NEC PS2561BL-1-V-A

DATA SHEET
PHOTOCOUPLER
PS2561B-1,PS2561BL-1
PS2561BL1-1,PS2561BL2-1
DIP PHOTOCOUPLER
OPERATING AMBIENT TEMPERATURE 110°C
−NEPOC Series−
DESCRIPTION
The PS2561B-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon
phototransistor.
The PS2561B-1 is in a plastic DIP (Dual In-line Package) and the PS2561BL-1 is lead bending type (Gull-wing) for
surface mount.
The PS2561BL1-1 is lead bending type for long creepage distance.
The PS2561BL2-1 is lead bending type for long creepage distance (Gull-wing) for surface mount.
FEATURES
• Operating ambient temperature: 110°C
PIN CONNECTION
(Top View)
• High Isolation voltage (BV = 5 000 Vr.m.s.)
• High collector to emitter voltage (VCEO = 80 V)
4
3
1. Anode
2. Cathode
3. Emitter
4. Collector
• High current transfer ratio (CTR = 200% TYP.)
• High-speed switching (tr = 3 μs TYP., tf = 5 μs TYP.)
• Ordering number of taping product: PS2561BL-1-E3, E4, F3, F4
1
2
: PS2561BL2-1-E3, E4
• Pb-Free product
• Safety standards
<R>
•
UL approved: No. E72422
•
CSA approved: No. CA 101391
•
BSI approved: No. 7112/7420
•
SEMKO approved: No. 408808
•
NEMKO approved: No. P04202822
•
DEMKO approved: No. 312926
•
FIMKO approved: No. FI 21008
•
DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40008862 (Option)
APPLICATIONS
• Power supply
• Telephone/FAX.
• FA/OA equipment
• Programmable logic controller
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PN10505EJ04V0DS (4th edition)
Date Published December 2008 NS
Printed in Japan
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
2004, 2008
PS2561B-1,PS2561BL-1,PS2561BL1-1,PS2561BL2-1
PACKAGE DIMENSIONS (UNIT : mm)
DIP Type
Long Creepage Distance
PS2561BL1-1
PS2561B-1
4.6±0.35
4.6±0.35
3
3.15 3.85
±0.35 ±0.4
0 to 15° +0.1
0.25 –0.05
1.25±0.15
3
1
2
0.50±0.1
0.25 M
1.25±0.15
0.50±0.10
0.25 M
10.16
3.5
±0.3
7.62
3.5±0.3
2
3.2
±0.4
4.15
±0.4
1
4
6.5±0.5
6.5±0.5
4
+0.1
0.25–0.05
2.54
0 to 15°
2.54
Lead Bending Type
Long Creepage Distance (Gull-Wing)
PS2561BL2-1
PS2561BL-1
4.6±0.35
4.6±0.35
3
1
2
3
1
2
0.25 M
2.54
0.15
0.15
1.25±0.15
0.25 M
+0.1
0.25–0.05
0.25±0.2
3.5±0.3
0.1 +0.1
–0.05
0.25 +0.1
–0.05
3.5±0.3
0.9±0.25
9.60±0.4
1.25±0.15
2
4
6.5±0.5
6.5±0.5
4
0.9±0.25
10.16
+0.2
2.54
Data Sheet PN10505EJ04V0DS
11.8–0.5
PS2561B-1,PS2561BL-1,PS2561BL1-1,PS2561BL2-1
<R>
MARKING EXAMPLE
No. 1 pin
Mark
2561B
NJ831
N
J
Assembly Lot
8 31
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
Package
Pb-Free
Pb-Free and
Halogen Free
Made in Japan Made in Taiwan
New PKG
J
K
New PKG
R
Y
*1
*1 Special version
Data Sheet PN10505EJ04V0DS
3
PS2561B-1,PS2561BL-1,PS2561BL1-1,PS2561BL2-1
