austriamicrosystems AG is now ams AG The technical content of this austriamicrosystems datasheet is still valid. Contact information: Headquarters: ams AG Tobelbaderstrasse 30 8141 Unterpremstaetten, Austria Tel: +43 (0) 3136 500 0 e-Mail: [email protected] Please visit our website at www.ams.com austriamicrosystems AS3685C Datasheet Datasheet AS3685C 1 General Description LED cathode disconnect in Shutdown Overtemperature Protection Automatic Flash Timeout to protect the LED − Adjustable between off, 100ms…1500ms Two Wire Interface − Accurate Control of Currents and Modes am lc s on A te G nt st il Additionally the AS3685 limits the flash time automatically to protect the flash LED. 2 Key Features lv The AS3685 is low noise high efficiency capacitive charge pump with 1:1, 1:1.5 and 1:2 operating modes in a small 3x3mm DFN10 or a tiny 2x1.5mm WL-CSP (Wafer Level Chip Scale Package) package. It can drive one flash led at up to 1000mA current. It supports flash/torch and indicator mode for the flash led. al id Ultra Small High Efficiency 1000mA Charge Pump for White LED Flash with Two Wire Serial Interface High Efficiency capactive charge pump with 1:1, 1:1.5 and 1:2 modes − 1:2 Mode can be disabled by interface Up to 1000mA Led Current Automatic Charge Pump Mode switching (Up) Package − DFN10 3x3mm (10 pins + exposed pad) − WL-CSP (Wafer Level Chip Scale Package) 3x4 balls 0.5mm pitch (2x1.5mm) 3 Applications Flash / Torch for Mobile Phones, Digital Cameras and PDA 4 Application Diagram Te ch ni ca Figure 1 – Application Diagram of AS3685C www.austriamicrosystems.com/AS3685 (ptr) 1.1 1 - 21 AS3685C Datasheet Table of Contents General Description........................................................................................................................................... 1 Key Features ..................................................................................................................................................... 1 Applications ....................................................................................................................................................... 1 Application Diagram .......................................................................................................................................... 1 Characteristics................................................................................................................................................... 3 5.1 Absolute Maximum Ratings..................................................................................................................... 3 5.2 Operating Conditions .............................................................................................................................. 3 5.3 Electrical Characteristics ......................................................................................................................... 4 6 Typical Operation Characteristics...................................................................................................................... 6 7 Detailed Functional Description ......................................................................................................................... 8 7.1 Low Noise Charge Pump ........................................................................................................................ 8 7.1.1 Mode Switching........................................................................................................................ 8 7.1.2 Soft Start .................................................................................................................................. 