PS8821-1

PHOTOCOUPLER
PS8821-1,-2
1 Mbps ANALOG OUTPUT TYPE
8-PIN SSOP (SO-8)
HIGH-SPEED PHOTOCOUPLER
−NEPOC Series−
DESCRIPTION
The PS8821-1, -2 are optically coupled isolators containing a GaAlAs LED on the light emitting diode (input side)
and a PIN photodiode and a high-speed amplifier transistor on the output side on one chip.
The PS8821-2 is suitable for high density applications.
FEATURES
• 40% reduction of mounting area (5-pin SOP × 2)
• Low power consumption (VCC = 3.3 V)
PIN CONNECTION
(Top View)
• High isolation voltage (BV = 2 500 Vr.m.s.)
• High-speed response (tPHL = 0.6 μs MAX., tPLH = 0.9 μs MAX.)
• Ordering number of tape product: PS8821-1-F3, F4: 1 500 pcs/reel
8
7
1
2
PS8821-1
5
1. NC
2. Anode
3. Cathode
4. NC
5. GND
6. VO
7. NC
8. VCC
3 4
8
7
6
1
2
: PS8821-2-F3, F4: 1 500 pcs/reel
• Pb-Free product
• Safety standards
• UL approved: File No. E72422
• DIN EN60747-5-2 (VDE0884 Part2) approved (Option)
APPLICATIONS
• Power over Ethernet
• Computer and peripheral manufactures
• Substitutions for relays and pulse transformers
• Power supply
6
PS8821-2
5
1. Anode1
2. Cathode1
3. Cathode2
4. Anode2
5. GND
6. VO2
7. VO1
8. VCC
3 4
Document No. PN10591EJ03V0DS (3rd edition)
Date Published August 2008 NS
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
2006, 2008
PS8821-1,-2
PACKAGE DIMENSIONS (UNIT: mm)
5.21±0.25
6.0±0.2
0.1±0.1
0.15 +0.10
–0.05
3.27±0.2
3.95±0.1
2
1.27
0.4 +0.10
–0.05
0.5±0.3
0.10 S
0.25 M
Data Sheet PN10591EJ03V0DS
PS8821-1,-2
<R>
MARKING EXAMPLE
SnBi PLATING
PS8821-1
8821-1
NL831
PS8821-2
8821-2
NL831
Type Number
Assembly Lot
Type Number
Assembly Lot
N
N
N L 8 31
N L 8 31
Week Assembled
Year Assembled
(Last 1 Digit)
No. 1 pin Mark
Initial of NEC
(Engraved mark)
Week Assembled
Year Assembled
(Last 1 Digit)
No. 1 pin Mark
Initial of NEC
(Engraved mark)
In-house Code
(L: Pb-Free)
In-house Code
(L: Pb-Free)
Rank Code
Rank Code
Ni/Pd/Au PLATING
PS8821-1
8821-1
NT831
PS8821-2
8821-2
NT831
Type Number
Assembly Lot
Assembly Lot
N
N
N T 8 31
No. 1 pin Mark
Initial of NEC
(Engraved mark)
Type Number
N T 8 31
Week Assembled
Year Assembled
(Last 1 Digit)
No. 1 pin Mark
Initial of NEC
(Engraved mark)
In-house Code
(T: Pb-Free)
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
(T: Pb-Free)
Rank Code
Rank Code
Data Sheet PN10591EJ03V0DS
3
PS8821-1,-2
<R>
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Specification
Packing Style
Safety Standard
Approval
PS8821-1
PS8821-1-A
Pb-Free
20 pcs (Tape 20 pcs cut)
