Datasheet Voltage Detector IC Series Counter Timer Built-in CMOS Voltage Detector IC BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series Key Specifications Detection voltage: ●General Description ROHM’s BU45xxxxx and BU46xxxxx series are highly accurate, low current consumption voltage detector IC series. Because the counter timer delay circuit is built-in, an external capacitor for the delay time setting is unnecessary. Two output types are available (Nch open drain and CMOS output) and detection voltages range from 2.3V to 4.8V in increments of 0.1V with fixed delay time of 200ms and 400ms, that may be selected according to application. ●Features Counter Timer Built-in No delay time setting capacitor required Low current consumption Two output types (Nch open drain and CMOS output) Package SSOP3 is similar to SOT-23-3 (JEDEC) 2.3V to 4.8V (Typ.) 0.1V steps High accuracy detection voltage: ±1.0% Low current consumption: 2.3µA (Typ.) Operating temperature range: -40°C to +105°C Two internal, fixed delay time: 200ms 400ms ●Package SSOP3 2.92mm x 2.80mm x 1.25mm ●Applications Circuits using microcontrollers or logic circuits that require a reset ●Typical Application Circuit V DD1 V DD1 V DD2 RL BU45 x x x xx R ST Micro controller BD46 xx x xx R ST CL CL （Noise-filtering Capacitor） （Noise-filtering Capacitor） GND Micro controller GND （Open Drain Output Type） BU45xxxxx series （CMOS Output Type） BU46xxxxx series ●Pin Descriptions ●Connection Diagram BU45KxxxG / BU46KxxxG SSOP3 GND VDD 3 3 GND 2 VOUT BU45Kxxx xxxG xxx BU46Kxxx xxxG xxx Symbol Function 1 GND GND 2 VOUT Reset Output 3 VDD Power Supply Voltage BU45LxxxG / BU46LxxxG TOP VIEW 1 PIN No. 1 2 VOUT VDD BU45Lxxx xxxG xxx BU46Lxxx xxxG xxx PIN No. Symbol Function 1 VOUT Reset Output 2 VDD Power Supply Voltage 3 GND GND ○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 1/14 TSZ02201-0R7R0G300130-1-2 17.May.2013 Rev.003 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series ●Ordering Information B U Part Number x x Output Type 45 : Open Drain 46 : CMOS x x Package 1 x Reset Voltage Value 23 : 2.3V 0.1V step 48 : 4.8V x x - Counter Timer Package 2 Delay Time Settings 2 : 200ms 4 : 400ms T L Packaging and forming specification TL : Embossed tape and reel Package 1 Package 2 Package name K G SSOP3 (1pin GND) L G SSOP3 (3pin GND) ●Lineup Table 1. Open Drain Output Type Counter Timer Delay Time Settings 1-Pin GND 200ms Detection Part Marking Voltage Number BU45K482 4.8V bH BU45K472 4.7V bG BU45K462 4.6V bF BU45K452 4.5V bE BU45K442 4.4V bD BU45K432 4.3V bC BU45K422 4.2V bB BU45K412 4.1V bA BU45K402 4.0V aY BU45K392 3.9V aX BU45K382 3.8V aW BU45K372 3.7V aT BU45K362 3.6V aS BU45K352 3.5V aR BU45K342 