Blazing A Trail to High Performance Graphics

Blazing A Trail to
High Performance Graphics
Hynix Semiconductor, Inc.
Agenda
• A Constraint to Performance
• Future Solutions
• Conclusion
Performance for Visualization
Performance
never compromise
Perf.
Perf.
Perf.
Time
A Constraint to Performance POWER
Smart
management of
System Power is
the KEY of Future
IT Leadership
Power-sensitive
Graphic Memory
Memory
Right time to blaze a trail
Power
for future Graphic solution
System Power Budget
GPU
Performance
Memory
Time
3 Options after GDDR5
• GDDR5 Single-ended I/O
- Max. 8Gbps with same power
• GDDR5 Differential I/O
- Max. 14Gbps with much more power
• HBM*(Wide I/O with TSV)
- Lower speed with many I/Os and low power
* High Bandwidth Memory
HBM for Best Solution
Performance
with a restricted power budget
HBM
GDDR5
Single-end I/O
GDDR5
Differential I/O
Time
HBM to satisfy IT trend
~ 65%
System Performance
~ 40%
Memory Power
Consumption
Major Features of HBM
Wide I/O Stacked DRAM with TSV
GDDR5
HBM
DRAM
Package
DRAM
Substrate
Architecture
DRAM
DRAM
DRAM
FBGA Ball
u-Bump
x32
IO
x 1024
7Gbps
Data Rate
1Gbps
1.5V
Voltage
1.2V
TSV
Extendibility of HBM
Perf.
Density
 Upgradable DRAM Speed
 Increasable # of I/O
 Flexible # of stack
App.
Graphics Card
HPC, Workstation
Interim solution for mainstream
• HBM migrating to mainstream
2-3 years after High-end segmentation
• Interim Solution between DDR3 and HBM
GDDR5M
 Speed : Max. 4.0Gbps @1.35V
 IO : x16/x8
Conclusion
 Based on the strong partnership with AMD,
Hynix navigates the best Graphics solutions of
each system for the future today.
 Hynix will be ready to support the full Graphics
solution portfolio for each Customer tomorrow
as like today.