PMC (Passive Micro Components) OVERVIEW PMC thin-film technology offers comprehensive materials and processes combinations allowing electronic designers superior space saving, tolerance and signal integrity for semi custom designs in the MHz to GHz spectrum. BENEFITS • • • • • • • Precision: 0.05% tolerance or match Integration: controlled parasitic ESR and ESL Miniaturization: 4µm line widths Materials: substrates, conductors, dielectrics and resistors Device laser trimming and tuning: die and wafer level Inductors: multi level and turn, ⭐40nH, Q⭐80 Termination options: BGA, LGA, or wire bond TYPICAL MATERIALS AND DESIGNS OFFERED Passive Resistors Capacitors Inductors Material TaN SiCr SiON SiO2 BCB X7R Cu Minimum Chip Size mm (in) 0.5 x 0.5 (0.020 x 0.020) 0.5 x 0.5 (0.020 x 0.020) 0.25 x 0.25 (0.010 x 0.010) 0.25 x 0.25 (0.010 x 0.010) 0.5 x 0.5 (0.020 x 0.020) 0.5 x 0.5 (0.020 x 0.020) 1.0 x 0.5 (0.039 x 0.020) Range 0.47-1M Ohm 47-20M Ohm 1-500pF 1-500pF 1-50pF 2.2pF-400nF 0.5-40nH Trimmable Yes Yes Yes No Yes No No Tolerance; NOTE value dependent 0.05% 0.05% ⭓0.5%; or ⭓0.05pF ⭓0.5%; or ⭓0.05pF ⭓0.5%; or ⭓0.05pF 5% 5% Performance; NOTE TCR in ppm/°C TCR -100 to -150 TCR ±25; ±250 K 5.8; TCC 60 K 4; TCC 30 K 2.7; TCC 42 K 1000 Q ⭐ 80 I/O Type BGA (Ball Grid Array), LGA (Land Grid Array), and gold or aluminum wire bond 1 PMC (Passive Micro Components) • SUBSTRATE SELECTION – 6 inch Silicon, Ceramic, Glass and Quartz • RESISTORS – SiCr and TaN • CAPACITORS – NP0 and X7R • INDUCTORS – Cu 1µm to 20µm thick • PASSIVATION – BCB / SiN • TERMINATION – BGA (Ball Grid Array) diameter from 60 to 300µm – LGA (Land Grid Array) – WB (Wire Bond) gold or aluminum • UBM – TiW Ni Cu or TiW Cu 2 PMC (Passive Micro Components) RESISTOR MATERIAL CAPABILITIES Y AXIS: TCR (PPM / oC) 400 SiCr 300 200 Sheet resistivity 300-1300 Ohms/square 100 TCR + 25ppm 0 R values 47 to 20M Ohms -100 0 250 TCR500+ 250ppm 750 1000 1250 -200 -300 TaN -400 Sheet resistivity 20-100 Ohms/square 1500 R values 0.5 to 1M Ohms TCR – 100 to -150 ppm X AXIS: R SQUARED (OHMS) CAPACITOR MATERIAL CAPABILITIES Material X7R SiON SiO2 BCB pF / mm2 8000 @ 5V, up to 25000 @ 3V* 55 35 25 Typical Stability -55 to +125 ±15% ±60 ppm/°C ±30 ppm/°C ±42 ppm/°C Rated Voltage 3-5 ⭐100 ⭐100 ⭐25 BDV (V/µm) 100 600 1000 300 DF ⭐8% ⭐0.1% ⭐0.1% ⭐0.1% Voltage Stability Less 1.25% per volt from 0 to 5 volts Independent Independent Independent Frequency Range ⭐10 GHz ⭐40 GHz ⭐40 GHz ⭐75 GHz *Based on dielectric thickness of 0.25µm @ 3V, and 0.5µm @5V 3 PMC (Passive Micro Components) • RESISTORS – Industry leading high Ohmic, laser trimmable low TCR and leakage high or low voltage designs • CAPACITORS – MIS, MOS, or MIM style SLCs – Precision laser trimmed NP0 capacitor arrays • INDUCTORS – 3 turn 2 level designs – Q up to 80 – Up to 40 nH – Copper construction • FILTERS – LCs, LRs, and RCs – Low & High Pass – Band Pass – Band Rejection A KYOCERA GROUP COMPANY http://www.avx.com S-PMC00M107-N