Datasheet 300mA Variable Output LDO Regulator BA3662CP-V5 ●General Description The BA3662CP-V5 is low-saturation regulator. The output voltage can be arbitrarily configured using the external resistance. This IC has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits and a thermal shutdown circuit that protects the IC from thermal damage due to overloading. ●Features High Output Voltage Precision : ±2% Low saturation with PNP output Built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits Built-in thermal shutdown circuit for protecting the IC from thermal damage due to overloading Built-in over- voltage protection circuit that prevents the destruction of the IC due to power supply surges ●Key Specifications Input Power Supply Voltage: Output voltage type: Output current: Shutdown current: Operating temperature range: ●Package TO220CP-V5 W (Typ.) x D (Typ.) x H (Max.) 10.00mm x 20.12mm x 4.60mm 25V(Max.) Fixed 0.3A(Max.) 0μA(Typ.) -40℃ to +125℃ TO220CP-V5 ●Applications Audiovisual equipments, FPDs, televisions, personal computers or any other consumer device ●Typical Application Circuit VCC VO CIN COUT R1 C CTL R2 GND CIN,COUT : Ceramic Capacitor ●Ordering Information B A 3 6 6 2 P - V 5 - Package CP-V5: TO220CP-V5 Part Number ●Lineup Maximum output current (Max.) 0.3A C Output Voltage (Max.) 15V ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 E2 Packaging and forming specification E2: Embossed tape and reel Package TO220CP-V5 Reel of 500 Orderable Part Number BA3662CP-V5E2 ○This product is not designed protection against radioactive rays. 1/14 TSZ02201-0R6R0A600110-1-2 26.Jun.2012 Rev.001 Datasheet BA3662CP-V5 ●Block Diagram VO VCC CTL GND C Fig.1 ●Pin Configuration ●Pin Description Pin No. Pin Name 1 CTL Output Control Pin 2 Vcc Power Supply Pin 3 GND GND 4 Vo Output Pin 5 C Adjustable Pin www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Function 2/14 TSZ02201-0R6R0A600110-1-2 26.Jun.2012 Rev.001 Datasheet BA3662CP-V5 ●Absolute Maximum Ratings (Ta=25℃) Parameter Symbol ※1 Supply Voltage Ratings Unit Vcc -0.3 to +35.0 V VCTL -0.3 to +Vcc V Pd 2000 mW Operating Temperature Range Topr -40 to +125 ℃ Storage Temperature Range Maximum Junction Temperature Tstg -55 to +150 ℃ Tjmax +150 ℃ Vcc peak +50 V Output Control Voltage ※2 Power Dissipation ※3 Peak Supply Voltage ※ 1 Not to exceed Pd. ※ 2 TO220CP-V5:Derating in done at 16mW/℃ for operating above Ta≧25℃.(without heat sink) ※ 3 Applied voltage : 200msec or less (tr≥1msec) NOTE : This product is not designed for protection against radioactive rays. tr≧1msec 50V 35V MAX200msec (Voltage Supply more than 35V) 0V ●Recommended Operating Ratings (Ta=-40 to +125℃) Parameter Symbol Min. Max. Unit Supply Voltage Vcc 4.0 25.0 V Output Control Voltage VCTL 0 Vcc V Output Current Io 0 0.3 A Output Voltage Vo 3.0 15.0 V ●Protect Features Parameter Symbol Min. Typ. Max. Unit Vcc 26 28 30 V Over Voltage protection ●Electrical Characteristics(Unless otherwise specified, Ta=25℃, Vcc=10V,VCTL=5V,Io=200mA,R1=2.2kΩ, R2=6.8kΩ) Symbol Min. Typ. Max. Unit Shut Down Current Parameter Isd － 0 10 µA VCTL=0V Bias Current Ib － 2.5 5.0 mA VCTL=2V, Io=0mA C Terminal Voltage Conditions Vc 1.200 1.225 1.250 V Io=50mA Dropout Voltage ⊿Vd － 0.3 0.5 V Ripple Rejection R.R. 45 55 － dB Line Regulation Reg.I － 20 100 mV Vcc=Vo×0.95 f=120Hz, ein※1=1Vrms, Io=100mA Vcc=6→25V Load Regulation Temperature Coefficient of Output Voltage Short Current Reg.L － 40 80 mV Io=5mA→200mA Tcvo － ±0.02 － %/℃ Ios － 0.1 － A Vcc=25V,Vo=0V ON Mode Voltage VthH 2.0 － － V ACTIVE MODE, Io=0mA OFF Mode Voltage VthL － － 0.8 V OFF MODE, Io=0mA Input High Current ICTL 100 200 300 µA VCTL=5V, Io=0mA Io=5mA,Tj=0℃ to 125℃ ※ 1 ein : Input Voltage Ripple www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/14 TSZ02201-0R6R0A600110-1-2 26.Jun.2012 Rev.001 Datasheet BA3662CP-V5 ●Typical Performance Curves BA3662CP-V5(5.0V preset voltage) (Unless otherwise specified, Ta=25℃, Vcc=10V,VCTL=5V,Io=200mA,R1=2.2kΩ, R2=6.8kΩ) Fig.2 Circuit Current Fig.3 Line Regulation Fig.5 