9 7.2 Current Source (Sink).............................................................................................................................. 9 7.2.1 AS3685 TXMask Function...................................................................................................... 12 7.3 Protection Functions.............................................................................................................................. 13 7.3.1 Overtemperature Protection ................................................................................................... 13 7.3.2 Flash Timeout ........................................................................................................................ 13 7.4 Layout Recommendations..................................................................................................................... 13 8 External Components ...................................................................................................................................... 14 8.1 Capacitor and Resistor Selection .......................................................................................................... 14 8.2 Usage of PCB Wire Inductance............................................................................................................. 14 8.3 External Component Specifications ...................................................................................................... 14 9 Pinout and Packaging...................................................................................................................................... 15 9.1 DFN10 3x3mm ...................................................................................................................................... 15 9.1.1 Pin Assignments DFN10 3x3mm ........................................................................................... 15 9.1.2 Pin Descriptions DFN10 3x3mm ............................................................................................ 15 9.1.3 Package Drawings and Marking DFN10 3x3.......................................................................... 16 9.2 WL-CSP 2x1.5mm (Wafer Level Chip Scale Package) ......................................................................... 18 9.2.1 Pin Assignments WL-CSP 2x1.5mm...................................................................................... 18 9.2.2 Pin Descriptions WL-CSP 2x1.5mm....................................................................................... 18 9.2.3 Package Drawings and Marking WL-CSP 2x1.5mm .............................................................. 19 10 Ordering Information........................................................................................................................................ 20 Te ch ni ca am lc s on A te G nt st il lv al id 1 2 3 4 5 www.austriamicrosystems.com/AS3685 (ptr) 1.1 2 - 21 AS3685C Datasheet 5 Characteristics 5.1 Absolute Maximum Ratings Stresses beyond those listed in Table 1 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Section 5 Electrical Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameter Min Max Unit VBATMAX Maximum Supply Voltage -0.3 7.0 V IIN Input Pin Current without causing latchup -25 +25 mA TSTRG Storage Temperature Range -55 125 °C Humidity 5 85 % VESD Electrostatic Discharge -1000 1000 V PT Total Continuous Power Dissipation TBODY Notes: 1. Non condensing Norm: MIL 883 E Method 3015 W DFN10 3x3mm, TA = 70°C 1 1.02 W WL-CSP 2x1.5mm, TA = 70°C 1 16.3 mW/ °C DFN10 3x3mm 14.7 mW/ °C WL-CSP 2x1.5mm Junction Temperature 150 °C Body Temperature during Soldering 260 °C am lc s on A te G nt st il TJUNC At 25ºC, Norm: Jedec 17 1.14 PT Derating Factor 2 PDERATE Note lv Symbol al id Table 1 – Absolute Maximum Ratings