AT91SAM9XE Microcontroller Series Schematic

AT91SAM9XE Microcontroller Series Schematic
Check List
1. Introduction
This application note is a schematic review check list for systems embedding Atmel’s
AT91SAM9XE series of ARM® Thumb®-based microcontrollers.
It gives requirements concerning the different pin connections that must be considered before starting any new board design and describes the minimum hardware
resources required to quickly develop an application with the AT91SAM9XE Series. It
does not consider PCB layout constraints.
AT91 ARM
Thumb-based
Microcontrollers
Application Note
It also gives advice regarding low-power design constraints to minimize power
consumption.
This application note is not intended to be exhaustive. Its objective is to cover as
many configurations of use as possible.
The Check List table has a column reserved for reviewing designers to verify the line
item has been checked.
6420C–ATARM–01-Oct-09
2. Associated Documentation
Before going further into this application note, it is strongly recommended to check the latest
documents for the AT91SAM9XE Series Microcontrollers on Atmel’s Web site.
Table 2-1 gives the associated documentation needed to support full understanding of this application note.
Table 2-1.
2
Associated Documentation
Information
Document Title
User Manual
Electrical/Mechanical Characteristics
Ordering Information
Errata
AT91SAM9XE Series Product Datasheet
Internal architecture of processor
ARM/Thumb instruction sets
Embedded in-circuit-emulator
ARM9EJ-S™ Technical Reference Manual
ARM926EJ-S™ Technical Reference Manual
Evaluation Kit User Guide
AT91SAM9XE-EK Evaluation Board User Guide
Using SDRAM on AT91SAM9
Microcontrollers
Using SDRAM on AT91SAM9 Microcontrollers
NAND Flash Support in AT91SAM9
Microcontrollers
NAND Flash Support in AT91SAM9 Microcontrollers
Application Note
6420C–ATARM–01-Oct-09
Application Note
3. Schematic Check List
CAUTION: The AT91SAM9 board design must comply with the power-up and power-down sequence guidelines
provided in the Electrical Characteristics section in the datasheet to guarantee reliable operation of the device.
1.8V and 3.3V Dual Power Supply Schematic Example
100nF
VDDANA
GNDANA
100nF
VDDIOP1
DC/DC Converter
GND
VDDIOP0
3.3V
10µF
100nF
GND
VDDIOM
10µF
100nF
GND
100nF
VDDPLL
GNDPLL
100nF
VDDBU
DC/DC Converter
GNDBU
VDDCORE
1.8V
10µF
100nF
GND
1.8V and 3.3V Dual Power Supply Schematic Example
3
6420C–ATARM–01-Oct-09
;
Signal Name
Recommended Pin Connection
VDDCORE
1.65V to 1.95V (1.8V nominal)
Decoupling/Filtering capacitors (100 nF
and 10µF)(1)(2)
VDDBU
1.65V to 1.95V (1.8V nominal)
Decoupling capacitor (100 nF)(1)(2)
Description
Powers the device.
Decoupling/Filtering capacitors must be added to improve
startup stability and reduce source voltage drop.
Powers the Slow Clock oscillator and a part of the System
Controller.
Powers External Bus Interface I/O lines.
VDDIOM(3)
1.65V to 1.95V or 3.0V to 3.6V
Decoupling/Filtering capacitors (100 nF
and 10µF)(1)(2)
Dual voltage range supported. The voltage ranges are
selected by programming the VDDIOMSEL bit in the
EBI_CSA register. At power-up, the selected voltage is
3.3V nominal, and power supply pins can accept either
1.8V or 3.3V.
Decoupling/Filtering capacitors must be added to improve
startup stability and reduce source voltage drop.
VDDIOP0
4
(3)(4)
3.0V to 3.6V
Decoupling/Filtering capacitors (100 nF
and 10µF)(1)(2)
Powers Peripheral I/O lines.
Decoupling/Filtering capacitors must be added to improve
startup stability and reduce source voltage drop.
VDDIOP1(3)(4)
1.65V to 3.6V
(1.8V, 2.5V, 3V or 3.3V nominal)
Decoupling/Filtering capacitors (100 nF
and 10µF)(1)(2)
Powers Peripheral I/O lines.
VDDPLL
1.65V to 1.95V (1.8V nominal)
Decoupling capacitor (100 nF)(1)(2)
Powers the PLL cell.
VDDANA
3.0V to 3.6V
Decoupling capacitor (100 nF)(1)(2)
Powers the ADC cell.
GND
Ground
GND pins are common to VDDCORE, VDDIOM,
VDDIOP0 and VDDIOP1 pins. GND pins should be
connected as shortly as possible to the system ground
plane.
