CYStech Electronics Corp. 5Amp. Ultrafast Plastic Rectifiers MUR0560F2 Features IF(AV) VRRM IFSM trr Tj VF(MAX) • 175℃ operating junction temperature • Glass passivated chip junction • Low leakage current • Low switching loss, high efficiency • High forward surge capability • Insulating package, insulating voltage=2500V AC • High temperature soldering guaranteed : 260℃/40s, 0.25”(6.35mm) from case • Pb-free lead plating package Spec. No. : C477F2 Issued Date : 2010.02.24 Revised Date : Page No. : 1/4 5A 600V 80A 60ns 175°C 1.5V Mechanical Data • Case: ITO-220AC molded plastic • Mounting Position: Any • Weight: 1.85 grams, 0.065 ounce approximately • Terminals: Pure tin plated, solderable per J-STD-002 and JESD22-B102 • Epoxy: UL 94V-0 rate flame retardant • Mounting torque: 10 in.-lb. maximum Equivalent Circuit MUR0560F2 Outline ITO-220AC K MUR0560F2 A CYStek Product Specification CYStech Electronics Corp. Spec. No. : C477F2 Issued Date : 2010.02.24 Revised Date : Page No. : 2/4 Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. resistive or inductive load. Single phase, half wave, 60Hz, For capacitive load, derate current by 20%.) Parameter Maximum Recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Symbol VRRM VRMS VDC Maximum instantaneous forward voltage at IF=5A Maximum Average forward rectified current @ TC=100℃ Non-repetitive peak forward surge current @ 8.3ms single half sine wave superimposed on rated load (JEDEC method) VR=600 V, TC=25℃ Maximum instantaneous reverse current at VR=600 V, TC=125℃ Maximum reverse IF=1A, VR=30V, dIF/dt=100A/μs recovery time Typical junction capacitance @ f=1MHz and applied 4V reverse voltage Isolation voltage from terminal to heatsink, t=1minute Storage temperature range Operating junction temperature range Min. Typ. Max. 600 420 600 Units V V V 1.2 1.5 V IF(AV) 5 A IFSM 80 A IR 10 100 μA trr 60 ns VF CJ VAC Tstg TJ 28 pF 2500 -65 -65 +175 +175 V ℃ ℃ Thermal Data Parameter Maximum Thermal Resistance, Junction-to-case Maximum Thermal Resistance, Junction-to-ambient Symbol Rth,j-c Rth,j-a Value 5 60 Unit °C/W °C/W Ordering Information Device MUR0560F2 MUR0560F2 Package ITO-220AC (RoHS compliant package) Shipping 50 pcs / Tube, 40 Tubes/Box CYStek Product Specification CYStech Electronics Corp. Spec. No. : C477F2 Issued Date : 2010.02.24 Revised Date : Page No. : 3/4 Characteristic Curves Forward Current Derating Curve Forward Current vs Forward Voltage 100000 Instantaneous Forward Current---IF (mA) Average Forward Current---Io(A) 6 5 4 3 2 1 resistive or inductive load 10000 1000 Tj=150℃ 100 Tj=25℃ 10 Pulse width=300μs, 1% Duty cycle 1 0 0 25 50 75 100 125 150 0 175 Case Temperature---TC(℃) 0.4 0.6 0.8 1 1.2 Forward Voltage---VF(V) 1.4 Junction Capacitance vs Reverse Voltage Reverse Leakage Current vs Reverse Voltage 1000 100 Tj=125℃ Junction Capacitance---C J(pF) Reverse Leakage Current---I R (μA) 0.2 10 1 Tj=75℃ 0.1 Tj=25℃ 0.01 100 Tj=25℃, f=1.0MHz 10 0.001 0 100 200 300 400 Reverse Voltage---VR (V) MUR0560F2 500 600 0.1 1 10 100 Reverse Voltage---VR(V) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C477F2 Issued Date : 2010.02.24 Revised Date : Page No. : 4/4 ITO-220AC Dimension Marking: Logo Device Name Date Code 1 2 K Style: Pin A 2-Lead ITO-220AC Plastic Package CYStek Package Code: F2 1.Cathode 2.Anode *: Typical Inches Min. Max. 0.178 0.194 0.028 0.036 0.014 0.021 0.617 0.633 0.274 0.408 0.092 0.108 *0.200 DIM A b C D E F e Millimeters Min. Max. 4.53 4.93 0.71 0.91 0.36 0.53 15.67 16.07 6.96 10.36 2.34 2.74 *5.08 DIM H1 J1 L Φ1 b1 L1 K Inches Min. Max. 0.256 0.272 0.101 0.117 0.487 0.503 0.117 0.133 0.045 0.055 0.088 0.104 0.122 0.138 Millimeters Min. Max. 6.50 6.90 2.56 2.96 12.37 12.77 2.98 3.38 1.15 1.39 2.23 2.63 3.10 3.50 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MUR0560F2 CYStek Product Specification