according to IPC/JEDEC JSTD-020 Depending on actual PCB layout and PCB used; for peak power dissipation during flashing see document ‘AS3685 Thermal Measurements’ For 1A flash current see application notes ‘AN3685_1Aflash’ and ‘AN3685_1Aflash_thermal_1v0’. The PT derating factor changes the total continuous power dissipation, if the ambient temperature is different to 70°C. Therefore for e.g. 85°C calculate PT85°C = PT – PDERATE * (85°C – 70 °C) 2. ca 5.2 Operating Conditions Table 2 – Operating Conditions VBAT Parameter Min Typ Max Unit Note Battery Supply Voltage 3.0 3.6 5.5 V Supply voltage range Battery Supply Voltage, Functionally working 2.6 V AS3685 functionally working, but not all parameters fulfilled 0.4 A Depending on load current and charge pump mode 2.0 A Limited lifetime, max 20,000s 25 85 °C 1.0 4.0 μA ni Symbol ch VBATFUNC Te IBAT Operating Current TAMB Ambient Temperature IOFF Off mode current www.austriamicrosystems.com/AS3685 (ptr) -30 1.1 Mode setting=off; VBAT<=4.2V 3 - 21 AS3685C Datasheet Table 2 – Operating Conditions Symbol Parameter IOPERATING Min Typ Power Consumption without load Max Unit Note 0.85 mA 1:1 Mode 6.6 mA 1:1.5 Mode 8.1 mA 1:2 Mode Max Unit Note VBAT * CPmode V CP-mode is 1, 1.5 or 2 (automatically selected) Parameter VCPOUT V(VCP) Output voltage without load – do not short to VSS Output limitation Min Typ Charge Pump effective Resistance RCP Eta 5.4 5.6 0.28 0.53 internally limited Ω 1:1 Mode VBAT = 3.6V, ICPOUT = 200mA am lc s on A te G nt st il Symbol lv Table 3 – Charge Pump Characteristics al id 5.3 Electrical Characteristics Efficiency 1.37 2.00 Ω 1:1.5 Mode VBAT = 3.3V, ICPOUT = 500mA, TJUNCTION<=85°C 1.95 2.44 Ω 1:2 Mode VBAT = 3.0V, ICPOUT=700mA, TJUNCTION<=85°C 93 % Vin=3.0V-4.5V, Iout=100mA (Charge Pump alone) mVpp Vin=3.0-4.5V, Iout=350mA, 75 VRIPPLE Output ripple voltage fclk Operating Frequency tUP_DEB_LONG Initial Mode Switching Debounce Time 256 μs tUP_DEB Mode Switching Debounce Time 16 μs 100 -20% 1.0 +20% MHz Mode switching up-debounce time after enabling of the charge pump or after mode switching between 1:1 to 1:1.5 Mode switching up-debounce time in normal operation ca Table 4 – Current Source (Sink) Characteristics Symbol Parameter Output Current Range ni ILED Min IACCURACY Current Setting Accuracy -10% Typ Max Unit Note 700 1000 mA 700mA: RISET = 14.2kΩ 1000mA: RISET = 10kΩ 500 +10% mA Measured with RISET = 19.9kΩ and maximum flash current Indicator Current setting 1.0 mA VISET Current Generator Set Point Voltage (pin ISET) 1.3 V IISET Current Generator operating range IFLASH2ISET Flash Current to Bias Current Ratio VSWITCH Mode Switching Threshold on V(ILED) between 1:1 -> 1:1.5 and 1:1.5 -> 1:2 Te ch IINDICATOR www.austriamicrosystems.com/AS3685 (ptr) 10.0 130 7650 350 400 1.1 μA A/A 450 mV IISET = VISET / RISET if the resulting bias current is higher than 200μA (typ.), the current source is disabled At full flash current (700mA with RISET = 14.2kΩ) Data1<7:0>(flash LED current) >= 0x80h in flash mode; ILED>350mA @ RISET=14.2kΩ 4 - 21 AS3685C Datasheet Table 4 – Current Source (Sink) Characteristics Symbol Parameter Min Typ Max Unit Note 150 200 250 mV All lower currents Min Typ Max Unit Note Parameter VIH High Level Input voltage 1.5 VBAT V VIL Low Level Input voltage 0.0 0.5 V ILEAKAGE Input pin leakage current -10 10 μA Max Unit Table 6 – Protection Functions Parameter Min Typ Note If the junction temperature exceeds TOVTEMP, the current sink will be disabled and the charge pump switched back into 1:1 mode until the temperature drops below TOVTEMP - TOVTEMPHYST am lc s on A te G nt st il Symbol For Pins SCL and SDA lv Symbol al id Table 5 –Digital Interface characteristics TOVTEMP Overtemperature protection 140 °C