3.4V aP BU45K332 3.3V aN BU45K322 3.2V aM BU45K312 3.1V aK BU45K302 3.0V aH BU45K292 2.9V aG BU45K282 2.8V aF BU45K272 2.7V aE BU45K262 2.6V aD BU45K252 2.5V aC BU45K242 2.4V aB BU45K232 2.3V aA 3-Pin GND 400ms Marking eF eE eD eC eB eA dY dX dW dT dS dR dP dN dM dK dH dG dF dE dD dC dB dA cY cX 200ms Part Number BU45K484 BU45K474 BU45K464 BU45K454 BU45K444 BU45K434 BU45K424 BU45K414 BU45K404 BU45K394 BU45K384 BU45K374 BU45K364 BU45K354 BU45K344 BU45K334 BU45K324 BU45K314 BU45K304 BU45K294 BU45K284 BU45K274 BU45K264 BU45K254 BU45K244 BU45K234 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/14 Marking hD hC hB hA gY gX gW gT gS gR gP gN gM gK gH gG gF gE gD gC gB gA fY fX fW fT 400ms Part Number BU45L482 BU45L472 BU45L462 BU45L452 BU45L442 BU45L432 BU45L422 BU45L412 BU45L402 BU45L392 BU45L382 BU45L372 BU45L362 BU45L352 BU45L342 BU45L332 BU45L322 BU45L312 BU45L302 BU45L292 BU45L282 BU45L272 BU45L262 BU45L252 BU45L242 BU45L232 Marking nB nA mY mX mW mT mS mR mP mN mM mK mH mG mF mE mD mC mB mA kY kX kW kT kS kR Part Number BU45L484 BU45L474 BU45L464 BU45L454 BU45L444 BU45L434 BU45L424 BU45L414 BU45L404 BU45L394 BU45L384 BU45L374 BU45L364 BU45L354 BU45L344 BU45L334 BU45L324 BU45L314 BU45L304 BU45L294 BU45L284 BU45L274 BU45L264 BU45L254 BU45L244 BU45L234 TSZ02201-0R7R0G300130-1-2 17.May.2013 Rev.003 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series ●Lineup - Continued Table 2. CMOS Output Type Counter Timer Delay Time Settings 1-Pin GND 200ms Detection Part Marking Voltage Number BU46K482 4.8V cW BU46K472 4.7V cT BU46K462 4.6V cS BU46K452 4.5V cR BU46K442 4.4V cP BU46K432 4.3V cN BU46K422 4.2V cM BU46K412 4.1V cK BU46K402 4.0V cH BU46K392 3.9V cG BU46K382 3.8V cF BU46K372 3.7V cE BU46K362 3.6V cD BU46K352 3.5V cC BU46K342 3.4V cB BU46K332 3.3V cA BU46K322 3.2V bY BU46K312 3.1V bX BU46K302 3.0V bW BU46K292 2.9V bT BU46K282 2.8V bS BU46K272 2.7V bR BU46K262 2.6V bP BU46K252 2.5V bN BU46K242 2.4V bM BU46K232 2.3V bK 3-Pin GND 400ms Marking fS fR fP fN fM fK fH fG fF fE fD fC fB fA eY eX eW eT eS eR eP eN eM eK eH eG Part Number BU46K484 BU46K474 BU46K464 BU46K454 BU46K444 BU46K434 BU46K424 BU46K414 BU46K404 BU46K394 BU46K384 BU46K374 BU46K364 BU46K354 BU46K344 BU46K334 BU46K324 BU46K314 BU46K304 BU46K294 BU46K284 BU46K274 BU46K264 BU46K254 BU46K244 BU46K234 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/14 200ms Marking kP kN kM kK kH kG kF kE kD kC kB kA hY hX hW hT hS hR hP hN hM hK hH hG hF hE 400ms Part Number BU46L482 BU46L472 BU46L462 BU46L452 BU46L442 BU46L432 BU46L422 BU46L412 BU46L402 BU46L392 BU46L382 BU46L372 BU46L362 BU46L352 BU46L342 BU46L332 BU46L322 BU46L312 BU46L302 BU46L292 BU46L282 BU46L272 BU46L262 BU46L252 BU46L242 BU46L232 Marking