Complementary wireless module WLAN Standard Laminate SiP Module Series/Type: Ordering code: R078 (WL1801) / D7021 B30911D7021Y918 Date: Version: 2014-09-25 1.2 Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the table and then change the color to "white". This ensures that the table disappears (invisible) for the customer PDF. Don't change formatting when entering or pasting text in the table and don't add any cell or line in and to it! Identification/Classification 1 (header 1 + top left bar): Complementary wireless module WLAN Identification/Classification 2 (header 2 + bottom left header bar): Standard Laminate SiP Module Ordering code: (top right header bar) B30911D7021Y918 Series/Type: (bottom right header bar) R078 (WL1801) / D7021 Preliminary data (optional): (if necessary) Department: SAW IT EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information Date: 2014-09-25 contained therein without EPCOS' prior express consent is prohibited. Version: EPCOS AG is a TDK Group Company. 1.2 Complementary wireless module WLAN Standard Laminate SiP Module B30911D7021Y918 R078 (WL1801) / D7021 1 Overview This document details the specifications and features of R078 (WL1801) / D7021 SiP module. The R078 (WL1801) / D7021 SiP module is based on Texas Instruments WL1801 IC, specifically WL180x Data Sheet version 1.2, such that the SiP module specification is subject to any subsequent changes in applicable Texas Instruments documentation and software. The R078 (WL1801) / D7021 contains the WL1801 SoC, 2.4GHz SPDT switch, 2.4GHz band pass filter / diplexer and necessary passive components for WLAN in a highly integrated solution. 1.1 Features WLAN on a single chip provides universal connectivity in small PCB footprint. Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC). Based on 45nm CMOS technology using proven core technology. Seamless integration with TI OMAP™ Application Processors. WLAN core software and hardware are compatible with prior WL127x and WL128x offerings, for smooth migration to Device. SDIO for WLAN. Downloadable patches and firmware enables new features to be added for all functional block's. Temperature detection and compensation mechanism ensures minimal variation in the RF performance over the entire temperature range. 1.2 Applications Mobile phone and mobile computer device applications. 1.3 General Description The R078 (WL1801) / D7021 is a highly integrated WLAN device that forms a complete standalone communication system. The WL1801 is a highly integrated single-chip CMOS (45-nm process) incorporates the core functionality of the WL1271/3 and WL1281/3 devices. The device is the 8th-generation WLAN device from Texas Instruments. As such, the WL1801 is based upon proven core technology and complements the TI integrated devices for connectivity portfolio. R078 (WL1801) / D7021 is ideal for use in mobile phone and mobile computer device applications due to its low current, small area and cellular phone coexistence-friendly features. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 2 of 35 Complementary wireless module WLAN Standard Laminate SiP Module 1.4 B30911D7021Y918 R078 (WL1801) / D7021 Terms and abbreviations BPF – Band-Pass Filter FE – Front-End (refers to FE IC and BPF) GND – Ground IC – Integrated Circuit I/O – Input/Output interfaces LDO – Low Drop-Out (voltage regulator) PCB – Printed Circuit Board Q – Quality factor RF – Radio Frequency RX – Receive SiP – System in Package SoC – System on Chip TX – Transmit Vbat – Battery Voltage VIO – external pre-existing 1.8V IO power supply WLAN – Wireless Local Area Network 1.5 Reference documents Texas Instruments WL180x_Data_Manual_Rev_1_2.pdf SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 3 of 35 Complementary wireless module WLAN Standard Laminate SiP Module 1 OVERVIEW ...................................................................................................................................................................2 1.1 1.2 1.3 1.4 1.5 2 FUNCTIONAL BLOCK DIAGRAM ...............................................................................................................................5 WLAN FEATURES ...................................................................................................................................................6 DETAILED DESCRIPTION ........................................................................................................................................7 3.1 3.2 3.3 3.4 3.5 4 FEATURES ................................................................................................................................................................2 APPLICATIONS..........................................................................................................................................................2 GENERAL DESCRIPTION ...........................................................................................................................................2 TERMS AND ABBREVIATIONS....................................................................................................................................3 REFERENCE DOCUMENTS .........................................................................................................................................3 FUNCTIONAL BLOCK FEATURES .........................................................................................................................5 2.1 2.2 3 B30911D7021Y918 R078 (WL1801) / D7021 HOST INTERFACES....................................................................................................................................................7 CLOCKS AND POWER MANAGEMENT .......................................................................................................................7 WLAN FUNCTIONAL BLOCK .................................................................................................................................11 TERMINAL ASSIGNEMENTS ....................................................................................................................................12 TERMINAL FUNCTIONS ...........................................................................................................................................13 DESIGN GOAL SPECIFICATIONS .........................................................................................................................19 4.1 4.2 4.3 4.4 4.5 GENERAL CHIP REQUIREMENTS AND OPERATION ..................................................................................................19 WLAN RF PERFORMANCE ....................................................................................................................................22 INTERFACE TIMING CHARACTERISTICS ..................................................................................................................25 PACKAGE MECHANICAL DRAWING ........................................................................................................................27 SCHEMATIC ............................................................................................................................................................28 5 LEAD-FREE PRODUCT STATUS ...........................................................................................................................29 6 RECOMMENDED REFLOW PROFILE .................................................................................................................30 7 PACKING INFORMATION ......................................................................................................................................31 8 REVISION HISTORY.................................................................................................................................................34 DISPLAY OF ORDERING CODES FOR EPCOS PRODUCTS ....................................................................................34 SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 4 of 35 Complementary wireless module WLAN Standard Laminate SiP Module B30911D7021Y918 R078 (WL1801) / D7021 2 Functional Block Features 2.1 Functional Block Diagram Figure 2-1 shows a high-level view of R078 (WL1801) / D7021 along with its various configurations. The flexibility of the R078 (WL1801) / D7021 based on WL1801 enables easy integration with various hostsystem topologies. Figure 2-1 High-Level System Diagram SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 5 of 35 Complementary wireless module WLAN Standard Laminate SiP Module 2.2 B30911D7021Y918 R078 (WL1801) / D7021 WLAN Features Integrated 2.4GHz power amplifiers for complete WLAN solution WLAN MAC Baseband Processor and RF transceiver - IEEE802.11b/g/n compliant WLAN 2.4GHz SISO (20 / 40 MHz channels). Baseband Processor IEEE Std 802.11b/g data rates and IEEE Std 802.11n data rates with 20 or 40 MHz SISO. Fully calibrated system. No production calibration required. Medium-Access Controller (MAC) Embedded ARM™ Central Processing Unit (CPU) Hardware-Based Encryption/Decryption Using 64-, 128-, and 256-Bit WEP, TKIP