Lamp 339-9SUGSURSUBC/S1174 Features ˙Popular T-1 3/4 package. ˙High efficiency. ˙Available on tape and reel. ˙Built in red, green, and blue chips. ˙UV resistance epoxy. ˙The product itself will remain within RoHS compliant version Descriptions ˙The series is specially designed for applications requiring higher brightness ˙The LED lamps are available with different colors, intensities, epoxy, colors, etc. ․Superior performance in outdoor environment Applications ˙Status indicators. ˙Commercial use. ˙Advertising Signs. ˙Message board Device Selection Guide Chip LED Part No. 339-9SUGSURSUBC/S1174 1 Revision Copyright © 2010, :1 DLE-0005798_Rev.1 LifecyclePhase: Everlight All Rights Material Emitted Color InGaN Super Green AlGaInP Hyper red InGaN Super Blue Reserved. Release Date :June. 27, 2013. Lens Color Water Clear Issue No: www.everlight.com Release Date:2013-07-03 16:21:36.0 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBC/S1174 Absolute Maximum Ratings (Ta=25℃) Parameter Symbol SUB/SUG SUR Units Forward Current IF 30 50 mA Pulse Forward Current (Duty1/10@ 1KHz) IFP 100 100 mA Operating Temperature Topr -40 ~ +85 -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 -40 ~ +100 ℃ Soldering Temperature Tsol 260 ±5 260 ±5 ℃ Power Dissipation Pd 100 120 mW Reverse Voltage VR 5 5 V *Notes: Soldering time≦5 seconds. 2 Revision Copyright © 2010, :1 DLE-0005798_Rev.1 LifecyclePhase: Everlight All Rights Reserved. Release Date :June. 27, 2013. Issue No: www.everlight.com Release Date:2013-07-03 16:21:36.0 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBC/S1174 Electro-Optical Characteristics (Ta=25℃) Parameter Luminous Intensity Symbol IV Color Min. Typ. Max. SUG 900 1800 3600 SUR 1125 1425 2250 SUB 565 900 1800 SUG Viewing Angle Peak Wavelength Dominant Wavelength Spectrum half-width Forward Voltage 2θ1/2 λp SUR λD △λ 518 ----- 468 SUG 525 470 SUG 35 ----- ----- 35 SUG 3.5 4.0 2.0 2.6 3.5 4.0 SUB SUG Reverse Current IR SUR Copyright © 2010, :1 DLE-0005798_Rev.1 LifecyclePhase: Everlight All Rights Reserved. V 50 ----- ----- μA 10 SUB 3 Revision nm ----- 20 SUB ----- deg IF=20mA 624 SUB SUR mcd ----- 632 SUB ----- ----- 25 SUG SUR VF ----- 35 SUR Condition 20 SUB SUR Unit VR=5V 50 Release Date :June. 27, 2013. Issue No: www.everlight.com Release Date:2013-07-03 16:21:36.0 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBC/S1174 Typical Electro-Optical Characteristics Curves Relative Intensity vs. Wavelength Forward Current vs. Forward Voltage 25 1.0 SUG SUR SUR Forward Current(mA) Relative Intensity(a.u.) SUB 0.8 0.6 0.4 0.2 0.0 400 450 500 550 600 650 20 15 10 5 0 1.0 700 1.5 2.0 Relative Luminous Intensity(a.u.) Relative Intensity vs. Ambient Temp. 2.0 1.5 1.0 SUR SUB/SUG 0.5 30 40 50 2.5 3.0 3.5 4.0 Forward Voltage(V) 60 70 Relative Luminous Intensity(a.u.) Wavelength(nm) 0.0 20 SUB/SUG Relative Intensity vs. Forward Current 2.5 SUR 2.0 SUB SUG 1.5 1.0 0.5 0.0 0 O 10 20 30 40 50 Forward Current(mA) Ambient Temperature Ta( C) Forward Current vs. Ambient Temp. 4 Revision Copyright © 2010, :1 DLE-0005798_Rev.1 LifecyclePhase: Everlight All Rights Reserved. Release Date :June. 27, 2013. Issue No: www.everlight.com Release Date:2013-07-03 16:21:36.0 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBC/S1174 Package Dimensions Notes: ˙All dimensions are in millimeters,tolerance is 0.25mm except being specified. ˙Lead spacing is measured where the lead emerges from the package. ˙Protruded resin under flange is 1.5mm Max LED. 5 Revision Copyright © 2010, :1 DLE-0005798_Rev.1 LifecyclePhase: Everlight All Rights Reserved. Release Date :June. 27, 2013. Issue No: www.everlight.com Release Date:2013-07-03 16:21:36.0 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBC/S1174 Packing Quantity Specification 1.500PCS/1Bag，5Bags/1Box 2.10Boxes/1Carton Label Form Specification CPN: Customer’s Production Number P/N : Production Number EVERLIGHT 339-9SUGSURSUBC/S1174:Production name CPN: QTY: