Crystal Units Surface Mount Type KSX-23 Series 3.2×2.5A Features How to Order KSX-23-26000K C A-Q C 0 R • Reference frequency for telecommunication systems • Reflow compatible • Using Ceramic Package resulting in high reliability • Small and low profile q w e rt y u i qType wNominal Frequency Code Freq.(kHz) Code Freq.(kHz) 19200K 19200.000 32000K 32000.000 19680K 19680.000 38400K 38400.000 19800K 19800.000 40000K 40000.000 26000K 26000.000 Applications • Cellular phone, IC Card, GPS * Please inquire about frequencies other than the above. RoHS Conforming Pb Free eLoad Capacitance C 12pF Specifications Items Symbol Frequency Range Specification Units rFrequency Stability A ±10ppm tOperating Temperature Q −30˚C to +85˚C Remarks Fo 19200~40000 kHz Overtone Order –––– Fundamental –––– Frequency Tolerance ∆F/F ±10 ppm @ 25°C Frequency Temperature Character ∆F/T ±15 ppm ref@ 25°C Over Operating Temp Range Motional Series Resistance CI Table 1 ohm –––– Table 2 µW Level of Drive Load Capacitance CL 12 pF Operating Temp. Range TOPR −30~+85 °C Storage Temp. Range TSTG −40~+85 °C yFrequency Temperature Stability C ±15ppm uFrequency Offset 0 0Hz(Standard) iPackaging R Taping * Taping packing : one unit 1,000pcs & 3,000pcs * Please inqurie about specifications other than the above. Table1 Motional Series Resistances Frequency Range Motional Series Resistance 19200~24999kHz 60Max 25000~40000kHz 40Max Table2 Level of Drive Units Frequency Range Level of Drive Units ohm 19200~40000kHz 10(Max 100) µW Dimensions (Unit : mm) Recommended Land Pattern (Unit : mm) KSX-23 <CONNECTION> 3.2±0.2 #4 TOP VIEW #4 #3 #1 #2 2.5±0.2 #3 1.4 #2 #1 1.2 (0.8) 0.9 1.2 1.7 0.85max #2, #4 are connected to the metal lid of the top. #4 #3 #1 #2 CRYSTAL(X’tal) IN or OUT GND (1.0) #1 #2 #4 #3 2.2 CRYSTAL(X’tal) IN or OUT GND Crystal Units Surface Mount Type KSX-35 Series 5.0×3.2A Features • Reference frequency for telecommunication systems • Reflow compatible • Using Ceramic Package resulting in high reliability • Small, low profile and market standard dimensionss Applications • Cellular phone, IC Card, GPS • Remote keyless entry RoHS Conforming Pb Free How to Order KSX-35-13000K C A-Q C 0 R q w qType wNominal Frequency Code Freq.(kHz) 13000K 13000.000 13560K 13560.000 14400K 14400.000 16800K 16800.000 19200K 19200.000 e rt y u i Code Freq.(kHz) 19440K 19440.000 19680K 19680.000 19800K 19800.000 26000K 26000.000 * Please inquire about frequencies other than the above. eLoad Capacitance C 12pF Specifications Items Symbol Frequency Range Specification Units rFrequency Stability A ±10ppm tOperating Temperature Q −30˚C to +85˚C Remarks Fo 12600~27820 kHz Overtone Order –––– Fundamental –––– Frequency Tolerance ∆F/F ±10 ppm @ 25°C Frequency Temperature Character ∆F/T ±15 ppm ref@ 25°C Over Operating Temp Range Motional Series Resistance CI Table 1 ohm –––– Table 2 µW Level of Drive Load Capacitance CL 12 pF Operating Temp. Range TOPR −30~+85 °C Storage Temp. Range TSTG −40~+85 °C yFrequency Temperature Stability C ±15ppm uFrequency Offset 0 0Hz(Standard) iPackaging R Taping * Taping packing : one unit 1,000pcs & 3,000pcs * Please inqurie about specifications other than the above. Table1 Motional Series Resistances Frequency Range Motional Series Resistance 12600~18999kHz 60Max 11000~25999kHz 50Max 26000~27820kHz 40Max Table2 Level of Drive Units (Unit : mm) Units 12600~27820kHz 10(Max 100) µW Recommended Land Pattern (Unit : mm) <PIN CONNECTION> 5.0±0.2 #4 Level of Drive ohm Dimensions KSX-35 Frequency Range TOP VIEW #4 #3 3.2±0.2 #3 1.8 #1 #2 1.2 #2 #1 1.2 0.95max #2, #4 are connected to the metal lid of the top. (0.9) 1.4 2.2 (1.2) #2 #4 #3 #3 #1 #2 CRYSTAL(X’tal) IN or OUT GND 2.6 #1 #4 CRYSTAL(X’tal) IN or OUT GND Handling Notes 1. Shock & Drop • Vibration 2. Cleaning Do not inflict excessive shock and mechanical vibration that exceeds the norm, such as hitting or mistakenly dropping, when transporting and mounting on a board. There are cases when pieces of crystal break, and pieces that are used become damaged, and become inoperable. When a shock or vibration that exceeds the norm has been inflicted, make sure to check the characteristics. Since a crystal piece can be broken by resonance when a crystal device is cleaned by ultrasonic cleaning. Be careful when carrying out ultrasonic cleaning. 