or AES Keys, Supports requirements for Wi-Fi Protected Access (WPA and WPA2.0) and IEEE Std 802.11i [Includes Hardware-Accelerated Advanced-Encryption Standard (AES)] Designed to work with IEEE Std 802.1x 2.4GHz Radio Internal LNA, PA and RF switch Supports: IEEE Std 802.11b, 802.11g and 802.11n Supports 4 bit SDIO host interface, including high speed (HS) and V3 modes SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 6 of 35 Complementary wireless module WLAN Standard Laminate SiP Module B30911D7021Y918 R078 (WL1801) / D7021 3 Detailed Description 3.1 Host Interfaces 3.1.1 WLAN SDIO Transport Layer The SDIO is the host interface for WLAN. The interface between the host and the D7021 uses an SDIO interface and supports a maximum clock rate of 50MHz. The Device SDIO also supports the following features of the SDIO V3 specification: 4 bit data bus Synchronous and Asynchronous In-Band-Interrupt Default and High-Speed (50MHz) timing Sleep/wake commands SDIO timing specifications are given in specification section at end of document. 3.2 Clocks and Power Management 3.2.1 Slow Clock / RTC clock The slow clock is a free-running clock of 32.768 KHz which is supplied from an external clock source. It is connected to the RTC_CLK pin and is a digital square-wave signal in the range of 0-1.8V nom. 3.2.2 Fast Clock System 3.2.2.1 Fast clock using external crystal The devices incorporate an internal crystal oscillator circuit for supporting a cost optimized crystal based fast clock scheme. Connection is as shown: Figure 3-1 XTAL Connection C1 = C2. Typically 8 - 22pF. Refer to Crystal manufacturer’s recommendations. R = 390K ohm (+/- 5% tolerance). SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 7 of 35 Complementary wireless module WLAN Standard Laminate SiP Module B30911D7021Y918 R078 (WL1801) / D7021 3.2.2.2 Fast Clock using external oscillator CLK_IN_P is the main system fast clock and must meet the specifications as described in "Fast clock specifications" at the end of this document. The clock must be one of the specified frequencies and the device incorporates an internal mechanism to detect this. The clock can be AC or DC coupled, sine or square wave. Figure 3-2 Fast Clock Block Diagram 3.2.3 Power Management 3.2.3.1 Block Diagram - internal DC2DC's The Device incorporates three internal DC2DC's (switched-mode power supplies) to provide efficient internal and external supplies, derived from Vbat. Figure 3-3 Internal DC2DC’s SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 8 of 35 Complementary wireless module WLAN Standard Laminate SiP Module B30911D7021Y918 R078 (WL1801) / D7021 3.2.4 Reset / Power up system After Vbat and VIO are fed to Device and while WLAN_EN are de-asserted (LOW), the device is in Shutdown state. While in Shutdown state all functional blocks, internal DC2DC's and LDO's will be disabled. The power supplied to the functional blocks is cut off. When one of the two signals WLAN_EN are asserted (High) a Power On Reset (POR) is performed. Stable Slow Clock, VIO and Vbat are pre-requisites for successful POR. 3.2.4.1 Chip Top-level Power Up Sequence Figure 3-4 Chip Top-level Power Up Sequence SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 9 of 35 Complementary wireless module WLAN Standard Laminate SiP Module 3.2.4.2 B30911D7021Y918 R078 (WL1801) / D7021 WLAN Power Up Sequence Figure 3-5 WLAN Power Up Sequence SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 10 of 35 Complementary wireless module WLAN Standard Laminate SiP Module 3.3 B30911D7021Y918 R078 (WL1801) / D7021 WLAN Functional Block 3.3.1 WLAN MAC R078 (WL1801) / D7021 MAC implements the IEEE standard 802.11 MAC sub-layer using both dedicated hardware and embedded firmware. The MAC hardware implements real-time functions, including access protocol management, encryption and decryption. 3.3.2 WLAN Baseband Processor R078 (WL1801) / D7021 baseband processor implements the IEEE 802.11b/g/n PHY sub layers and has been optimized to perform well in conditions of high multipath and noise. 3.3.3 WLAN RF Radio R078 (WL1801) / D7021 WLAN radio is a highly integrated radio processor designed for 802.11b/g/n applications, including internal front-end PA's. 3.3.4 WLAN RF Configuration and Power Options The R078 (WL1801) / D7021 includes RF switch, band pass filter and diplexer for complete WLAN (SISO) RF system. Figure 3-6 R078 (WL1801) / D7021 SISO configuration 3.3.4.1 SISO configuration (WL1801 device) The diagram above shows WLAN pins in standard SISO application. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 11 of 35 Complementary wireless module WLAN Standard Laminate SiP Module 3.4 B30911D7021Y918 R078 (WL1801) / D7021 Terminal Assignements The view is from top side: A B C D E F G H J K L M N P 12 GND NU GND VIO GND GND GND GND NU NU NU NU GND GND 12 DIGITAL 11 GND NU GND GND GND SDIO_D2_ SDIO_CLK WL _WL GND NU GND NU GND GND NU 11 RF 10 GND NU GND NU GND SDIO_D3_ SDIO_D0_ WL WL GND DC2DC_R CLK_REQ EQ_MODE _OUT _SOC GND GND GND GND 10 Power 9 GND GND GND NU GND SDIO_CM SDIO_D1_ D_WL WL GND SLOW_CL K NU NU GND GND NU 9 GND 8 NU GND NU NU GND COEX_M COEX_M WS_BT_W WS_FRAM L_TX_O E_SYNC NU NU GND GND NU 8 CLOCK 7 GND GND NU GND GND COEX_M COEX_M RX_SW_F WS_ACTI WS_RX_P EM_WL VE RI NU NU GND GND GND NU 7 DIGITAL High Speed 6 NU GND PBIAS_TE STP_W GND GND DC2DC_R WLAN_IR EQ_OUT_ Q SOC GPIO_2 NU NU GND GND NU 6 Not Used 5 GND GND PDET_TE STM_W GND GND GND NU GPIO_1 GND GND GND GND 5 4 GND GND NU GND NU NU NU NU NU GPIO_3 GND VBAT1 VBAT2 VBAT3 4 3 11bg_ANT _1 GND GND GND GND GND GND GND GND GND GND GND GND GND 3 2 GND GND GND GND GND GND GND GND GND GND GND GND 2 1 GND GND GND GND GND GND GND GND GND GND GND GND 1 A B C D E F G H L M N P GND GND NU WLAN_EN FEM_PA_ _SOC EN_WL CLK_IN_P CLK_IN_M PA_DC2D PA_DC2D C_IN C_OUT J K Top view Figure 3-7 Terminal Assignements SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 12 of 35 Complementary wireless module WLAN Standard Laminate SiP Module 3.5 B30911D7021Y918 R078 (WL1801) / D7021 Terminal Functions Pin names and pin numbers in bracket apply to WSP pin out. Table 3-3 Terminal Functions Module Pin Name Module I/O Shut Default Buffer Description (WSP Pin Name) Pin No. Type Down after Type (WSP ball state POR [mA] no.) WLAN pins: I/O signals SDIO_CLK_WL (SDIO_CLK_WL) G11 (E11) IN HiZ HiZ WLAN SDIO clock. Must be driven by the host. SDIO_CMD_WL(SDIO_CMD_WL) F9 (D8) IN HiZ HiZ WLAN SDIO command in. Host must pull up. SDIO_D0_WL (SDIO_D0_WL) G10 (E10) I/O HiZ HiZ WLAN SDIO data bit 0. Host must pull up. SDIO_D1_WL (SDIO_D1_WL) G9 (E9) I/O HiZ HiZ WLAN SDIO data bit 1. Host must pull up. SDIO_D2_WL (SDIO_D2_WL) F11 (D11) I/O HiZ HiZ WLAN SDIO data bit 2. Host must pull up. SDIO_D3_WL (SDIO_D3_WL) F10 (D10) I/O HiZ PU WLAN SDIO data bit 3. Changes state to PU at WL_EN assertion for card detect. Later disabled by the SW during init. Host must pull up. WLAN_IRQ (IRQ_WL) G6 OUT PD Drive 0 SDIO available, interrupt out. (E3) Active high. To use WL_RS232_TX/RX lines, need to pull up with 10K resistor. GPIO_1 (GPIO1) K5 (H1) I/O PD PD Option: WL_RS232_TX (when IRQ_WL = 1 at power up) GPIO_2 (GPIO2) J6 (H2) I/O PD PD Option: WL_RS232_RX (when IRQ_WL = 1 at power up) GPIO_3 (UART_DBG_WL) K4 (G4) OUT PU PU WLAN logger Option: GPIO3 FEM_PA_EN_WL H5 (F2) NC (GPIO13) RX_SW_FEM_WL G7 (F3) NC (SW_CTRL_BG_IO1) PBIAS_TESTP_W C6 (C7) ANA NC (PABIAS_OUT_FEM_TESTP_WL) PDET_TESTM_W C5 (C6) ANA NC (PDET_IN_FEM_TESTM_WL) WLAN Pins: RF antenna 11bg_ANT_1 A3 RF WLAN BG RX and TX 50Ω input and output. No external matching required. Clock pins CLK_IN_P F2 (E4) CLK_IN_M SLOW_CLK (RTC_CLK) CLK_REQ_OUT G2 (E5) ANA J9 (H8) ANA K10 (K11) OUT PD ANA PD SAW IT Please read Cautions and warnings and Important notes at the end of this document. FREF/TCXO input for all functional blocks Connect to GND Sleep clock 32.768 kHz Request external fast clock NC if not used. 2014-09-25 Page 13 of 35 Complementary wireless module WLAN Standard Laminate SiP Module Module Pin Name (WSP Pin Name) Enable pins WLAN_EN_SOC (WLAN_EN) Power management pins VBAT1 VBAT2 VBAT3 VIO PA_DC2DC_IN PA_DC2DC_OUT B30911D7021Y918 R078 (WL1801) / D7021 Module I/O Shut Default Buffer Description Pin No. Type Down after Type (WSP ball state POR [mA] no.) G5 (E1) IN PD M4 N4 P4 D12 J1 POW POW POW POW POW K1 POW PD Battery voltage Battery voltage Battery voltage 1.8V I/O power supply PA power supply input, with internal PA_DC2DC connect to pin PA_DC2DC_OUT K1. DC2DC output for PA supply, with internal PA_DC2DC connect to pin PA_DC2DC_IN J1. NC NC DC2DC_REQ_OUT_SOC (NU) F6 (D3) DC2DC_REQ_MODE_SOC (NU) J10 (J10) Co-existence signals COEX_MWS_RX_PRI (COEX_MWS_UART_RX) COEX_MWS_BT_WL_TX_O (COEX_MWS_UART_TX) COEX_MWS_ACTIVE (COEX_MWS_PRE_TX) COEX_MWS_FRAME_SYNC (COEX_MWS_FRAME_SYNC) Not used pins NU NU NU NU NU NU NU NU NU NU NU NU NU NU NU NU NU NU NU H7 (G5) PU PU H8 (G7) PU PU F7 (G8) PU PU J8 (H7) PU PU A6 (A4) A8 B10 (G11) B11 (G9) B12 (H11) C4 (F9) C7 (F8) C8 (F11) D8 (F10) D9 (E8) D10 (B11) E4 (E2) F4 (E7) G4 (F7) H4 (G6) H6 (G2) J4 (F6) J5 (H3) J7 (H5) General purpose IO. NC if not used. General purpose IO. NC if not