PS2513-1,PS2513L-1 DS

PHOTOCOUPLER
PS2513-1,PS2513L-1
HIGH-SPEED SWITCHING/HIGH ISOLATION VOLTAGE
−NEPOC
PHOTOCOUPLER SERIES
Series−
DESCRIPTION
The PS2513-1 and PS2513L-1 are optically coupled isolators containing a GaAs light emitting diode and an NPN
silicon phototransistor.
The PS2513-1 is in a plastic DIP (Dual In-line Package) and the PS2513L-1 is lead bending type (Gull-wing) for
surface mount.
FEATURES
• High isolation voltage (BV = 5 000 Vr.m.s.)
• High collector to emitter voltage (VCEO = 120 V)
• Guaranteed maximum switching speed (toff ≤ 60 μs @ IF = 5 mA, VCC = 5 V, RL = 1.9 kΩ)
• High-speed switching (ton = 5 μs TYP. @ IF = 5 mA, VCC = 5 V, RL = 1.9 kΩ)
(toff = 25 μs TYP. @ IF = 5 mA, VCC = 5 V, RL = 1.9 kΩ)
• Ordering number of tape product: PS2513L-1-E3, E4, F3, F4
• Safety standards
• UL approved: File No. E72422
• DIN EN60747-5-2 (VDE0884 Part2) approved (Option)
APPLICATIONS
• Power supply
• Air conditioner
• FA equipment
Document No. PN10163EJ03V0DS (3rd edition)
Date Published March 2006 CP(K)
The mark  shows major revised points.
© NEC Compound Semiconductor Devices, Ltd. 2002, 2006
PS2513-1,PS2513L-1
PACKAGE DIMENSIONS (UNIT: mm)
DIP Type
PS2513-1
4.6±0.35
3
6.5±0.5
1. Anode
2. Cathode
3. Emitter
4. Collector
1
2
7.62
3.5±0.3
3.2±0.4 4.15±0.4
TOP VIEW
4
0 to 15˚ +0.1
0.25 –0.05
1.25±0.15
0.50±0.10
0.25 M
2.54
Lead Bneding Type
PS2513L-1
TOP VIEW
4
4.6±0.35
6.5±0.5
1. Anode
2. Cathode
3. Emitter
4. Collector
2
0.1 +0.1
–0.05
3.5±0.3
0.25 +0.1
–0.05
1
0.9±0.25
9.60±0.4
1.25±0.15
0.25 M
2.54
2
3
0.15
Data Sheet PN10163EJ03V0DS
PS2513-1,PS2513L-1
MARKING EXAMPLE
No. 1 pin
Mark
2513
NJ601
N
J
Assembly Lot
6 01
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
Data Sheet PN10163EJ03V0DS
3
PS2513-1,PS2513L-1
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Packing Style
Safety Standard
Application Part
Approval
Number
Specification
PS2513-1
PS2513-1-A
Pb-Free
PS2513L-1
PS2513L-1-A
PS2513L-1-E3
PS2513L-1-E3-A
PS2513L-1-E4
PS2513L-1-E4-A
PS2513L-1-F3
PS2513L-1-F3-A
PS2513L-1-F4
PS2513L-1-F4-A
PS2513-1-V
PS2513-1-V-A
PS2513L-1-V
PS2513L-1-V-A
PS2513L-1-V-E3
PS2513L-1-V-E3-A
PS2513L-1-V-E4
PS2513L-1-V-E4-A
PS2513L-1-V-F3
PS2513L-1-V-F3-A
PS2513L-1-V-F4
PS2513L-1-V-F4-A
Magazine case 100 pcs
Standard products
(UL Approved)
Embossed Tape 1 000 pcs/reel
Embossed Tape 2 000 pcs/reel
Magazine case 100 pcs
DIN EN60747-5-2
(VDE0884 Part2)
Embossed Tape 1 000 pcs/reel
approved products
(Option)
Embossed Tape 2 000 pcs/reel
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Ratings
Parameter
Symbol
PS2513-1,
Unit
PS2513L-1
Diode
Reverse Voltage
VR
6
V
Forward Current (DC)
IF
60
mA
ΔPD/°C
1.5
mW/°C
PD
150
mW
IFP
1
A
Collector to Emitter Voltage
VCEO
120
V
Emitter to Collector Voltage
VECO
6
V
IC
30
mA
ΔPC/°C
1.5
mW/°C
PC
150
mW
BV
5 000
Vr.m.s.
Operating Ambient Temperature
TA
−55 to +100
°C
Storage Temperature
Tstg
−55 to +150
°C
Power Dissipation Derating
Power Dissipation
Peak Forward Current
Transistor
*1
Collector Current
Power Dissipation Derating
Power Dissipation
Isolation Voltage
*2
*1 PW = 100 μs, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output
Pins 1-2 shorted together, 3-4 shorted together.