3. Soldering conditions To maintain the product reliability, please follow recommended conditions. Standard soldering iron conditions Crystal Units Soldering iron 280˚C ~ 340˚C Time 3+1/−0sec. max Reflow conditions (Example) Temperature(˚C) 260˚C±5˚C 10sec(max) 200˚C min 30-45sec. Hold-Time 1-2min Cool Down 2.5-5˚C/s Ramp-Up 1-3˚C/s Time(sec.) Crystal Units Recommended reflow Conditions vary depending upon products. Please check with the respective specification for details. 4. Mounting Precautions Leaded Devices The special glass, located where the lead of the retainer base comes out, is aligned with the coefficient of thermal expansion of the lead, If the glass is damaged and cracks appear, there may be cases in which performance deteriorates and it fails to operate. Consequently, when making the device adhere closely and applying solder, align the gap of the hole of the board with the gap of the lead and insert without excessive force. When making the device adhere closely to a through hole board and applying solder, be careful that the solder does not get into the metal part of the retainer base and cause a short. Putting in an insulation spacer is one more method of preventing a short circuit. When the lead is mounted floating, fix it as far as possible so that contact with other parts and the breakage due to the fatigue, and the mechanical resonance of the lead will not occur. When the lead is bent and used, do not bend the lead directly from the base, separate it 0.5mm or more and then bend it. When bending, before attaching to the board, fix the place where the lead comes out in advance and attach it after bending so that a crack does not occur in the glass part. Surface Mount Devices The lead of the device and the pattern of the board is soldered on the surface. Since extreme deformation of the board tears off the pattern, tears off the lead metal, cracks the solder and damages the sealed part of the device and there are cases in which performance deteriorates and operation fails, use it within the stipulated bending conditions. Due to the small cracks in the board resulting from mounting, please pay sufficient attention when attaching a device at the position where the warping of the board is great. When using an automatic loading machine, as far as possible, select a type that has a small impact and use it while confirming that there is no damage. Surface mount devices are NOT flow soldering compatible. 5. Storage Condition Since the long hour high temperature and low temperature storage, as well as the storage at high humidity are causes of deterioration in frequency accuracy and solderability. Parts should be stored in temperature range of -5 to +40C˚, humidity 40 to 60% RH, and avoid direct sunlight. Then use within 6 months. Handling Notes For Proper Use of Crystal Units 1. Characteristics of crystal units The thickness of crystal vibrator of the AT cut crystal unit as described in the previous page differs depending on the overtone mode. (1) Relationship between thickness of crystal blank and oscillation frequency Cut angle/mode overtone Frequency range (MHz) Formula of thickness of crystal blank AT/Fundamental mode 3.5~ 33 1.67/f AT/3’rd O. T 33~100 5.01/f AT/5’th O. T 100~150 8.35/f AT/7’th O. T 150~200 11.69/f f : Series resonance frequency. (MHz) In case of calculating the thickness of AT-cut 16MHz t=1.67/16=0.104(mm) (2) Examples of specifications for frequency-temperature characteristics The frequency-temperature characteristics of the AT cut crystal unit are tertiary curves. The diagram below shows examples of the tertiary curves that pass temperature range and frequency deviation specifications. The range enclosed by the smaller rectangular satisfies the following specification: ±10×10-6 (-10 to 60: 25˚C) The range enclosed by the larger rectangular satisfies the following specification: ±50×10-6 (-20 to 70: 25˚C) Temperature (˚C) –70 –50 –30 –10 10 30 50 70 90 110 70 60 50 Frequency deviation ∆ f / f (×10–6) 40 30 20 10 0 –10 –20 –30 –40 –50 –60 –70 * These are examples. Required frequency-temperature specifications are determined through individual consultations. (3) Equivalent electric circuit and equivalent constant of crystal unit The following equivalent constants are used near the resonance frequency. L1 : Motional inductance in the equivalent electric circuit L1 C1 R1 C1 : Motional capacitance in the equivalent electric circuit R : Motional resistance in the equivalent electric circuit C0 : Parallel capacitance in the equivalent electric circuit C0 Equivalent electric circuit of a quarts crystal unit Handling Notes (4) Items calculated by equivalent constants and load capacitance 1 2π L1 C1 f s: Series resonance frequency fs = f p: Parallel resonance frequency 1 C C 2π L 1 0 1 C0+ C1 γ = C0 C1 g : Capacitance ratio fp = C1 +1 2 (C 0 + C L ) f L : Load resonance frequency fL = fs R L : Load resistance R L = R 1 1+ C L : Load capacitance CL = C1 2 Q : Quality factor Q= 2π f s L 1 1 = R1 2π f s C1 R1 C0 CL 2 1 −C 0 (f L /f s )−1 The equation f L shows that f L varies as load capacitance C L connected to the crystal unit changes and that f L becomes larger. as C L becomes smaller. The equation R L shows the change in impedance with a load capacitance connected. The impedance of crystal unit becomes larger as C L becomes smaller. 2. Oscillation circuit and crystal unit (1) Equivalent circuit of oscillation circuit and oscillation conditions A simplified equivalent circuit is shown below. Crystal unit Oscillation circuit CL Crystal unit XL Oscillation circuit C L = –X C C L : Load capacitance –R : Negative resistance X L : Reactance of crystal unit –X C : Reactance of oscillation circuit R L : Load resonance resistance –R RL –R Handling Notes The oscillation start-up conditions are described as R L => | −R | , and in order to oscillate the crystal unit accurately, it must be designed such that the negative resistance of the oscillation circuit becomes bigger comparing with the resonance resistance value at the time of loading. This ratio is called oscillation margin degree MOSC and it is one of critical factors when designing the oscillation circuit and is described as below. For oscillation circuit designing conditions, it is recommended that an oscillation circuit be designed using a negative resistance of a value five to ten times or more larger than RL calculated from the resonance resistance specification value. MOSC = | −R | / R L => 5 In a steady oscillation state, the load resonance resistance is given as follows: R L = | −R | The mutual conductance of the oscillation circuit decreases after the oscillation has started to continuously compensate for the power loss due to the load resonance resistance of the crystal unit, which continues oscillation. The frequency condition is given as follows: XL = XC, XL - XC = 0 As shown in the following figure, the reactance of the crystal unit varies to a value matching the load capacitance of the oscillation circuit C L = XC. Thus an oscillation frequency is determined. +X fp fs fL f s : Series resonance frequency Reactance f L : Load resonance frequency Admittance –X ω Le –1/ωC L Frequency f p : Parallel resonance frequency Handling Notes (2) Changes of load capacitance and oscillation frequency 800 As shown above, the series resonance frequency of the crystal unit changes with load capacitance C L of the oscillation circuit. In the actual oscillation circuit, however, fine adjustments of oscillation frequencies are carried out by varying C L by the trimmer capacitor or the like. The following figure shows an example of load capacitance characteristics. The slope of the characteristics varies depending on the frequency, shape, the number of overtone mode, etc. 700 Load capacity characteristic ∆f/f (×10 –6) 