SMD B 16-216/T3D

SMD  B
16-216/T3D-AQ1R2TY/3T
Features
․Package in 8mm tape on 7〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow
solder process.
․Mono-color type.
․Pb-free.
․The product itself will remain within RoHS
compliant version.
Description
․The 16-216 SMD LED is much smaller than lead frame type components,
thus enable smaller board size, higher packing density,
reduced storage space and finally smaller equipment to be obtained.
․Besides, lightweight makes them ideal for miniature applications. etc.
Applications
․Backlighting in dashboard and switch.
․Telecommunication: indicator and backlighting in
telephone and fax.
․Flat backlight for LCD, switch and symbol.
․General use.
1
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr.2013. Issue No: DSE-0007602
Rev.5
www.everlight.com
DATASHEET
SMD  B
16-216/T3D-AQ1R2TY/3T
Device Selection Guide
Chip
Materials
InGaN
Emitted Color
Resin Color
Pure White
Yellow Diffused
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
Reverse Voltage
VR
5
V
Forward Current
IF
25
mA
IFP
100
mA
Pd
110
mW
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +90
℃
Electrostatic Discharge
ESDHBM
150
V
Soldering Temperature
Tsol
Peak Forward Current
(Duty 1/10 @1KHz)
Power Dissipation
Operating Temperature
Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Luminous Intensity
Iv
72
-----
180
mcd
Viewing Angle
2θ1/2
-----
130
-----
deg
Forward Voltage
VF
2.6
----
3.0
V
Reverse Current
IR
-----
-----
50
μA
Condition
IF=5mA
VR=5V
Note:
1. Tolerance of Luminous Intensity: ±11%
2. Tolerance of Forward Voltage: ±0.05V
2
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013. Issue No: DSE-0007602
Rev5
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DATASHEET
SMD  B
16-216/T3D-AQ1R2TY/3T
Bin Range of Luminous Intensity
Bin Code
Min.
Max.
Unit
Condition
Q1
Q2
R1
R2
72
90
112
140
90
112
140
180
mcd
IF =5mA
Unit
Condition
mcd
IF =5mA
Bin Range Of Luminous Voltage
Bin Code
Min.
Max.
28
2.6
2.7
29
2.7
2.8
30
2.8
2.9
31
2.9
3.0
Note:
1. Tolerance of Luminous Intensity: ±11%
2. Tolerance of Forward Voltage: ±0.05V
Chromaticity Coordinates Specifications for Bin Grading
Group
Bin Code
1
2
3
A
4
5
6
CIE_X
CIE_Y
Condition
0.274
0.274
0.294
0.294
0.274
0.274
0.294
0.294
0.294
0.294
0.314
0.314
0.294
0.294
0.314
0.314
0.314
0.314
0.334
0.334
0.314
0.314
0.334
0.334
0.226
0.258
0.286
0.254
0.258
0.291
0.319
0.286
0.254
0.286
0.315
0.282
0.286
0.319
0.347
0.315
0.282
0.315
0.343
0.311
0.315
0.347
0.376
0.343
IF =5mA
Notes:
1.The C.I.E. 1931 chromaticity diagram ( Tolerance ±0.01 ).
2.The products are sensitive to static electricity and care must be fully taken when
handling products.
3
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013. Issue No: DSE-0007602
Rev5
www.everlight.com
DATASHEET
SMD  B
16-216/T3D-AQ1R2TY/3T
CIE Chromaticity Diagram
4
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013. Issue No: DSE-0007602
Rev5
www.everlight.com
DATASHEET
SMD  B
16-216/T3D-AQ1R2TY/3T
Typical Electro-Optical Characteristics Curves
Forward Current vs.
Forward Voltage
Spectrum Distribution
Ta=25°C
100
Forward Current IF (mA)
Relative luminous intensity (%)
Ta=25°C
75
50
25
0
400
500
600
700
800
Forward Voltage VF (V)
Wavelength λ (nm)
Luminous Intensity vs.
Luminous Intensity vs.
Forward Current
Ta=25°C
Relative luminous intensity (% )
Relative luminous intensity (% )
Ambient Temperature
Ambient Temperature Ta (°C)
Radiation Diagram
Ta=25°C
Forward Current
I F (mA)
Forward Current Derating Curve
Forward Current I F (mA)
Ambient Temperature Ta (°C)
5
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013. Issue No: DSE-0007602
Rev5
www.everlight.com
DATASHEET
SMD  B
16-216/T3D-AQ1R2TY/3T
Package Dimension
Suggested pad dimension is just for reference only.
Please modify the pad dimension based on individual need.
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
6
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013. Issue No: DSE-0007602
Rev5
www.everlight.com
DATASHEET
SMD  B
16-216/T3D-AQ1R2TY/3T
Moisture Resistant Packing Materials
Label Explanation
Pb
EVERLIGHT
CPN :
P N : XXXXXXXXXXXXX
RoHS
XXXXXXXXXXXXX
‧CPN: Customer’s Product Number
‧P/N: Product Number
‧QTY: Packing Quantity
‧CAT: Luminous Intensity Rank
‧HUE: Chromaticity Coordinates
‧REF: Forward Voltage Rank
‧LOT No: Lot Number
CAT : XXX
HUE : XXX
REF : XXX
QTY : XXX
LOT NO : XXXXXXXXXX
Reference : XXXXXXXX
MADE IN TAIWAN
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
7
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013. Issue No: DSE-0007602
Rev5
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DATASHEET
SMD  B
16-216/T3D-AQ1R2TY/3T
Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Moisture Resistant Packaging
Label
8
Aluminum moisture-proof bag
Desiccant
Label
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013. Issue No: DSE-0007602
Rev5
www.everlight.com
DATASHEET
SMD  B
16-216/T3D-AQ1R2TY/3T
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
260°C Max.
10sec. Max.
Above255°C
30sec.Max.
3°C/sec.Max.
6°C/sec.Max.
Pre-heating
Above 217°C
60~150sec.
150~200°C
60~120sec.
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less
than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful
because the damage of the product is often started at the time of the hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head
soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs
will or will not be damaged by repairing.
9
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013. Issue No: DSE-0007602
Rev5
www.everlight.com
DATASHEET
SMD  B
16-216/T3D-AQ1R2TY/3T
Application Restrictions
High reliability applications such as military/aerospace, automotive safety/security systems,
and medical equipment may require different product. If you have any concerns, please contact
Everlight before using this product in your application. This specification guarantees the quality
and performance of the product as an individual component. Do not use this product beyond the
specification described in this document.
10
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013. Issue No: DSE-0007602
Rev5
www.everlight.com