Complementary wireless module WLAN / BT Standard Laminate SiP Module Series/Type: Ordering code: R078 (WL1837) / D7020 B30931D7020Y918 Date: Version: 2014-09-25 1.2 Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the table and then change the color to "white". This ensures that the table disappears (invisible) for the customer PDF. Don't change formatting when entering or pasting text in the table and don't add any cell or line in and to it! Identification/Classification 1 (header 1 + top left bar): Complementary wireless module WLAN / BT Identification/Classification 2 (header 2 + bottom left header bar): Standard Laminate SiP Module Ordering code: (top right header bar) B30931D7020Y918 Series/Type: (bottom right header bar) R078 (WL1837) / D7020 Preliminary data (optional): (if necessary) Department: SAW IT EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information Date: 2014-09-25 contained therein without EPCOS' prior express consent is prohibited. Version: EPCOS AG is a TDK Group Company. 1.2 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 1. Overview This document details the specifications and features of R078 (WL1837) / D7020 SiP module. The R078 (WL1837) / D7020 SiP module is based on Texas Instruments WL1837 IC, specifically WL183x Data Sheet version 1.4, such that the SiP module specification is subject to any subsequent changes in applicable Texas Instruments documentation and software. The R078 (WL1837) / D7020 contains the WL1837 SoC, 2.4GHz and 5 GHz SPDT switches, 2.4GHz and 5GHz band pass filters / diplexer and necessary passive components for WLAN and BT in a highly integrated solution. 1.1 Features WLAN, BT, BLE on a single chip provide universal connectivity in small PCB footprint. Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC). Based on 45nm CMOS technology using proven core technology. Seamless integration with TI OMAP™ Application Processors. WLAN and Bluetooth cores software and hardware are compatible with prior WL127x and WL128x offerings, for smooth migration to Device. Shared HCI transport for BT/BLE over UART and SDIO for WLAN. Downloadable patches and firmware enables new features to be added for all functional block's. Temperature detection and compensation mechanism ensures minimal variation in the RF performance over the entire temperature range. Bluetooth 4.0, BLE and all audio processing features work in parallel and include full coexistence with WLAN 1.2 Applications Mobile phone and mobile computer device applications. 1.3 General Description The R078 (WL1837) / D7020 is a highly integrated WLAN, BT, BLE device that forms a complete standalone communication system. The WL1837 is a highly integrated single-chip CMOS (45-nm process) incorporates the core functionality of the WL1271/3 and WL1281/3 devices. The device is the 8th-generation WLAN/BT/BLE devices from Texas Instruments. As such, the WL1837 is based upon proven core technology and complements the TI integrated devices for connectivity portfolio. R078 (WL1837) / D7020 is ideal for use in mobile phone and mobile computer device applications due to its low current, small area and cellular phone coexistence-friendly features. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 2 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 1.4 B30931D7020Y918 R078 (WL1837) / D7020 Terms and abbreviations BPF – Band-Pass Filter BT – Bluetooth FE – Front-End (refers to FE IC and BPF) GND – Ground HCI – Host Controller Interface IC – Integrated Circuit I/O – Input/Output interfaces LDO – Low Drop-Out (voltage regulator) PCB – Printed Circuit Board Q – Quality factor RF – Radio Frequency RX – Receive SiP – System in Package SoC – System on Chip TX – Transmit Vbat – Battery Voltage VIO – external pre-existing 1.8V IO power supply WLAN – Wireless Local Area Network 1.5 Reference documents Texas Instruments WL183x_Data_Manual_Rev_1_4.pdf SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 3 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 1. OVERVIEW ...................................................................................................................................................................2 1.1 1.2 1.3 1.4 1.5 2 FUNCTIONAL BLOCK DIAGRAM ...............................................................................................................................5 WLAN FEATURES ...................................................................................................................................................6 BLUETOOTH FEATURES ............................................................................................................................................6 BLE FEATURES ........................................................................................................................................................6 DETAILED DESCRIPTION ........................................................................................................................................7 3.1 3.2 3.3 3.4 3.5 3.6 4 FEATURES ................................................................................................................................................................2 APPLICATIONS..........................................................................................................................................................2 GENERAL DESCRIPTION ...........................................................................................................................................2 TERMS AND ABBREVIATIONS....................................................................................................................................3 REFERENCE DOCUMENTS .........................................................................................................................................3 FUNCTIONAL BLOCK FEATURES .........................................................................................................................5 2.1 2.2 2.3 2.4 3 B30931D7020Y918 R078 (WL1837) / D7020 HOST INTERFACES....................................................................................................................................................7 CLOCKS AND POWER MANAGEMENT .....................................................................................................................11 WLAN FUNCTIONAL BLOCK .................................................................................................................................14 BLUETOOTH FUNCTIONAL BLOCK .........................................................................................................................16 TERMINAL ASSIGNEMENTS ....................................................................................................................................18 TERMINAL FUNCTIONS ...........................................................................................................................................19 DESIGN GOAL SPECIFICATIONS .........................................................................................................................25 4.1 4.2 4.3 4.4 4.5 4.6 4.7 GENERAL CHIP REQUIREMENTS AND OPERATION ..................................................................................................25 WLAN RF PERFORMANCE ....................................................................................................................................28 BLUETOOTH RF PERFORMANCE .............................................................................................................................32 BLE RF PERFORMANCE .........................................................................................................................................36 INTERFACE TIMING CHARACTERISTICS ..................................................................................................................38 PACKAGE MECHANICAL DRAWING ........................................................................................................................42 SCHEMATIC ............................................................................................................................................................43 5 LEAD-FREE PRODUCT STATUS ...........................................................................................................................44 