GNDPLL
PLL ground
GNDPLL pin is provided for VDDPLL pin. GNDPLL pin
should be connected as shortly as possible to the system
ground plane.
GNDANA
ADC analog ground
GNDANA pin is provided for VDDANA pin. GNDANA pin
should be connected as shortly as possible to the system
ground plane.
GNDBU
Backup ground
GNDBU pin is provided for VDDBU pin. GNDBU pin
should be connected as shortly as possible to the system
ground plane.
Decoupling/Filtering capacitors must be added to improve
startup stability and reduce source voltage drop.
Application Note
6420C–ATARM–01-Oct-09
Application Note
;
Signal Name
Recommended Pin Connection
Description
Clock, Oscillator and PLL
Crystal Load Capacitance to check
AT91SAM9XE
XIN
XOUT
GND
3 to 20MHz crystal
XIN
XOUT
Main Oscillator
in
Normal Mode
1K
Capacitors on XIN and XOUT (crystal load
capacitance dependent)
1 kOhm resistor on XOUT only required
for crystals with frequencies lower than 8
MHz.
CCRYSTAL
CLEXT
CLEXT
Example: for an 18.432 MHz crystal with a load
capacitance of CCRYSTAL= 18 pF, external capacitors are
required: CLEXT = 10 pF.
Refer to the electrical specifications of the AT91SAM9XE
series datasheet.
XIN
XOUT
Main Oscillator
in
Bypass Mode
XIN: external clock source
XOUT: can be left unconnected.
1.8V (VDDPLL) square wave signal
Duty Cycle: 40 to 60%
Refer to the electrical specifications of the AT91SAM9XE
datasheet.
Crystal load capacitance to check (CCRYSTAL32).
AT91SAM9XE
XIN32
XIN32
XOUT32
Slow Clock
Oscillator
XOUT32
GNDBU
CCRYSTAL32
32.768 kHz Crystal
Capacitors on XIN32 and XOUT32
(crystal load capacitance dependent)
CLEXT32
CLEXT32
Example: for an 32.768 kHz crystal with a load
capacitance of CCRYSTAL32= 12.5 pF, external capacitors
are required: CLEXT32= 17 pF.
Refer to the electrical specifications of the AT91SAM9XE
datasheet.
5
6420C–ATARM–01-Oct-09
;
Signal Name
Recommended Pin Connection
Description
See the Excel spreadsheet:
“ATMEL_PLL_LFT_Filter_CALCULATOR_AT91_xxx.zip”
(available in the software files on the Atmel Web site)
allowing calculation of the best R-C1-C2 component
values for the PLL Loop Back Filter.
PLLRC
Second-order filter
PLL
PLLRCA
R
Can be left unconnected if PLL not used.
C2
C1
PLLRCGND
R, C1 and C2 must be placed as close as possible to the
pins.
Slow Clock Oscillator Selection.
OSCSEL
6
Application dependent.
Please refer to the I/O line considerations
and errata section of the AT91SAM9XE
datasheet.
Must be tied to VDDBU to select the external 32,768 Hz
crystal.
Must be tied to GNDBU to select the on-chip
RC oscillator.
Application Note
6420C–ATARM–01-Oct-09
Application Note
;
Signal Name
Recommended Pin Connection
Description
ICE and JTAG(5)
TCK
Pull-up (100 kOhm)(1)
No internal pull-up resistor.
TMS
Pull-up (100 kOhm)
(1)
No internal pull-up resistor.
TDI
Pull-up (100 kOhm)(1)
No internal pull-up resistor.
TD0
Floating
Output driven at up to VVDDIO1
Internal pull-down resistor (15 kOhm).
JTAGSEL
In harsh(6) environments, it is strongly
recommended to tie this pin to GND if
not used or to add an external low
resistor value (such as 1 KOhm).
NTRST
Please refer to the I/O line considerations
AT91SAM9XE datasheet.
Must be tied to VDDBU to enter JTAG Boundary Scan.
Internal pull-up resistor to VVDDIOP0 (15 kOhm)
Flash Memory
Can be left unconnected for normal
operations.
Internal pull-down resistor (15 kOhm).
It is strongly recommended to tie this
ERASE
pin to GND in harsh(6) environments.
Must be tied to VVDDIO to erase the
General Purpose NVM bits (GPNVMx),
the whole flash content and the security bit
(SECURITY).
This pin is debounced by the RC oscillator to improve the
glitch tolerance.
Minimum debouncing time is 220 ms.
Reset/Test
NRST is configured as an output at power up.
NRST
Application dependant.
