EVERLIGHT 61-238XK2C-SXXXXXXXXXX-ET

SMD Low Power LED
61-238/XK2C-SXXXXXXXXXX/ET
Features
‧ P-LCC-6 package
‧ Top view LED
‧ Wide viewing angle:120°
‧ High Luminous intensity
‧ High Efficacy
‧ Pb-free
‧ RoHS-compliant
‧ ANSI Binning
.
Description
˙The Everlight 61-238 package has high efficacy, high CRI, low power consumption, wide viewing angle and a compact
form factor. These features make this package an ideal LED for all lighting applications.
Applications
‧General lighting
‧Decorative and Entertainment Lighting
‧Indicators
‧Illumination
‧Switch lights
1
Copyright © 2010, Everlight All Rights Reserved. Release Date : 06-Apr.-2011. Issue No: v2
Device No: DSE-0003809
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DATASHEET
SMD ƒ Low Power LED
61-238/XK2C-SXXXXXXXXXX/ET
Product Number Explanation
Notes
Table of Color Rendering Index
Symbol
Description
M
CRI(min) : 60
N
CRI(min) : 65
L
CRI(min) : 70
Q
CRI(min) : 75
K
CRI(min) : 80
H
CRI(min) : 90
Notes:
1. Tolerance of Color Rendering Index: ±2
Example:
61-238/KK2C-S30306F4GB2/ET
CRI
Min=80
CCT
3000K
IV
5400mcd~6400mcd
VF
2.9V~3.6V
2
Copyright © 2010, Everlight All Rights Reserved. Release Date : 06-Apr.-2011. Issue No: v1
Device No: DSE-000
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DATASHEET
SMD ƒ Low Power LED
61-238/XK2C-SXXXXXXXXXX/ET
Mass Production list
Product
CRI
min.
CCT(K)
IV(mcd)
Min
IV(mcd)
Max
Φ(lm)
Typ.
61-238/KK2C-S30306F4GB2/ET
80
3000K
5400
6400
17.0
61-238/KK2C-S40408F6GB2/ET
80
4000K
5600
6600
18.0
3
Copyright © 2010, Everlight All Rights Reserved. Release Date : 06-Apr.-2011. Issue No: v1
Device No: DSE-000
www.everlight.com
DATASHEET
SMD ƒ Low Power LED
61-238/XK2C-SXXXXXXXXXX/ET
Device Selection Guide
Chip
Materials
InGaN
Emitted Color
Resin Color
Neutral White
Warm White
Water Clear
Absolute Maximum Ratings (Ta=25℃)
*1
Parameter
Symbol
Rating
Unit
Reverse Voltage*1
VR
5
V
Forward Current*1
IF
30
mA
Peak Forward Current(Duty 1/10 @ 1KHZ)*1
IFP
100
mA
Power Dissipation*1
Pd
110
mW
Electrostatic Discharge(HBM) *1
ESD
1000
℃
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +90
℃
Soldering Temperature
Tsol
Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
* 1. The value are based on 1 die performance
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
2θ1/2
-----
120
-----
deg
IF=20mA
IR
Reverse Current
----*1 When three LED dies are operated simultaneously.
*2 For each die.
-----
50
μA
VR=5V
Viewing Angle
4
*1
Copyright © 2010, Everlight All Rights Reserved. Release Date : 06-Apr.-2011. Issue No: v1
Device No: DSE-000
*2
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DATASHEET
SMD ƒ Low Power LED
61-238/XK2C-SXXXXXXXXXX/ET
*1
Bin Range of Luminous Intensity
Bin Code
Min.
Max.
4D
3200
3400
6D
3400
3600
8D
3600
3800
AE
3800
4000
2E
4000
4200
4E
4200
4400
6E
4400
4600
8E
4600
4800
AF
4800
5000
2F
5000
5200
4F
5200
5400
6F
5400
5600
8F
5600
5800
AG
5800
6000
2G
6000
6200
4G
6200
6400
6G
6400
6600
Unit
Condition
mcd
IF=20mA
*2
Notes:
1. *1 When three LED dies are operated simultaneously.