600 500 400 300 200 100 0 0 3. Crystal oscillation circuit 10 20 30 50 60 C L (pF) C-MOS fundamental crystal oscillation circuit (1) C-MOS fundamental crystal oscillation circuit R f = 1M As shown above, the series resonance frequency of the crystal The figure on the right shows a standard C-MOS inverter crystal oscillation circuit for oscillating crystal unit with fundamental mode. * Rx is an element to reduce excitation current of the crystal unit preventing frequency fluctuation, but Rx is not used in some cases. Buffer Xtal Rd Rx C1 C2 Variation of negative resistance with condenser capacity Condenser capasityC (C 1 =C 2)(pF) 0 10 20 30 40 50 -100 Negative resistance Characteristics of the circuit when load capacitances C1 and C2 are changed under the condition of C1 = C2 are shown in the figure on the right. It is not desirable that the excessive increase of the value of condenser leads to a decrease of the negative resistance resulting in increasing the possibility of oscillation failure. 40 -200 (Ω) -5K 16.0MHz -500 10.0MHz -1K 3.579545MHz -2K -10K Frequency characteristics of negative resistance Rd mainly adjusts frequency characteristics of the negative resistance and is used to prevent oscillating by third Overtone mode. In case of a bigger circuit of the negative resistance, there is a case it is used to prevent the abnormal oscillation. Frequency(MHz) 2 Negative resistance (Ω) 4 6 8 10 12 14 16 -100 -200 C 1=C 2=10pF -500 -1K -2K -5K -10K Resistance of Rd 3.5~6.9MHz=2.2kΩ 7.0~16MHz=220Ω Handling Notes Selection of ICs and circuit constants by frequency bands Frequency 3~4.9(MHz) 5~6.9(MHz) 7~9.9(MHz) 10~19.9(MHz) TC74HCU04A TC7SU04F TC7WU04FU TC4069UB TC4SU69F IC Rf 20~30(MHz) TC74VHCU04 TC7SHU04F TC7WHU04FU 1M Rd *1 Rx *2 C 1, C 2 *3 1500( ) 470( ) 0( ) 0( ) 0( ) 6~15(pF) 6~15(pF) 0~1500 6~22(pF) *1: Necessary for preventing overtone oscillation and must be changed depending on the frequency band or the C1 and C2 values. *2: Used to reduce excitation current of the crystal unit. Necessary for stable operation of small-sized crystal units. *3: The optimum value differs with the values of load capacitance and Rd. (2) C-MOS overtone crystal oscillation circuit This figure shows a standard C-MOS inverter crystal oscillation circuit to oscillate a crystal unit using the overtone mode. C-MOS overtone crystal oscillation circuit R f = 1M L1 X-tal R1 C3 1000pF C1 C2 L2 There are same cases when L1 and R1 are matched to the value of load capacitance. (3) Selection of ICs and circuit constants by frequency bands Frequency range 20~60(MHz) C1 TC74VHCU04 TC7SHU04F TC7WHU04FU 3~10pF C2 10~22pF IC (4) Method of selecting circuit constants and functions of elements C1 : Forms load capacitance of the circuit together with C2, L1 and L2. A value of approx. 5pF is used. C2 : Forms load capacitance of the circuit together with C1, L1 and L2. Prevents fundamental wave oscillation. Shall be selected so that C2 comes between the third overtone frequency at which resonance frequency with L2 is to make oscillation and 1/3 of the third overtone frequency. A value of 10 to 22pF is used. C3 : A bypath capacitor L1 : A coil to adjust load capacitance of the oscillation circuit to a value near the series. A value of several µH is used. L2 : Forms load capacitance of the circuit together with C1, C2 and L1. Prevents fundamental wave oscillation. Shall be selected so that L2 comes between the third overtone frequency at which resonance frequency with C2 is to make oscillation and 1/3 of the third overtone frequency. A value of 10 to 22pF is used. R1 : A Q dump resistor for L1 . As an element for preventing self-excited oscillation, A value of several kΩ to several tens of kΩ is used. * L1 and R1 might not be used. Handling Notes (5) Method of checking oscillation circuit qSome ICs have a low upper-limit value of usable frequency, so refer to individual IC catalog to make sure that the IC can oscillate a crystal unit with an adequate negative resistance. w The following figure shows an example of a