Can be connected to a push button for
hardware reset.
TST
In harsh(6) environments, it is strongly
recommended to tie this pin to GND if
not used or to add an external low
resistor value (such as 1 KOhm).
NRST is controlled by the Reset Controller (RSTC).
An internal pull-up resistor to VVDDIOP0 (100 kOhm) is
available for User Reset and External Reset control.
Internal pull-down resistor (15 kOhm).
Shutdown/Wakeup Logic
WKUP
0V to VDDBU
This pin is an input-only.
WKUP behavior can be configured through the Shutdown
Controller (SHDWC).
Application dependent.
A typical application connects the pin
SHDN to the shutdown input of the DC/DC
Converter providing the main power
supplies
The SHDN pin is a tri state output.
No internal pull-up resistor.
An external pull-up to VDDBU is needed.
SHDN
An external pull-up to VDDBU is needed
and its value is to be higher than 1 MOhm.
The resistor value is calculated according
to the regulator enable implementation
and the SHDN level.
SHDN pin is driven low to GNDBU by the Shutdown
Controller (SHDWC).
7
6420C–ATARM–01-Oct-09
;
Signal Name
Recommended Pin Connection
Description
PIO
PAx
PBx
PCx
All PIOs are pulled-up inputs at reset except those which
are multiplexed with the Address Bus signals that require
to be enabled as peripherals:
PC4 (A23),PC5 (A24) and PC10 (A25).
R pullup (typ) = 100 KOhm
Application Dependant
To reduce power consumption if not used, the concerned
PIO can be configured as an output, driven at ‘0’ with
internal pull-up disabled.
EBI
Data Bus (D0 to D31)
Data bus lines D0 to D15 are pulled-up inputs to VVDDIOM
D0-D15
(D16-D31)
at reset.
Application dependent.
Note: Data bus lines D16 to D31 are multiplexed with
the PIOC controller. Their I/O line reset state is
input with pull-up enabled too.
Address Bus (A0 to A25)
All address lines are driven to ‘0’ at reset.
A0-A22
(A23-A25)
Application dependent.
Note: PC4 (A23),PC5 (A24) and PC10 (A25) are
enabled by default at reset through the PIO
controllers.
SMC - SDRAM Controller - CompactFlash® Support - NAND Flash Support
See “External Bus Interface (EBI) Hardware Interface” on page 10.
USB Host (UHP)
HDPA
HDPB
Application dependent(7)
To reduce power consumption, if USB Host is not used,
connect HDPA/HDPB to GND.
HDMA
HDMB
Application dependent(7)
To reduce power consumption, if USB Host is not used,
connect HDMA/HDMB to GND.
USB Device (UDP)
To reduce power consumption, USB Device Built-in Transceivers can be disabled (enabled by default).
Notes:
8
DDP
Application dependent(8)
To reduce power consumption, if USB Device is not used,
connect DHSDP to VVDDIOP.
DDM
Application dependent (8)
To reduce power consumption, if USB Device is not used,
connect DHSDM to GND.
1. These values are given only as a typical example.
Application Note
6420C–ATARM–01-Oct-09
Application Note
2. Decoupling capacitors must be connected as close as possible to the microcontroller and on each concerned pin.
100nF
VDDCORE
100nF
VDDCORE
100nF
VDDCORE
GND
3. The double power supplies VDDIOM, VDDIOP0 and VDDIOP1 power the device differently when interfacing with memories
or with peripherals.
4. Some I/O lines of PIO Controller C are powered by VDDIOP0. See the section “Multiplexing on PIO Controller C” in the
AT91SAM9XE datasheet. Some I/O lines of PIO Controller Bare powered by VDDIOP0 and VDDIOP1. See the section
“Multiplexing on PIO Controller B” in the AT91SAM9XE datasheet.
5. It is recommended to establish accessibility to a JTAG connector for debug in any case.
6. In a well-shielded environment subject to low magnetic and electric field interference, the pin may be left unconnected. In
noisy environments, a connection to ground is recommended.
7. Example of USB Host connection: A termination serial resistor (REXT) must be connected to HDPA/HDPB and HDMA/HDMB.
A recommended resistor value is defined in the electrical specifications of the AT91SAM9XE datasheet.
5V
0.20A
Type A Connector
10μF
HDMA
or
HDMB
100nF
10nF
REXT
HDPA
or
HDPB
REXT
8. Example of USB Device connection: As there is an embedded pull-up, no external circuitry is necessary to enable and disable the 1.5 kOhm pull-up. Internal pull-downs on DDP and DDM are embedded to prevent over consumption when the host
is disconnected. A termination serial resistor (REXT) must be connected to DDP and DDM. A recommended resistor value is
defined in the electrical specifications of the AT91SAM9XE datasheet.
