LAMP 313-2SUGD/S400-X6 Features • Choice of various viewing angles • Available on tape and reel. • Reliable and robust • Pb free • The product itself will remain within RoHS compliant version. Description •The series is specially designed for applications requiring higher brightness •The led lamps are available with different colors, intensities.. Applications • TV set • Monitor • Telephone • Computer 1 Copyright Revision :1 © LifecyclePhase: 2010, Everlight All Rights Reserved. Release Date : Aug.28.2013. Issue No: DLE-0006021 _Rev.1 Release Date:2013-09-04 15:43:06.0 www.everlight.com Expired Period: Forever DATASHEET LAMP 313-2SUGD/S400-X6 Device Selection Guide Chip Materials InGaN Emitted Color Resin Color Brilliant Green Green Diffused Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Unit Continuous Forward Current IF 25 mA Peak Forward Current (Duty 1/10 @ 1KHZ) IFP 100 mA Reverse Voltage VR 5 V Power Dissipation Pd 90 mW Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ ESD ESDHBM 2000 V Soldering Temperature Tsol 260 ℃ for 5 sec. Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Min. Typ. Max. Unit Condition Luminous Intensity Iv 1600 3200 ----- mcd IF=20mA Viewing Angle 2θ1/2 ----- 20 ----- deg IF=20mA Peak Wavelength λp ----- 518 ----- nm IF=20mA Dominant Wavelength λd ----- 525 ----- nm IF=20mA Spectrum Radiation Bandwidth Δλ ----- 35 ----- nm IF=20mA Forward Voltage VF 2.7 3.3 3.7 V IF=20mA Reverse Current IR ----- ----- 50 μA VR=5V 2 Copyright Revision :1 © LifecyclePhase: Release Date:2013-09-04 15:43:06.0 www.everlight.com 2010, Everlight All Rights Reserved. Release Date : Aug.28.2013. Issue No: : DLE-0006021 _Rev.1 Expired Period: Forever DATASHEET LAMP 313-2SUGD/S400-X6 Typical Electro-Optical Characteristics Curves Directivity (Ta=25℃) Radiation Angle Relative Intensity (a.u.) Relative Intensity vs. Wavelength (Ta=25℃) Wavelength (nm) Relative Intensity (a.u.) Forward Current vs. Forward Voltage (Ta=25℃) Relative Intensity vs. Forward Current (Ta=25℃) 1.5 25 Relative Intensity(a.u.) Forward Current (mA) 30 20 15 10 5 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 1.0 0.5 0.0 0 Forward Voltage (V) 20 25 40 Forward Current (mA) Relative Intensity(a.u.) 15 Forward Current vs. Ambient Temp. 2.0 1.5 1.0 0.5 0.0 25 30 35 40 45 50 55 60 65 Ambient Temperature Ta(℃) LifecyclePhase: 10 Forward Current (mA) Relative Intensity vs. Ambient Temp. 3 Copyright Revision :1 © 5 70 30 20 10 0 0 20 40 60 80 100 Ambient Temperature Ta(℃) Release Date:2013-09-04 15:43:06.0 www.everlight.com 2010, Everlight All Rights Reserved. Release Date : Aug.28.2013. Issue No: : DLE-0006021 _Rev.1 Expired Period: Forever DATASHEET LAMP 313-2SUGD/S400-X6 Package Dimension Note: Note: 1. All dimensions are in millimeters 2. The height of flange must be less than 1.5mm(0.059"). 3. Without special declared, the tolerance is ±0.25mm. 4 Copyright Revision :1 © LifecyclePhase: Release Date:2013-09-04 15:43:06.0 www.everlight.com 2010, Everlight All Rights Reserved. Release Date : Aug.28.2013. Issue No: : DLE-0006021 _Rev.1 Expired Period: Forever DATASHEET LAMP 313-2SUGD/S400-X6 Moisture Resistant Packing Materials Label Explanation CPN: Customer's Production Number Pb EVERLIGHT X P/N : Production Number QTY: Packing Quantity RoHS 313-2SUGD/S400-X6 CAT: Ranks HUE: Dominant Wavelength REF: Reference LOT No: Lot Number Packing Specification ■ Anti-electrostatic bag ■ Inner Carton ■ Outside Carton Pb EL ECTR OSTATIC ELECTR ONAGNET IC MAGNETIC OR RADIOACTIVE RELDS anti-static for 750 ■ Packing Quantity 1. 500 PCS/1 Bag, 5 Bags/1 Inner Carton 2. 10 Inner Cartons/1 Outside Carton 5 Copyright Revision :1 © LifecyclePhase: Release Date:2013-09-04 15:43:06.0 www.everlight.com 2010, Everlight All Rights Reserved. Release Date : Aug.28.2013. Issue No: : DLE-0006021 _Rev.1 Expired Period: Forever DATASHEET LAMP 313-2SUGD/S400-X6 Notes 1. Lead Forming During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. Lead forming should be done before soldering. Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs. Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs. When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs. 2. Storage The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. 3. Soldering Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended. Recommended soldering conditions: Hand Soldering 300℃ Max. (30W Max.) Temp. at tip of iron Soldering time 3 sec Max. Distance 3mm Min.(From solder joint to epoxy bulb) Recommended soldering profile Preheat temp. Bath temp. & time Distance DIP Soldering 100℃ Max. (60 sec Max.) 260 Max., 5 sec Max 3mm Min. (From solder joint to epoxy bulb) laminar wave Fluxing Prehead Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering. Dip and hand soldering should not be done more than one time After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature. 6 Copyright Revision :1 © LifecyclePhase: Release Date:2013-09-04 15:43:06.0 www.everlight.com 2010, Everlight All Rights Reserved. Release Date : Aug.28.2013. Issue No: : DLE-0006021 _Rev.1 Expired Period: Forever DATASHEET LAMP 313-2SUGD/S400-X6 A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. Although the recommended soldering conditions are specified in the above table, dip or hand soldering at the lowest possible temperature is desirable for the LEDs. Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4. Cleaning When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than one minute. Dry at room temperature before use. Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the LED 5. Heat Management Heat management of LEDs must be taken into consideration during the design stage of LED application. The current should be de-rated appropriately by referring to the de-rating curve found in each product specification. The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating curve. 6. ESD (Electrostatic Discharge) Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs. An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling LEDs. All devices, equipment and machinery must be properly grounded. Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of friction between LEDs during storage and handing. 7. Other Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent. 7 Copyright Revision :1 © LifecyclePhase: Release Date:2013-09-04 15:43:06.0 www.everlight.com 2010, Everlight All Rights Reserved. Release Date : Aug.28.2013. Issue No: : DLE-0006021 _Rev.1 Expired Period: Forever