<R>
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Packing Style
Specification
Application
Approval
Part Number
PS2561B-1
PS2561B-1-A
PS2561BL-1
PS2561BL-1-A
(UL, CSA, BSI,
PS2561BL1-1
PS2561BL1-1-A
NEMKO, DEMKO,
PS2561BL2-1
PS2561BL2-1-A
SEMKO, FIMKO
PS2561BL-1-E3
PS2561BL-1-E3-A
PS2561BL-1-E4
PS2561BL-1-E4-A
PS2561BL-1-F3
PS2561BL-1-F3-A
PS2561BL-1-F4
PS2561BL-1-F4-A
PS2561BL2-1-E3
PS2561BL2-1-E3-A
PS2561BL2-1-E4
PS2561BL2-1-E4-A
PS2561B-1-V
PS2561B-1-V-A
PS2561BL-1-V
PS2561BL-1-V-A
(VDE0884 Part2)
PS2561BL1-1-V
PS2561BL1-1-V-A
approved
PS2561BL2-1-V
PS2561BL2-1-V-A
(Option)
PS2561BL-1-V-E3
PS2561BL-1-V-E3-A
PS2561BL-1-V-E4
PS2561BL-1-V-E4-A
PS2561BL-1-V-F3
PS2561BL-1-V-F3-A
PS2561BL-1-V-F4
PS2561BL-1-V-F4-A
PS2561BL2-1-V-E3
PS2561BL2-1-V-E3-A
PS2561BL2-1-V-E4
PS2561BL2-1-V-E4-A
PS2561B-1
PS2561B-1Y-A
Special version
PS2561BL-1
PS2561BL-1Y-A
(Pb-Free and
(UL, CSA, BSI,
PS2561BL1-1
PS2561BL1-1Y-A
Halogen Free)
NEMKO, DEMKO,
PS2561BL2-1
PS2561BL2-1Y-A
PS2561BL-1-F3
PS2561BL-1Y-F3-A
Embossed Tape 2 000 pcs/reel approved)
PS2561BL2-1-E3
PS2561BL2-1Y-E3-A
Embossed Tape 1 000 pcs/reel
PS2561B-1-V
PS2561B-1Y-V-A
Magazine case 100 pcs
PS2561BL-1-V
PS2561BL-1Y-V-A
(VDE0884 Part2)
PS2561BL1-1-V
PS2561BL1-1Y-V-A
approved
PS2561BL2-1-V
PS2561BL2-1Y-V-A
(Option)
PS2561BL-1-V-F3
PS2561BL-1Y-V-F3-A
Embossed Tape 2 000 pcs/reel
PS2561BL2-1-V-E3
PS2561BL2-1Y-V-E3-A
Embossed Tape 1 000 pcs/reel
Pb-Free
Magazine case 100 pcs
Safety Standard
Standard products
Embossed Tape 1 000 pcs/reel approved)
Embossed Tape 2 000 pcs/reel
Embossed Tape 1 000 pcs/reel
Magazine case 100 pcs
DIN EN60747-5-2
Embossed Tape 1 000 pcs/reel
Embossed Tape 2 000 pcs/reel
Embossed Tape 1 000 pcs/reel
Magazine case 100 pcs
Standard products
SEMKO, FIMKO
DIN EN60747-5-2
*1 For the application of the Safety Standard, following part number should be used.
4
PS2561B-1
Data Sheet PN10505EJ04V0DS
PS2561B-1
*1
PS2561B-1,PS2561BL-1,PS2561BL1-1,PS2561BL2-1
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Reverse Voltage
VR
6
V
Forward Current (DC)
IF
40
mA
ΔPD/°C
1.5
mW/°C
PD
150
mW
IFP
1
A
Collector to Emitter Voltage
VCEO
80
V
Emitter to Collector Voltage
VECO
7
V
IC
50
mA
ΔPC/°C
1.5
mW/°C
PC
150
mW
BV
5 000
Vr.m.s.
Operating Ambient Temperature
TA
–55 to +110
°C
Storage Temperature
Tstg
–55 to +150
°C
Diode
Power Dissipation Derating
Power Dissipation
*1
Peak Forward Current
Transistor
Collector Current
Power Dissipation Derating
Power Dissipation
Isolation Voltage
*2
*1 PW = 100 μs, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-2 shorted together, 3-4 shorted together.
