Datasheet
CMOS LDO Regulator Series for Portable Equipments
Versatile Package
FULL CMOS LDO Regulator
BUxxUB3WG series
●General Description
BUxxUB3WG series is high-performance FULL CMOS
regulator with 360-mA output, which is mounted on
versatile package SSOP5 (2.9 mm × 2.8 mm × 1.25 mm).
It has excellent noise characteristics and load
responsiveness characteristics despite its low circuit
current consumption of 50μA. It is most appropriate for
various applications such as power supplies for logic IC,
RF, and camera modules.ROHM’s.
●Key Specifications
Output voltage:
Accuracy output voltage:
Low current consumption:
Operating temperature range:
1.0V to 2.6V
±1.0% (±25mV)
50μA
-40°C to +85°C
●Applications
Battery-powered portable equipment, etc.
●Package
SSOP5:
●Features
High accuracy detection
low current consumption
Compatible with small ceramic capacitor (Cin=Co=1.0uF)
With built-in output discharge circuit
High ripple rejection
ON/OFF control of output voltage
With built-in over current protection circuit
and thermal shutdown circuit
Package SSOP5 is similar to SOT-23-5 (JEDEC)
Low dropout voltage
2.90mm x 2.80mm x 1.25mm
●Typical Application Circuit
STBY
VIN
STBY
VOUT
VOUT
VIN
GND
GND
GND
Fig.1 Application Circuit
○Product structure:Silicon monolithic integrated circuit
○This product is not designed protection against radioactive rays.
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Datasheet
BUxxUB3WG series
●Connection Diagram
VOUT
SSOP5
N.C.
Lot. No
Marking
VIN GND STBY
TOP VIEW
●Pin Descriptions
SSOP5
PIN No.
Symbol
Function
1
VIN
Power Supply Voltage
2
GND
Grouding
3
STBY
4
N.C.
ON/OFF control of output voltage
(High: ON, Low: OFF)
Unconnected Terminal
5
VOUT
Output Voltage
z Ordering Information
B
U
x
Part
Number
x
U
Output Voltage
10 : 1.0V
B
3
Low Dropout Voltage
Maximum Output Current
360mA
W
G
with
Package
output discharge G : SSOP5
26 : 2.6V
-
ｘ
ｘ
Halogen Free
G : compatible
Blank : incompatible
ｘ
Packageing and forming specification
Embossed tape and reel
TR : The pin number 1 is the upper right
TL : The pin number 1 is the lower left
SSOP5
+6°
4° −4°
2.9±0.2
5
1
2
0.2Min.
2.8±0.2
+0.2
1.6 −0.1
4
3
0.05±0.05
1.1±0.05
1.25Max.
+0.05
0.13 −0.03
+0.05
0.42 −0.04
0.95
0.1
(Unit : mm)
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Datasheet
BUxxUB3WG series
●Lineup
Marking
Output Voltage
Part Number
MW
1.0V
BU10
MX
1.15V
BU1B
MZ
1.2V
BU12
M6
1.25V
BU1C
LL
2.1V
BU21
LM
2.3V
BU23
LN
2.5V
BU25
LP
2.6V
BU26
M7
1.5V
BU15
M2
1.8V
BU18
M8
1.85V
BU1J
M9
1.9V
BU19
LJ
2.0V
BU20
●Absolute Maximum Ratings (Ta=25°C)
PARAMETER
Power Supply Voltage
Power Dissipation
Maximum junction temperature
Operating Temperature Range
Storage Temperature Range
Symbol
Limit
VMAX
-0.3 ～ +4.0
V
540(*1)
mW
Pd
Unit
+125
℃
Topr
-40 ～ +85
℃
Tstg
-55 ～ +125
℃
TjMAX
(*1)Pd deleted at 5.4mW/℃ at temperatures above Ta=25℃, mounted on 70×70×1.6 mm glass-epoxy PCB.
● RECOMMENDED OPERATING RANGE (not to exceed Pd)
PARAMETER
Symbol
Limit
Unit
Power Supply Voltage
VIN
1.7～3.6
V
Maximum Output Current
IMAX
360
mA
●OPERATING CONDITIONS
PARAMETER
Symbol
MIN.
TYP.
MAX.