Load Regulation Fig.4 Line Regulation (Io=200mA) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/14 TSZ02201-0R6R0A600110-1-2 26.Jun.2012 Rev.001 Datasheet BA3662CP-V5 ●Typical Performance Curves - continued Fig.7 Ripple Rejection (lo=100mA) Fig.6 Dropout Voltage Io-△Vd Characteristics (Vcc=4.75V) Fig.8 Output Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Fig.9 Circuit Current (lo=0mA→300mA) (IFEEDBACK_R≒555µA) 5/14 TSZ02201-0R6R0A600110-1-2 26.Jun.2012 Rev.001 Datasheet BA3662CP-V5 ●Typical Performance Curves - continued Fig.11 CTL Voltage vs Output Voltage Fig.10 CTL Voltage vs CTL Current Fig.13 Thermal Shutdown Circuit Characteristics Fig.12 Overvoltage Operating (lo = 200mA) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/14 TSZ02201-0R6R0A600110-1-2 26.Jun.2012 Rev.001 Datasheet BA3662CP-V5 ●Measurement Circuit for Typical Performance Curves A Vo Vcc Vo Vcc 6.8kΩ 6.8kΩ 1µ F CTL 1µ F + GND Vo Vcc CTL ADJ 22µ F 6.8kΩ 1µ F + ADJ GND CTL V + GND ADJ V 22µ F 22µ F 200mA 2.2kΩ 5V 2.2kΩ 2.2kΩ 5V IFEEDBACK _R Measurement Circuit of Fig.1 Measurement Circuit of Fig.2 Measurement Circuit of Fig.2 Measurement Circuit of Fig.3 Measurement Circuit of Fig.3 Measurement Circuit of Fig.4 V Vo Vcc Vo Vcc 1µ F CTL 6.8kΩ + GND ADJ 22µ F 10V CTL CTL GND 1µ F + ADJ CTL V 22µ F 10V Vcc Vo CTL ADJ 6.8kΩ 1µ F + GND 10V 100mA Measurement Circuit of Fig.7 Measurement Circuit of Fig.6 ADJ 2.2kΩ 2.2kΩ 5V 2.2kΩ 6.8kΩ 6.8kΩ 1µ F ADJ 5V Vo Vcc + GND 22µ F Measurement Circuit of Fig.5 Measurement Circuit of Fig.6 Vo Vcc CTL 10V 2.2kΩ 5V Measurement Circuit of Fig.5 Measurement Circuit of Fig.4 1µ F 22µ F 4.75V 2.2kΩ 5V ～ A + ADJ GND 6.8kΩ 1Vrms 1µ F A Vo Vcc 6.8kΩ 22µ F A + GND 22µ F 10V IFEEDBACK _R 5V 2.2kΩ A Vo Vcc Vo Vcc 6.8kΩ 1µ F CTL ADJ 1µ F CTL V 22µ F 10V Vcc Vo CTL ADJ 6.8kΩ + GND Measurement Circuit of Fig.9 Measurement Circuit of Fig.10 Measurement Circuit of Fig.8 Measurement Circuit of Fig.9 Measurement Circuit of Fig.7 Measurement Circuit of Fig.8 2.2kΩ Measurement Circuit of Fig.10 Measurement Circuit of Fig.11 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6.8kΩ 1µ F + GND ADJ V 22µ F 10V 2.2kΩ 5V 200mA Measurement Circuit of Fig.11 Measurement Circuit of Fig.12 7/14 + GND V 22µ F 10V 5V 2.2kΩ Measurement Circuit of Fig.12 Measurement Circuit of Fig.13 TSZ02201-0R6R0A600110-1-2 26.Jun.2012 Rev.001 Datasheet BA3662CP-V5 ●I/O equivalence circuit CTL Pin Vcc Pin Vo Pin C Pin Vcc 25kΩ Vcc CTL 10 kΩ C IC 25kΩ Vo 5.5 kΩ ●Output Voltage Configuration Method Please connect resistors R1 and R2 (which determines the output voltage) as shown in Fig.14. Please be aware that the offset due to the current that flows from the C pin becomes large when resistors with large values are used. The use of resistors with R1=2kΩ to 15kΩ is recommended. Vo R2 IC Vo ≒ Vc × (R1+R2) / R1 Vc≒1.225V (TYP.) C pin R1 Fig.14 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/14 TSZ02201-0R6R0A600110-1-2 26.Jun.2012 Rev.001 Datasheet BA3662CP-V5 ●Power Dissipation 25 (1)When using a maximum heat sick : θjc=6.25(℃/W) (2)When using an IC alone : θja=62.5(℃/W) Power Dissipation Pd （W) (1) 20.0 20 15 10 5 (2) 2.0 0 0 25 50 75 100 125 150 Ambient Temperature Ta(℃) Fig.15 When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.15. The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at temperatures less than the maximum junction temperature Tjmax. Fig.15 shows the acceptable loss and heat reducing characteristics of the TO220CP-V5 package. Even when the ambient temperature Ta is a normal temperature (25℃), the chip (junction) temperature Tj may be quite high so please operate the IC at temperatures less than the acceptable loss Pd. The calculation method for power consumption Pc(W) is as follows. Pc=(Vcc－Vo)×Io+Vcc×Ib Acceptable loss Pd≧Pc Solving this for load current Io in order to operate within the acceptable loss, Io≦ Pd－Vcc×Ib Vcc－Vo Vcc: Vo: Io: Ib: Ishort: Input voltage Output voltage Load current Circuit current Short current (Please refer to Fig.9 for Ib.) It is then possible to find the maximum load current IoMax with respect to the applied voltage Vcc at the time of thermal design. Calculation Example) When Ta=85℃,Vcc=10V,Vo=5V 1.04－10×Ib 5 Io≦192mA (Ib:8mA) Io≦ With the IC alone :θja=62.5℃/W → -16mW/℃ 25℃=2.0W → 85℃=1.04W Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is : Pc=Vcc×(Ib+Ishort) (Please refer to Fig.5 for Ishort.) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/14 TSZ02201-0R6R0A600110-1-2 26.Jun.2012 Rev.001 Datasheet BA3662CP-V5 ●Operational Notes 1. Absolute maximum ratings Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC. 2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external circuits and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics. 3. GND potential The potential of the GND pin must be the minimum potential in the system in all operating conditions. Ensure that no pins are at a voltage below the GND at any time, regardless of transient characteristics. 4. Ground wiring pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by poor soldering or foreign objects) may result in damage to the IC. 6. Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications where strong electromagnetic fields may be present. 7. Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Power dissipation If IC is used on condition that the power loss is over the power dissipation, the reliability will become worse by heat up. The power dissipation that is described to the absolute maximum rating in this specification is a value when the heat sink is not populated. In this case it exceed the power dissipation, please consider using the heat sink,etc. Also, be sure to use this IC within a power dissipation range allowing enough of margin. 9. Thermal consideration Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions. (Pd≧Pc) Tjmax : Maximum junction temperature=150℃, θja : Thermal resistance of package-ambience[℃/W], Pc : Power dissipation [W], Vo : Output Voltage, Io : Load, Package Power dissipation Power dissipation Ta : Peripheral temperature [℃], Pd : Package Power dissipation [W], Vcc : Input Voltage, Ib : Bias Current : Pd (W)=(Tjmax－Ta)/θja : Pc (W)=(Vcc－Vo)×Io+Vcc×Ib 10. Vcc pin Insert a capacitor (capacitor≧above 0.33µF) between the Vcc and GND pins. The appropriate capacitance value varies by application. Be sure to allow a sufficient margin for input voltage levels. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/14 TSZ02201-0R6R0A600110-1-2 26.Jun.2012 Rev.001 Datasheet BA3662CP-V5 11. Vo Terminal Please attach an anti-oscillation capacitor between Vo and GND. The capacitance of the capacitor may significantly change due to factors such as temperature changes, which may cause oscillations. Please use a tantalum capacitor or aluminum electrolytic capacitor with favorable characteristics and small external series resistance (ESR) even at low temperatures. The output oscillates regardless of whether the ESR is large or small. Please use the IC within the stable operating region while referring to the ESR characteristics reference data shown in Fig.16. In cases where there are sudden load fluctuations, the large capacitor is recommended. Below figure, it is ESR-to-Io stability Area characteristics, measured by 22µF-ceramic-capacitor and resistor connected in series. This characteristic is not equal value perfectly to 22µF-aluminum electrolytic capacitor in order to measurement method. Note, however, that the stable range suggested in the figure depends on the IC and the resistance load involved, and can vary with the board’s wiring impedance, input impedance, and/or load impedance. Therefore, be certain to ascertain the final status of these items for actual use. Keep capacitor capacitance within a range of 22µF to 1000µF. It is also recommended that a 0.33µF bypass capacitor be connected as close to the input pin-GND as location possible. However, in situations such as rapid fluctuation of the input voltage or the load, please check the operation in real application to determine proper capacitance. Vcc=10V