4
Data Sheet PN10163EJ03V0DS
*1
PS2513-1
PS2513-1,PS2513L-1
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter
Diode
Transistor
Symbol
Conditions
Forward Voltage
VF
IF = 5 mA
Reverse Current
IR
VR = 5 V
Terminal Capacitance
Ct
V = 0 V, f = 1.0 MHz
Collector to Emitter Dark
ICEO
MIN.
TYP.
MAX.
Unit
1.1
1.3
V
5
μA
30
VCE = 120 V, IF = 0 mA
pF
100
nA
Current
Coupled
Current Transfer Ratio
CTR1
IF = 1 mA, VCE = 5 V
25
75
100
%
(IC/IF)
CTR2
IF = 5 mA, VCE = 5 V
50
125
200
%
Collector Saturation
VCE(sat)
IF = 10 mA, IC = 2 mA
0.3
V
Voltage
Isolation Resistance
RI-O
VI-O = 1.0 kVDC
Isolation Capacitance
CI-O
V = 0 V, f = 1.0 MHz
*1
tr
Rise Time
*1
Fall Time
VCC = 5 V, IC = 2 mA, RL = 100 Ω
tf
*1
ton
*1
toff
Turn-on Time
Turn-off Time
10
Ω
11
0.5
pF
3
μs
4
VCC = 5 V, IF = 5 mA, RL = 1.9 kΩ
5
60
25
60
μs
*1 Test circuit for switching time
Pulse Input
IF
VCC
PW = 100 μs
Duty Cycle = 1/10
50 Ω
VOUT
RL = 100 Ω, 1.9 kΩ
Data Sheet PN10163EJ03V0DS
5
PS2513-1,PS2513L-1
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
Transistor Power Dissipation PC (mW)
Diode Power Dissipation PD (mW)
175
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
150
125
100
75
50
25
0
25
50
100
75
125
100
75
50
25
50
75
100
125
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
FORWARD CURRENT vs.
FORWARD VOLTAGE
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
TA = +100˚C
+60˚C
+25˚C
Collector Current IC (mA)
30
10
5
0˚C
–25˚C
–55˚C
1
0.5
25
20
50
mA
20
15
mA
A
10 m
10
IF = 5 mA
5
0.1
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
0
2
4
6
8
10
Forward Voltage VF (V)
Collector to Emitter Voltage VCE (V)
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
40
10 000
1 000
Collector Current IC (mA)
VCE = 5 V
10 V
24 V
40 V
120 V
100
10
1
– 50
–25
0
25
50
75
100
20 mA
10 mA
5 mA
10
5
2 mA
1
IF = 1 mA
0.5
0.1
0
Ambient Temperature TA (˚C)
0.2
0.4
0.6
0.8
Collector Saturation Voltage VCE(sat) (V)
Remark The graphs indicate nominal characteristics.
6
25
35
50
Forward Current IF (mA)
150
0
125
100
Collector to Emitter Dark Current ICEO (nA)
175
Data Sheet PN10163EJ03V0DS
1.0
PS2513-1,PS2513L-1
;;;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;;;
1.0;;;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;;;
0.8;;;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;;;
0.6
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
1.2
0.4
Normalized to 1.0
at TA = 25˚C,
IF = 5 mA, VCE = 5 V
0.2
0
–50
–25
0
25
50
75
250
Current Transfer Ratio CTR (%)
Normalized Current Transfer Ratio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
VCC = 5 V,
n=3
200
Sample A
B
C
150
100
50
0
0.1
100
0.5
Ambient Temperature TA (˚C)
50
1 000
IF = 5 mA,
VCC = 5 V,
CTR = 130%
Switching Time t ( μ s)
IC = 2 mA,
VCC = 10 V,
CTR = 130%
Switching Time t ( μ s)
10
SWITCHING TIME vs.
LOAD RESISTANCE
100
tr
10
tf
td
ts
1
0.1
10
50 100
tf
100
ts
10
tr
td
1
1k
5 k 10 k
500 1 k
5k
10 k
50 k
Load Resistance RL (Ω)
Load Resistance RL (Ω)
TURN-ON TIME vs.
AMBIENT TEMPERATURE
TURN-OFF TIME vs.
AMBIENT TEMPERATURE
10
100 k
100
IF = 5 mA,
VCC = 5 V,
RL = 1.9 kΩ,
CTR = 150%
Turn-off Time toff ( μ s)
Turn-on Time ton ( μ s)
5
Forward Current IF (mA)
SWITCHING TIME vs.
LOAD RESISTANCE
8
1
6
4
2
0
–50
–25
0
25
50
75
100
IF = 5 mA,
VCC = 5 V,
80 RL = 1.9 kΩ,
CTR = 150%
60
40
20
0
–50
Ambient Temperature TA (˚C)
–25
0
25
50
75
100
Ambient Temperature TA (˚C)
Remark The graphs indicate nominal characteristics.