TOVTEMPHYST Overtemperature protection Hysteresis 5 °C tFLASHTIMEOUT Flash Timeout Time 100… 1500 +20% ms adjustable by register Flash Timeout Timer Te ch ni ca -20% www.austriamicrosystems.com/AS3685 (ptr) 1.1 5 - 21 AS3685C Datasheet 6 Typical Operation Characteristics Figure 2 – Efficiency vs. Battery Voltage (with Lumiled PWF1) Figure 3 – Battery Current vs. Battery Voltage (with Lumiled PWF1) 1.6 100 ILED=100m ILED=200m ILED=300m ILED=400m 90 1.4 1.2 ILED=500m 80 70 ILED=700m ILED=600m 0.6 ILED=700m ILED=500m ILED=400m ILED=300m 0.4 50 ILED=200m 0.2 ILED=50m ILED=100m lv ILED=600m 60 0.8 0.0 40 2.8 3.2 3.6 4.0 4.4 4.8 2.8 5.2 3.2 3.6 4.0 5.2 Figure 5 – Linearty of Current Sink 0.8 0.7 ILED=700m 0.6 0.6 ILED=500m 0.3 ILED [A] ILED=300m ILED=100m 0.1 ILED=50m 0.0 2.8 3.2 ILED=500m ILED=400m 0.4 0.3 ILED=200m 0.2 ILED=600m 0.5 ILED=400m 0.4 ILED=700m 0.7 ILED=600m 0.5 ILED [A] 4.8 am lc s on A te G nt st il Figure 4 – LED current I(ILED) vs. Battery Voltage (with Lumiled PWF1) ILED=300m ILED=200m 0.2 ILED=100m 0.1 ILED=50m 3.6 4.0 4.4 4.8 0.0 5.2 0.0 VBAT [V] 0.5 1.0 1.5 2.0 2.5 VILED [V] Figure 6 –I(ILED) vs. R(ISET) Figure 7 – Typical Operating Waveforms 1:1.5 Mode ca 1200 ni 1000 Maximum Flash Current 800 600 ch ILED [mA] 4.4 VBAT [V] VBAT [V] 0.8 al id 1.0 IBAT [A] Efficiency of Charge Pump [%] ILED=50m 400 Te 200 0 0k 20k 40k 60k 80k 100k 120k 140k VCP ac-coupled, 100mV/div 1µs/div RISET [Ohm] www.austriamicrosystems.com/AS3685 (ptr) VBAT=3.3V, ILED=500mA 1.1 6 - 21 AS3685C Datasheet al id Figure 8 – Typical Operating Waveforms 1:2 Mode Te ch ni ca am lc s on A te G nt st il lv VCP ac-coupled, 50mV/div 250ns/div VBAT=3.3V, ILED=500mA www.austriamicrosystems.com/AS3685 (ptr) 1.1 7 - 21 AS3685C Datasheet 7 Detailed Functional Description am lc s on A te G nt st il lv al id Figure 9 – Internal Circuit Diagram of AS3685C 7.1 Low Noise Charge Pump The AS3685 charge pump uses two external flying capacitors to generate output voltages higher than the battery voltage. The charge pump can operate in three different modes: ni 1:1 Bypass Mode or Off Mode − Battery input and output are connected by a low-impedance switch − Battery current = output current 1:1.5 Mode − The output voltage is 1.5 times the battery voltage (without load) − Battery current = 1.5 times output current 1:2 Mode − The output voltage is 2 times the battery voltage (without load) − Battery current = 2 times output current ca ch The flying capacitors are switched at the fixed frequency fclk. 7.1.1 Mode Switching Te The AS3685 monitors the voltage at the current sink V(ILED) and if this voltage falls below VSWITCH, for a time longer than the debounce time, the charge pump automatically switches into a higher mode. The debounce time is set to tUP_DEB_LONG at enabling of the charge pump or immediately after a 1:1 to 1:1.5 mode change. Afterwards the debounce time is reduced to tUP_DEB. (This allows the LED current to settle properly on startup or after a mode change) The charge pump enters always 1:1 mode in off mode or in case of overtemperature. It is possible to avoid the 1:2 mode (register programmable) to limit the battery current to 1.5 times the output (=LED) current. www.austriamicrosystems.com/AS3685 (ptr) 1.1 8 - 21 AS3685C Datasheet 7.1.2 Soft Start The soft start mechanism reduces the inrush current. Battery current is smoothed when switching the charge pump on and also at each switching condition. This precaution reduces electromagnetic radiation significantly. 