6 RECOMMENDED REFLOW PROFILE .................................................................................................................45 7 PACKING INFORMATION ......................................................................................................................................46 8 REVISION HISTORY.................................................................................................................................................49 DISPLAY OF ORDERING CODES FOR EPCOS PRODUCTS ....................................................................................50 SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 4 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 2 Functional Block Features 2.1 Functional Block Diagram Figure 2-1 shows a high-level view of R078 (WL1837) / D7020 along with its various configurations. The flexibility of the R078 (WL1837) / D7020 based on WL1837 enables easy integration with various hostsystem topologies. Figure 2-1 High-Level System Diagram SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 5 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 2.2 WLAN Features Integrated 2.4 & 5GHz power amplifiers for complete WLAN solution WLAN MAC Baseband Processor and RF transceiver - IEEE802.11a/b/g/n compliant WLAN 2.4 / 5 GHz SISO (20 / 40 MHz channels), 2.4 GHz MIMO (20 MHz channels). Baseband Processor IEEE Std 802.11a/b/g data rates and IEEE Std 802.11n data rates with 20 or 40 MHz SISO and 20 MHz MIMO. Fully calibrated system. No production calibration required. Medium-Access Controller (MAC) Embedded ARM™ Central Processing Unit (CPU) Hardware-Based Encryption/Decryption Using 64-, 128-, and 256-Bit WEP, TKIP or AES Keys, Supports requirements for Wi-Fi Protected Access (WPA and WPA2.0) and IEEE Std 802.11i [Includes Hardware-Accelerated Advanced-Encryption Standard (AES)] Designed to work with IEEE Std 802.1x New advanced co-existence scheme with BT/BLE 2.4/5.0 GHz Radio Internal LNA, PA and RF switch Supports: IEEE Std 802.11a, 802.11b, 802.11g and 802.11n Supports 4 bit SDIO host interface, including high speed (HS) and V3 modes 2.3 B30931D7020Y918 R078 (WL1837) / D7020 Bluetooth Features Supports Bluetooth 4.0 BLE Includes concurrent operation and built-in coexistence and prioritization handling of BT, BLE, audio processing and WLAN Dedicated Audio processor supporting on chip SBC encoding + A2DP: Assisted A2DP (A3DP) support - SBC Encoding implemented internally Assisted WB-Speech (AWBS) support - modified SBC codec implemented internally 2.4 BLE Features Fully compliant with BT4.0 BLE dual mode standard Support for all roles and role-combinations, mandatory as well as optional Supports up to 10BLE connection Independent buffering for LE allows having large number of multiple connections without affecting BR/EDR performance SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 6 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 3 Detailed Description 3.1 Host Interfaces 3.1.1 Device Host Interface Options The following table summarizes the Host Controller interface options. All interfaces operate independently. Table 3-1 Host Controller Interface options WLAN Shared HCI for BT BT Voice/Audio WLAN HS SDIO Over UART BT PCM The Device incorporates UART module dedicated to the BT shared-transport Host Controller Interface (HCI) transport layer. The HCI interface is used to transport commands, events, and ACL between the Bluetooth device and its host using HCI data packets. This acts as a shared transport for BT/BLE functional blocks. 3.1.2 WLAN SDIO Transport Layer The SDIO is the host interface for WLAN. The interface between the host and the D7020 uses an SDIO interface and supports a maximum clock rate of 50MHz. The Device SDIO also supports the following features of the SDIO V3 specification: 4 bit data bus Synchronous and Asynchronous In-Band-Interrupt Default and High-Speed (50MHz) timing Sleep/wake commands SDIO timing specifications are given in specification section at end of document. 3.1.3 HCI UART Shared Transport Layers for BT The HCI UART supports most baud rates (including all PC rates) for all fast clock frequencies - up to maximum of 4 Mbps. After power up the baud rate is set for 115.2 kbps, irrespective of fast clock frequency. The baud rate can then be changed by using a VS command. The Device responds with a Command Complete Event (still at 115.2 kbps), after which the baud rate change takes place. HCI hardware includes the following features: Receiver detection of break, idle, framing, FIFO overflow, and parity error conditions. Transmitter underflow detection. CTS/RTS hardware flow control. 4 wire (H4) Parameter Value Bit rate 115.2 kbps Data length 8 bits Stop bit 1 Parity None Table 3-2 UART Default Setting SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 7 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 3.1.3.1 UART 4 Wire Interface - H4 The interface includes four signals: TXD, RXD, CTS and RTS. Flow control between the host and the Device is byte-wise by hardware. Flow control is obtained by the following: Figure 3-1 HCI UART Connection When the RX buffer of the Device passes the “flow control” threshold, it will set the HCI_RTS signal high to stop transmission from the host. When the CTS signal is set high, the Device will stop its transmission on the interface. In case CTS is set high in the middle of transmitting a byte, the Device will finish transmitting the byte and stop the transmission. 3.1.3.2 BT function Firmware Low Power Mode Protocols The Device includes a mechanism that handles the transition between operating mode and deep sleep lowpower mode. The protocol is done via the UART and is known as eHCILL (enhanced HCI Low Level) power management protocol. This protocol is backward compatible with the TI BT HCILL Protocol, so a Host that implements the HCILL does not need to change anything in order to work with the Device. The "Enhanced" portion of the HCILL introduces changes that allow a simpler host implementation of this protocol. See SWRA288 eHCILL Four-Wire Power Management Protocol. 3.1.4 BT Audio CODEC Interface 3.1.4.1 Overview The CODEC interface is a fully dedicated programmable serial port, supporting the following: Two voice channels Master / slave modes Coding schemes: u-Law, A-Law, Linear, Transparent and SBC (for Assisted WBS operation) Long & short frames Different data sizes, order and positions Enlarged interface options to support a wider variety of Codecs 3.1.4.2 PCM Hardware Interface The PCM interface is one implementation of the codec interface. It contains the following four lines: Clock--configurable direction (input or output) Frame Sync--configurable direction (input or output) Data In--Input Data Out--Output/Tri state The Device can be either the master of the interface where it generates the clock and the frame-sync signals, or slave where it receives these two signals. The PCM interface is fully configured by means of a VS command. For slave mode, clock input frequencies between 64KHz and 12 MHz are supported.. For master mode, the Device can generate any clock frequency between 64 kHz and 6 MHz. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 8 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 3.1.4.3 PCM Data Format The data format is fully configurable: The data length can be from 8 to 320 bits, in 1 bit increments, when working with two channels, or up to 640 bits when using 1 channel. The data length can be set independently for each channel. The data position within a frame is also configurable with 1-clock (bit) resolution, and can be set independently (relative to the edge of the Frame Sync signal) for each channel. The Data_IN and Data_OUT bit order can be configured independently. For example; Data_IN can start with MSB while Data_OUT starts with LSB. Each channel is separately configurable. The inverse bit order (i.e. LSB first) is supported only for sample sizes up to 24 bits. The data in and data out size do not necessarily have to be the same length. The Data_OUT line is configured as a „high-Z‟ output between data words. Data_OUT can also be set for permanent high-Z, irrespective of data out. This allows the Device to be a bus slave in a multi-slave PCM environment. At power up, Data_OUT is configured as high-Z. 3.1.4.4 PCM Frame-Idle Period The CODEC interface has the capability for frame-idle periods, where the PCM clock can “take a break” and become „0‟ at the end of the PCM frame, after all data has been transferred. The Device supports frame-idle periods both as master and slave of the PCM bus. When Device is the master of the interface, the frame-idle period is configurable. There are 2 configurable parameters: Clk_Idle_Start - Indicates the number of PCM clock cycles from the beginning of the frame till the beginning of the idle period. After Clk_Idle_Start clock cycles, the clock becomes „0‟. Clk_Idle_End - Indicates the time from the beginning of the frame till the end of the idle period. This time is given in multiples of PCM clock periods. The delta between Clk_Idle_Start and Clk_Idle_End is the clock idle period. e.g. For PCM clock rate = 1 MHz, frame sync period = 10 kHz, Clk_Idle_Start = 60, Clk_Idle_End = 90. Between each two-frame sync there are 70 clock cycles (instead of 100). The clock idle period starts 60 clock cycles after the beginning of the frame and lasts 90-60=30 clock cycles. This means that the idle period ends 100-90=10 clock cycles before the end of the frame. The data transmission must end prior to the beginning of the idle period. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 9 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 3.1.5 Two Channel PCM Bus Example In the following figure, a 2-channel PCM bus is shown where the two channels have different word sizes and arbitrary positions in the bus‟ frame. (FT stands for Frame Timer). Figure 3-2 2 Channels PCM Bus Timing 3.1.6 PCM Audio Encoding The Device CODEC interface can use one of four audio coding patterns: A-Law (8-bit) µ-Law (8-bit) Linear (8 or 16-bit) SBC (16-bit) Two BT voice channels are not supported when SBC encoding is selected. 3.1.6.1 BT PCM Clock Mismatch Handling In BT RX, the Device receives RF voice packets and writes these to the CODEC I/F. If the Device receives data faster than the CODEC I/F output allows, an overflow occurs. In this case, the Device BT function has 2 possible behavior modes: “allow overflow” and “don‟t allow overflow”. If overflow is allowed, the Device BT function continues receiving data and overwrites any data not yet sent to the CODEC. If overflow is not allowed, RF voice packets received when buffer is full, are discarded. When the Bluetooth functional block is master on the PCM and slave on the Bluetooth network, the Bluetooth functional block can measure the drift between the two clocks and apply compensation to the PCM clock in order to avoid underrun and overrun scenarios 3.1.6.2 BT Inter-IC Sound (BT I2S over PCM bus) The Device can be configured as an Inter-IC Sound (I2S) serial interface to a I2S CODEC device. In this mode, the Device audio CODEC interface is configured as a bi-directional, full duplex interface, with two time slots per frame: Time slot 0 is used for the left channel audio data and time slot 1 for the right channel audio data. Each time slot is configurable up to 40 serial clock cycles in length and the frame is configurable up to 80 serial clock cycles in length. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 10 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 3.2 B30931D7020Y918 R078 (WL1837) / D7020 Clocks and Power Management 3.2.1 Slow Clock / RTC clock The slow clock is a free-running clock of 32.768 KHz which is supplied from an external clock source. It is connected to the RTC_CLK pin and is a digital square-wave signal in the range of 0-1.8V nom. 3.2.2 Fast Clock System 3.2.2.1 Fast clock using external crystal The devices incorporate an internal crystal oscillator circuit for supporting a cost optimized crystal based fast clock scheme. Connection is as shown: Figure 3-3 XTAL Connection C1 = C2. Typically 8 - 22pF. Refer to Crystal manufacturer‟s recommendations. R = 390K ohm (+/- 5% tolerance). NOTE : this arrangement does not support 5GHz band functions. 3.2.2.2 Fast Clock using external oscillator CLK_IN_P is the main system fast clock and must meet the specifications as described in "Fast clock specifications" at the end of this document. The clock must be one of the specified frequencies and the device incorporates an internal mechanism to detect this. The clock can be AC or DC coupled, sine or square wave. Crystal operation is supported as shown: Figure 3-4 Fast Clock Block Diagram SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 11 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 3.2.3 B30931D7020Y918 R078 (WL1837) / D7020 Power Management 3.2.3.1 Block Diagram - internal DC2DC's The Device incorporates three internal DC2DC's (switched-mode power supplies) to provide efficient internal and external supplies, derived from Vbat. Figure 3-5 Internal DC2DC’s 3.2.4 Reset / Power up system After Vbat and VIO are fed to Device and while BT_EN, WLAN_EN are de-asserted (LOW), the device is in Shutdown state. While in Shutdown state all functional blocks, internal DC2DC's and LDO's will be disabled. The power supplied to the functional blocks is cut off. When one of the two signals BT_EN or WLAN_EN are asserted (High) a Power On Reset (POR) is performed. Stable Slow Clock, VIO and Vbat are pre-requisites for successful POR. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 12 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 3.2.4.1 B30931D7020Y918 R078 (WL1837) / D7020 Chip Top-level Power Up Sequence Figure 3-6 Chip Top-level Power Up Sequence 3.2.4.2 WLAN Power Up Sequence Figure 3-7 WLAN Power Up Sequence SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 13 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 3.2.4.3 B30931D7020Y918 R078 (WL1837) / D7020 BT/BLE Power Up Sequence Figure 3-8 BT Power Up Sequence 3.3 WLAN Functional Block 3.3.1 WLAN MAC R078 (WL1837) / D7020 MAC implements the IEEE standard 802.11 MAC sub-layer using both dedicated hardware and embedded firmware. The MAC hardware implements real-time functions, including access protocol management, encryption and decryption. 3.3.2 WLAN Baseband Processor R078 (WL1837) / D7020 baseband processor implements the IEEE 802.11a/b/g/n PHY sub layers and has been optimized to perform well in conditions of high multipath and noise. 3.3.3 WLAN RF Radio R078 (WL1837) / D7020 WLAN radio is a highly integrated radio processor designed for 802.11a/b/g/n applications, including internal front-end PA's. 3.3.4 Coexistence BT/BLE - WLAN R078 (WL1837) / D7020 has been designed to support simultaneous operation of each of the major on-chip core functions. This operational coexistence is based on extensive frequency planning for each of the on-chip core functions, as well as a sophisticated MAC co-ordination scheme between Bluetooth and WLAN subsystems that allows operation in the same ISM frequency band. 3.3.5 WLAN RF Configuration and Power Options The R078 (WL1837) / D7020 includes all RF switches, band pass filters and diplexer for complete WLAN (SISO) and BT RF system. Optional MIMO configuration is also supported with external band pass filter. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 14 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 Figure 3-9 R078 (WL1837) / D7020 SISO/MIMO configuration options 3.3.5.1 MIMO and SISO options (WL1837 device) The diagram above shows WLAN and BT pins in standard SISO application and also for optional MIMO. Standard configuration for SISO: WLAN 2.4/5GHz + BT WLAN/BT 2.4GHz simultaneous RX/RX Optional configuration for MIMO: WLAN 2.4/5GHz + BT WLAN/BT 2.4GHz simultaneous RX/RX WLAN 2.4GHz MIMO SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 15 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 3.4 B30931D7020Y918 R078 (WL1837) / D7020 Bluetooth Functional Block 3.4.1 BT Digital Radio Processor (DRP) The Device uses 8th-generation TI Bluetooth technology, with new features and improved radio performance. 