Data Sheet PN10163EJ03V0DS
7
PS2513-1,PS2513L-1
LONG TERM CTR DEGRADATION
1.2
TYP.
CTR (Relative Value)
1.0
0.8
IF = 5 mA
TA = 25˚C
0.6
IF = 5 mA
TA = 60˚C
0.4
0.2
0
102
103
104
105
Time (Hr)
Remark The graph indicates nominal characteristics.
8
Data Sheet PN10163EJ03V0DS
PS2513-1,PS2513L-1
TAPING SPECIFICATIONS (UNIT: mm)
1.55±0.1
4.5 MAX.
10.3±0.1
7.5±0.1
φ 1.5 +0.1
–0
16.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
4.0±0.1
5.3±0.1
8.0±0.1
0.4
Tape Direction
PS2513L-1-E3
PS2513L-1-E4
Outline and Dimensions (Reel)
2.0±0.5
φ 21.0±0.8
φ 80.0±1.0
R 1.0
φ 254±2.0
2.0±0.5
φ 13.0±0.2
17.5±1.0
21.5±1.0
Packing: 1 000 pcs/reel
Data Sheet PN10163EJ03V0DS
15.9 to 19.4
Outer edge of
flange
9
PS2513-1,PS2513L-1
1.55±0.1
4.5 MAX.
10.3±0.1
7.5±0.1
φ 1.5 +0.1
–0
16.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
4.0±0.1
5.3±0.1
8.0±0.1
0.4
Tape Direction
PS2513L-1-F3
PS2513L-1-F4
Outline and Dimensions (Reel)
2.0±0.5
φ 21.0±0.8
φ 100±1.0
R 1.0
φ 330±2.0
2.0±0.5
φ 13.0±0.2
17.5±1.0
21.5±1.0
Packing: 2 000 pcs/reel
10
Data Sheet PN10163EJ03V0DS
15.9 to 19.4
Outer edge of
flange
PS2513-1,PS2513L-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C
120±30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Package Surface Temperature T (˚C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260˚C MAX.
220˚C
to 60 s
180˚C
120˚C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
260°C or below (molten solder temperature)
• Time
10 seconds or less
• Preheating conditions
120°C or below (package surface temperature)
• Number of times
One (Allowed to be dipped in solder including plastic mold portion.)
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature)
350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
Data Sheet PN10163EJ03V0DS
11
PS2513-1,PS2513L-1
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ according
to product.
When using products other than at the specified forward current, the characteristics curves may differ from the
standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual
operating conditions and thoroughly take variations or the like into consideration before use.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
12
Data Sheet PN10163EJ03V0DS
PS2513-1,PS2513L-1
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Speck
Unit
Application classification (DIN VDE 0109)
for rated line voltages ≤ 300 Vr.m.s.
IV
for rated line voltages ≤ 600 Vr.m.s.
III
Climatic test class (DIN IEC 68 Teil 1/09.80)
55/100/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
UIORM
890
Vpeak
Upr
1 068
Vpeak
Upr
1 424
Vpeak
UTR
8 000
Vpeak
Upr = 1.2 × UIORM, Pd < 5 pC
Test voltage (partial discharge test, procedure b for all devices test)
Upr = 1.6 × UIORM, Pd < 5 pC
Highest permissible overvoltage
Degree of pollution (DIN VDE 0109)
2
Clearance distance
> 7.0
mm
Creepage distance
> 7.0
mm
Comparative tracking index (DIN IEC 112/VDE 0303 part 1)
CTI
Material group (DIN VDE 0109)
175
III a
Storage temperature range
Tstg
–55 to +150
°C
Operating temperature range
TA
–55 to +100
°C
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25 °C
Ris MIN.
10
12
Ω
VIO = 500 V dc at TA MAX. at least 100 °C
Ris MIN.
10
11
Ω
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Tsi
175
°C
Current (input current IF, Psi = 0)
Isi
400
mA
Power (output or total power dissipation)
Psi
700
mW
Ris MIN.
10
Isolation resistance
VIO = 500 V dc at TA = 175 °C (Tsi)
Data Sheet PN10163EJ03V0DS
9
Ω
13
PS2513-1,PS2513L-1
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority
having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.
• The information in this document is current as of March, 2006. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4 - 0110
14
Data Sheet PN10163EJ03V0DS
PS2513-1,PS2513L-1
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
http://www.ncsd.necel.com/
E-mail: [email protected] (sales and general)
[email protected] (technical)
Sales Division TEL: +81-44-435-1573 FAX: +81-44-435-1579
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: [email protected] (sales, technical and general)
FAX: +852-3107-7309
TEL: +852-3107-7303
Hong Kong Head Office
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
Taipei Branch Office
FAX: +82-2-558-5209
TEL: +82-2-558-2120
Korea Branch Office
NEC Electronics (Europe) GmbH
http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc.
http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
0504