Data Sheet PN10505EJ04V0DS
5
PS2561B-1,PS2561BL-1,PS2561BL1-1,PS2561BL2-1
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter
Diode
Transistor
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
1.17
1.4
V
5
μA
Forward Voltage
VF
IF = 10 mA
Reverse Current
IR
VR = 5 V
Terminal Capacitance
Ct
V = 0 V, f = 1.0 MHz
ICEO
VCE = 48 V, IF = 0 mA
CTR
IF = 5 mA, VCE = 5 V
100
200
IF = 1 mA, VCE = 5 V
50
100
Collector to Emitter Dark
50
pF
100
nA
400
%
0.3
V
Current
Coupled
Current Transfer Ratio
*1
(IC/IF)
Collector Saturation
VCE (sat)
IF = 10 mA, IC = 2 mA
Voltage
Isolation Resistance
RI-O
VI-O = 1.0 kVDC
Isolation Capacitance
CI-O
V = 0 V, f = 1.0 MHz
Rise Time
*2
tr
*2
tf
Fall Time
10
Ω
11
VCC = 10 V, IC = 2 mA, RL = 100 Ω
0.5
pF
3
μs
5
*1 CTR rank
CTR Rank
CTR (%)
Conditions
100 to 200
IF = 5 mA, VCE = 5 V
50 and larger
IF = 1 mA, VCE = 5 V
130 to 260
IF = 5 mA, VCE = 5 V
70 and larger
IF = 1 mA, VCE = 5 V
100 to 300
IF = 5 mA, VCE = 5 V
50 and larger
IF = 1 mA, VCE = 5 V
200 to 400
IF = 5 mA, VCE = 5 V
100 and larger
IF = 1 mA, VCE = 5 V
100 to 400
IF = 5 mA, VCE = 5 V
50 and larger
IF = 1 mA, VCE = 5 V
Q
W
D
L
N
<R>
*2 Test circuit for switching time
Pulse Input
VCC
Input
PW = 100 μ s
Duty Cycle = 1/10
ton
IF
50 Ω
td
VOUT
RL = 100 Ω
toff
ts
90%
Output
10%
tr
6
Data Sheet PN10505EJ04V0DS
tf
PS2561B-1,PS2561BL-1,PS2561BL1-1,PS2561BL2-1
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
Transistor Power Dissipation PC (mW)
Diode Power Dissipation PD (mW)
150
100
1.5 mW/°C
50
0
25
50
100110 125
75
1.5 mW/°C
50
25
50
100110 125
75
150
Ambient Temperature TA (°C)
Ambient Temperature TA (°C)
FORWARD CURRENT vs.
FORWARD VOLTAGE
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
70
50
TA = +100°C
+60°C
+25°C
60
Collector Current IC (mA)
Forward Current IF (mA)
100
0
150
100
10
5
0°C
–25°C
–55°C
1
0.5
50
40
20
30
mA A
m
10
20
IF = 5 mA
10
0.1
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
0
1.5
2
4
6
8
10
Forward Voltage VF (V)
Collector to Emitter Voltage VCE (V)
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
40
10 000
Collector Current IC (mA)
Collector to Emitter Dark Current ICEO (nA)
150
VCE = 48 V
24 V
10 V
5V
1 000
100
10
1
– 50
–25
0
25
50
75
100 110
5 mA
5
2 mA
IF = 1 mA
1
0.5
0.1
0
0.2
0.4
0.6
0.8
1.0
Collector Saturation Voltage VCE (sat) (V)
Ambient Temperature TA (°C)
Remark
20 mA
10 mA
10
The graphs indicate nominal characteristics.
Data Sheet PN10505EJ04V0DS
7
PS2561B-1,PS2561BL-1,PS2561BL1-1,PS2561BL2-1
Normalized Current Transfer Ratio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
1.2
450
VCE = 5 V
400
1.0
350
300
0.8
Sample A
B
C
250
0.6
200
0.4
150
Normalized to 1.0
at TA = 25°C,
IF = 5 mA, VCE = 5 V
0.2
0
–50
–25
0
25
50
75
100
50
0
100 110
0.05 0.1
1
5
10
50
Forward Current IF (mA)
Ambient Temperature TA (°C)
SWITCHING TIME vs.
LOAD RESISTANCE
SWITCHING TIME vs.
LOAD RESISTANCE
50
1 000
IC = 2 mA,
VCC = 10 V,
CTR = 290%
Switching Time t ( μ s)
0.5
tf
IF = 5 mA,
VCC = 5 V,
CTR = 290%
tf
tr
10
ts
100
td
ts
1
10
tr
50 100
td
500 1 k
5 k 10 k
50 k 100 k
Load Resistance RL (Ω)
Load Resistance RL (Ω)
IC, ICEO vs. AMBIENT TEMPERATURE
FREQUENCY RESPONSE
10 000
1 000
100
IF = 5 mA,
VCE = 5 V
CTR = 200%
0
IC (VCE = 5 V, IF = 1 mA)
VCE = 48 V
= 24 V
10
1
0.1
–5
–10
100 Ω
–15
RL = 1 kΩ
–20
0.01
300 Ω
0.001
0
25
50
75
100 110
0.5 1
Ambient Temperature TA (°C)
Remark
8
1
100
5 k 10 k
500 1 k
Normalized Gain GV
Collector Current IC, Collector to Emitter Dark Current ICEO (μA)
0.1
10
2
5
10 20
50 100 200 500
Frequency f (kHz)
The graphs indicate nominal characteristics.
Data Sheet PN10505EJ04V0DS
PS2561B-1,PS2561BL-1,PS2561BL1-1,PS2561BL2-1
LONG TERM CTR DEGRADATION
1.2
TYP.
1.0
0.8
IF = 5 mA
TA = 25°C
0.6
IF = 5 mA
TA = 60°C
0.4
0.2
0
102
103
104
105
Time (Hr)
Remark
The graph indicates nominal characteristics.