Packing Quantity P/N: CAT: Ranks of Luminous Intensity and Forward Voltage RoHS HUE: Ranks of Dominant Wavelength 339-9SUGSURSUBC/S1174 REF: Reference QTY： CAT: LOT No: Lot Number HUE: MADE IN TAIWAN: Production Place LOT NO： REF: MADE IN TAIWAN 6 Revision Copyright © 2010, :1 DLE-0005798_Rev.1 LifecyclePhase: Everlight All Rights Reserved. Release Date :June. 27, 2013. Issue No: www.everlight.com Release Date:2013-07-03 16:21:36.0 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBC/S1174 Notes 1.Lead Forming During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. Lead forming should be done before soldering. Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs. Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs. When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs. 2.Storage The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. 3.Soldering Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended. Recommended soldering conditions: Hand Soldering DIP Soldering Temp. at tip of 300℃ Max. iron Max.) 7 Revision (30W Preheat temp. 100℃ Max. (60 sec Max.) Bath temp. & time 260 Max., 5 sec Max Soldering time 3 sec Max. Distance 3mm Min.(From solder Distance joint to epoxy bulb) Copyright © 2010, :1 DLE-0005798_Rev.1 LifecyclePhase: Everlight All Rights Reserved. Release Date 3mm Min. (From solder joint to epoxy bulb) :June. 27, 2013. Issue No: www.everlight.com Release Date:2013-07-03 16:21:36.0 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBC/S1174 Recommended soldering profile laminar wave Fluxing Prehead Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering. Dip and hand soldering should not be done more than one time After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. Although the recommended soldering conditions are specified in the above table, dip or handsoldering at the lowest possible temperature is desirable for the LEDs. Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4.Cleaning When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than one minute. Dry at room temperature before use. Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the LED. 8 Revision Copyright © 2010, :1 DLE-0005798_Rev.1 LifecyclePhase: Everlight All Rights Reserved. Release Date :June. 27, 2013. Issue No: www.everlight.com Release Date:2013-07-03 16:21:36.0 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBC/S1174 5.Heat Management Heat management of LEDs must be taken into consideration during the design stage of LED application. The current should be de-rated appropriately by referring to the de-rating curve found in each product specification. The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating curve. 6.ESD (Electrostatic Discharge) The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability. When handling the products, the following measures against electrostatic discharge are strongly recommended: Eliminating the charge Grounded wrist strap, ESD footwear, clothes, and floors Grounded workstation equipment and tools ESD table/shelf mat made of conductive materials Proper grounding is required for all devices, equipment, and machinery used in product assembly. Surge protection should be considered when designing of commercial products. If tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommended: Dissipating static charge with conductive materials Preventing charge generation with moisture Neutralizing the charge with ionizers 9 Revision Copyright © 2010, :1 DLE-0005798_Rev.1 LifecyclePhase: Everlight All Rights Reserved. Release Date :June. 27, 2013. Issue No: www.everlight.com Release Date:2013-07-03 16:21:36.0 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBC/S1174 7.Other Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent. 10 Revision Copyright © 2010, :1 DLE-0005798_Rev.1 LifecyclePhase: Everlight All Rights Reserved. Release Date :June. 27, 2013. Issue No: www.everlight.com Release Date:2013-07-03 16:21:36.0 Expired Period: Forever