PIO
5V Bus Monitoring
27 K
47 K
REXT
DDM
2
1
3
Type B 4
Connector
DDP
REXT
9
6420C–ATARM–01-Oct-09
4. External Bus Interface (EBI) Hardware Interface
Table 4-1 and Table 4-2 detail the connections to be applied between the EBI pins and the external devices for each Memory Controller:
Table 4-1.
EBI Pins and External Static Devices Connections
Pins of the Interfaced Device
8-bit Static
Device
Signals:
EBI_
2 x 8-bit
Static
Devices
16-bit Static
Device
Controller
4 x 8-bit
Static
Devices
2 x 16-bit
Static
Devices
32-bit Static
Device
SMC
D0 - D7
D0 - D7
D0 - D7
D0 - D7
D0 - D7
D0 - D7
D0 - D7
D8 - D15
–
D8 - D15
D8 - D15
D8 - D15
D8 - 15
D8 - 15
D16 - D23
–
–
–
D16 - D23
D16 - D23
D16 - D23
D24 - D31
–
–
–
D24 - D31
D24 - D31
D24 - D31
BE0(5)
A0/NBS0
A0
–
NLB
–
A1/NWR2/NBS2
A1
A0
A0
WE(2)
NLB(4)
BE2(5)
A2 - A22
A[2:22]
A[1:21]
A[1:21]
A[0:20]
A[0:20]
A[0:20]
A23 - A25
A[23:25]
A[22:24]
A[22:24]
A[21:23]
A[21:23]
A[21:23]
NCS0
CS
CS
CS
CS
CS
CS
NCS1/SDCS
CS
CS
CS
CS
CS
CS
NCS2
CS
CS
CS
CS
CS
CS
NCS2/NANDCS
CS
CS
CS
CS
CS
CS
NCS3/NANDCS
CS
CS
CS
CS
CS
CS
NCS4/CFCS0
CS
CS
CS
CS
CS
CS
NCS5/CFCS1
CS
CS
CS
CS
CS
CS
NRD/CFOE
OE
OE
OE
OE
OE
OE
WE
WE
NWR0/NWE
WE
WE
(1)
(1)
NWR1/NBS1
–
WE
NWR3/NBS3
–
–
Notes:
WE
NUB
–
NLB
(3)
WE
(2)
WE
(2)
WE(2)
(3)
BE1(5)
NUB(4)
BE3(5)
NUB
1. NWR1 enables upper byte writes. NWR0 enables lower byte writes.
2. NWRx enables corresponding byte x writes. (x = 0,1,2 or 3)
3. NBS0 and NBS1 enable respectively lower and upper bytes of the lower 16-bit word.
4. NBS2 and NBS3 enable respectively lower and upper bytes of the upper 16-bit word.
5. BEx: Byte x Enable (x = 0,1,2 or 3).
10
Application Note
6420C–ATARM–01-Oct-09
Application Note
.
Table 4-2.
EBI Pins and External Devices Connections
Pins of the Interfaced Device
Signals:
EBI0_, EBI1_
Controller
SDRAM
CompactFlash
(EBI0 only)
SDRAMC
CompactFlash
True IDE Mode
(EBI0 only)
NAND Flash
SMC
D0 - D7
D0 - D7
D0 - D7
D0 - D7
I/O0-I/O7
D8 - D15
D8 - D15
D8 - 15
D8 - 15
I/O8-I/O15
D16 - D31
D16 - D31
–
–
–
A0/NBS0
DQM0
A0
A0
–
A1/NWR2/NBS2
DQM2
A1
A1
–
A2 - A10
A[0:8]
A[2:10]
A[2:10]
–
A11
A9
–
–
–
SDA10
A10
–
–
–
–
–
–
–
A[11:12]
–
–
–
–
–
–
–
A16/BA0
BA0
–
–
–
A17/BA1
BA1
–
–
–
A18 - A20
–
–
–
–
A21/NANDALE
–
–
–
ALE
A22/NANDCLE
–
REG
REG
CLE
A23 - A24
–
–
A12
A13 - A14
A15
–
–
(1)
A25
–
NCS0
–
–
–
–
CS
–
–
–
NCS2
–
–
–
–
NCS2/NANDCS
–
–
–
–
NCS3/NANDCS
–
–
NCS1/SDCS
NCS4/CFCS0
–
CFRNW
(1)
CFRNW
–
CFCS0
(1)
CFCS1
(1)
–
CE
CFCS0
(1)
–
CFCS1
(1)
–
NCS5/CFCS1
–
NANDOE
–
–
–
OE
NANDWE
–
–
–
WE
NRD/CFOE
–
OE
–
–
NWR0/NWE/CFWE
–
WE
WE
–
NWR1/NBS1/CFIOR
DQM1
IOR
IOR
–
NWR3/NBS3/CFIOW
DQM3
IOW
IOW
–
CFCE1
–
CE1
CS0
–
CFCE2
–
CE2
CS1
–
11
6420C–ATARM–01-Oct-09
Table 4-2.