3.4.2 BT Receiver The receiver uses near-zero-IF architecture to convert the RF signal to baseband data. Received signal from the external antenna is input to an internal RF switch and a differential LNA (low-noise amplifier). This signal is then passed to a mixer which down-converts the signal to an IF, followed by a filter and amplifier. The signal is then quantized by a sigma-delta ADC. The quantized signal is further processed to reduce the interference level. The demodulator digitally down-converts the signal to zero IF and recovers the data stream by an adaptive decision mechanism. The demodulator includes EDR processing with state-of-the-art performance. It includes a maximum-likelihood sequence estimator (MLSE) for improved performance of basic-rate BR sensitivity, and adaptive equalization to enhance EDR modulation. 3.4.3 BT Transmitter The transmitter is based on an all-digital sigma-delta PLL with a digitally controlled oscillator (DCO) as the RF frequency clock. The modulation is achieved by directly modulating the digital PLL. The power amplifier is also digitally controlled. For EDR modulation, the transmitter uses a Polar-Modulation technique. In this mode, in addition to the frequency modulation that controls the direct-modulated ADPLL, an amplitude control modulates the PA, using the Digital-Transmitter block. This block receives the input bit-stream and converts these signals to phasemodulated control-words. The phase-modulated digital signal is then processed to provide frequencymodulation control to the ADPLL. 3.4.4 Class 1.5 Application Device provides on-chip support for Class 2 and Class 1.5 applications. Class 1.5 is the normal operating mode after the initialization script has been sent to the Device. It is called Class 1.5 as Device can transmit more than 4dBm on any BT modulation. Refer to Bluetooth RF Performance specifications at end of document for more information. 3.4.5 Advanced Audio features The Device includes Audio and Voice Processor (AVPR) targeted for off-loading the host CPU from coding voice/audio samples when running A2DP and WBS profiles. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 16 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 3.4.5.1 Assisted Wideband (WB) speech Encode/Decode 16kHz PCM audio samples to/from 64kbps SBC frames Fully compliant with the BT SIG Wideband speech profile Figure 3-10 Device Wideband speech support 3.4.5.2 Assisted A2DP Encode 44.1/48kHz PCM audio samples to Low/Mid/High Quality A2DP stream Fully compliant with the BT SIG A2DP profile Figure 3-11 Device Assisted A2DP SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 17 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 3.5 B30931D7020Y918 R078 (WL1837) / D7020 Terminal Assignements The view is from top side: A B C D E F G H J K L M N P 12 GND BT_AUD_ FSYNC_S B_DATA GND VIO GND GND GND GND NC NC NC NC GND GND 12 DIGITAL 11 GND BT_AUD_I N_SB_CL K GND GND GND SDIO_D2_ SDIO_CLK WL _WL GND BT_AUD_ OUT GND NC GND GND NC 11 RF 10 GND BT_AUD_ CLK GND FUNC2_B T GND SDIO_D3_ SDIO_D0_ WL WL GND DC2DC_R CLK_REQ EQ_MODE _OUT _SOC GND GND GND GND 10 Power 9 GND GND GND FUNC1_B T GND SDIO_CM SDIO_D1_ D_WL WL GND SLOW_CL K NC NC GND GND NC 9 GND 8 WLAN_BG 2 GND NC NC GND COEX_M COEX_M WS_BT_W WS_FRAM L_TX_O E_SYNC NC NC GND GND NC 8 CLOCK 7 GND GND NC GND GND COEX_M COEX_M RX_SW_F WS_ACTI WS_RX_P EM_WL VE RI NC NC GND GND GND NC 7 DIGITAL High Speed 6 NC GND PBIAS_TE STP_W GND GND DC2DC_R WLAN_IR UART_DE EQ_OUT_ Q BUG SOC GPIO_2 NC NC GND GND NC 6 Not Used NC 5 GND GND PDET_TE STM_W GND GND NC GPIO_1 GND GND GND GND 5 4 GND GND NC GND GPIO_3 GND VBAT1 VBAT2 VBAT3 4 3 11abg_AN T_1 GND GND GND GND 2 GND GND GND GND GND 1 GND GND GND GND GND GND GND GND A B C D E F G H GND GND GND WLAN_EN FEM_PA_ _SOC EN_WL BT_EN_S BT_HCI_R BT_HCI_T BT_HCI_R BT_HCI_C OC X X TS TS GND GND CLK_IN_P CLK_IN_M GND GND GND GND GND GND GND 3 GND GND GND GND GND GND GND 2 GND GND GND GND 1 L M N P PA_DC2D PA_DC2D C_IN C_OUT J K Top view Figure 3-12 Terminal Assignements SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 18 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 3.6 B30931D7020Y918 R078 (WL1837) / D7020 Terminal Functions Pin names and pin numbers in bracket apply to WSP pin out. Table 3-3 Terminal Functions Module Pin Name Module I/O Shut Default Buffer Description (WSP Pin Name) Pin No. Type Down after Type (WSP ball state POR [mA] no.) WLAN pins: I/O signals SDIO_CLK_WL (SDIO_CLK_WL) G11 (E11) IN HiZ HiZ WLAN SDIO clock. Must be driven by the host. SDIO_CMD_WL(SDIO_CMD_WL) F9 (D8) IN HiZ HiZ WLAN SDIO command in. Host must pull up. SDIO_D0_WL (SDIO_D0_WL) G10 (E10) I/O HiZ HiZ WLAN SDIO data bit 0. Host must pull up. SDIO_D1_WL (SDIO_D1_WL) G9 (E9) I/O HiZ HiZ WLAN SDIO data bit 1. Host must pull up. SDIO_D2_WL (SDIO_D2_WL) F11 (D11) I/O HiZ HiZ WLAN SDIO data bit 2. Host must pull up. SDIO_D3_WL (SDIO_D3_WL) F10 (D10) I/O HiZ PU WLAN SDIO data bit 3. Changes state to PU at WL_EN or BT_EN assertion for card detect. Later disabled by the SW during init. Host must pull up. WLAN_IRQ (IRQ_WL) G6 OUT PD Drive 0 SDIO available, interrupt out. (E3) Active high. To use WL_RS232_TX/RX lines, need to pull up with 10K resistor. GPIO_1 (GPIO1) K5 (H1) I/O PD PD Option: WL_RS232_TX (when IRQ_WL = 1 at power up) GPIO_2 (GPIO2) J6 (H2) I/O PD PD Option: WL_RS232_RX (when IRQ_WL = 1 at power up) GPIO_3 (UART_DBG_WL) K4 (G4) OUT PU PU WLAN logger Option: GPIO3 FEM_PA_EN_WL H5 (F2) NC (GPIO13) RX_SW_FEM_WL G7 (F3) NC (SW_CTRL_BG_IO1) PBIAS_TESTP_W C6 (C7) ANA NC (PABIAS_OUT_FEM_TESTP_WL) PDET_TESTM_W C5 (C6) ANA NC (PDET_IN_FEM_TESTM_WL) WLAN Pins: RF antenna 11abg_ANT_1 A3 RF WLAN ABG / BT RX and TX 50Ω input and output. No external matching required. WLAN_BG2 A8 RF Second 2.4GHz WLAN BG input and output for MIMO functionality. Requires external RF filter. BT pins: I/O Signals BT_HCI_RX (HCI_RX_BT) F4 (E7) IN PU PU HCI UART RX from host. Shared HCI I/F for BT. NC if not used. BT_HCI_TX (HCI_TX_BT) G4 (F7) OUT PU PU HCI UART TX to host. Shared HCI I/F.NC if not used. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 19 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module Module Pin Name (WSP Pin Name) B30931D7020Y918 R078 (WL1837) / D7020 Shut Default Buffer Description Down after Type state POR [mA] BT_HCI_RTS (HCI_RTS_BT) Module I/O Pin No. Type (WSP ball no.) H4 (G6) OUT PU PU BT_HCI_CTS (HCI_CTS_BT) J4 (F6) IN PU PU UART_DEBUG (UART_DEBUG_BT) FUNC1_BT (FUNC1_BT) H6 (G2) OUT PU PU D9 (E8) OUT PD PD FUNC2_BT (FUNC2_BT) D10 (B11) IN PD PD BT_AUD_CLK (AUD_CLK_BT) B10 (G11) OUT PD PD BT_AUD_FSYNC_SB_DATA (AUD_FSYNC_BT) BT_AUD_IN_SB_CLK (AUD_IN_BT) BT_AUD_OUT (AUD_OUT_BT) B12 (H11) OUT PD PD B11 (G9) IN PD PD J11 (G10) OUT PD PD C8 (F11) C7 (F8) C4 (F9) D8 (F10) IN IN IN OUT PD PD PD PD F2 (E4) ANA JTAG pins JTAG_TCK JTAG_TMS JTAG_TDI JTAG_TDO Clock pins CLK_IN_P CLK_IN_M SLOW_CLK (RTC_CLK) CLK_REQ_OUT Enable pins BT_EN_SOC (BT_EN) WLAN_EN_SOC (WLAN_EN) Power management pins VBAT1 VBAT2 VBAT3 VIO PA_DC2DC_IN PA_DC2DC_OUT PD PD PD PD G2 (E5) ANA J9 (H8) ANA K10 (K11) OUT PD PD E4 (E2) G5 (E1) IN IN PD PD M4 N4 P4 D12 J1 POW POW POW POW POW K1 POW PD PD DC2DC_REQ_OUT_SOC (NU) F6 (D3) DC2DC_REQ_MODE_SOC (NU) J10 (J10) SAW IT Please read Cautions and warnings and Important notes at the end of this document. HCI UART RTS to host. Shared HCI I/F. NC if not used. HCI UART CTS from host. Shared HCI I/F. NC if not used. BT UART debug (logger). NC if not used. Optional: BT_HOST_WAKE_UP signal to wake-up the HOST from BT. NC if not used. Optional: BT_WAKE_UP Bluetooth wakeup from HOST. NC if not used. BT PCM/I2S bus clock. NC if not used. BT PCM/I2S bus frame sync. NC if not used. BT PCM/I2S bus data input. NC if not used. BT PCM/I2S bus data output. NC if not used. JTAG_TCK NC if not used JTAG_TMS NC if not used JTAG_TDI NC if not used JTAG_TDO NC if not used FREF/TCXO input for all functional blocks Connect to GND Sleep clock 32.768 kHz Request external fast clock NC if not used. High = enable High = enable Battery voltage Battery voltage Battery voltage 1.8V I/O power supply PA power supply input, with internal PA_DC2DC connect to pin PA_DC2DC_OUT K1. DC2DC output for PA supply, with internal PA_DC2DC connect to pin PA_DC2DC_IN J1. NC NC 2014-09-25 Page 20 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module Module Pin Name (WSP Pin Name) Co-existence signals COEX_MWS_RX_PRI (COEX_MWS_UART_RX) COEX_MWS_BT_WL_TX_O (COEX_MWS_UART_TX) COEX_MWS_ACTIVE (COEX_MWS_PRE_TX) COEX_MWS_FRAME_SYNC (COEX_MWS_FRAME_SYNC) Not used pins NU NU NU NU NU NU NU NU NU NU NU NU NU NU NU NU NU NU NU NU Ground pins GND GND GND GND GND GND