2. *2 For each die.
3. Tolerance of Luminous Intensity ±11%
5
Copyright © 2010, Everlight All Rights Reserved. Release Date : 06-Apr.-2011. Issue No: v1
Device No: DSE-000
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DATASHEET
SMD ƒ Low Power LED
61-238/XK2C-SXXXXXXXXXX/ET
*1
Bin Range of Forward Voltage
Group
Bin Code
Min.
Max.
Unit
Condition
G
34
35
36
37
38
39
40
41
42
43
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
v
IF=20mA
B2
*2
Notes:
1. *1 When three LED dies are operated simultaneously.
2. *2 For each die.
3. Tolerance of Forward Voltage ±0.05V
4. Forward Voltage rank is the average forward voltage of three dies
6
Copyright © 2010, Everlight All Rights Reserved. Release Date : 06-Apr.-2011. Issue No: v1
Device No: DSE-000
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DATASHEET
SMD ƒ Low Power LED
61-238/XK2C-SXXXXXXXXXX/ET
Bin Range of Chromaticity Coordinates
CCT
Bin Code
40K-1
4000K
40K-2
30K-1
3000K
30K-2
CIE_x
CIE_y
0.4006
0.3871
0.3828
0.3952
0.3871
0.3736
0.3703
0.3828
0.4562
0.4431
0.4345
0.4468
0.4431
0.4299
0.4223
0.4345
0.4044
0.3959
0.3803
0.3880
0.3959
0.3874
0.3726
0.3803
0.4260
0.4213
0.4033
0.4077
0.4213
0.4165
0.3990
0.4033
Bin Code
40K-3
40K-4
30K-3
30K-4
CIE_x
CIE_y
0.3828
0.3703
0.3670
0.3784
0.3952
0.3828
0.3784
0.3898
0.4345
0.4223
0.4147
0.4260
0.4468
0.4345
0.4260
0.4373
0.3803
0.3726
0.3578
0.3647
0.3880
0.3803
0.3647
0.3716
0.4033
0.3990
0.3814
0.3854
0.4077
0.4033
0.3854
0.3893
Note:
Tolerance of Chromaticity Coordinates: ±0.01
7
Copyright © 2010, Everlight All Rights Reserved. Release Date : 06-Apr.-2011. Issue No: v1
Device No: DSE-000
www.everlight.com
DATASHEET
SMD ƒ Low Power LED
61-238/XK2C-SXXXXXXXXXX/ET
The C.I.E. 1931 Chromaticity Diagram
8
Copyright © 2010, Everlight All Rights Reserved. Release Date : 06-Apr.-2011. Issue No: v1
Device No: DSE-000
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DATASHEET
SMD ƒ Low Power LED
61-238/XK2C-SXXXXXXXXXX/ET
Typical Electro-Optical Characteristics Curves
Forward Current vs.
Forward Voltage
Spectrum Distribution
Ta=25°
Forward Current IF (mA)
Relative luminous intensity (%)
50
40
30
20
10
0
2.6
Wavelength λ(nm)
Relative luminous intensity (%)
Relative luminous intensity (%)
100
10
0
1000
3.8
4.2
f=1KHz
Duty=1/10
10
20 40 60 80 100
1 0
10
3
2
1
10
10
10
Forward Current IF (mA)
Radiation Diagram
Forward Current Derating Curve
IF(mA)
3.4
100
Ambient Temperature Ta(°C )
Forward Current
3.0
Relative Luminous Intensity vs.
Forward Current
Ta=25°
Relative Luminous Intensity vs.