Standard products
PS8821-1-F3
PS8821-1-F3-A
(SnBi)
Embossed Tape 1 500 pcs/reel
(UL approved)
PS8821-1-F4
PS8821-1-F4-A
PS8821-2
PS8821-2-A
20 pcs (Tape 20 pcs cut)
PS8821-2-F3
PS8821-2-F3-A
Embossed Tape 1 500 pcs/reel
PS8821-2-F4
PS8821-2-F4-A
PS8821-1-V
PS8821-1-V-A
20 pcs (Tape 20 pcs cut)
DIN EN60747-5-2
PS8821-1-V-F3
PS8821-1-V-F3-A
Embossed Tape 1 500 pcs/reel
(VDE0884 Part2)
PS8821-1-V-F4
PS8821-1-V-F4-A
PS8821-2-V
PS8821-2-V-A
20 pcs (Tape 20 pcs cut)
PS8821-2-V-F3
PS8821-2-V-F3-A
Embossed Tape 1 500 pcs/reel
PS8821-2-V-F4
PS8821-2-V-F4-A
PS8821-1
PS8821-1-AX
Pb-Free
20 pcs (Tape 20 pcs cut)
Standard products
PS8821-1-F3
PS8821-1-F3-AX
(Ni/Pd/Au)
Embossed Tape 1 500 pcs/reel
(UL approved)
PS8821-1-F4
PS8821-1-F4-AX
PS8821-2
PS8821-2-AX
20 pcs (Tape 20 pcs cut)
PS8821-2-F3
PS8821-2-F3-AX
Embossed Tape 1 500 pcs/reel
PS8821-2-F4
PS8821-2-F4-AX
PS8821-1-V
PS8821-1-V-AX
20 pcs (Tape 20 pcs cut)
DIN EN60747-5-2
PS8821-1-V-F3
PS8821-1-V-F3-AX
Embossed Tape 1 500 pcs/reel
(VDE0884 Part2)
PS8821-1-V-F4
PS8821-1-V-F4-AX
PS8821-2-V
PS8821-2-V-AX
20 pcs (Tape 20 pcs cut)
PS8821-2-V-F3
PS8821-2-V-F3-AX
Embossed Tape 1 500 pcs/reel
PS8821-2-V-F4
PS8821-2-V-F4-AX
PS8821-1
PS8821-2
PS8821-1
Approved (Option)
PS8821-2
PS8821-1
PS8821-2
PS8821-1
Approved (Option)
*1 For the application of the Safety Standard, following part number should be used.
4
Application
*1
Part Number
Data Sheet PN10591EJ03V0DS
PS8821-2
PS8821-1,-2
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
IF
25
mA/ch
VR
5.0
V/ch
PD
45
mW/ch
Supply Voltage
VCC
7
V
Output Voltage
VO
7
V/ch
IO
8.0
mA/ch
PC
100
mW/ch
BV
2 500
Vr.m.s.
Operating Ambient Temperature
TA
–55 to +100
°C
Storage Temperature
Tstg
–55 to +125
°C
Diode
Forward Current
Reverse Voltage
Power Dissipation
Detector
*1
Output Current
Power Dissipation
Isolation Voltage
*2
*3
*1 Reduced to 0.45 mA/°C at TA = 25°C or more.
*2 Reduced to 1.00 mA/°C at TA = 25°C or more.
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-4 shorted together, 5-8 shorted together.
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Forward Current (ON)
Input Voltage (OFF)
Symbol
MIN.
TYP.
MAX.
Unit
VCC
3.0
3.3
3.6
V
IF (ON)
16
20
mA
VF (OFF)
0
0.8
V
Data Sheet PN10591EJ03V0DS
5
PS8821-1,-2
ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
Parameter
Diode
Conditions
Forward Voltage
VF
IF = 16 mA
Reverse Current
IR
VR = 3 V
Forward Voltage
Temperature Coefficient
Detector
Symbol
ΔVF/ΔTA
MIN.
IF = 16 mA
TYP.
MAX.