Unit
Input Capacitor
Cin
0.47(*2)
1.0
-
μF
Output Capacitor
Co
0.47(*2)
1.0
-
μF
CONDITION
Ceramic capacitor recommended
(*2)Make sure that the output capacitor value is not kept lower than this specified level across a variety of
temperature, DC bias, changing as time progresses characteristic.
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Datasheet
BUxxUB3WG series
●Electrical Characteristics
(Ta=25℃, VIN=VOUT+1.0V (*3), STBY=VIN, Cin=1.0μF, Co=1.0μF, unless otherwise noted.)
PARAMETER
Limit
Symbol
MIN.
Unit
TYP.
Conditions
MAX.
Overall Device
Output Voltage 1
VOUT1
VOUT×0.99
VOUT-25mV
Operating Current
Operating Current (STBY)
Ripple Rejection Ratio
Dropout Voltage
VOUT
VOUT×1.01
V
VOUT+25mV
IOUT=10μA，VOUT≧2.5V
IOUT=10μA，VOUT＜2.5V
IIN
-
50
90
μA
IOUT=0mA
ISTBY
-
-
1.0
μA
STBY=0V
RR
45
70
-
dB
VRR=-20dBv,fRR=1kHz,IOUT=10mA, VIN=3.6V
-
470
700
mV
1.0V≦VOUT＜1.2V(IOUT=300mA)
-
350
500
mV
1.2V≦VOUT＜1.5V(IOUT=300mA)
-
280
380
mV
1.5V≦VOUT＜1.7V(IOUT=300mA)
-
250
320
mV
1.7V≦VOUT＜2.1V(IOUT=300mA)
-
220
260
mV
2.1V≦VOUT＜2.5V(IOUT=300mA)
-
200
220
mV
2.5V≦VOUT＜2.6V(IOUT=300mA)
-
2
20
mV
VIN=VOUT+1.0V to 3.6V(*4), IOUT=10μA
VSAT
Line Regulation
VDL
Load Regulation
VDLO
-
25
45
mV
IOUT=0.01mA to 300mA
-
35
55
mV
IOUT=0.01mA to 360mA
Over-current Protection (OCP)
Limit Current
ILMAX
370
550
-
mA
Vo=VOUT*0.95
Short Current
ISHORT
50
150
300
mA
Vo=0V
RDSC
20
50
80
Ω
VIN=3.6V, STBY=0V, VOUT=2.6V
ISTB
0.1
0.9
8.0
μA
STBY=1.5V
Standby Block
Discharge
Resistor
STBY Pin Pull-down Current
STBY Control Voltage
ON
VSTBH
1.2
-
5.5
V
OFF
VSTBL
-0.3
-
0.3
V
VOUT2
1.7
1.8
1.9
V
Output Voltage 2
VIN=2.375V to 2.625V
VOUT=1.8V, IOUT=0.01mA to 300mA, Ta=-40～85℃
●This product is not designed for protection against radioactive rays.
(*3) VIN=2.5V for VOUT≦1.5V
(*4) VIN=2.5V to 3.6V for VOUT≦1.5V
●Block Diagrams
VIN
VIN
1
VREF
VOUT
Cin
VOUT
5
GND
2
OCP
Co
TSD
STBY
STBY
3
STBY
Discharge
Cin･･･1.0μF (Ceramic)
Co ･･･1.0μF (Ceramic)
Fig. 2 Block Diagrams
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Datasheet
BUxxUB3WG series
z Reference data
BU18UB3WG
(Ta=25ºC unless otherwise specified.)