1
-60 -40 -20
2.8
Forward Voltage VF -(Volts)
Ambient Temperature
1000
Ta=25°
0°
50
10°
20°
Ta=25°
30°
40
30
1.0
20
0.9
0.8
10
0.7
0
0
20
40
60
80
100
40°
50°
0.5 0.3
0.1
0.2
0.4 0.6
60°
70°
80°
90°
Ambient Temperature Ta (°C )
9
Copyright © 2010, Everlight All Rights Reserved. Release Date : 06-Apr.-2011. Issue No: v1
Device No: DSE-000
www.everlight.com
DATASHEET
SMD ƒ Low Power LED
61-238/XK2C-SXXXXXXXXXX/ET
Package Dimension
Note:
Tolerance unless mentioned is ±0.1mm; Unit = mm
10
Copyright © 2010, Everlight All Rights Reserved. Release Date : 06-Apr.-2011. Issue No: v1
Device No: DSE-000
www.everlight.com
DATASHEET
SMD ƒ Low Power LED
61-238/XK2C-SXXXXXXXXXX/ET
Moisture Resistant Packing Materials
Label Explanation
‧CPN: Customer’s Product Number
‧P/N: Product Number
‧QTY: Packing Quantity
‧CAT: Luminous Intensity Rank
‧HUE: Dom. Wavelength Rank
‧REF: Forward Voltage Rank
‧LOT No: Lot Number
Reel Dimensions
Carrier Tape Dimensions: Loaded Quantity 800 pcs Per Reel
Note:
Tolerances unless mentioned ±0.1mm. Unit = mm
11
Copyright © 2010, Everlight All Rights Reserved. Release Date : 06-Apr.-2011. Issue No: v1
Device No: DSE-000
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DATASHEET
SMD ƒ Low Power LED
61-238/XK2C-SXXXXXXXXXX/ET
Moisture Resistant Packing Process
Note:
Tolerances unless mentioned ±0.1mm. Unit = mm
Reliability Test Items and Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level:90%
LTPD:10%
No.
Items
1
Reflow Soldering
Test Condition
Test Hours/Cycles Sample Size
Temp. : 260℃±5℃ Min.
22 PCS.
6 Min.
10sec.
Ac/Re
0/1
H : +100℃ 15min
2
Temperature Cycle
∫ 5 min
L : -40℃ 15min
300 Cycles
22 PCS.
0/1
22 PCS.
0/1
H : +100℃ 5min
3
Thermal Shock
4
∫ 10 sec
L : -10℃ 5min
300 Cycles
High Temperature
Storage
Temp. : 100℃
1000 Hrs.
22 PCS.
0/1
5
Low Temperature
Storage
Temp. : -40℃
1000 Hrs.
22 PCS.
0/1
6
DC Operating Life
IF*2 = 20 mA
1000 Hrs.
22 PCS.
0/1
7
High Temperature / High
Humidity
85℃/ 85%RH
1000 Hrs.
22 PCS.
0/1
12
Copyright © 2010, Everlight All Rights Reserved. Release Date : 06-Apr.-2011. Issue No: v1
Device No: DSE-000
www.everlight.com
DATASHEET
SMD ƒ Low Power LED
61-238/XK2C-SXXXXXXXXXX/ET
Precautions for Use
1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause big current
change (Burn out will happen).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life are 168 hours under 30℃ or less and 60% RH or
less. If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following conditions.
Baking treatment: 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
260°C Max.
10sec. Max.
Above255°C
30sec.Max.
3°C/sec.Max.
6°C/sec.Max.
Pre-heating
Above 217°C
60~150sec.
150~200°C
60~120sec.
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
13
Copyright © 2010, Everlight All Rights Reserved. Release Date : 06-Apr.-2011. Issue No: v1
Device No: DSE-000
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DATASHEET
SMD ƒ Low Power LED
61-238/XK2C-SXXXXXXXXXX/ET
4. Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once
in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of
each terminal. Be careful because the damage of the product is often started at the time of the hand
solder.
5. Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a
double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether
the characteristics of the LEDs will or will not be damaged by repairing.
14
Copyright © 2010, Everlight All Rights Reserved. Release Date : 06-Apr.-2011. Issue No: v1
Device No: DSE-000
www.everlight.com