Data Sheet PN10505EJ04V0DS
9
PS2561B-1,PS2561BL-1,PS2561BL1-1,PS2561BL2-1
TAPING SPECIFICATIONS (UNIT : mm)
1.55±0.1
4.5 MAX.
10.3±0.1
7.5±0.1
φ 1.5 +0.1
–0
16.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
4.0±0.1
5.3±0.1
8.0±0.1
0.4
Tape Direction
PS2561BL-1-E3
PS2561BL-1-E4
Outline and Dimensions (Reel)
2.0±0.5
φ 21.0±0.8
φ 80.0±1.0
R 1.0
φ 254±2.0
2.0±0.5
φ 13.0±0.2
17.5±1.0
21.5±1.0
Packing: 1 000 pcs/reel
10
Data Sheet PN10505EJ04V0DS
15.9 to 19.4
Outer edge of
flange
PS2561B-1,PS2561BL-1,PS2561BL1-1,PS2561BL2-1
1.55±0.1
4.5 MAX.
10.3±0.1
7.5±0.1
1.5 +0.1
–0
16.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
4.0±0.1
5.3±0.1
8.0±0.1
0.4
Tape Direction
PS2561BL-1-F3
PS2561BL-1-F4
Outline and Dimensions (Reel)
2.0±0.5
φ 21.0±0.8
φ 100±1.0
R 1.0
φ 330±2.0
2.0±0.5
φ 13.0±0.2
17.5±1.0
21.5±1.0
Packing: 2 000 pcs/reel
Data Sheet PN10505EJ04V0DS
15.9 to 19.4
Outer edge of
flange
11
PS2561B-1,PS2561BL-1,PS2561BL1-1,PS2561BL2-1
2.05±0.1
4.4±0.2
12.35±0.15
11.5±0.1
1.55±0.1
24.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
0.38
6.6±0.2
12.0±0.1
Tape Direction
PS2561BL2-1-E3
PS2561BL2-1-E4
Outline and Dimensions (Reel)
R 1.0
φ 21.0±0.8
φ 100±1.0
2.0±0.5
φ13.0±0.2
φ 330±2.0
2.0±0.5
25.5±1.0
29.5±1.0
Packing: 1 000 pcs/reel
12
Data Sheet PN10505EJ04V0DS
23.9 to 27.4
Outer edge of
flange
PS2561B-1,PS2561BL-1,PS2561BL1-1,PS2561BL2-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C
120±30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Package Surface Temperature T (°C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260°C MAX.
220°C
to 60 s
180°C
120°C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
260°C or below (molten solder temperature)
• Time
10 seconds or less
• Preheating conditions
120°C or below (package surface temperature)
• Number of times
One (Allowed to be dipped in solder including plastic mold portion.)
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature)
350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
Data Sheet PN10505EJ04V0DS
13
PS2561B-1,PS2561BL-1,PS2561BL1-1,PS2561BL2-1
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
corrector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ according
to product.
When using products other than at the specified forward current, the characteristics curves may differ from the
standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual
operating conditions and thoroughly take variations or the like into consideration before use.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
14
Data Sheet PN10505EJ04V0DS
PS2561B-1,PS2561BL-1,PS2561BL1-1,PS2561BL2-1
<R>
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Climatic test class (IEC 60068-1/DIN EN 60068-1)
Spec.
Unit
55/100/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
UIORM
890
Vpeak
Upr
1 335
Vpeak
Upr
1 669
Vpeak
UTR
8 000
Vpeak
Upr = 1.5 × UIORM, Pd < 5 pC
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 × UIORM, Pd < 5 pC
Highest permissible overvoltage
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1)
2
Clearance distance
>7.0
mm
Creepage distance
>7.0
mm
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11))
CTI
Material group (DIN EN 60664-1 VDE0110 Part 1)
175
III a
Storage temperature range
Tstg
–55 to +150
°C
Operating temperature range
TA
–55 to +100
°C
VIO = 500 V dc at TA = 25°C
Ris MIN.
10
12
Ω
VIO = 500 V dc at TA MAX. at least 100°C
Ris MIN.
10
11
Ω
Package temperature
Tsi
175
°C
Current (input current IF, Psi = 0)
Isi
400
mA
Power (output or total power dissipation)
Psi
700
mW
Ris MIN.
10
Isolation resistance, minimum value
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Isolation resistance
VIO = 500 V dc at TA = Tsi
Data Sheet PN10505EJ04V0DS
9
Ω
15
PS2561B-1,PS2561BL-1,PS2561BL1-1,PS2561BL2-1
• The information in this document is current as of December, 2008. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
• NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
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or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
• While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
16
Data Sheet PN10505EJ04V0DS
PS2561B-1,PS2561BL-1,PS2561BL1-1,PS2561BL2-1
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.