AP62T03GH/J-HF Halogen-Free Product Advanced Power Electronics Corp. N-CHANNEL ENHANCEMENT MODE POWER MOSFET ▼ Lower Gate Charge D ▼ Simple Drive Requirement ▼ Fast Switching Characteristic BVDSS 30V RDS(ON) 12mΩ ID G 54A S ▼ RoHS Compliant & Halogen-Free Description AP62T03 series are from Advanced Power innovated design and silicon process technology to achieve the lowest possible on-resistance and fast switching performance. It provides the designer with an extreme efficient device for use in a wide range of power applications. The TO-252 package is widely preferred for all commercial-industrial surface mount applications using infrared reflow technique and suited for high current application due to the low connection resistance. The through-hole version (AP62T03GJ) are available for low-profile applications. G G D D S TO-252(H) TO-251(J) S o Absolute Maximum Ratings@Tj=25 C(unless otherwise specified) Symbol . Parameter Rating Units VDS Drain-Source Voltage 30 V VGS Gate-Source Voltage +20 V ID@TC=25℃ Drain Current, VGS @ 10V 54 A ID@TC=100℃ Drain Current, VGS @ 10V 38 A 120 A 47 W 20 mJ 1 IDM Pulsed Drain Current PD@TC=25℃ Total Power Dissipation 3 EAS Single Pulse Avalanche Energy TSTG Storage Temperature Range -55 to 175 ℃ TJ Operating Junction Temperature Range -55 to 175 ℃ Thermal Data Symbol Rthj-c Parameter Maximum Thermal Resistance, Junction-case Rthj-a Maximum Thermal Resistance, Junction-ambient (PCB mount) Rthj-a Maximum Thermal Resistance, Junction-ambient Data & specifications subject to change without notice 4 Value Units 3.2 ℃/W 62.5 ℃/W 110 ℃/W 1 201409034 AP62T03GH/J-HF o Electrical Characteristics@Tj=25 C(unless otherwise specified) Symbol BVDSS RDS(ON) Parameter Test Conditions Drain-Source Breakdown Voltage Static Drain-Source On-Resistance 2 Min. Typ. Max. Units VGS=0V, ID=250uA 30 - - V VGS=10V, ID=20A - - 12 mΩ VGS=4.5V, ID=15A - - 18 mΩ VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 1 - 3 V gfs Forward Transconductance VDS=10V, ID=20A - 20 - S IDSS Drain-Source Leakage Current VDS=24V, VGS=0V - - 10 uA IGSS Gate-Source Leakage VGS=+20V, VDS=0V - - +100 nA Qg Total Gate Charge ID=20A - 11.5 18 nC Qgs Gate-Source Charge VDS=20V - 2 - nC Qgd Gate-Drain ("Miller") Charge VGS=4.5V - 7 - nC td(on) Turn-on Delay Time VDS=15V - 6 - ns tr Rise Time ID=20A - 56 - ns td(off) Turn-off Delay Time RG=3.3Ω - 22 - ns tf Fall Time VGS=10V - 7 - ns Ciss Input Capacitance VGS=0V - 750 1200 pF Coss Output Capacitance VDS=25V - 190 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 140 - pF Rg Gate Resistance f=1.0MHz - 2 4 Ω Min. Typ. IS=20A, VGS=0V - - 1.2 V . Source-Drain Diode Symbol Parameter 2 Test Conditions Max. Units VSD Forward On Voltage trr Reverse Recovery Time IS=20A, VGS=0V, - 30 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 21 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test o 3.Starting Tj=25 C , VDD=25V , L=0.1mH , RG=25Ω 2 4.Surface mounted on 1 in copper pad of FR4 board THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP62T03GH/J-HF 100 120 T C = 175 C 80 ID , Drain Current (A) ID , Drain Current (A) 100 80 60 V G =3.0V 40 10V 7.0V 5.0V 4.5V o 10V 7.0V 5.0V 4.5V o T C =25 C 60 40 V G =3.0V 20 20 0 0 0 1 2 3 4 5 6 0 1 V DS , Drain-to-Source Voltage (V) 2 3 4 5 6 7 8 V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 1.6 35 I D = 20 A V G =10V I D = 15 A RDS(ON) (mΩ) T C =25 C 25 . Normalized RDS(ON) 1.4 o 1.2 1.0 15 0.8 5 0.6 2 4 6 8 10 -50 25 100 175 o V GS , Gate-to-Source Voltage (V) T j , Junction Temperature ( C) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 16 1.4 1.2 IS (A) T j =175 o C Normalized VGS(th) 12 T j =25 o C 8 1 0.8 4 0.6 0.4 0 0 0.4 0.8 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.2 -50 25 100 175 T j , Junction Temperature ( o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP62T03GH/J-HF f=1.0MHz 1000 12 I D = 20 A V DS =15V V DS =2 0 V V DS = 25 V 8 6 C (pF) VGS , Gate to Source Voltage (V) C iss 10 4 C oss C rss 2 100 0 0 8 16 24 1 32 5 9 Q G , Total Gate Charge (nC) 13 17 21 25 29 V DS ,Drain-to-Source Voltage (V) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 1 ID (A) 100 . 100us 10 1ms 10ms 100ms DC T C =25 o C Single Pulse 1 0.1 1 10 Normalized Thermal Response (Rthjc) 1000 Duty factor=0.5 0.2 0.1 0.1 0.05 PDM 0.02 t T 0.01 Duty factor = t/T Peak Tj = PDM x Rthjc + T C Single Pulse 0.01 100 0.00001 0.0001 0.001 0.01 0.1 1 10 V DS ,Drain-to-Source Voltage (V) t , Pulse Width (s) Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance 90 VG ID , Drain Current (A) V DS =5V T j =25 o C T j =175 o C QG 60 4.5V QGS QGD 30 Charge Q 0 0 2 4 6 V GS , Gate-to-Source Voltage (V) Fig 11. Transfer Characteristics Fig 12. Gate Charge Waveform 4 AP62T03GH/J-HF MARKING INFORMATION TO-251 62T03GJ Part Number meet Rohs requirement for low voltage MOSFET only Package Code YWWSSS Date Code (YWWSSS) Y:Last Digit Of The Year WW:Week SSS:Sequence TO-252 62T03GH Part Number meet Rohs requirement for low voltage MOSFET only . Package Code YWWSSS Date Code (YWWSSS) Y:Last Digit Of The Year WW:Week SSS:Sequence 5