SMD B 59-146UTD/TR8 Features ․Super luminosity white LED. ․Built in 4 LED chips. ․Wide viewing angle. ․Soldering methods: Reflow soldering. ․High performance. ․Package in 12mm tape on 7〞diameter reel. ․Pb-free. ․The product itself will remain within RoHS compliant version. Description ․The 59-146 SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․Besides, lightweight makes them ideal for miniature applications. etc. Applications ․Amusement equipment. ․Information boards. ․Flashlight for digital camera of cellular phone. ․Lighting for small size device. 1 Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May.2013. Issue No: DSE-0000567 Rev.4 www.everlight.com DATASHEET SMD B 59-146UTD/TR8 Device Selection Guide Chip Materials InGaN Emitted Color Resin Color White Yellow Diffused Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Unit Reverse Voltage VR 5 V Forward Current IF 30 mA IFP 100 mA Power Dissipation Pd 110 mW Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +90 ℃ Electrostatic Discharge ESDHBM 1000 V Soldering Temperature Tsol Peak Forward Current (Duty 1/10 @1KHz) Reflow Soldering : 260 ℃ for 10 sec. Hand Soldering : 350 ℃ for 3 sec. * The value are base d on the 1-die performance. 2 Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0008905 Rev.4 www.everlight.com DATASHEET SMD B 59-146UTD/TR8 Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Luminous Intensity*1 Iv Viewing Angle*1 2θ1/2 Min. Typ. Max. 8.5 11.0 15.0 Unit IF=20mA*2 cd 23.0 33.0 45.0 ----- 50 ----- 2.0 2.4 2.8 2.8 3.2 3.7 3.7 4.2 4.85 ----- ----- 50 IFP=100mA*2 (Duty 1/10 @ 400ms) deg Forward Voltage*2 -25℃< T < 30℃ Reverse Current IR IF=20mA*2 IF=0.1mA*2 Forward Voltage*2 VF Condition V IF=20mA*2 IFP=100mA*2 (Duty 1/10 @ 400ms) μA VR=5V*2 Note: 1. Tolerance of Luminous Intensity: ±11% 2. Tolerance of Forward Voltage: ±0.05V *1 When 4 LED dies are operated simultaneously. *2 For each die. The products are sensitive to static electricity and care must be fully taken when handling products. 3 Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0008905 Rev.4 www.everlight.com DATASHEET SMD B 59-146UTD/TR8 Chromaticity Coordinates Specifications for Bin Grading Bin Code B3 B4 B5 B6 C0 CIE_X CIE_Y 0.327 0.335 0.323 0.345 0.344 0.370 0.347 0.355 0.347 0.355 0.344 0.370 0.370 0.400 0.370 0.379 0.336 0.316 0.327 0.335 0.347 0.355 0.351 0.334 0.351 0.334 0.347 0.355 0.370 0.379 0.370 0.358 0.370 0.358 0.370 0.400 0.401 0.425 0.394 0.391 Notes: 1.The C.I.E. 1931 chromaticity diagram ( Tolerance ±0.01 ). 2.The products are sensitive to static electricity and care must be fully taken when handling products. 4 Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0008905 Rev.4 www.everlight.com DATASHEET SMD B 59-146UTD/TR8 CIE Chromaticity Diagram 5 Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0008905 Rev.4 www.everlight.com DATASHEET SMD B 59-146UTD/TR8 Typical Electro-Optical Characteristics Curves Forward Current vs. Forward Voltage Spectrum Distribution Ta=25°C Forward Current I F (mA) Relative luminous intensity (% ) Ta=25°C Wavelength λ (nm) Forward Voltage VF (V) Luminous Intensity vs Luminous Intensity vs. Forward Current Relative luminous intensity (% ) Relative luminous intensity (% ) Ambient Temperature Ambient Temperature Ta (°C) Forward Current Derating Curve Ta=25° f=1KHz Duty=1/10 Forward Current I F (mA) Radiation Diagram Forward Current FI (mA) Ta=25° Ambient Temperature Ta (°C) 6 Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0008905 Rev.4 www.everlight.com DATASHEET SMD B 59-146UTD/TR8 Package Dimension A CL Pin Mark Package Mark 2 2 1 3 8 4 7 5 3 1 4 8 5 7 6 6 A Sec A-A (View back) Solder pattern Polarity 2 1 3 8 4 7 5 6 (2) (1) (5) (6) (3) (4) (8) (7) Note: Tolerances unless mentioned ±0.1mm. Unit = mm Suggested pad dimension is just for reference only. Please modify the pad dimension based on individual need. 7 Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0008905 Rev.4 www.everlight.com DATASHEET SMD B 59-146UTD/TR8 Moisture Resistant Packing Materials Label Explanation Pb EVERLIGHT CPN : P N : XXXXXXXXXXXXX RoHS XXXXXXXXXXXXX ‧CPN: Customer’s Product Number ‧P/N: Product Number ‧QTY: Packing Quantity ‧CAT: Luminous Intensity Rank ‧HUE: Chromaticity Coordinates & Dom. Wavelength Rank ‧REF: Forward Voltage Rank ‧LOT No: Lot Number CAT : XXX HUE : XXX REF : XXX QTY : XXX LOT NO : XXXXXXXXXX Reference : XXXXXXXX MADE IN TAIWAN Reel Dimensions Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm 8 Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0008905 Rev.4 www.everlight.com DATASHEET SMD B 59-146UTD/TR8 Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm Moisture Resistant Packaging Label 9 Aluminum moisture-proof bag Desiccant Label Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0008905 Rev.4 www.everlight.com DATASHEET SMD B 59-146UTD/TR8 Precautions For Use 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 260°C Max. 10sec. Max. Above255°C 30sec.Max. 3°C/sec.Max. 6°C/sec.Max. Pre-heating Above 217°C 60~150sec. 150~200°C 60~120sec. 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. 10 Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0008905 Rev.4 www.everlight.com DATASHEET SMD B 59-146UTD/TR8 Application Restrictions High reliability applications such as military/aerospace, automotive safety/security systems,and medical equipment may require different product. If you have any concerns, please contact Everlight before using this product in your application. This specification guarantees the quality and performance of the product as an individual component. Do not use this product beyond the specification described in this document. 11 Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0008905 Rev.4 www.everlight.com