GND GND GND GND GND GND GND GND B30931D7020Y918 R078 (WL1837) / D7020 Module I/O Shut Default Buffer Description Pin No. Type Down after Type (WSP ball state POR [mA] no.) H7 (G5) PU PU H8 (G7) PU PU F7 (G8) PU PU J8 (H7) PU PU A6 J5 J7 J12 K6 K7 K8 K9 K12 L6 L8 L9 L11 L12 M12 P6 P7 P8 P9 P11 A1 A2 A4 A5 A7 A9 A10 A11 A12 B1 B2 B3 B4 B5 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC GND GND GND GND GND GND GND GND GND GND GND GND GND GND SAW IT Please read Cautions and warnings and Important notes at the end of this document. General purpose IO. NC if not used. General purpose IO. NC if not used. General purpose IO. NC if not used. General purpose IO. NC if not used. 2014-09-25 Page 21 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module Module Pin Name (WSP Pin Name) GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Module Pin No. (WSP ball no.) B6 B7 B8 B9 C1 C2 C3 C9 C10 C11 C12 D1 D2 D3 D4 D5 D6 D7 D11 E1 E2 E3 E5 E6 E7 E8 E9 E10 E11 E12 F1 F3 F5 F8 F12 G1 G3 G8 G12 I/O Shut Default Buffer Description Type Down after Type state POR [mA] GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND SAW IT Please read Cautions and warnings and Important notes at the end of this document. B30931D7020Y918 R078 (WL1837) / D7020 2014-09-25 Page 22 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module Module Pin Name (WSP Pin Name) GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Module Pin No. (WSP ball no.) H1 H2 H3 H9 H10 H11 H12 J2 J3 K2 K3 K11 L1 L2 L3 L4 L5 L7 L10 M1 M2 M3 M5 M6 M7 M8 M9 M10 M11 N1 N2 N3 N5 N6 N7 N8 N9 N10 N11 I/O Shut Default Buffer Description Type Down after Type state POR [mA] GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND SAW IT Please read Cautions and warnings and Important notes at the end of this document. B30931D7020Y918 R078 (WL1837) / D7020 2014-09-25 Page 23 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module Module Pin Name (WSP Pin Name) GND GND GND GND GND GND GND Module Pin No. (WSP ball no.) N12 P1 P2 P3 P5 P10 P12 I/O Shut Default Buffer Description Type Down after Type state POR [mA] GND GND GND GND GND GND GND SAW IT Please read Cautions and warnings and Important notes at the end of this document. B30931D7020Y918 R078 (WL1837) / D7020 2014-09-25 Page 24 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 4 Design Goal Specifications Section Disclaimer This Specification is based upon the Texas Instruments WL183x Data Sheet version 1.4, and is subject to any subsequent changes in applicable Texas Instruments documentation and software. Any parameter marked TBD indicates that this is yet to be determined by TDK design/testing. Any parameter marked TBC indicates that this is yet to be determined in an update of Texas Instruments documentation. 4.1 General Chip Requirements and Operation All parameters are measured as follows unless stated otherwise: VlO=1.8V 4.1.1 Absolute Maximum Ratings (1) Value VBAT (2) Unit (4) VIO Input voltage to Analog pins (3) -0.5 to 5.5 V -0.5 to 2.1 V -0.5 to 2.1 V Input voltage to all other pins -0.5 to (VDD_IO + 0.5V) V Operating ambient temperature range -30 to +85 °C RF pins >500 V Other >1000 V RF pins >300 V Other >250 V ESD Stress Voltage (6) Human Body Model (5) (7) Charged Device Model (8) (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The following signals are from the VBAT group: VBAT1, VBAT2, VBAT3 (3) Analog pins: WLAN_BG2, 11abg_ANT_1. (4) 5.5V up to 10s cumulative in 7 years. 5V cumulative to 250s, 4.8V cumulative to 2.33 years – all includes charging dips and peaks. (5) Operating free-air temperature range. The device can be reliably operated for 7 years at Tambient of 85˚C, assuming 25% active mode and 75% sleep mode (15,400 cumulative active power-on hours). (6) Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into the device. (7) Level listed is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process, and manufacturing with less than 500V HBM is possible if necessary precautions are taken. Pins listed as 1000V may actually have higher performance. (8) Level listed is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process, and manufacturing with less than 250V CDM is possible if necessary precautions are taken. Pins listed as 250 V may actually have higher performance. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 25 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 4.1.2 Recommended Operating Conditions Rating 1.8V core supply voltage Vbat Condition Sym DC supply range for all modes IO high-level input voltage IO low-level input voltage Enable inputs high-level input voltage Enable inputs low-level input voltage High-level output voltage @4 mA @ 1 mA @0.3 mA Low-level output voltage @4 mA @ 1 mA @0.09 mA Input transitions time Tr/Tf from 10% (1) to 90% (Digital IO) Output rise time from 10% to 90% CL <25 pF (1) (Digital pins) Output fall time from 10% to 90% CL <25 pF (1) (Digital pins) Ambient operating temperature (1) B30931D7020Y918 R078 (WL1837) / D7020 Min 1.7 3.4 Max 1.95 4.3 Unit V VIH 0.65 x VDD_IO VIL 0 Vih_en 1.365 VDD_IO 0.35 x VDD_IO VDD_IO Vil_en 0 VOH VDD_lO – 0.45 VDD_lO – 0.112 VDD_IO- 0.033 VOL 0 0 0 Tr/Tf 1 0.4 VDD_IO VDD_IO VDD_IO 0.45 0.112 0.01 10 ns Tr 5.3 ns Tf 4.9 -30 +85 °C Applies to all Digital lines except SDIO, SPI, UART, I2C, PCM and slow clock lines 4.1.3 External Digital Slow Clock Requirements (-30°C to +85°C) The supported digital slow clock is 32.768 kHz digital (square wave). All core functions share a single input. Characteristics Condition Sym Min Input slow clock frequency Input slow clock accuracy (initial + temp + aging) Tr/Tf Frequency input duty cycle 15 Square wave, DC-coupled Unit 50 Hz ±250 ppm 100 ns 85 % Vpeak Vih 0.65xVDD_I O VDD_IO Vil 0 0.35xVDD_I O Input impedance MΩ 1 Input capacitance 5 SAW IT Please read Cautions and warnings and Important notes at the end of this document. Max 32768 WLAN, BT Input transition time Tr/Tf -lO% to 90% Input voltage limits Typ pF 2014-09-25 Page 26 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 4.1.4 B30931D7020Y918 R078 (WL1837) / D7020 External fast clock Crystal Requirements and operation (-30°C to +85°C) Characteristics Condition Min Supported frequencies Max 26, 38.4 Frequency accuracy Load capacitance, Typ MHz Initial + temp + aging (1) CL 5 Equivalent Series Resistance, ESR Drive level Unit ±20 ppm 13 pF 60 ohms 100 uW 1) Load capacitance, CL = [C1.C2] / [C1 + C2] + CP, where C1, C2 are the capacitors connected on CLK_IN_P & CLK_IN_M respectively and CP is the parasitic capacitance (typically 1-2pF). For example, for C1 = C2 = 12pF and CP = 2pF, then CL = 8pF. 4.1.5 External TCXO CLK Requirements (-30°C to +85°C) Parameter Conditions Min Supported frequency Max 26, 38.4 Frequency accuracy Total short and long term Input voltage limits (TCXO_P) Sine wave/ ac-coupled Input impedance, 26 MHz RP Input resistance CP Input capacitance Input impedance, 38.4 MHz RP Input resistance CP Input capacitance Power-up time Typ MHz ±20 ppm 2.4GHz WLAN 0.2 1.4 Vp-p 5GHz WLAN 1.4 0.8 kΩ 20 2.5 pF kΩ 15 2.5 pF 5 ms -120 dBc/Hz -130 dBc/Hz -135 dBc/Hz -125 dBc/Hz -132 dBc/Hz -136.5 dBc/Hz -125 dBc/Hz -139 dBc/Hz Measured at 100KHZ offset -144 dBc/Hz Measured at 1 KHz offset -125 dBc/Hz Measured at 10 KHZ offset -142 dBc/Hz Measured at 100KHZ offset -145 dBc/Hz (1) Phase noise 2.4GHz for 38.4MHz Measured at 1 KHz offset (2) 20MHz SISO Measured at 10 KHz offset Measured at 100 KHz offset Phase noise 2.4GHz for 38.4MHz Measured at 1 KHz offset (2) 40MHz SISO Measured at 10 KHz offset Measured at 100KHZ offset Phase noise 2.4GHz for 38.4MHz Measured at 1 KHz offset (2) 20MHz MIMO Measured at 10 KHz offset Phase noise 5GHz for 38.4MHz, (2) 20/40MHz SISO Unit (1) Power-up time is calculated from the time CLK_REQ_OUT asserted till the time the TCXO_CLK amplitude is within voltage limit specified above and TCXO_CLK frequency is within 0.1 ppm of final steady state frequency. (2) The phase noise numbers listed here must be met at 38.4 MHz. For other frequencies the phase noise requirement is corrected by adding 20 x log10(fTCXO / 38.4e6) dB. Specifically, for 26 MHz TCXO, the correction factor would be -3.4 dB. * The slope of the clock at zero-crossings should not be less than that of a 200 mVp-p sine-wave (800 mVp-p for 11a band). i.e. 26MHz clock: 16V/μs (for 11bg band) 38.4MHz clock: 24V/μs (for 11bg band) SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 27 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 4.2 B30931D7020Y918 R078 (WL1837) / D7020 WLAN RF Performance All specifications in this draft data sheet are design goal level and subject to change. All specifications have been measured using TDK CB (Carrier Board) and are given at the module pins (Carrier Board insertion loss is de-embedded). All measurements have been performed over VBAT voltage range from 3.4V to 4.3V and over temperature range from -30°C to +85°C. * MIMO function is confirmed by only WL183x. * 11n 40MHz bandwidth function is available. However the RF performance is guaranteed by only WL183x. 4.2.1 WLAN 2.4 GHz Radio Characteristics 4.2.1.1 WLAN 2.4 GHz Receiver RF Characteristics Characteristics Condition Operation frequency range Sensitivity (ANT1) 1 Mbps DSSS 20MHz bandwidth. 