AP9T15GH/J RoHS-compliant Product Advanced Power Electronics Corp. N-CHANNEL ENHANCEMENT MODE POWER MOSFET ▼ Low Gate Charge D ▼ Capable of 2.5V Gate Drive ▼ Single Drive Requirement G ▼ RoHS Compliant BVDSS 20V RDS(ON) 50mΩ ID 12.5A S Description Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, ultra low on-resistance and cost-effectiveness. G D G D S S TO-252(H) TO-251(J) Absolute Maximum Ratings Symbol Parameter Rating Units VDS Drain-Source Voltage 20 V VGS Gate-Source Voltage +16 V ID@TC=25℃ Continuous Drain Current, V GS @ 4.5V 12.5 A ID@TC=100℃ Continuous Drain Current, V GS @ 4.5V 8 A 60 A 1 IDM Pulsed Drain Current PD@TC=25℃ Total Power Dissipation 12.5 W Linear Derating Factor 0.1 W/℃ 2 W 3 PD@TA=25℃ Total Power Dissipation TSTG Storage Temperature Range -55 to 150 ℃ TJ Operating Junction Temperature Range -55 to 150 ℃ Thermal Data Symbol Parameter Value Units Rthj-c Maximum Thermal Resistance, Junction-case 10 ℃/W Rthj-a Maximum Thermal Resistance, Junction-ambient (PCB mount) 3 62.5 ℃/W Rthj-a Maximum Thermal Resistance, Junction-ambient 110 ℃/W Data and specifications subject to change without notice 1 201009303 AP9T15GH/J Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol BVDSS RDS(ON) Parameter Test Conditions Drain-Source Breakdown Voltage Min. Typ. 20 - - V VGS=4.5V, ID=6A - - 50 mΩ VGS=2.5V, ID=5.2A - - 80 mΩ 0.5 - 1.5 V VGS=0V, ID=250uA Static Drain-Source On-Resistance 2 Max. Units VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA gfs Forward Transconductance VDS=5V, ID=10A - 10 - S IDSS Drain-Source Leakage Current VDS=20V, VGS=0V - - 1 uA Drain-Source Leakage Current (T j=125 C) VDS=16V ,VGS=0V - - 250 uA Gate-Source Leakage VGS=+16V, VDS=0V - - +100 nA ID=10A - 5 8 nC o IGSS 2 Qg Total Gate Charge Qgs Gate-Source Charge VDS=16V - 1 - nC Qgd Gate-Drain ("Miller") Charge VGS=4.5V - 2 - nC 2 td(on) Turn-on Delay Time VDS=10V - 8 - ns tr Rise Time ID=10A - 55 - ns td(off) Turn-off Delay Time RG=3.3Ω,VGS=5V - 10 - ns tf Fall Time RD=1Ω - 3 - ns Ciss Input Capacitance VGS=0V - 360 580 pF Coss Output Capacitance VDS=20V - 70 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 50 - pF Rg Gate Resistance f=1.0MHz - 1.67 - Ω Min. Typ. Source-Drain Diode Symbol Parameter 2 Test Conditions Max. Units VSD Forward On Voltage IS=10A, VGS=0V - - 1.3 V trr Reverse Recovery Time2 IS=10A, VGS=0V, - 17 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 9 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 2 3.Surface mounted on 1 in copper pad of FR4 board THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP9T15GH/J 50 40 o T C = 150 o C T C =25 C ID , Drain Current (A) ID , Drain Current (A) 5.0V 4.5V 40 30 3.5V 20 2.5V 30 5.0V 4.5V 20 3.5V 10 2.5V 10 V G =1.5V V G =1.5V 0 0 0 1 2 3 4 5 0 1 2 3 4 5 6 V DS , Drain-to-Source Voltage (V) V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 45 1.8 I D = 5.2 A 43 I D =6A V G =4.5V 1.6 o Normalized RDS(ON) RDS(ON) (mΩ) T C =25 C 41 39 37 35 1.4 1.2 1.0 0.8 33 0.6 0 2 4 6 8 10 -50 V GS , Gate-to-Source Voltage (V) 0 50 100 150 o T j , Junction Temperature ( C) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 2.0 10 Normalized VGS(th) (V) 8 IS(A) 6 T j =150 o C T j =25 o C 4 1.5 1.0 0.5 2 0 0.0 0 0.2 0.4 0.6 0.8 1 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.2 -50 0 50 100 150 T j , Junction Temperature ( o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP9T15GH/J f=1.0MHz 14 1000 I D =10A C iss V DS =10V V DS =12V V DS =16V 10 8 C (pF) VGS , Gate to Source Voltage (V) 12 6 100 C oss C rss 4 2 10 0 0 2 4 6 8 10 1 12 5 9 13 17 21 25 29 V DS , Drain-to-Source Voltage (V) Q G , Total Gate Charge (nC) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 1 Normalized Thermal Response (Rthjc) 100 Operation in this area limited by RDS(ON) 100us ID (A) 10 1ms 10ms 100ms DC 1 o T c =25 C Single Pulse Duty factor = 0.5 0.2 0.1 0.1 0.05 PDM 0.02 t T 0.01 Duty Factor = t/T Peak Tj = PDM x Rthjc + T C Single Pulse 0.01 0.1 0.1 1 10 100 0.00001 0.0001 V DS , Drain-to-Source Voltage (V) Fig 9. Maximum Safe Operating Area 0.001 0.01 0.1 1 10 t , Pulse Width (s) Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG 4.5V QGS QGD 10% VGS td(on) tr td(off)tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4