ Maximum instantaneous reverse current at VR=600 V, TC=125℃ Maximum reverse IF=1A, VR=30V, dIF/dt=100A/μs recovery time Typical junction capacitance @ f=1MHz and applied 4V reverse voltage Storage temperature range Operating junction temperature range Symbol VRRM VRMS VDC Min. Max. 600 420 600 2.5 2.0 Units V V V IF(AV) 10 A IFSM 110 A IR 10 500 μA trr 30 ns 1.7 1.5 VF CJ Tstg TJ Typ. 60 V pF -65 -65 +175 +175 ℃ ℃ Thermal Data Parameter Maximum Thermal Resistance, Junction-to-case Maximum Thermal Resistance, Junction-to-ambient Symbol Rth,j-c Rth,j-a Value 2 62.5 Unit °C/W °C/W Ordering Information Device MSR1060E2 MSR1060E2 Package TO-220AC (RoHS compliant package) Shipping 50 pcs / Tube, 40 Tubes/Box CYStek Product Specification CYStech Electronics Corp. Spec. No. : C484E2 Issued Date : 2011.03.22 Revised Date : 2011.03.29 Page No. : 3/4 Typical Characteristics Forward Current Derating Curve Forward Current vs Forward Voltage 100000 Instantaneous Forward Current---IF (mA) Average Forward Current---Io(A) 12 10 8 6 4 2 resistive or inductive load 1000 Tj=125°C 100 Tj=75°C Tj=25℃ 10 Pulse width=300μs, 1% Duty cycle 1 0 0 Case Temperature---TC(℃) 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 Forward Voltage---VF(V) Reverse Leakage Current vs Reverse Voltage Junction Capacitance vs Reverse Voltage 25 50 75 100 125 150 175 0 200 1000 2.2 1000 Tj=150°C 100 Junction Capacitance---C J(pF) Reverse Leakage Current---I R (μA) Tj=150℃ 10000 Tj=125℃ 10 Tj=75℃ 1 Tj=25℃ 0.1 0.01 100 10 Tj=25℃, f=1.0MHz 1 0.001 0 100 200 300 400 Reverse Voltage---VR (V) MSR1060E2 500 600 0.1 1 10 100 Reverse Voltage---VR (V) CYStek Product Specification Spec. No. : C484E2 Issued Date : 2011.03.22 Revised Date : 2011.03.29 Page No. : 4/4 CYStech Electronics Corp. TO-220AC Dimension Marking: CYS MSR Device Name 1060 □□□□ Date Code K Style: Pin A 1, 2, 4 Cathode 3.Anode 2-Lead TO-220AC Plastic Package CYStek Package Code: E2 Millimeters Min. Max. 4.470 4.670 2.520 2.820 0.710 0.910 1.170 1.370 0.310 0.530 1.170 1.370 10.010 10.310 8.500 8.900 12.060 12.460 DIM A A1 b b1 c c1 D E E1 Inches Min. Max. 0.176 0.184 0.099 0.111 0.028 0.036 0.046 0.054 0.012 0.021 0.046 0.054 0.394 0.406 0.335 0.350 0.475 0.491 DIM e e1 F h L L1 L2 Φ Millimeters Min. Max. 2.540 TYP 4.980 5.180 2.590 2.890 0.000 0.300 13.400 13.800 3.560 3.960 0.000 1.000 3.735 3.935 Inches Min. Max. 0.100 TYP 0.196 0.204 0.102 0.114 0.000 0.012 0.528 0.543 0.140 0.156 0.000 0.039 0.147 0.155 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MSR1060E2 CYStek Product Specification