54 Mbps OFDM At < 10% PER limit MCS7 Max Input Level OFDM (11g/n) At < 10% PER limit CCK Adjacent Channel Rejection at 2Mbps sensitivity level +3 for OFDM and 11 Mbps +6 for CCK 54 Mbps LO leakage Min 2400 Typ –19 –4 42.7 37.9 2 Max 2480 -91 -70 -65 Unit MHz dBm dBm dB –80 dBm 4.2.1.2 WLAN 2.4 GHz Receiver Blocking Characteristics Per Band The R078 (WL1837) / D7020 is designed to coexist with co-located cellular transmitters. Table below lists typical cellular interference sources and the corresponding maximum power from the cellular interference source that can be present at the input terminal of R078 (WL1837) / D7020, such that WLAN receiver sensitivity is not degraded by more than 1 dB. (Further improvement is achieved by antenna isolation) Characteristics Blocking performance at other bands Condition 776 to 794 MHz (CDMA) 824 to 849 MHz (GMSK) 824 to 849 MHz (EDGE) 824 to 849 MHz (CDMA) 880 to 915 MHz (GMSK) 880 to 915 MHz (EDGE) 1710 to 1785 MHz (GMSK) 1710 to 1785 MHz (EDGE) 1850 to 1910 MHz (GMSK) 1850 to 1910 MHz (EDGE) 1850 to 1910 MHz (CDMA) 1850 to 1910 MHz (WCDMA) 1920 to 1980 MHz (WCDMA) SAW IT Please read Cautions and warnings and Important notes at the end of this document. Min Typ Max Unit +10 dBm +10 +10 +10 +21 +21 +3 +3 -3 -3 -10 -10 -10 2014-09-25 Page 28 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 4.2.1.3 WLAN 2.4 GHz Transmitter power RF transmission (Tx) tests are done in continuous transmission. Characteristics Condition 11abg_ANT_1 pin Min Typ Max Maximum output power 1 Mbps +12 +15 11Mbps +12 +15 -Notice that 6 Mbps at EVM: -10 dB, +10 +13 WLAN_BG2 path 54 Mbps at EVM: -25 dB +9 +12 requires external RF MCS0 (Greenfield) at +9 +13 filter. EVM: -10 dB MCS7 (Greenfield) at +8 +11 EVM: -28 dB Output power accuracy ±1.5 Transmit power control 0.125 resolution B30931D7020Y918 R078 (WL1837) / D7020 WLAN_BG2 pin Min Typ Max Unit dBm +16 +19 +13.5 +15 +15.6 +19 +12.1 +14 ±1.5 0.125 dB dB 4.2.1.4 WLAN 2.4 GHz Transmitter out-of-band emissions Table below shows 2.4GHz WLAN transmitter out-of-band emissions for each band listed in the Condition column. The wideband noise at 2.4GHz WLAN antenna port is also listed. Characteristics Condition Min Typ Max Unit Cellular bands out-of-band broadband 746 to 764 MHz (CDMA1) -145 dBm/Hz emissions(1) 869 to 894 MHz (GSM850) -145 925 to 960 MHz (EGSM900) -138 1570 to 1580 MHz (GPS) -142 1596 to 1609 MHz (GLONASS) -130 1805 to 1880 MHz (DCS1800) -140 1930 to 1990 MHz (PCS1900) -120 2110 to 2170 MHz -129 (4) Cellular bands out-of-band spurious 746 to 764 MHz (CDMA) -44.2 dBm (4) emissions 869 to 894 MHz (CDMA, GSM850) -44.2 (4) 925 to 960 MHz (EGSM900) -44.2 (4) 1570 to 1580 MHz (GPS) -44.2 (4) 1805 to 1880 MHz (DCS1800) -44.2 (4) 1930 to 1990 MHz (PCS1900, CDMA) -44.2 (4) 2110 to 2170 MHz -44.2 (2) Spurious emission during operation at 30MHz – 1GHz –55 dBm nd (3) 1MHz RBW –33 2 harmonic rd (3) –33 3 harmonic th (3) –33 4 harmonic th (3) –33 5 harmonic (1) Figures are for max transmission power for all available modulations. The setup noise floor is -167dBm/Hz. (2) Based on TI IC performance (3) ETSI limit plus 3dB margin (4) FCC conductive limit plus 3dB margin SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 29 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 4.2.1.5 B30931D7020Y918 R078 (WL1837) / D7020 2.4GHz WLAN Current Consumption Active Current (1) Spec item Tx 11CCK @15dBm Tx 54OFDM @12dBm Rx MIN TYP 345 290 65 MAX 380 320 75 Units mA mA mA (1) All measured at ANT1 and the 3.6V VBAT rail of the solution. TCXO current included. 4.2.2 WLAN 5 GHz Radio Characteristics 4.2.2.1 WLAN 5 GHz Receiver RF Characteristics Characteristics Condition Operation frequency range (1) Sensitivity 54 Mbps OFDM Notes: MCS7 -20MHz bandwidth. -At < 10% PER limit Max Input Level 802.11a/n Adjacent channel rejection LO leakage (1) 54 Mbps Min 4910 Typ Max 5835 -70 Unit MHz dBm -65 –27 dBm 2 –53 dBm The sensitivity is guaranteed at only 36ch (5180MHz). 4.2.2.2 WLAN 5 GHz Receiver Blocking Characteristics Per Band The R078 (WL1837) / D7020 is designed to coexist with co-located cellular transmitters. Table below lists typical cellular interference sources and the corresponding maximum power from the cellular interference source that can be present at the input terminal of R078 (WL1837) / D7020, such that WLAN receiver sensitivity is not degraded by more than 1 dB. (Further improvement is achieved by antenna isolation) Characteristics Blocking performance at other bands Condition 776 to 794 MHz (CDMA) 824 to 849 MHz (GMSK) 824 to 849 MHz (EDGE) 824 to 849 MHz (CDMA) 880 to 915 MHz (GMSK) 880 to 915 MHz (EDGE) 1710 to 1785 MHz (GMSK) 1710 to 1785 MHz (EDGE) 1850 to 1910 MHz (GMSK) 1850 to 1910 MHz (EDGE) 1850 to 1910 MHz (CDMA) 1850 to 1910 MHz (WCDMA) 1920 to 1980 MHz (WCDMA) SAW IT Please read Cautions and warnings and Important notes at the end of this document. Min Typ Max Unit -10 dBm -10 -10 -10 -10 -10 -10 -18 -39 -39 -39 -39 -23 2014-09-25 Page 30 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 4.2.2.3 WLAN 5 GHz Transmitter power RF transmission (Tx) tests are done in continuous transmission. Characteristics Condition Min 6 Mbps at EVM: -10 dB, +10 54 Mbps at EVM: -25 dB +6 MCS0 (Greenfield) at EVM: -10 dB +8 MCS7 (Greenfield) at EVM: -28 dB +7 Output power accuracy Transmit power control resolution Typ +12 +9 +11 +14 -1.5 0.125 Max Unit dBm +1.5 dB dB 4.2.2.4 WLAN 5 GHz Transmitter out-of-band emissions Table below shows 5GHz WLAN transmitter out-of-band emissions for each band listed in the Condition column. The wideband noise at 5GHz WLAN antenna port is also listed. Characteristics Condition Min Typ Max Unit Cellular bands out-of-band broadband 746 to 764 MHz (CDMA2000) -143 dBm/Hz emissions 869 to 894 MHz (GSM850) -143 925 to 960 MHz (EGSM900) -143 1570 to 1580 MHz (GPS) -145 1570 to 1580 MHz (GLONASS) -145 1805 to 1880 MHz (DCS1800) -110 1930 to 1990 MHz (PCS1900) -105 2110 to 2170 MHz (WCDMA FDD) -142 Cellular bands out-of-band spurious 746 to 764 MHz (CDMA2000) -44.2(4) dBm emissions 869 to 894 MHz (GSM850) -44.2(4) 925 to 960 MHz (EGSM900) -44.2(4) 1570 to 1580 MHz (GPS) -44.2(4) 1570 to 1580 MHz (GLONASS) -44.2(4) 1805 to 1880 MHz (DCS1800) -44.2(4) 1930 to 1990 MHz (PCS1900, CDMA) -44.2(4) 2110 to 2170 MHz (WCDMA FDD) -44.2(4) 2 harmonic 11an –33(3) dBm nd (1) Figures are for max transmission power for all available modulations. The setup noise floor is -167dBm/Hz. (2) Based on TI IC performance (3) ETSI Limit plus 3dB margin (4) FCC conductive Limit plus 3dB margin 4.2.2.5 5GHz WLAN Current Consumption Active Current (1) Spec item Tx 6 OFDM @ 12dBm Tx 54OFDM @ 9dBm Rx MIN TYP 420 375 75 MAX 460 415 85 Units mA mA mA (1) All measured at the 3.6V VBAT rail of the solution. TCXO current included. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 31 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 4.3 B30931D7020Y918 R078 (WL1837) / D7020 Bluetooth RF Performance All specifications in this draft data sheet are design goal level and subject to change. All specifications have been measured using TDK CB (Carrier Board) and are given at the module pins (Carrier Board insertion loss is de-embedded). All measurements have been performed over VBAT voltage range from 3.4V to 4.3V and over temperature range from -30°C to +85°C. 4.3.1 Bluetooth BR, EDR Receiver Characteristics—In-Band Signals Characteristics Condition Min Typ Operation frequency range Channel spacing Input impedance Sensitivity (1) BR, BER = 0.1% Dirty TX on EDR2, BER = 0.01% EDR3, BER = 0.01% EDR BER floor at EDR2, BER = 0.1% sensitivity + 10 dB, EDR3, BER = 0.1% dirty TX off (for 1,600,00 bits) Maximum useable BR, BER = 0.1% input power EDR2, BER = 0.1% EDR3, BER = 0.1% Intermodulation Level of interferers characteristics For n = 3, 4, and 5 C/I performance BR, co-channel Note: Numbers show EDR, co-channel EDR2 wanted-signal to EDR3 interfering-signal BR, adjacent ±1 MHz ratio. Smaller EDR, adjacent EDR2 numbers indicate ±1MHz, (image) EDR3 better C/I BR, adjacent +2 MHz performance. Image = EDR, adjacent EDR2 –1 MHz +2MHz EDR3 BR, adjacent –2 MHz EDR, adjacent EDR2 –2MHz, EDR3 BR, adjacent | ±3 | MHz EDR, adjacent EDR2 EDR3 | ±3 | MHz RF return loss (1) 2402 –86 –85 –78 1e-6 Max 2480 1 50 –90 –89 –82 Bluetooth Unit Spec MHz –70 –70 –70 1e-5 MHz Ω dBm 1e-6 1e-5 –5 –10 –10 –36 –20 –20 –20 –39 dBm 11 13 21 0 0 5 –30 –30 –25 –20 –20 –13 –40 –40 –33 dB –30 8 9.5 16.5 –10 –10 –5 –38 –38 –38 –28 –28 –22 –45 –45 –44 10 12 20 –3 –3 2 –33 –33 –28 –22 –20 –13 –42 –42 –36 –10 dBm dB Sensitivity degradation up to –3 dBm may occur due to fast clock harmonics with dirty Tx on. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 32 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 4.3.2 Bluetooth Receiver Characteristics—General Blocking Characteristics Condition Min Blocking performance over full 30 to 2000 MHz -6 range, according to 2000 to 2399 MHz -6 Bluetooth specification (1) 2484 to 3000 MHz -6 3 to 12.75 GHz -6 Typ Bluetooth Spec Unit -10 dBm -27 -27 -10 (1) Exceptions taken out of the total 24 allowed in the Bluetooth spec. 4.3.3 Bluetooth Receiver Characteristics—GFSK, EDR2, EDR3 Blocking Per Band Characteristics Condition Min Blocking performance for various cellular bands. 776 to 794 MHz (CDMA) (1) +13 824 to 849 MHz (GMSK) (1) +22 Hopping on. (1) 824 to 849 MHz (EDGE) +14 Wanted signal: -3 dB from sensitivity, with 824 to 849 MHz (CDMA,QPSK) (1) +13 modulated continuous blocking signal. +11 BER = 0.1% for BT BR, BER = 0.01% for BT EDR, 880 to 915 MHz (GMSK) 880 to 915 MHz (EDGE) +10 PER = 1% 1710 to 1875 MHz (GMSK) +17 1710 to 1875 MHz (EDGE) +3 1850 to 1910 MHz (GMSK) -3 1850 to 1910 MHz (EDGE) -5 1850 to 1910 MHz (CDMA,QPSK) -5 1850 to 1910 MHz (WCDMA,QPSK) -1 1920 to 1980 MHz (WCDMA,QPSK) -2 Typ Unit dBm (1) Expect for frequencies where (3 x F_BLOCKER falls within the BT band (2400-2483.5 MHz). 4.3.4 Bluetooth Transmitter, BR, Class 1.5 Characteristics RF output power Gain control range Power control step Adjacent channel power |M–N| = 2 Adjacent channel power |M–N| > 2 Min Typ Max 9 11 30 5 –43 –48 8 –35 –40 2 4.3.5 Bluetooth Transmitter, EDR, Class 1.5 Characteristics Min Typ –2 EDR relative power Gain control range Power control step Adjacent channel power |M–N| = 1 Adjacent channel power |M–N| = 2 Adjacent channel power |M–N| > 2 2 SAW IT Please read Cautions and warnings and Important notes at the end of this document. Bluetooth Unit Spec dBm dB 2 to 8 < –20 dBm < –40 30 5 –36 –30 –42 Max Bluetooth Spec 1 –4 to +1 8 –30 –23 –40 2 to 8 <–26 <–20 <–40 Units dB dBm 2014-09-25 Page 33 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 4.3.6 Bluetooth Modulation, BR—Class 1.5 Characteristics Condition Sym –20 dB BW Average deviation Mod Data = 4-1, 4-0 dF1 avg detector bandwidth – 1111000011110000... 10 MHz Instantaneous Mod data = 10101… dF2 max deviation 1010101... dF2/dF1 Carrier frequency drift DH1 DH3 and DH5 Drift rate lfk+5 – fkl , k = 0 …. max Initial carrier F0 –fTX frequency tolerance Min Typ Max 145 925 160 995 170 120 130 85 -25 -35 88 4.3.8 Bluetooth Unit Spec 1000 kHz 140 to 175 kHz 25 35 15 25 -25 4.3.7 Bluetooth Modulation, EDR, Class 1.5 Characteristics Condition Min Carrier frequency stability Initial carrier frequency tolerance RMS DEVM (1) EDR2 EDR3 99% DEVM (1) EDR2 EDR3 Peak DEVM (1) EDR2 EDR3 B30931D7020Y918 R078 (WL1837) / D7020 Typ Max -5 -25 4 4 9 9 > 115 kHz > 80 < ±25 < ±40 < 20 <± 75 % kHz kHz/ 50µs s kHz Unit 5 25 Bluetooth spec ≤10 ± 75 15 10 30 20 25 18 20 13 30 20 35 25 % % % % % % kHz kHz Bluetooth Transceiver, Out-of-Band Emissions Characteristics TX out-of-band emissions Condition 746 to 764 MHz (CDMA) 869 to 894 MHz (CDMA1, GSM) 925 to 960 MHz (E-GSM) 1570 to 1580 MHz (GPS) 1598 to 1607 MHz (GLONASS) 1805 to 1880 MHz (DCS, WCDMA) 1930 to 1990 MHz (PCS) 2110 to 2170 MHz (WCDMA) SAW IT Please read Cautions and warnings and Important notes at the end of this document. Typ Max -143 -141 -140 -137 -137 -133 Unit dBm/Hz -131 -121 2014-09-25 Page 34 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 4.3.9 Bluetooth Transceiver, Spurious Emissions Characteristics Condition Typ out-of-band spurious 76 to 108 MHz (FM) emissions 746 to 764 MHz (CDMA) 869 to 894 MHz (CDMA1, GSM) 925 to 960 MHz (E-GSM) 1570 to 1580 MHz (GPS) 1805 to 1880 MHz (GSM) 1930 to 1990 MHz (GSM, CDMA1, WCDMA) 2110 to 2170 MHz (WCDMA) SAW IT Please read Cautions and warnings and Important notes at the end of this document. B30931D7020Y918 R078 (WL1837) / D7020 Max -44.2 -44.2 -44.2 -44.2 -44.2 -44.2 -44.2 -44.2 Unit dBm 2014-09-25 Page 35 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 4.4 B30931D7020Y918 R078 (WL1837) / D7020 BLE RF performance All specifications in this draft data sheet are design goal level and subject to change. All specifications have been measured using TDK CB (Carrier Board) and are given at the module pins (Carrier Board insertion loss is de-embedded). All measurements have been performed over VBAT voltage range from 3.4V to 4.3V and over temperature range from -30°C to +85°C. * BLE function is available. However the RF performance is guaranteed by only WL183x. 4.4.1 BLE Receiver Characteristics—In-Band Signals Characteristics Condition (2) Min Operation frequency range Channel spacing Input impedance Sensitivity (1) dirty Tx on Dirty TX on Maximum useable input power Intermodulation Level of interferers characteristics For n = 3, 4, and 5 C/I performance BLE, co-channel Note: Numbers show BLE, adjacent ±1 MHz wanted-signal to BLE, adjacent +2 MHz interfering-signal BLE, adjacent –2 MHz ratio. Smaller BLE, adjacent ≥|±3| MHz numbers indicate better C/I performance. Image = –1 MHz Typ 2402 Max BLE Spec 2480 2 50 –91 -88 -5 -36 -30 8 –5 –45 –22 –47 12 0 –38 –15 –40 Unit MHz ≤ -70 MHz Ω dBm ≥ -10 dBm ≥ -50 dBm ≤ 21 ≥ 15 ≤ -17 ≤ -15 ≤ -27 dB (1) Sensitivity degradation up to –3 dBm may occur due to fast clock harmonics with dirty Tx on. (2) BER of 0.1% corresponds to PER of 30.8% for a minimum of 1500 transmitted packets, according to BLE test spec. 4.4.2 BLE Receiver Characteristics—General Blocking Characteristics Condition Blocking performance over full range, 30 to 2000 MHz according to BLE specification (1) 2000 to 2399 MHz 2484 to 3000 MHz 3 to 12.75 GHz Min -15 -15 -15 -15 BLE spec -30 -35 -35 -30 Unit dBm (1) Exceptions taken out of the total 10 allowed for fbf_1, according to the BT LE Spec. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 36 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 4.4.3 B30931D7020Y918 R078 (WL1837) / D7020 BLE Receiver Characteristics—Blocking Per Band Same as BT BR with following conditions: - Hopping off. - Desired signal: -3dB from sensitivity, with modulated continuous blocking signal. PER = 30.8% 4.4.4 BLE Transmitter Characteristics RF output power Adjacent channel power |M–N| = 2 Adjacent channel power |M–N| > 2 Min Typ Max 6 8 -51 -54 –43 –46 BLE Spec <10 < –20 < –30 Unit dBm dBm (1) BLE spec = 10dBm max can be achieved using normal system losses due to filters etc, or by reducing value through VS command. 4.4.5 BLE Modulation Characteristics Condition(1) BLE modulation characteristics BLE carrier frequency drift BLE drift rate BLE initial carrier frequency tolerance Min Typ Max Mod Data = 4-1, 4-0; 240 1111000011110000... 250 260 ΔF2 max ≥ limit for Mod data = 10101... 195 at least 99.9% of all ∆f2max ΔF2avg / ΔF1avg 85 lf0 – fnl , n = 2,3 ….K –25 215 ΔF1 avg lf1 – f0l and lfn – fn5l, n = 6,7….K fn – ftx -25 BLE Spec 225 to 275 Unit > 185 kHz 25 > 80 <±50 % kHz 15 < 20 kHz/50µs 25 <±150 kHz 90 kHz (1) Performance figures at maximum power. 4.4.6 BLE Transceiver, Out-Of-Band and Spurious Emissions Same as BT basic rate. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 37 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 4.5 4.5.1 B30931D7020Y918 R078 (WL1837) / D7020 Interface Timing Characteristics UART timing Figure 4-1 UART timing diagram Table 4-1 UART timing Parameter Baud rate Baud rate accuracy per byte Baud rate accuracy per bit CTS low to TX_DATA on CTS high to TX_DATA off CTS High Pulse Width RTS low to RX_DATA on RTS high to RX_DATA off STR D0..Dn PAR STP - Condition Symbol Receive/Transmit Receive/Transmit Hardware flow control Interrupt set to ¼ FIFO t3 t4 t6 t1 t2 Min 37.5 -2.5 -12.5 0 Typ Max 4364 +1.5 +12.5 2 1 1 0 2 16 Unit Kbps % % µs Byte Bit µs Bytes Start bit Data bits (LSB first) Parity bit (if used) Stop bit SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 38 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 4.5.2 B30931D7020Y918 R078 (WL1837) / D7020 SDIO timing specifications 4.5.2.1 SDIO Switching Characteristics - Default rate input and output Specification is over recommended operating conditions. Parameters are for default clock frequency. Figure 4-2 SDIO default input timing Figure 4-3 SDIO default output timing Parameter fclock DC tTLH tTHL tISU tIH tODLY CI Table 4-2 SDIO Switching Characteristics – Deault Rate Min Max Clock frequency, CLK 0 26 Low/high duty cycle 40 60 Rise time, CLK 10 Fall time, CLK 10 Setup time, input valid before CLK ↑ 3 Hold time, input valid after CLK ↑ 2 Delay time, CLK ↓ to output valid 2.5 14.8 Capacitive load on outputs 15 Unit MHz % ns ns ns ns ns pF Note: Option to change data out clock edge from falling edge (default) to rising edge, by setting configuration bit. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 39 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 4.5.2.2 SDIO Switching Characteristics - High Rate Specification is over recommended operating conditions. Parameters are for maximum clock frequency. Figure 4-4 SDIO HS input timing Figure 4-5 SDIO HS output timing Parameter fclock DC tTLH tTHL tISU tIH tODLY CI Table 4-3 SDIO Switching Characteristics – High Rate Min Max Clock frequency, CLK 0 50 Low/high duty cycle 40% 60% Rise time, CLK 3 Fall time, CLK 3 Setup time, input valid before CLK ↑ 3 Hold time, input valid after CLK ↑ 2 Delay time, CLK ↓ to output valid 2.5 14 Capacitive load on outputs 10 SAW IT Please read Cautions and warnings and Important notes at the end of this document. Unit MHz ns ns ns ns ns pF 2014-09-25 Page 40 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 4.5.3 B30931D7020Y918 R078 (WL1837) / D7020 BT Codec/PCM (audio) timing specifications Figure 4-6 PCM Interface Timing Table 4-5 PCM Master Symbol Parameter Min tclk Cycle time 166.67 (6.144 MHz) tw High or low pulse width 35% of Tclk min tis AUD_IN setup time 10.6 tih AUD_IN hold time 0 top AUD_OUT propagation time 0 top AUD_FSYNC_OUT propagation time 0 CI Capacitive loading on outputs Max 15625 (64 kHz) Unit ns 15 15 40 pF Table 4-6 PCM Slave Symbol Parameter Min Max tclk Cycle time 81 (12.288Hz)) tw High or low pulse width 35% of Tclk min tis AUD_IN setup time 5 tih AUD_IN hold time 0 tis AUD_FSYNC setup time 5 tih AUD_FSYNC hold time 0 top AUD_OUT propagation time 0 19 CI Capacitive loading on outputs 40 SAW IT Please read Cautions and warnings and Important notes at the end of this document. Unit ns pF 2014-09-25 Page 41 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 4.6 B30931D7020Y918 R078 (WL1837) / D7020 Package Mechanical Drawing Land Grid Array (LGA) Module SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 42 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 4.7 B30931D7020Y918 R078 (WL1837) / D7020 Schematic SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 43 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 5 Lead-free Product Status All Epcos modules in mass production are lead-free. This is achieved by using only materials with lead contamination below 1000 ppm. The applied lead-free solder alloy is the main source of Pb-contamination, which together gives Pb-levels much below 50 ppm per module. A comprehensive qualification for these lead-free module packages has been done. The related AQTP documentation is available from Epcos on request. SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 44 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 6 Recommended Reflow Profile Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Range 3°C/second max. Preheat: -Temperature Min (Tsmin) -Temperature Max (Tsmax) -Time (tsmin to tsmax) 150°C 200°C 60-120 seconds Time maintained above: -Temperature (TL) -Time (tL) 217°C 60-150 seconds Peak Temperature (Tp) Time within 5°C of actual Peak Temperature (Tp) Ramp-Down Rate Time 25°C to Peak Temperature SAW IT Please read Cautions and warnings and Important notes at the end of this document. 245-250°C 20-40 seconds 6°C/second max. 8 minutes max. 2014-09-25 Page 45 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 7 Packing Information 7.1.1 Packaging flow SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 46 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 7.1.2 Outer Box 7.1.3 Inner Box SAW IT Please read Cautions and warnings and Important notes at the end of this document. B30931D7020Y918 R078 (WL1837) / D7020 2014-09-25 Page 47 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module 7.1.4 B30931D7020Y918 R078 (WL1837) / D7020 Tape drawing SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 48 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 8 Revision History Version Date Status Note 0.1 7.1.2013 Preliminary Initial 0.2 18.2.2013 Preliminary Update from TI - FM support removed 0.3 18.4.2013 Preliminary Update from TI - 5GHz WLAN RX MIMO support removed 0.3b 11.6.2013 Preliminary LTE co-existence removed 9.10.2013 Preliminary 4.2.1.1 remove MIMO description adding ANT2 description remove MCS8,15,32 change spec for 1Mbps change spec for 54Mbps change spec for MCS7 4.2.1.3 remove MIMO description remove MCS8,15,32 change spec for all rate 4.2.2.1 remove MCS8,15,32 4.2.2.3 remove MCS32 adding Notes 4.6 update Package Mechanical Drawing 18.10.2013 Preliminary Removed ANT function Removed 802. 11d,e,h,k,r function Removed Cisco support Removed 802.11v support 4.2.1.1 removed 11Mbps,6Mpbs,MCS0 4.2.1.3 spec update 4.2.1.5 removed inactive current and update 4.2.2.1 removed 6Mpbs,MCS0 4.2.2.3 spec update 4.2.2.5 Current Consumption spec update 25.10.2013 Preliminary 4.6 07.03.2014 Preliminary Updated 3.2.4.2 WLAN Power Up Sequence Updated Table 3-3 WLAN_IRQ (IRQ_WL) Updated 4.1.2 DC supply range Ambient operating temperature 30.5.2014 Preliminary Removed 11n BW40MHz function Removed BLE function Removed external Xtal option Updated operation condition (3.4 to 4.3V / -15 to +55degree C) Updated all RF performance table Updated tape drawing 0.4 0.5 0.6 0.7 0.8 update Package Mechanical Drawing SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 49 of 51 Complementary wireless module WLAN / BT Standard Laminate SiP Module B30931D7020Y918 R078 (WL1837) / D7020 Version Date Status Note 1.0 3.6.2014 Official Release Updated 11n BW40MHz function Updated BLE function Updated external Xtal option 1.1 3.9.2014 Official Release Changed 4.1.1 Absolute Maximum Ratings Operating ambient temperature range : -15 to +55 °C Changed the template of the data sheet Updated operation temperature range : -30 to +85℃ 1.2 25.9.2014 Official Release Updated 4.2.1.3 WLAN 2.4 GHz Transmitter power (1Mbps and 11Mbps) Updated 4.2.2.3 WLAN 5 GHz Transmitter power (MCS7) Display of ordering codes for EPCOS products The ordering code for one and the same EPCOS product can be represented differently in data sheets, data books, other publications, on the EPCOS website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.epcos.com/orderingcodes SAW IT Please read Cautions and warnings and Important notes at the end of this document. 2014-09-25 Page 50 of 51 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the ―General Terms of Delivery for Products and Services in the Electrical Industry‖ published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, Alu-X, CeraDiode, CeraLink, CeraPlas, CSMP, CSSP, CTVS, DeltaCap, DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PQSine, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, TFAP, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. Page 51 of 51