LINE REGULATION
LINE REGULATION
1.90
1.88
1.86
1.86
1.84
1.84
1.82
1.82
1.80
1.78
1.76
1.80
1.78
1.76
1.74
1.74
85℃
25℃
-40℃
1.72
1.70
85℃
25℃
-40℃
1.72
1.70
2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VIN[V]
VIN[V]
Fig. 3
Fig. 4
LOAD REGULATION
1.90
OUTPUT VOLTAGE vs TEMPERATURE
1.90
Vout=1.8V
1.88
1.88
1.86
1.86
1.84
1.84
1.82
1.82
VOUT[V]
VOUT[V]
Vout=1.8V
Iout=300mA
1.88
VOUT[V]
VOUT[V]
1.90
Vout=1.8V
Iout=10mA
1.80
1.78
1.76
Vout=1.8V
1.80
1.78
1.76
1.74
1.74
85℃
25℃
-40℃
1.72
1.70
0
50
100
150
200
250
10mA
150mA
300mA
1.72
1.70
300
-40
-20
0
20
Fig. 5
65
60
80
Fig. 6
GROUND PIN CURRENT vs INPUT VOLTAGE
Vout=1.8V
70
40
Temperature[℃]
IOUT[mA]
GROUND PIN CURRENT vs LOAD
450
Vout=1.8V
400
60
55
350
50
300
IGND[uA]
IGND[uA]
45
40
35
30
25
250
200
150
20
100
15
85℃
25℃
-40℃
10
5
0
0
2.3
2.5
2.7
2.9
3.1
3.3
0
3.5
50
100
150
200
250
300
IOUT[mA]
VIN[V]
Fig. 7
Fig. 8
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25℃
-40℃
50
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Datasheet
BUxxUB3WG series
z Reference data
BU18UB3WG
(Ta=25ºC unless otherwise specified.)
GROUND PIN CURRENT vs TEMPERATURE
Vout=1.8V
70
SHUTDOWN CURRENT vs INPUT VOLTAGE
Vout=1.8V
2.5
60
2.0
ISHDN[uA]
IGND[uA]
50
40
30
1.5
1.0
20
0.5
85℃
25℃
-40℃
10
0.0
0
-40
-20
0
20
40
60
Temperature[℃]
2.3
80
2.5
2.7
2.9
Fig. 9
3.3
3.5
Fig. 10
CURRENT LIMIT vs INPUT VOLTAGE
700
3.1
VIN[V]
POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY
100
Vout=1.8V
90
600
10mA
150mA
80
70
PSRR[dB]
ILIM[mA]
500
400
300
60
50
40
30
200
20
85℃
25℃
-40℃
100
10
0
0
2.3
2.5
2.7
2.9
3.1
3.3
10
3.5
100
Fig. 11
20mA/div
0mA
100mV/div
100mA/div
100mV/div
1000000
Trise=Tfall=1us
VOUT
10mA
IOUT
0mA
VOUT
Vout=1.8V
Vout=1.8V
10µs/div
10µs/div
Fig. 13
Fig. 14
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100000
LOAD TRANSIENT RESPONSE
200mA
IOUT
10000
Fig. 12
LOAD TRANSIENT RESPONSE
Trise=Tfall=1us
1000
Frequency[Hz]
VIN[V]
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Datasheet
BUxxUB3WG series
z Reference data
BU18UB3WG
(Ta=25ºC unless otherwise specified.)
LOAD TRANSIENT RESPONSE
LOAD TRANSIENT RESPONSE
200mA/div
Trise=Tfall=1us
50mA
IOUT
0mA
100mV/div
100mV/div
50mA/div
Trise=Tfall=1us
VOUT
300mA
IOUT
0mA
VOUT
Vout=1.8V
Vout=1.8V
10µs/div
10µs/div
Fig. 15
Fig. 16
LINE TRANSIENT RESPONSE
LINE TRANSIENT RESPONSE
Slew Rate = 0.5V/µs
1V/div
1V/div
Slew Rate = 0.5V/µs
2.9V
VIN
2.9V
VIN
2.3V
100mV/div
100mV/div
2.3V
VOUT
Vout=1.8V
VOUT
Vout=1.8V
Iout=1mA
Iout=300mA
1ms/div
1ms/div
Fig. 17
Fig. 18
VIN RAMP UP, RAMP DOWN RESPONSE
LINE TRANSIENT RESPONSE
Slew Rate = 0.5V/µs
Vout=1.8V
Iout=1mA
1V/div
3.6V
VIN
VIN
100mV/div
1V/div
2.1V
VOUT
VOUT
Vout=1.8V
Iout=300mA
1ms/div
200ms/div
Fig. 20
Fig. 19
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BUxxUB3WG series
z Reference data
BU18UB3WG
(Ta=25ºC unless otherwise specified.)
DISCHARGE TIME
START UP TIME
1.5V
1V/div
1V/div
1.5V
STBY
0V
VOUT
1V/div
1V/div
STBY
Vout=1.8V
Iout=0mA
Cout=1.0uF
VOUT
Vout=1.8V
Iout=0mA
Cout=1.0uF
40µs/div
20µs/div
Fig. 21
Fig. 22
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Datasheet
BUxxUB3WG series
z About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the
original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability.