used. General purpose IO. NC if not used. General purpose IO. NC if not used. NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC SAW IT Please read Cautions and warnings and Important notes at the end of this document. High = enable 2014-09-25 Page 14 of 35 Complementary wireless module WLAN Standard Laminate SiP Module Module Pin Name (WSP Pin Name) NU NU NU NU NU NU NU NU NU NU NU NU NU NU NU NC NC NU NU NU Ground pins GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Module I/O Shut Default Buffer Pin No. Type Down after Type (WSP ball state POR [mA] no.) J5 (H3) J7 (H5) J11 (G10) J12 (J8) K6 (J4) K7 (K4) K8 (K5) K9 (J7) K12 (K8) L6 (H6) L8 (L7) L9 (K7) L11 (L11) L12 (M10) M12 (M9) P6 (M7) P7 (M5) P8 (L5) P9 (M6) P11 (K6) A1 A2 A4 A5 A7 A9 A10 A11 A12 B1 B2 B3 B4 B5 B6 B7 B8 B9 Description NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND SAW IT Please read Cautions and warnings and Important notes at the end of this document. B30911D7021Y918 R078 (WL1801) / D7021 2014-09-25 Page 15 of 35 Complementary wireless module WLAN Standard Laminate SiP Module Module Pin Name (WSP Pin Name) GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Module Pin No. (WSP ball no.) C1 C2 C3 C9 C10 C11 C12 D1 D2 D3 D4 D5 D6 D7 D11 E1 E2 E3 E5 E6 E7 E8 E9 E10 E11 E12 F1 F3 F5 F8 F12 G1 G3 G8 G12 H1 H2 H3 H9 I/O Shut Default Buffer Description Type Down after Type state POR [mA] GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND SAW IT Please read Cautions and warnings and Important notes at the end of this document. B30911D7021Y918 R078 (WL1801) / D7021 2014-09-25 Page 16 of 35 Complementary wireless module WLAN Standard Laminate SiP Module Module Pin Name (WSP Pin Name) GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Module Pin No. (WSP ball no.) H10 H11 H12 J2 J3 K2 K3 K11 L1 L2 L3 L4 L5 L7 L10 M1 M2 M3 M5 M6 M7 M8 M9 M10 M11 N1 N2 N3 N5 N6 N7 N8 N9 N10 N11 N12 P1 P2 P3 I/O Shut Default Buffer Description Type Down after Type state POR [mA] GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND SAW IT Please read Cautions and warnings and Important notes at the end of this document. B30911D7021Y918 R078 (WL1801) / D7021 2014-09-25 Page 17 of 35 Complementary wireless module WLAN Standard Laminate SiP Module Module Pin Name (WSP Pin Name) GND GND GND Module Pin No. (WSP ball no.) P5 P10 P12 I/O Shut Default Buffer Description Type Down after Type state POR [mA] GND GND GND SAW IT Please read Cautions and warnings and Important notes at the end of this document. B30911D7021Y918 R078 (WL1801) / D7021 2014-09-25 Page 18 of 35 Complementary wireless module WLAN Standard Laminate SiP Module B30911D7021Y918 R078 (WL1801) / D7021 4 Design Goal Specifications Section Disclaimer This Specification is based upon the Texas Instruments WL180x Data Sheet version 1.2, and is subject to any subsequent changes in applicable Texas Instruments documentation and software. Any parameter marked TBD indicates that this is yet to be determined by TDK design/testing. Any parameter marked TBC indicates that this is yet to be determined in an update of Texas Instruments documentation. 4.1 General Chip Requirements and Operation All parameters are measured as follows unless stated otherwise: VlO=1.8V 4.1.1 Absolute Maximum Ratings (1) Value VBAT (2) Unit (4) -0.5 to 5.5 V -0.5 to 2.1 V -0.5 to 2.1 V Input voltage to all other pins -0.5 to (VDD_IO + 0.5V) V Operating ambient temperature range -30 to +85 °C RF pins >500 V Other >1000 V RF pins >300 V Other >250 V VIO Input voltage to Analog pins ESD Stress Voltage (6) (3) Human Body Model (5) (7) Charged Device Model (8) (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The following signals are from the VBAT group: VBAT1, VBAT2, VBAT3 (3) Analog pins: 11bg_ANT_1. (4) 5.5V up to 10s cumulative in 7 years. 5V cumulative to 250s, 4.8V cumulative to 2.33 years – all includes charging dips and peaks. (5) Operating free-air temperature range. The device can be reliably operated for 7 years at Tambient of 85˚C, assuming 25% active mode and 75% sleep mode (15,400 cumulative active power-on hours). (6) Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into the device. (7) Level listed is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process, and manufacturing with less than 500V HBM is possible if necessary precautions are taken. Pins listed as 1000V may actually have higher performance. (8) Level listed is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process, and manufacturing with less than 250V CDM is possible if necessary precautions are taken. Pins listed as 250 V may actually have higher performance. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 19 of 35 Complementary wireless module WLAN Standard Laminate SiP Module 4.1.2 B30911D7021Y918 R078 (WL1801) / D7021 Recommended Operating Conditions Rating 1.8V core supply voltage Vbat Condition Sym DC supply range for all modes IO high-level input voltage IO low-level input voltage Enable inputs high-level input voltage Enable inputs low-level input voltage High-level output voltage @4 mA @ 1 mA @0.3 mA Low-level output voltage @4 mA @ 1 mA @0.09 mA Input transitions time Tr/Tf from 10% (1) to 90% (Digital IO) Output rise time from 10% to 90% CL <25 pF (1) (Digital pins) Output fall time from 10% to 90% CL <25 pF (1) (Digital pins) Ambient operating temperature (1) Min 1.7 3.4 Max 1.95 4.3 Unit V VIH 0.65 x VDD_IO VIL 0 Vih_en 1.365 VDD_IO 0.35 x VDD_IO VDD_IO Vil_en 0 VOH VDD_lO – 0.45 VDD_lO – 0.112 VDD_IO- 0.033 VOL 0 0 0 Tr/Tf 1 0.4 VDD_IO VDD_IO VDD_IO 0.45 0.112 0.01 10 ns Tr 5.3 ns Tf 4.9 -30 +85 °C Applies to all Digital lines except SDIO, SPI, UART, I2C, PCM and slow clock lines 4.1.3 External Digital Slow Clock Requirements (-30°C to +85°C) The supported digital slow clock is 32.768 kHz digital (square wave). All core functions share a single input. Characteristics Condition Sym Min Input slow clock frequency Input slow clock accuracy (initial + temp + aging) WLAN, BT Tr/Tf Frequency input duty cycle 15 Square wave, DC-coupled Unit 50 Hz ±250 ppm 100 ns 85 % Vih 0.65xVDD_I O VDD_IO Vpeak Vil 0 0.35xVDD_I O Input impedance MΩ 1 Input capacitance 5 SAW IT Please read Cautions and warnings and Important notes at the end of this document. Max 32768 Input transition time Tr/Tf -lO% to 90% Input voltage limits Typ pF 2014-09-25 Page 20 of 35 Complementary wireless module WLAN Standard Laminate SiP Module 4.1.4 B30911D7021Y918 R078 (WL1801) / D7021 External fast clock Crystal Requirements and operation (-30°C to +85°C) Characteristics Condition Min Supported frequencies Max 26, 38.4 Frequency accuracy Load capacitance, Typ MHz Initial + temp + aging (1) CL 5 Equivalent Series Resistance, ESR Drive level Unit ±20 ppm 13 pF 60 ohms 100 uW 1) Load capacitance, CL = [C1.C2] / [C1 + C2] + CP, where C1, C2 are the capacitors connected on CLK_IN_P & CLK_IN_M respectively and CP is the parasitic capacitance (typically 1-2pF). For example, for C1 = C2 = 12pF and CP = 2pF, then CL = 8pF. 4.1.5 External TCXO CLK Requirements (-30°C to +85°C) Parameter Conditions Min Supported frequency Max 26, 38.4 Frequency accuracy Total short and long term Input voltage limits (TCXO_P) Sine wave/ ac-coupled Input impedance, 26 MHz RP Input resistance CP Input capacitance Input impedance, 38.4 MHz RP Input resistance CP Input capacitance Power-up time Typ MHz ±20 ppm 2.4GHz WLAN 0.2 1.4 Vp-p 5GHz WLAN 1.4 (1) Phase noise 2.4GHz for 38.4MHz Measured at 1 KHz offset (2) 20MHz SISO Measured at 10 KHz offset Measured at 100 KHz offset Phase noise 2.4GHz for 38.4MHz Measured at 1 KHz offset (2) 40MHz SISO Measured at 10 KHz offset Phase noise 5GHz for 38.4MHz, (2) 20/40MHz SISO Unit 0.8 kΩ 20 2.5 pF kΩ 15 2.5 pF 5 ms -120 dBc/Hz -130 dBc/Hz -135 dBc/Hz -125 dBc/Hz -132 dBc/Hz Measured at 100KHZ offset -136.5 dBc/Hz Measured at 1 KHz offset -125 dBc/Hz Measured at 10 KHZ offset -142 dBc/Hz Measured at 100KHZ offset -145 dBc/Hz (1) Power-up time is calculated from the time CLK_REQ_OUT asserted till the time the TCXO_CLK amplitude is within voltage limit specified above and TCXO_CLK frequency is within 0.1 ppm of final steady state frequency. (2) The phase noise numbers listed here must be met at 38.4 MHz. For other frequencies the phase noise requirement is corrected by adding 20 x log10(fTCXO / 38.4e6) dB. Specifically, for 26 MHz TCXO, the correction factor would be -3.4 dB. * The slope of the clock at zero-crossings should not be less than that of a 200 mVp-p sine-wave . i.e. 26MHz clock: 16V/μs (for 11bg band) 38.4MHz clock: 24V/μs (for 11bg band) SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 21 of 35 Complementary wireless module WLAN Standard Laminate SiP Module 4.2 B30911D7021Y918 R078 (WL1801) / D7021 WLAN RF Performance All specifications in this draft data sheet are design goal level and subject to change. All specifications have been measured using TDK CB (Carrier Board) and are given at the module pins (Carrier Board insertion loss is de-embedded). All measurements have been performed over VBAT voltage range from 3.4V to 4.3V and over temperature range from -30°C to +85°C. * 11n 40MHz bandwidth function