C-MOS oscillation circuit. Check resistance Rsup is connected in series with the crystal unit to check the negative resistance. Use 3 to 22pF for C1 and C2, and see the table below for values of check resistance. Rf Frequency range Rsup C1 C2 Values of check resistance 3.5~4.5MHz 1.5k 4.6~6.0MHz 1.0k 6.1~10.0MHz 800 10.1~14.0MHz 500 14.1~20.0MHz 400 eUsing a spectrum analyzer or oscilloscope, check that every oscillation is normally activated while turning the power on and off several times. For oscillation circuits with no power regulator ICs, carefully check changes in the negative resistance against supply voltage and in frequencies. rWhen oscillation is normal, remove the check resistance before using the crystal circuit. tIf oscillation is unstable or is not generated, gradually decrease the values of C1 and C2 until normal oscillation is obtained. yIf normal oscillation cannot be generated near 10MHz or near 20MHz, replace the IC with a new one suitable for higher frequencies. (6) Load capacitance and oscillation frequency of transistor/fundamental crystal oscillation circuit Viewed from the connection terminals of a crystal unit, the load capacitance C L of an oscillation circuit is generally comprised of C1, C t, C2, and C3 if stray capacitance of the circuit and the capacitance between base and emitter of the transistor are ignored. Since trimmer capacitor is adjusted to C T = MIN. to MAX. for zero adjustment of the oscillation frequency, the value of C L at this time can be obtained from the following equation. C L MIN. = 1 1 1 + + C 1 +C T C3 C2 −1 ~ C L MAX.= 1 1 1 + + C 1 +C T C3 C2 −1 When these calculation results are substituted for the following equation for load resonance frequency, the oscillation frequency can be obtained. fL = fs C1 +1 2 (C 0 + C L ) Handling Notes Vcc C4 0.01µ R1 C2 C5 C1 Ct R2 OUT C3 R3 Select each circuit constant so that the adjustment ranges of upper and lower frequencies of this circuit are even on the basis of the frequency of a single crystal unit measured using a specified load capacity, and that the margin of ±8 to 10 ×10-6 of the room temperature deviation of the crystal unit can be reserved. To prevent the decrease in the negative resistance, always connect the crystal unit to the base of the transistor. For transistors used for oscillation circuits, hfe and fT are important. To obtain the large negative resistance with small current consumption, select a transistor for high frequency amplification with hfe of over 250 and fT of 1GHz or more. (7) Transistor third overtone oscillation circuit qThe resonance circuit comprised of L2 and C3 is required on the emitter side for preventing fundamental mode crystal oscillation. Set the resonance frequency to a value higher than the intermediate between fundamental wave frequency and third overtone frequency. w Use L1, referred to as an elongation coil, to connect the load capacitance of the oscillation circuit in series. R1 prevents selfexcited oscillation by L1. Since it is difficult in general to design the oscillation circuit having adequate negative resistance in the overtone oscillation frequency band, there are no other effective means of obtaining adequate oscillation margin except for preventing the increase of load resonance resistance RL of the crystal unit. Handling Notes R L in the equation of load resonance resistance can be made equal to R S by connecting CL in series, or making it infinite, which prevents increase in the load resonance resistance. R L = R 1 1+ C0 CL 2 Vcc C5 R2 C2 C6 L1 OUT R1 R3 C1 Ct C3 L2 C4 1000P R4 To prevent decrease in the negative resistance, connect the crystal unit to the base of the transistor as in the fundamental mode crystal oscillation circuit. To use the crystal circuit for both oscillation and multiplication, connect a parallel resonance circuit having multiplication frequency as resonance frequency to the collector of the transistor. When selecting circuit constants for zero adjustment range by trimmer capacitor, set the constants to values