7.2 Current Source (Sink) al id The AS3685 operates in three different modes: Indicator Mode: A small (average) current is used to obtain an indication function with the flash LED (e.g. indication for camera operation) Torch Mode: A moderate current of e.g. 150mA allows the use of the flash LED as a torch or video light Flash Mode: A high current of e.g. 700mA (up to 1000mA) is set for a high brightness flash. Only in this mode, the flash timeout timer limits the total flash time. lv The current through the LED and the operating mode is controlled by the two digital interface connected to SCL and SDA. The current is controlled with a two wire bus interface commands similar to I2C communication (device address 82h, only commands writing to the AS3685 are possible, no readback) as shown in following figure: ca am lc s on A te G nt st il Figure 10 – Two wire interface waveform ni Data from the bus is always captured on the rising edge of the SCL signal; therefore the data on SDA has to be stable slightly before this rising edge. Te ch The strobe command is merged with the interface commands and all other devices connected to the bus will ignore these commands. Only the AS3685 will also use these commands and switch on/off the flash led with the strobe pin (The strobe function can be enabled/disabled by the interface and its polarity is selectable): www.austriamicrosystems.com/AS3685 (ptr) 1.1 9 - 21 AS3685C Datasheet Using the above external circuit, an active strobe function can be implemented as follows: am lc s on A te G nt st il lv Figure 12 – Timing Diagram of the AS3685 using active High strobe function al id Figure 11 – External circuit of the AS3685 using active High strobe function Alternatively (if the device driving SCL has only the possibility to pulldown the SCL line, but does not actively control high/low/tristate of the SCL line) use following circuit: Te ch ni ca Figure 13 – External circuit of the AS3685 using active Low strobe function www.austriamicrosystems.com/AS3685 (ptr) 1.1 10 - 21 AS3685C Datasheet The control waveform is shown in the next figure: lv al id Figure 14 – Timing Diagram of the AS3685 using active Low strobe function am lc s on A te G nt st il If the strobe function is not used at all, the interface can be addressed like a normal slave (only writing access). The strobe function does not violate the two wire interface specification. Data1 setups the flash current from 0mA to 1000mA, Data2 can be used to set the preview current and Data3 will set the operating mode, can lock 1:2 charge pump mode and set or disable the flash mode timeout time. Table 7 – Current and Mode Setting for the AS3685 Register Purpose Data1<7:0> Data2<6:0> Current Setting Torch (Preview) not used – leave at 0 ni ca Data2<7> Current Setting Flash Mode setting Te ch Data3<2:0> www.austriamicrosystems.com/AS3685 (ptr) Comments Flash Mode current setting, Flash Timeout timer used if the mode setting uses this current 0mA to 1000mA (for RISET=10kΩ) 0mA to 700mA (for RISET=14.2kΩ) Torch (=Preview or Assist) Mode current setting, no timeout timer used for this current setting 0mA to 500mA 0mA to 350mA (for RISET=10kΩ) (for RISET=14.2kΩ) not used 000 … Off (Power down; Charge Pump in 1:1 mode) 001 … Indicator Mode Data2<7> = 0: ILED = 0.5mA Data2<7> = 1: ILED = 1.0mA 010 … Torch (=Preview) Mode (Data2 sets current) 011 … Flash Mode (Data1 sets current) 100 … Preview / Flash Mode, STROBE active high STROBE=H: Flash mode (Data1 sets current) STROBE=L: Preview mode (Data2 sets current) 101 … Preview / Flash Mode, STROBE active low STROBE=L: Flash mode (Data1 sets current) STROBE=H: Preview mode (Data2 sets current) 110 … Force Charge Pump into 1:1.5 mode; no current is flowing through the current sink (AS3685 can be used as voltage generator for e.g. backlight LEDs with additional external current source(s)) 111 … Force Charge Pump into 1:2 mode; no current is flowing through the current sink (AS3685 can be used as voltage generator