EBI Pins and External Devices Connections (Continued)
Pins of the Interfaced Device
Signals:
EBI0_, EBI1_
Controller
SDRAM
CompactFlash
(EBI0 only)
SDRAMC
CompactFlash
True IDE Mode
(EBI0 only)
NAND Flash
SMC
SDCK
CLK
–
–
–
SDCKE
CKE
–
–
–
RAS
RAS
–
–
–
CAS
CAS
–
–
–
SDWE
WE
–
–
–
NWAIT
–
WAIT
WAIT
–
Pxx
(2)
–
CD1 or CD2
CD1 or CD2
–
Pxx
(2)
–
–
–
CE
Pxx
(2)
–
–
–
RDY
Notes:
1. Not directly connected to the CompactFlash slot. Permits the control of the bidirectional buffer between the EBI data bus and
the CompactFlash slot.
2. Any PIO Line
12
Application Note
6420C–ATARM–01-Oct-09
Application Note
5. AT91SAM Boot Program Hardware Constraints
See AT91SAM Boot Program section of the AT91SAM9XE datasheet for more details on the
boot program.
5.1
5.1.1
AT91SAM Boot Program Supported Crystals (MHz)
On-chip RC Selected (OSCSEL=0)
If the Internal RC Oscillator is used (OSCSEL = 0) and the Main Oscillator is active:
Table 5-1.
Supported Crystals (MHz)
3.0
6.0
18.432
Other Crystal
Boot on DBGU
Yes
Yes
Yes
Yes
Boot on USB
Yes
Yes
Yes
No
Note:
Any other crystal can be used but it prevents using the USB for SAM-BA® Boot.
If the Internal RC Oscillator is used (OSCSEL = 0) and the Main Oscillator is bypassed:
Table 5-2.
1.0
2.0
6.0
12.0
25.0
50.0
Other Frequency
Boot on DBGU
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Boot on USB
Yes
Yes
Yes
Yes
Yes
Yes
No
Note:
5.1.2
Supported Input Frequencies (MHz)
Any other input frequency can be used but it prevents using the USB.
External 32,768 Hz Crystal Selected (OSCSEL=1)
If an external 32,768 Hz Oscillator is used (OSCSEL = 1) and the Main Oscillator is active or in
bypass mode:
Table 5-3.
Supported Crystals (MHz)
3.0
3.2768
3.6864
3.84
4.0
4.433619
4.9152
5.0
5.24288
6.0
6.144
6.4
6.5536
7.159090
7.3728
7.864320
8.0
9.8304
10.0
11.05920
12.0
12.288
13.56
14.31818
14.7456
16.0
17.734470
18.432
20.0
-
Note:
Booting either on USB or on DBGU is possible with any of these input frequencies.
13
6420C–ATARM–01-Oct-09
5.2
SAM-BA Boot
The SAM-BA Boot Assistant supports serial communication via the DBGU or the USB Device
Port.
Table 5-4.
14
Pins Driven during SAM-BA Boot Program Execution
Peripheral
Pin
PIO Line
DBGU
DRXD
PB14
DBGU
DTXD
PB15
Application Note
6420C–ATARM–01-Oct-09
Application Note
Revision History
Doc. Rev
Comments
(8)
6420C
was edited on page 9.
Change
Request Ref.
6696
In “USB Host (UHP)” on page 8, Recommended Pin Connection column was edited for HDPA-HDPB
and HDMA-HDMB.
6697
XIN XOUT main oscillator, change capacitance of crystal in Section 3. “Schematic Check List”
rfo
Change voltage to VDDIOP1 in Section 3. “Schematic Check List”
rfo
VDDIOP to VDDBU change in Section 3. “Schematic Check List”
5857
Add OSCSEL to table in Section 3. “Schematic Check List”
5863
CAUTION message added before main table in Section 3. “Schematic Check List”
6124
SHDN pin edit in Section 3. “Schematic Check List”
6029-6149
6420B
6420A
First issue
15
6420C–ATARM–01-Oct-09
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6420C–ATARM–01-Oct-09