Unit
1.7
2.2
V
10
μA
−2.1
mV/°C
30
pF
Terminal Capacitance
Ct
V = 0 V, f = 1 MHz
High Level Output Current
IOH
IF = 0 mA, VCC = VO = 3.3 V
0.01
1
μA
Low Level Output Voltage
VOL
IF = 16 mA, VCC = 3.3 V, IOL = 1.2 mA
0.1
0.4
V
High Level Supply Current
ICCH
IF = 0 mA, VO = open, VCC = 3.3 V
0.1
10
μA
0.2
20
(PS8821-1)
High Level Supply Current
(PS8821-2)
Low Level Supply Current
(PS8821-1)
ICCL
IF = 16 mA, VO = open, VCC = 3.3 V
100
Low Level Supply Current
200
(PS8821-2)
Coupled
Current Transfer Ratio
CTR
IF = 16 mA, VCC = 3.3 V, VO = 0.4 V
20
Input-Output
RI-O
VI-O = 1 kVDC, RH = 40 to 60%
10
RI-I
VI-I = 5 VDC, RH = 40 to 60%
10
CI-O
V = 0 V, f = 1 MHz
40
%
Ω
11
Isolation Resistance
Insulation Resistance
7
(Input-Input), (PS8821-2)
Input-Output
0.6
pF
Isolation Capacitance
Insulation Capacitance
(Input-Input), (PS8821-2)
CI-I
Propagation Delay Time
tPHL
(H → L)
*1
Propagation Delay Time
tPLH
0.3
IF = 10 mA, VCC = 3.3 V, RL = 1.8 kΩ,
CL = 15 pF, VTHHL = VTHLH = 1.5 V,
TA = 0 to 100°C
0.3
0.6
0.5
0.9
μs
(L → H)
*1
Common Mode
CMH
Common Mode
Transient Immunity at
*2
Low Level Output
6
IF = 0 mA, VCC = 3.3 V, RL = 4.1 kΩ,
1
VCM = 1 kV
Transient Immunity at
*2
High Level Output
CML
IF = 10 mA, VCC = 3.3 V, RL = 4.1 kΩ,
VCM = 1 kV
Data Sheet PN10591EJ03V0DS
−1
kV/μs
PS8821-1,-2
*1 Test circuit for propagation delay time
VCC = 3.3 V
PS8821-1
(PW = 1μs,
Pulse input (IF)
Duty cycle = 1/10)
Input
(Monitor)
47 Ω
0.1 μ F
RL = 1.8 kΩ
VO (Monitor)
CL = 15 pF
(IF = 10 mA)
Input
50%
Output
VCC = 3.3 V
PS8821-2
Pulse input (IF)
(PW = 1μs,
Duty cycle = 1/10)
Input
(Monitor)
tPHL
1.5 V
VOL
tPLH
RL = 1.8 kΩ
VO (Monitor)
0.1 μF
CL = 15 pF
47 Ω
Remark CL is approximately 15 pF which includes probe and stray wiring capacitance.
*2 Test circuit for common mode transient immunity
PS8821-1
VCC = 3.3 V
RL = 4.1 kΩ
0.1 μF
VO (Monitor)
CL = 15 pF
1 kV
VCM 90%
10%
IF
VCM
0V
tr
VO
(IF = 0 mA)
PS8821-2
SW IF
VCC = 3.3 V
RL = 4.1 kΩ
0.1 μF
VO (Monitor)
CL = 15 pF
VO
(IF = 10 mA)
tf
VOH
2V
0.8 V
VOL
VCM
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. By-pass capacitor of 0.1 μF is used between VCC and GND near device. Also, ensure that the distance between
the leads of the photocoupler and capacitor is no more than 10 mm.
3. Avoid storage at a high temperature and high humidity.
Data Sheet PN10591EJ03V0DS
7
PS8821-1,-2
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
TRANSISTOR POWER DISSIPATION vs.
AMBIENT TEMPERATURE
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
Transistor Power Dissipation PC (mW)
Diode Power Dissipation PD (mW)
50
40
30
20
10
25
0
50
75
60
40
20
50
75
100
Ambient Temperature TA (˚C)
FORWARD CURRENT vs.
FORWARD VOLTAGE
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
High Level Output Current IOH (nA)
TA = +100˚C
+50˚C
+25˚C
1
0˚C
–25˚C
0.1
1.2
1.4
1.6
1.8
2.0
2.2
IF = 0 mA,
VCC = VO = 3.3 V
100.0
10.0
1.0
–50
2.4
–25
0
25
50
75
100
Forward Voltage VF (V)
Ambient Temperature TA (˚C)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
70.0
VCC = 3.3 V,
VO = 0.4 V
60.0
50.0
40.0
30.0
20.0
10.0
0
1
10
50
1.6
Normalized to 1.0
1.4 at TA = 25˚C, IF = 10 mA,
VCC = 3.3 V, VO = 0.4 V
1.2
1.0
0.8
0.6
0.4
0.2
0.0
–50
Remark
–25
0
25
50
75
Ambient Temperature TA (˚C)
Forward Current IF (mA)
8
25
Ambient Temperature TA (˚C)
Normalized Current Transfer Raio CTR
Forward Current IF (mA)
80
1 000.0
0.01
1.0
Current Transfer Ratio CTR (%)
100
0
100
100
10
120
The graphs indicate nominal characteristics.