for e.g. backlight LEDs with additional external current source(s)) 1.1 11 - 21 AS3685C Datasheet Table 7 – Current and Mode Setting for the AS3685 Purpose Data3<3> Avoid 1:2 Mode Data3<7:4> Comments 0 … Charge Pump can use 1:2 Mode 1 … Charge Pump does not use 1:2 Mode; ignored if Data3<2:0> is set to 111 (forced 1:2 mode) 0000 … Disable Timeout timer for Flash Mode 0001 … 100ms Timeout timer for Flash Mode 0010 … 200ms Timeout timer for Flash Mode Flash Timeout Timer … 1111 … 1500ms Timeout timer for Flash Mode 7.2.1 AS3685 TXMask Function al id Register lv If the battery has to supply two high currents at the same time (e.g. the AS3685 flash and a RF-power amplifier) it is possible, that the total current causes a high voltage drop on the battery resulting in a shutdown of the complete system. In order to avoid this shutdown, the AS3685 (AS3685A or AS3685B) can reduce its current with the signal ‘TXMask’ using the following circuit: am lc s on A te G nt st il Figure 15 – TXMask function of the AS3685 The TXMask signal is connected to e.g. the (RF-) power amplifier enable pin (active high if the PA is enabled). This reduces the flash current if the power amplifier is enabled and avoids the unexpected shutdown of the system. Note: The internal flash timeout timer (tFLASHTIMEOUT) to limit the total flash duration, is not affected by the TXMask function (see also section ‘Flash Timeout’). ca The IISET current (current into the pin ISET) for TXMask = 0 can be calculated with: 0 V ISET VISET R ISET RTXMASK ni IISET , TXMask 1.3 V RISET 1.3 V R TXMASK For TXMask = 1 the current IISET is reduced to: 1 ch IISET , TXMask V ISET V ISET V TXMask R ISET R TXMASK 1.3 V RISET 1.3 V V TXMask RTXMASK Te V(TXMask) is the actual voltage for the high level (‘1’) for the signal TXMask The maximum flash current ILEDMAX for TXMask=0 or 1 can be calculated according to the following formula using the above obtained IISET values: ILEDMAX IFLASH2BIAS IISET 7650 I ISET Choose the values for RISET and RTXMASK according to your application requirements. www.austriamicrosystems.com/AS3685 (ptr) 1.1 12 - 21 AS3685C Datasheet 7.3 Protection Functions 7.3.1 Overtemperature Protection If the AS3685 junction temperature exceeds TOVTEMP, the current sink will be disabled and the charge pump forced into 1:1 mode. If the junction temperature drops below TOVTEMP – TOVTEMPHYST, the device enables the current sink again and the charge pump resumes normal operation. 7.3.1.1 LED Shortcircuit protection al id If the LED is shorted (VCP to ILED), then depending on the set current and the resulting high power dissipation inside the AS3685, the overtemperature protection will trigger. This protects the AS3685 and the system against damage. If the AS3685 is in off-mode, then shorting of the diode will have no influence on the system. Note: Do not short VCP to VSS if the supply is not current limited (e.g. by an internal protection inside the battery), as there is an internal diode between VBAT (anode) and VCP (cathode). 7.3.2 Flash Timeout 7.4 Layout Recommendations am lc s on A te G nt st il To improve the heat dissipation, use a massive ground plane. lv The flash duration of a single flash is limited automatically to tFLASHTIMEOUT (applies only for ‘Flash’ mode(s)). This protects the flash LED against thermal damage. Figure 16 – AS3685 DFN10 3x3mm Layout Recommendation Te ch ni ca Figure 17 – AS3685 WL-CSP 2x1.5mm Layout Recommendation www.austriamicrosystems.com/AS3685 (ptr) 1.1 13 - 21 AS3685C Datasheet 8 External Components 8.1 Capacitor and Resistor Selection Use low-ESR ceramic capacitors with X7R or X5R dielectric. These capacitors allow good filtering and have a wide temperature range. The connections of all external capacitors should be kept as short as possible. All resistors should have a tolerance of ±1%. 