obtained by adding approx. ±12 to 15×10-6 to the room temperature deviation of the crystal unit, centering the value obtained by measuring the crystal unit with load capacitances in series. (When the room temperature deviation specification of the crystal unit is ±10×10-6) (8) Excitation power of oscillation circuit Normal operation of crystal units is not assured when excitation power is raised. The allowable excitation power varies depending on the shape of the crystal unit or the stability of targeted frequency. When highly accurate oscillation is required, however, it is recommended to use an oscillation circuit with an excitation power of 5 to 50 µW or less. For other cases, refer to individual relevant crystal units on the pages of the catalog. (9) Precautions for designing printed circuit board Be sure to design printed circuit board patterns that connect a crystal unit with other oscillation elements so that the lengths of such patterns become shortest possible to prevent deterioration of characteristics due to stray capacitances and wiring inductance. For multi-layer circuit boards, it is important not to wire the ground and other signal patterns right beneath the oscillation circuit. Tape & Reel Specifications Tape & Reel Specifications ICrystal Units T A P E R E E L CX-2520SB CX-3225SB (CX-101F) A 2.0±0.05 2.0±0.05 B 4.0±0.1 4.0±0.1 C φ1.55±0.05 φ1.55±0.05 D 4.0±0.05 4.0±0.05 E 3.5±0.05 3.5±0.05 F 1.75±0.1 1.75±0.1 G 8.0±0.2 8.0±0.2 H φ1.05±0.1 φ1.05±0.1 J 3.5±0.1 3.5±0.1 L 2.8±0.1 2.8±0.1 N 0.85±0.1 0.85±0.1 O 0.25±0.05 0.25±0.05 P φ180+0/−3 φ180+0/-3 Q φ60+1/−0 φ60+1/−0 R φ13±0.2 φ13±0.2 S φ21±0.8 φ21±0.8 U 2.0±0.5 2.0±0.5 W 9±1 9±1 3000/1000 3000/1000 KSX-23 CX-4025S KSX-35 CX-96F CX-53F CX-53G CX-8045G CX-17F 2.0±0.1 2.0±0.1 2.0±0.1 2.0±0.1 2.0±0.1 Qty A T A P E R E E L Feed direction 2.0±0.1 CX-49F CX-5FW CX-5FD CX-49L 2.0±0.1 2.0±0.1 2.0±0.1 B 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 C φ1.5+0.1/-0 φ1.55±0.05 φ1.5±0.1 φ1.55±0.1 φ1.5±0.1 φ1.5±0.1 φ1.55±0.05 φ1.55±0.05 φ1.5±0.1 D 4.0±0.1 4.0±0.1 8.0±0.1 8.0±0.1 8.0±0.1 8.0±0.1 8.0±0.1 12.0±0.1 16.0±0.1 E 5.5±0.1 5.5±0.1 5.5±0.1 5.5±0.1 7.5±0.1 7.5±0.1 11.5±0.1 11.5±0.1 11.5±0.1 F 1.75±0.1 1.75±0.1 1.75±0.1 1.75±0.1 1.75±0.1 1.75±0.1 1.75±0.1 1.75±0.1 1.75±0.1 G 12.0±0.3 12.0±0.3 12.0±0.3 12.0±0.2 16.0±0.3 16.0±0.3 24.0±0.3 24.0±0.3 24.0±0.3 H φ1.5+0.1/-0 φ1.05±0.1 φ1.5±0.1 φ1.55±0.1 φ1.55±0.05 φ1.6±0.1 φ2.05±0.05 φ2.05±0.05 φ2.2±0.1 J 3.5±0.1 4.2±0.1 5.5±0.1 5.4±0.1 8.4±0.1 6.5±0.1 11.5±0.1 12.2±0.1 −−− L 2.8±0.1 2.7±0.1 3.7±0.1 3.6±0.1 4.9±0.1 4.2±0.1 5.4±0.1 5.85±0.1 −−− N 1.0±0.1 0.95±0.05 1.4±0.1 1.7±0.1 2.1±0.1 1.5±0.1 5.5±0.1 2.8±0.1 6.5±0.1 O 0.3±0.05 0.2±0.05 0.3±0.05 0.25±0.05 0.3±0.05 0.2±0.05 0.3±0.05 0.3±0.05 0.5±0.05 P φ330±2 φ180+0/-3 φ330±2φ178±2 φ330±2/φ254±2 φ330±2/φ254±2 φ330±2/φ178±2 φ330±2 φ330±2 φ330±2 Q φ100±1 φ60+1/−0 φ80±2φ100±1 φ100±1 φ80±1 φ80±2 φ100±1 φ100±1 φ100±1 R φ13±0.2 φ13±0.2 φ13±0.2 φ13±0.2 φ13±0.2 φ13±0.2 φ13±0.5 φ13±0.5 φ13±0.5 S φ21±0.8 φ21±0.8 φ21±0.8 φ21±0.8 φ21±0.8 φ21±0.8 φ21±0.5 φ21±0.5 −−− U 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.2 2.0±0.5 −−− 13.5±0.5 13±1 13.5+1/−0.5 13.4+2/−0 16.0+2/−0 17.5+2/−0 25.5±0.5 24.4+2/−0 25.5+1/−0.5 5000/3000 3000/1000 5000/1000 3000/1000 3000/1000 5000/1000 1000 1000 5000 W Qty Crystal Units ORDERING FORMAT FOR CRYSTAL UNITS Please specify the following items when ordering crystal units. 1. Type ____________ 2. Nominal Frequency ____________ Hz 3. Overtone order _______________ 4. Frequency Tolerance _____________________ ×10-6 MAX. (at 25˚C) 5. Frequency Stability vs. Temperature Range (referred to 25˚C) ________________________________ ×10-6 MAX, ______˚C ~______˚C 6. Motional Resistance _____________________ Ω MAX. 7. Load Capacitance(CL) _____________________ pF 8. Drive Level _____________________ mW 9. Shunt Capacitance(Co) ______________________ pF Max. 10. Others ______________________________________ 11. Marking ______________________________________ 12. Application ______________________________________