Data Sheet PN10591EJ03V0DS
100
Propagation Delay Time tPHL, tPLH (μs)
PROPAGATION DELAY TIME vs.
FORWARD CURRENT
2.0
VCC = 3.3 V,
RL = 1.8 kΩ
1.0
tPLH
tPHL
0
8
10
12
14
16
18
Normalized Propagation Delay Time tPHL, tPLH
PS8821-1,-2
NORMALIZED PROPAGATION DELAY TIME
vs. AMBIENT TEMPERATURE
5
4
3
2
tPLH
1
0
–50
Forward Current IF (mA)
Remark
Normalized to 1.0
at TA = 25˚C,
IF = 10 mA, VCC = 3.3 V,
VO = 0.4 V, RL = 1.8 kΩ
tPHL
–25
0
25
50
75
100
Ambient Temperature TA (˚C)
The graphs indicate nominal characteristics.
Data Sheet PN10591EJ03V0DS
9
PS8821-1,-2
TAPING SPECIFICATIONS (UNIT: mm)
1.7±0.1
5.56±0.1
5.5±0.1
1.5+0.1
–0
12.0±0.2
2.0±0.05
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
4.05 MAX.
3.6±0.1
6.4±0.1
0.3±0.05
8.0±0.1
Taping Direction
PS8821-1-F4
PS8821-2-F4
PS8821-1-F3
PS8821-2-F3
Outline and Dimensions (Reel)
2.0±0.5
φ 13.0±0.2
φ 21.0±0.8
φ 100±1.0
R 1.0
φ 330±2.0
2.0±0.5
φ13.0±0.2
13.5±1.0
17.5±1.0
11.9 to 15.4
Outer edge of
flange
Packing: 1 500 pcs/reel
10
Data Sheet PN10591EJ03V0DS
PS8821-1,-2
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
1.27
0.8
1.45
5.25
Remark
All dimensions in this figure must be evaluated before use.
Data Sheet PN10591EJ03V0DS
11
PS8821-1,-2
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C
120±30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Package Surface Temperature T (˚C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260˚C MAX.
220˚C
to 60 s
180˚C
120˚C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
260°C or below (molten solder temperature)
• Time
10 seconds or less
• Preheating conditions
120°C or below (package surface temperature)
• Number of times
One (Allowed to be dipped in solder including plastic mold portion.)
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature) 350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
12
Data Sheet PN10591EJ03V0DS
PS8821-1,-2
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
<R>
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10591EJ03V0DS
13
PS8821-1,-2
<R>
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Speck
Unit
Application classification (DIN EN 60664-1 VDE0110 Part 1)
for rated line voltages ≤ 300 Vr.m.s.
for rated line voltages ≤ 600 Vr.m.s.
IV
III
Climatic test class (DIN EN 60664-1 VDE0110)
55/100/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.5 × UIORM, Pd < 5 pC
Test voltage (partial discharge test, procedure b for all devices)
UIORM
Upr
566
849
Vpeak
Vpeak
Upr
1 061
Vpeak
UTR
4 000
Vpeak
Upr = 1.875 × UIORM, Pd < 5 pC
Highest permissible overvoltage
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1)
2
Clearance distance
>4.0
mm
Creepage distance
>4.0
mm
Comparative tracking index (DIN IEC 112/VDE 0303 Part 1)
CTI
Material group (DIN EN 60664-1 VDE0110 Part 1)
175
III a
Storage temperature range
Tstg
–55 to +125
°C
Operating temperature range
TA
–55 to +100
°C
Ris MIN.
Ris MIN.
10
11
10
Package temperature
Tsi
150
°C
Current (input current IF, Psi = 0)
Isi
150
mA
Power (output or total power dissipation)
Psi
600
mW
Ris MIN.
10
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
VIO = 500 V dc at TA MAX. at least 100°C
12
Ω
Ω
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Isolation resistance
VIO = 500 V dc at TA = Tsi
14
Data Sheet PN10591EJ03V0DS
9
Ω
PS8821-1,-2
• The information in this document is current as of August, 2008. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
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written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
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property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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redundancy, fire-containment and anti-failure features.
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The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
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The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
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(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
Data Sheet PN10591EJ03V0DS
15
PS8821-1,-2
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.