Therefore, be sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
{ Measurement conditions
Standard ROHM Board
Layout of Board for
Measurement
Top Layer (Top View)
IC
Implementation
Position
Bottom Layer (Top View)
Measurement State
With board implemented (Wind speed 0 m/s)
Board Material
Glass epoxy resin (Double-side board)
Board Size
70 mm x 70 mm x 1.6 mm
Top layer
Wiring
Bottom
Rate
layer
Through Hole
Metal (GND) wiring rate: Approx. 0%
Metal (GND) wiring rate: Approx. 50%
Diameter 0.5mm x 6 holes
Power Dissipation
0.54W
Thermal Resistance
θja=185.2°C/W
0.6
0.5
0.54W
Standard ROHM
Board
Pd [W]
0.4
0.3
* Please design the margin so that
PMAX becomes is than Pd (PMAX<Pd)
within the usage temperature range
0.2
0.1
0
0
25
50
75
85
100
125
Ta [℃]
Fig. 23 SSOP5 Power dissipation heat reduction characteristics (Reference)
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BUxxUB3WG series
●Operation Notes
1.) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in
damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage
is suffered. If operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry
(such as fuses) to eliminate the risk of damaging the IC.
2.) GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions.
Never connect a potential lower than GND to any pin, even if only transiently.
3.) Thermal design
Use a thermal design that allows for a sufficient margin for that package power dissipation rating (Pd) under actual operating
conditions.
4.) Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting or
shorts between pins may result in damage to the IC.
5.) Operation in strong electromagnetic fields
Strong electromagnetic fields may cause the IC to malfunction. Caution should be exercised in applications where strong
electromagnetic fields may be present.
6.) Common impedance
Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should
be use to keep ripple to a minimum.
7.) Voltage of STBY pin
To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more.
STBY to a voltage between 0.3 and 1.2 V may cause malfunction and should be avoided.
Setting
Keep transition time between high and
low (or vice versa) to a minimum.
Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing
a temporary voltage to remain on the output pin.
occur on the output.
If the IC is switched on again while this voltage is present, overshoot may
Therefore, in applications where these pins are shorted, the output should always be completely discharged
before turning the IC on.
8.) Over-current protection circuit (OCP)
This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC when
the output is shorted.
The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output
shorts) and is not designed to be used as an active security device for the application.
Therefore, applications should not
be designed under the assumption that this circuitry will engage.
9.) Thermal shutdown circuit (TSD)
This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the
IC exceeds about 150℃.
This feature is intended to protect the IC only in the event of thermal overload and is not designed
to guarantee operation or act as an active security device for the application.
Therefore, applications should not be designed
under the assumption that this circuitry will engage.
10.) Input/output capacitor
Capacitors must be connected between the input/output pins and GND for stable operation, and should be physically mounted as
close to the IC pins as possible (refer to figure 4).
The input capacitor helps to counteract increases in power supply impedance,
and increases stability in applications with long or winding power supply traces.
The output capacitance value is directly
regionpossible value for
related to the overall stability and transient response of the regulator, and should be set Unstable
to the largest
the application to increase these characteristics. During design, keep in mind that in general, ceramic capacitors have a wide
range of tolerances, temperature coefficients and DC bias characteristics, and that their capacitance values tend to decrease
over time. Confirm these details before choosing appropriate capacitors for your application.(Please refer the technical note,
regarding ceramic capacitor of
recommendation)
11.) About the equivalent series resistance (ESR) of a ceramic capacitor
Cout=1.0uF Cin=1.0uF Temp=25℃
Capacitors generally have ESR (equivalent series resistance)
100
and it operates stably in the ESR-IOUT area shown on the right.
Since ceramic capacitors, tantalum capacitors, electrolytic
Unstable
capacitors, etc. generally have different ESR, please check
10
stability area range shown in the right graph for evaluation
of the actual application.
ESR[Ω]
the ESR of the capacitor to be used and use it within the
1
0.1
Stable
0.01
0
100
Fig. 24
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200
IOUT[mA]
300
400
Stable region (example)
TSZ02201-0RBR0A300010-1-2
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Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.