8.2 Usage of PCB Wire Inductance al id The inductance between the battery and pin VBAT can be used as a filter to reduce disturbance on the battery. Instead of using one capacitor (CBAT) it is recommended to split CBAT into CBAT1 and CBAT2 with the capacitance of CBAT1 = CBAT2 = CBAT lv It is recommended to apply a minimum of 20nH (maximum 200nH) with low impedance. This inductance can be realized on the PCB without any discrete coil. Assuming that a 1mm signal line corresponds to approximately 1nH (valid if the length (L) is significantly bigger than the width (W) of the line (L/W <10)), a line length of 20mm < L < 200mm is recommended. The shape of the line is not important. am lc s on A te G nt st il Figure 18 – PCB Wire Inductance Example1 L Battery Connector AS3685 Pin VBAT CBAT1 VSS LTOTAL = L CBAT2 VSS Figure 19 – PCB Wire Inductance Example2 L1 CBAT1 VSS AS3685 Pin VBAT CBAT2 L2 Battery Connector LTOTAL = L1 + 10*L2 VSS ca 8.3 External Component Specifications Table 8 – External Components List Tol (Min) Rating (Max) 2.2μF +/-20% 6.3V CFLY1, CFLY2 1.0μF +/-20% 6.3V CVCP 2.2μF +/-20% 6.3V Min Te ch CBAT 1 RISET RTXMASK DLED Notes: Value Typ ni Part 10kΩ Max 130kΩ See section ‘TXMask function’ Notes Package (min) Ceramic, X5R 0603 e.g. Murata GRM21BR71A225KA01L Ceramic, X5R e.g. Murata GRM188R60J105K Ceramic, X5R e.g. Murata GRM21BR71A225KA01L 0603 (0402, 0405) 0603 +/-1% Current Set Resistor 0201 +/-1% TXMask Set Resistor 0201 Flash Led 1. See section ‘Usage of PCB Wire Inductance’ www.austriamicrosystems.com/AS3685 (ptr) 1.1 14 - 21 AS3685C Datasheet 9 Pinout and Packaging 9.1 DFN10 3x3mm 9.1.1 Pin Assignments DFN10 3x3mm am lc s on A te G nt st il lv al id Figure 20 –Pin Assignments DFN10 3x3mm 9.1.2 Pin Descriptions DFN10 3x3mm Table 9 – Pin Type Descriptions DFN10 3x3mm Pin Type Description AI/O Analog Pin DI Digital Input S Supply Pin Table 10 – Pin Descriptions DFN10 3x3mm Pin Number Pin Name Type Description 1 C2- AI/O Flying Capacitor 2 connection – connect 1μF ceramic capacitor CFLY2 between C2- and C2+ VBAT S C1+ AI/O 2 ca 3 4 AI/O SCL DI ni 5 VCP Battery Supply Voltage Flying Capacitor 1 connection – connect 1μF ceramic capacitor CFLY1 between C1- and C1+ Charge Pump Output voltage – connect flash LED anode to this pin and add CVCP capacitor with 2.2μF to VSS Digital Control Signal two wire interface clock input ISET AI/O Current Generator input pin – connect current set resistor RISET between this pin and VSS (and optional RTXMASK) SDA DI/O Digital Input/Output Control two wire interface data signal 8 C2+ AI/O Flying Capacitor 2 connection – connect 1μF ceramic capacitor CFLY2 between C2- and C2+ 9 ILED AI/O Current Source input pin – connect flash LED cathode to this pin 10 C1- AI/O Flying capacitor 1 connection – connect 1μF ceramic capacitor CFLY1 between C1- and C1+ Exposed Pad VSS S 6 Te ch 7 www.austriamicrosystems.com/AS3685 (ptr) Ground Connection – a proper thermal connection with several vias to the ground plane is recommended 1.1 15 - 21 AS3685C Datasheet 9.1.3 Package Drawings and Marking DFN10 3x3 al id Figure 21 – DFN10 – 3x3mm Pacakge Drawing am lc s on A te G nt st il lv Top View ch ni ca Bottom View (rotated) Te Marking: Line 1: AYWW A = Pb-Free Identifier Y = Year WW = Week Line 2: XZZ X = Plant Identifier ZZ = Letters of Free Choice Line 3: AS8C for AS3685C www.austriamicrosystems.com/AS3685 (ptr) 1.1 16 - 21 AS3685C Datasheet Te ch ni ca am lc s on A te G nt st il lv al id Figure 22 – DFN10 – 3x3mm Detail Dimensions www.austriamicrosystems.com/AS3685 (ptr) 1.1 17 - 21 AS3685C Datasheet 9.2 WL-CSP 2x1.5mm (Wafer Level Chip Scale Package) 9.2.1 Pin Assignments WL-CSP 2x1.5mm am lc s on A te G nt st il 9.2.2 Pin Descriptions WL-CSP 2x1.5mm lv al id Figure 23 – WL-CSP 2x1.5mm Pin Assignments Table 11 – Pin Type Descriptions WL-CSP 2x1.5mm Pin Type Description AI/O Analog Pin DI Digital Input S Supply Pin Table 12 – Pin Descriptions WL-CSP 2x1.5mm Pin Number Pin Name Type A1 SCL DI Digital Control Signal two wire interface clock input VSS S Ground Connection – a proper thermal connection to the ground plane is recommended ISET AI/O Current Generator input pin – connect current set resistor RISET between this pin and VSS (and optional RTXMASK) C1+ AI/O Flying Capacitor 1 connection – connect 1μF ceramic capacitor CFLY1 between C1- and C1+ A2 A3 B2 Charge Pump Output voltage – connect flash LED anode to this pin and add CVCP capacitor with 2.2μF to VSS SDA DI/O Digital Input/Output Control two wire interface data signal VBAT S C2+ AI/O Flying Capacitor 2 connection – connect 1μF ceramic capacitor CFLY2 between C2- and C2+ ch C2 AI/O ni B3 C1 VCP ca B1 Description Battery Supply Voltage ILED AI/O Current Source input pin – connect flash LED cathode to this pin D1 C2- AI/O Flying Capacitor 2 connection – connect 1μF ceramic capacitor CFLY2 between C2- and C2+ D2 C1- AI/O Flying capacitor 1 connection – connect 1μF ceramic capacitor CFLY1 between C1- and C1+ D3 VSS S Te C3 www.austriamicrosystems.com/AS3685 (ptr) Ground Connection – a proper thermal connection to the ground plane is recommended 1.1 18 - 21 AS3685C Datasheet 9.2.3 Package Drawings and Marking WL-CSP 2x1.5mm Marking: am lc s on A te G nt st il Line 1: austriamicrosystems logo Line 2: AS3685C Line 3: AYWWIZZ A = Pb-Free Identifier Y = Year WW = Week I = Plant Identifier ZZ = Letters of Free Choice lv al id Figure 24 – WL-CSP 2x1.5mm Package Drawing Te ch ni ca Figure 25 – WL-CSP 2x1.5mm Detail Dimensions www.austriamicrosystems.com/AS3685 (ptr) 1.1 19 - 21 AS3685C Datasheet 10 Ordering Information Table 13 – Delivery Information Package Type Delivery Form Description AS3685C WL-CSP 2x1.5mm Tape&Reel AS3685C Interface Wafer Level Chip Scale Package, Size 2x1.5mm, 4x3 balls, 0.5mm pitch, RoHS compliant / Pb-free AS3685C-ZWLT AS3685C-ZDFT1 AS8C DFN 10 3x3mm Tape&Reel AS3685C Interface DFN Package, 3x3mm, 10 pins, 0.4mm pitch, RoHS compliant / Pb-free Description: AS3685C-ZPPT AS3685 - … AS3685C Interface Version Two wire interface signal with STROBE am lc s on A te G nt st il C al id Marking lv Part Number … Temperature range: Z = -30°C – 85°C PP … Package: WL = Wafer Level Chip Scale Package DF = DFN10 T … Delivery Form: T = Tape&Reel Te ch ni ca Z 1 Contact austriamicrosystems for availability. www.austriamicrosystems.com/AS3685 (ptr) 1.1 20 - 21 AS3685C Datasheet Copyright Copyright © 1997-2010, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, AustriaEurope. Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. All products and companies mentioned are trademarks or registered trademarks of their respective companies. Diclaimer ni ca am lc s on A te G nt st il lv al id Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by austriamicrosystems AG for each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard production flow, such as test flow or test location. The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However, austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of austriamicrosystems AG rendering of technical or other services ch Contact Information Te Headquarters austriamicrosystems AG Tobelbaderstrasse 30 Schloss Premstätten A-8141 Austria Tel: Fax: +43 (0) 3136 500 0 +43 (0) 3136 525 01 For Sales Offices, Distributors and Representatives, please visit: http://www.austriamicrosystems.com/contact www.austriamicrosystems.com/AS3685 (ptr) 1.1 21 - 21