is available. However the RF performance is guaranteed by only WL180x. 4.2.1 WLAN 2.4 GHz Radio Characteristics 4.2.1.1 WLAN 2.4 GHz Receiver Characteristics Operation frequency range Sensitivity (ANT1) 20MHz bandwidth. At < 10% PER limit Max Input Level At < 10% PER limit Adjacent Channel Rejection at sensitivity level +3 for OFDM and +6 for CCK LO leakage RF Characteristics Condition 1 Mbps DSSS 54 Mbps OFDM MCS7 OFDM (11g/n) CCK 2Mbps 11 Mbps 54 Mbps Min 2400 Typ –19 –4 42.7 37.9 2 Max 2480 -91 -70 -65 Unit MHz dBm dBm dB –80 dBm 4.2.1.2 WLAN 2.4 GHz Receiver Blocking Characteristics Per Band The R078 (WL1801) / D7021 is designed to coexist with co-located cellular transmitters. Table below lists typical cellular interference sources and the corresponding maximum power from the cellular interference source that can be present at the input terminal of R078 (WL1831) / D7021, such that WLAN receiver sensitivity is not degraded by more than 1 dB. (Further improvement is achieved by antenna isolation) Characteristics Blocking performance at other bands Condition 776 to 794 MHz (CDMA) 824 to 849 MHz (GMSK) 824 to 849 MHz (EDGE) 824 to 849 MHz (CDMA) 880 to 915 MHz (GMSK) 880 to 915 MHz (EDGE) 1710 to 1785 MHz (GMSK) 1710 to 1785 MHz (EDGE) 1850 to 1910 MHz (GMSK) 1850 to 1910 MHz (EDGE) 1850 to 1910 MHz (CDMA) 1850 to 1910 MHz (WCDMA) 1920 to 1980 MHz (WCDMA) SAW IT Please read Cautions and warnings and Important notes at the end of this document. Min Typ Max Unit +10 dBm +10 +10 +10 +21 +21 +3 +3 -3 -3 -10 -10 -10 2014-09-25 Page 22 of 35 Complementary wireless module WLAN Standard Laminate SiP Module B30911D7021Y918 R078 (WL1801) / D7021 4.2.1.3 WLAN 2.4 GHz Transmitter power RF transmission (Tx) tests are done in continuous transmission. Characteristics Condition 11bg_ANT_1 pin Min Typ Max Maximum output power 1 Mbps +12 +15 11Mbps +12 +15 6 Mbps at EVM: -10 dB, +10 +13 54 Mbps at EVM: -25 dB +9 +12 MCS0 (Greenfield) at +9 +13 EVM: -10 dB MCS7 (Greenfield) at +8 +11 EVM: -28 dB Output power accuracy ±1.5 Transmit power control 0.125 resolution 4.2.1.4 WLAN 2.4 GHz Transmitter out-of-band emissions Table below shows 2.4GHz WLAN transmitter out-of-band emissions for each band listed in the Condition column. The wideband noise at 2.4GHz WLAN antenna port is also listed. Characteristics Condition Min Typ Max Unit Cellular bands out-of-band broadband 746 to 764 MHz (CDMA1) -145 dBm/Hz emissions(1) 869 to 894 MHz (GSM850) -145 925 to 960 MHz (EGSM900) -138 1570 to 1580 MHz (GPS) -142 1596 to 1609 MHz (GLONASS) -130 1805 to 1880 MHz (DCS1800) -140 1930 to 1990 MHz (PCS1900) -120 2110 to 2170 MHz -129 (4) Cellular bands out-of-band spurious 746 to 764 MHz (CDMA) -44.2 dBm (4) emissions 869 to 894 MHz (CDMA, GSM850) -44.2 (4) 925 to 960 MHz (EGSM900) -44.2 (4) 1570 to 1580 MHz (GPS) -44.2 (4) 1805 to 1880 MHz (DCS1800) -44.2 (4) 1930 to 1990 MHz (PCS1900, CDMA) -44.2 (4) 2110 to 2170 MHz -44.2 (2) Spurious emission during operation at 30MHz – 1GHz –55 dBm nd (3) 1MHz RBW –33 2 harmonic rd (3) –33 3 harmonic th (3) –33 4 harmonic th (3) –33 5 harmonic (1) Figures are for max transmission power for all available modulations. The setup noise floor is -167dBm/Hz. (2) Based on TI IC performance (3) ETSI limit plus 3dB margin (4) FCC conductive limit plus 3dB margin SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 23 of 35 Complementary wireless module WLAN Standard Laminate SiP Module 4.2.1.5 B30911D7021Y918 R078 (WL1801) / D7021 2.4GHz WLAN Current Consumption Active Current (1) Spec item Tx 11CCK @15dBm Tx 54OFDM @12dBm Rx MIN TYP 345 290 65 MAX 380 320 75 Units mA mA mA (1) All measured at ANT1 and the 3.6V VBAT rail of the solution. TCXO current included. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 24 of 35 Complementary wireless module WLAN Standard Laminate SiP Module 4.3 4.3.1 B30911D7021Y918 R078 (WL1801) / D7021 Interface Timing Characteristics SDIO timing specifications 4.3.1.1 SDIO Switching Characteristics – Default rate input and output Specification is over recommended operating conditions. Parameters are for default clock frequency. Figure 4-1 SDIO default input timing Figure 4-2 SDIO default output timing Table 4-1 SDIO Switching Characteristics – Deault Rate Parameter Min Max Unit fclock Clock frequency, CLK 0 26 MHz DC Low/high duty cycle 40 60 % tTLH Rise time, CLK 10 ns tTHL Fall time, CLK 10 ns tISU Setup time, input valid before CLK ↑ 3 ns tIH Hold time, input valid after CLK ↑ 2 ns tODLY Delay time, CLK ↓ to output valid 2.5 14.8 ns CI Capacitive load on outputs 15 pF Note: Option to change data out clock edge from falling edge (default) to rising edge, by setting configuration bit. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 25 of 35 Complementary wireless module WLAN Standard Laminate SiP Module B30911D7021Y918 R078 (WL1801) / D7021 4.3.1.2 SDIO Switching Characteristics – High Rate Specification is over recommended operating conditions. Parameters are for maximum clock frequency. Figure 4-3 SDIO HS input timing Figure 4-4 SDIO HS output timing Parameter fclock DC tTLH tTHL tISU tIH tODLY CI Table 4-2 SDIO Switching Characteristics – High Rate Min Max Clock frequency, CLK 0 50 Low/high duty cycle 40% 60% Rise time, CLK 3 Fall time, CLK 3 Setup time, input valid before CLK ↑ 3 Hold time, input valid after CLK ↑ 2 Delay time, CLK ↓ to output valid 2.5 14 Capacitive load on outputs 10 SAW IT Please read Cautions and warnings and Important notes at the end of this document. Unit MHz ns ns ns ns ns pF 2014-09-25 Page 26 of 35 Complementary wireless module WLAN Standard Laminate SiP Module 4.4 B30911D7021Y918 R078 (WL1801) / D7021 Package Mechanical Drawing Land Grid Array (LGA) Module SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 27 of 35 Complementary wireless module WLAN Standard Laminate SiP Module 4.5 B30911D7021Y918 R078 (WL1801) / D7021 Schematic SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 28 of 35 Complementary wireless module WLAN Standard Laminate SiP Module B30911D7021Y918 R078 (WL1801) / D7021 5 Lead-free Product Status All Epcos modules in mass production are lead-free. This is achieved by using only materials with lead contamination below 1000 ppm. The applied lead-free solder alloy is the main source of Pb-contamination, which together gives Pb-levels much below 50 ppm per module. A comprehensive qualification for these lead-free module packages has been done. The related AQTP documentation is available from Epcos on request. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 29 of 35 Complementary wireless module WLAN Standard Laminate SiP Module B30911D7021Y918 R078 (WL1801) / D7021 6 Recommended Reflow Profile Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Range 3°C/second max. Preheat: -Temperature Min (Tsmin) -Temperature Max (Tsmax) -Time (tsmin to tsmax) 150°C 200°C 60-120 seconds Time maintained above: -Temperature (TL) -Time (tL) 217°C 60-150 seconds Peak Temperature (Tp) Time within 5°C of actual Peak Temperature (Tp) Ramp-Down Rate Time 25°C to Peak Temperature SAW IT Please read Cautions and warnings and Important notes at the end of this document. 245-250°C 20-40 seconds 6°C/second max. 8 minutes max. 2014-09-25 Page 30 of 35 Complementary wireless module WLAN Standard Laminate SiP Module B30911D7021Y918 R078 (WL1801) / D7021 7 Packing Information 7.1.1 Packaging flow SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 31 of 35 Complementary wireless module WLAN Standard Laminate SiP Module 7.1.2 Outer Box 7.1.3 Inner Box SAW IT Please read Cautions and warnings and Important notes at the end of this document. B30911D7021Y918 R078 (WL1801) / D7021 2014-09-25 Page 32 of 35 Complementary wireless module WLAN Standard Laminate SiP Module 7.1.4 B30911D7021Y918 R078 (WL1801) / D7021 Tape drawing SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 33 of 35 Complementary wireless module WLAN Standard Laminate SiP Module B30911D7021Y918 R078 (WL1801) / D7021 8 Revision History Version Date Status Note 1.0 27.6.2014 Official Release Initial 1.1 3.9.2014 Official Release Changed 4.1.1 Absolute Maximum Ratings Operating ambient temperature range : -15 to +55 °C Changed the template of the data sheet 1.2 25.9.2014 Official Release Updated operation temperature range : -30 to +85℃ Updated 4.2.1.3 WLAN 2.4 GHz Transmitter power (1Mbps and 11Mbps) Display of ordering codes for EPCOS products The ordering code for one and the same EPCOS product can be represented differently in data sheets, data books, other publications, on the EPCOS website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.epcos.com/orderingcodes SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 34 of 35 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms of Delivery for Products and Services in the Electrical Industry” published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, Alu-X, CeraDiode, CeraLink, CeraPlas, CSMP, CSSP, CTVS, DeltaCap, DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PQSine, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, TFAP, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. Page 35 of 35