VO=5V Ta=25℃ R1=2kΩ to 15kΩ Cin=0.33µF Cout=22µF 100 U n sta b le o p e ra tin g re g io n Cout_ESR（Ω） Cout (22µF) 10 R2 Cin Vcc (10V) 1 CTL (0.33µF) GND ADJ Io (ROUT) VCTL (5V) 100 200 R1 (2k to 15kΩ) U n sta b le o p e ra tin g re g io n 0 .1 0 ESR (above 0.001Ω) Vo Vcc Sta b le o p e ra tin g re g io n ※Operation Note 11 Measurement circuit 300 Io[mA] Fig.16 Cout_ESR vs Io (reference data) 12. Over current protection circuit (OCP) The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output capacity. This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit output current (without latching) in the event of a large and instantaneous current flow from a large capacitor or other component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous or transitive operation of the protection circuits. 13. Thermal shutdown circuit (TSD) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of thermal overload. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used after this function has activated, or in applications where the operation of this circuit is assumed. 14. Applications or inspection processes where the potential of the Vcc pin or other pins may be reversed from their normal state may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1000µF or lower in case Vcc is shorted with the GND pin while the external capacitor is charged. Insert a diode in series with Vcc to prevent reverse current flow, or insert bypass diodes between Vcc and each pin. 15. Positive voltage surges on VCC pin A power zener diode should be inserted between VCC and GND for protection against voltage surges of more than 50V on the VCC pin. Vcc GND www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/14 TSZ02201-0R6R0A600110-1-2 26.Jun.2012 Rev.001 Datasheet BA3662CP-V5 16. Negative voltage surges on VCC pin A schottky barrier diode should be inserted between VCC and GND for protection against voltages lower than GND on the VCC pin. Vcc GND 17. Output protection diode Loads with large inductance components may cause reverse current flow during startup or shutdown. protection diode should be inserted on the output to protect the IC. In such cases, a 18. Regarding input pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes and/or transistors. For example (refer to the figure below): ○When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode ○When GND > Pin B, the PN junction operates as a parasitic transistor Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Transistor (NPN) Resistor B (Pin B) (Pin A) (Pin B) E C B N P P+ N P P+ N P+ N Parasitic elements GND E P P+ N N GND N P substrate Parasitic elements or transistors C GND Parasitic elements or transistors (Pin A) Parasitic elements Example of Simple Monolithic IC Architecture Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/14 TSZ02201-0R6R0A600110-1-2 26.Jun.2012 Rev.001 Datasheet BA3662CP-V5 ●Physical Dimension Tape and Reel Information TO220CP-V5 <Tape and Reel information> 4.5±0.1 (1.0) 1.444 0.82±0.1 0.92 1.778 Tape Embossed carrier tape Quantity 500pcs E2 Direction of feed The direction is the 1pin of product is at the lower left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 16.92 13.60 +0.2 2.8 -0.1 8.0 ± 0.2 12.0 ± 0.2 4.92 ± 0.2 1.0 ± 0.2 +0.4 15.2 -0.2 +0.3 φ3.2±0.1 10.0 -0.1 0.42±0.1 1.58 (2.85) 4.12 (Unit : mm) Reel 1pin Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagram TO220CP-V5 (TOP VIEW) Part Number Marking LOT Number BA3662 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/14 TSZ02201-0R6R0A600110-1-2 26.Jun.2012 Rev.001 Datasheet BA3662CP-V5 ●Revision History Date Revision 26.Jun.2012 001 Changes New Release www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/14 TSZ02201-0R6R0A600110-1-2 26.Jun.2012 Rev.001 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. 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It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. 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ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved.