313-2SUGD/S400-X6

LAMP
313-2SUGD/S400-X6
Features
• Choice of various viewing angles
• Available on tape and reel.
• Reliable and robust
• Pb free
• The product itself will remain within RoHS compliant version.
Description
•The series is specially designed for applications requiring higher brightness
•The led lamps are available with different colors, intensities..
Applications
• TV set
• Monitor
• Telephone
• Computer
1 Copyright
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:1 ©
LifecyclePhase:
2010, Everlight All Rights Reserved. Release Date : Aug.28.2013. Issue No:
DLE-0006021
_Rev.1
Release
Date:2013-09-04
15:43:06.0
www.everlight.com
Expired Period: Forever
DATASHEET
LAMP
313-2SUGD/S400-X6
Device Selection Guide
Chip
Materials
InGaN
Emitted Color
Resin Color
Brilliant Green
Green Diffused
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
Continuous Forward Current
IF
25
mA
Peak Forward Current (Duty 1/10 @ 1KHZ)
IFP
100
mA
Reverse Voltage
VR
5
V
Power Dissipation
Pd
90
mW
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
ESD
ESDHBM
2000
V
Soldering Temperature
Tsol
260 ℃ for 5 sec.
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Luminous Intensity
Iv
1600
3200
-----
mcd
IF=20mA
Viewing Angle
2θ1/2
-----
20
-----
deg
IF=20mA
Peak Wavelength
λp
-----
518
-----
nm
IF=20mA
Dominant Wavelength
λd
-----
525
-----
nm
IF=20mA
Spectrum Radiation Bandwidth
Δλ
-----
35
-----
nm
IF=20mA
Forward Voltage
VF
2.7
3.3
3.7
V
IF=20mA
Reverse Current
IR
-----
-----
50
μA
VR=5V
2 Copyright
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:1 ©
LifecyclePhase:
Release
Date:2013-09-04
15:43:06.0
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2010, Everlight All Rights Reserved. Release Date : Aug.28.2013. Issue No:
: DLE-0006021
_Rev.1
Expired Period: Forever
DATASHEET
LAMP
313-2SUGD/S400-X6
Typical Electro-Optical Characteristics Curves
Directivity (Ta=25℃)
Radiation Angle
Relative Intensity (a.u.)
Relative Intensity vs. Wavelength (Ta=25℃)
Wavelength (nm)
Relative Intensity (a.u.)
Forward Current vs. Forward Voltage (Ta=25℃)
Relative Intensity vs. Forward Current (Ta=25℃)
1.5
25
Relative Intensity(a.u.)
Forward Current (mA)
30
20
15
10
5
0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
1.0
0.5
0.0
0
Forward Voltage (V)
20
25
40
Forward Current (mA)
Relative Intensity(a.u.)
15
Forward Current vs. Ambient Temp.
2.0
1.5
1.0
0.5
0.0
25
30
35
40
45
50
55
60
65
Ambient Temperature Ta(℃)
LifecyclePhase:
10
Forward Current (mA)
Relative Intensity vs. Ambient Temp.
3 Copyright
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:1 ©
5
70
30
20
10
0
0
20
40
60
80
100
Ambient Temperature Ta(℃)
Release
Date:2013-09-04
15:43:06.0
www.everlight.com
2010, Everlight All Rights Reserved. Release Date : Aug.28.2013. Issue No:
: DLE-0006021
_Rev.1
Expired Period: Forever
DATASHEET
LAMP
313-2SUGD/S400-X6
Package Dimension
Note: Note:
1. All dimensions are in millimeters
2. The height of flange must be less than 1.5mm(0.059").
3. Without special declared, the tolerance is ±0.25mm.
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Release
Date:2013-09-04
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2010, Everlight All Rights Reserved. Release Date : Aug.28.2013. Issue No:
: DLE-0006021
_Rev.1
Expired Period: Forever
DATASHEET
LAMP
313-2SUGD/S400-X6
Moisture Resistant Packing Materials
Label Explanation
CPN: Customer's Production Number
Pb
EVERLIGHT
X
P/N : Production Number
QTY: Packing Quantity
RoHS
313-2SUGD/S400-X6
CAT: Ranks
HUE: Dominant Wavelength
REF: Reference
LOT No: Lot Number
Packing Specification
■ Anti-electrostatic bag
■ Inner Carton
■ Outside Carton
Pb
EL ECTR OSTATIC ELECTR ONAGNET IC
MAGNETIC OR RADIOACTIVE RELDS
anti-static for 750
■ Packing Quantity
1. 500 PCS/1 Bag, 5 Bags/1 Inner Carton
2. 10 Inner Cartons/1 Outside Carton
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Date:2013-09-04
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2010, Everlight All Rights Reserved. Release Date : Aug.28.2013. Issue No:
: DLE-0006021
_Rev.1
Expired Period: Forever
DATASHEET
LAMP
313-2SUGD/S400-X6
Notes
1.
Lead Forming

During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.

Lead forming should be done before soldering.

Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it
may break the LEDs.

Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs.

When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs
are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.
2.
Storage

The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits
are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a
nitrogen atmosphere and moisture absorbent material.

Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can
occur.
3.
Soldering

Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb,
and soldering beyond the base of the tie bar is recommended.

Recommended soldering conditions:

Hand Soldering
300℃ Max. (30W Max.)
Temp. at tip of iron
Soldering time
3 sec Max.
Distance
3mm Min.(From solder
joint to epoxy bulb)
Recommended soldering profile
Preheat temp.
Bath temp. & time
Distance
DIP Soldering
100℃ Max. (60 sec Max.)
260 Max., 5 sec Max
3mm Min. (From solder
joint to epoxy bulb)
laminar wave
Fluxing
Prehead

Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering.

Dip and hand soldering should not be done more than one time

After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to
room temperature.
6 Copyright
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Release
Date:2013-09-04
15:43:06.0
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2010, Everlight All Rights Reserved. Release Date : Aug.28.2013. Issue No:
: DLE-0006021
_Rev.1
Expired Period: Forever
DATASHEET
LAMP
313-2SUGD/S400-X6

A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.

Although the recommended soldering conditions are specified in the above table, dip or hand soldering at the lowest
possible temperature is desirable for the LEDs.

Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder
wave.
4.
Cleaning

When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than
one minute. Dry at room temperature before use.

Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs
depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to
ensure this will not cause damage to the LED
5.
Heat Management

Heat management of LEDs must be taken into consideration during the design stage of LED application. The current
should be de-rated appropriately by referring to the de-rating curve found in each product specification.

The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating
curve.
6.
ESD (Electrostatic Discharge)

Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.

An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling LEDs.

All devices, equipment and machinery must be properly grounded.

Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of
friction between LEDs during storage and handing.
7.
Other

Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above
specification.

When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these
specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does
not comply
with the absolute maximum ratings and the instructions included in these specification sheets.

These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t
reproduce or cause anyone to reproduce them without EVERLIGHT’s consent.
7 Copyright
Revision
:1 ©
LifecyclePhase:
Release
Date:2013-09-04
15:43:06.0
www.everlight.com
2010, Everlight All Rights Reserved. Release Date : Aug.28.2013. Issue No:
: DLE-0006021
_Rev.1
Expired Period: Forever