pM pK pH pG pF pE pD pC pB pA nY nX nW nT nS nR nP nN nM nK nH nG nF nE nD nC Part Number BU46L484 BU46L474 BU46L464 BU46L454 BU46L444 BU46L434 BU46L424 BU46L414 BU46L404 BU46L394 BU46L384 BU46L374 BU46L364 BU45L354 BU46L344 BU46L334 BU46L324 BU46L314 BU46L304 BU46L294 BU46L284 BU46L274 BU46L264 BU46L254 BU46L244 BU46L234 TSZ02201-0R7R0G300130-1-2 17.May.2013 Rev.003 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series Absolute maximum ratings (Ta=25°C) Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output Output Current *1 *2 Power Dissipation Operating Temperature Ambient Storage Temperature Symbol VDD-GND VOUT Io Pd Topr Tstg Limit -0.3 to +6.0 GND-0.3 to +6.0 GND-0.3 to VDD+0.3 70 700 -40 to +105 -55 to +125 Unit V V mA mW °C °C *1 Use above Ta=25°C results in a 7.0mW loss per degree. *2 When mounted on ROHM standard circuit board (70mmx70mmx1.6mm, glass epoxy board). ●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) Parameter Operating Voltage Range Symbol VOPL Condition VOL≤0.4V, RL=470kΩ, Ta=25~105°C VOL≤0.4V, RL=470kΩ, Ta=-40~25°C *1 VDD=H L, RL=470kΩ Ta=25°C VDET=2.5V Ta=-40°C to 85°C Ta=85°C to 105°C Ta=25°C VDET=3.0V Ta=-40°C to 85°C Ta=85°C to 105°C Detection Voltage VDET Ta=25°C VDET=3.3V Ta=-40°C to 85°C Ta=85°C to 105°C Ta=25°C VDET=4.2V Ta=-40°C to 85°C Ta=85°C to 105°C Ta=25°C VDET=4.8V Ta=-40°C to 85°C Ta=85°C to 105°C Detection Voltage Temperature coefficient VDET/∆T -40°C~105°C Min. 0.6 0.9 VDET(T) ×0.99 2.475 2.418 2.404 2.970 2.901 2.885 3.267 3.191 3.173 4.158 4.061 4.039 4.752 4.641 4.616 - ‘High’ Output Delay time tPLH Circuit Current when ON Circuit Current when OFF IDD1 IDD2 VDET(T) ×0.03 120 Ta=25°C 95 Ta=-40°C to 85°C BU4XXXX2G CL=100pF, 85 Ta=85°C to 105°C RL=100kΩ *1,*2,* 3 240 Ta=25°C 190 BU4XXXX4G Ta=-40°C to 85°C 170 Ta=85°C to 105°C 0.60 VDD=VDET-0.2V, VDET=2.3V~4.8V 1.10 VDD=VDET+1.0V, VDET=2.3V~4.8V ‘High’ Output Voltage (Pch) VOH VDD=5.0V, ISOURCE= 6.8mA, VDET(4.3V to 4.8V) ‘Low’Output Voltage (Nch) VOL Hysteresis Voltage Leak Current when OFF ∆VDET Ileak VDD＝L H L, RL=470kΩ Limit Typ. - Unit 2.5 3.0 3.3 4.2 4.8 - Max. 6.0 6.0 VDET(T) ×1.01 2.525 2.584 2.597 3.030 3.100 3.117 3.333 3.410 3.428 4.242 4.341 4.364 4.848 4.961 4.987 ±50 ±360 VDET(T) ×0.05 200 400 2.30 2.80 VDET(T) ×0.08 280 460 235 560 920 470 7.00 8.00 ms - V VDET(T) VDD-0.5 V V ppm/°C V µA µA VDD=1.2V, ISINK = 2.0mA - - 0.3 V VDD=2.4V, ISINK = 8.5mA, VDET(2.7V to 4.8V) - - 0.3 V - - 1.0 µA *1 VDD=VDS=6.0V VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step) RL :Pull-up resistor to be connected between VOUT and power supply. CL :Capacitor to be connected between VOUT and GND. *1 Guarantee is Ta=25°C. *2 tPLH:VDD=(VDET(T)-0.5V) (VDET(T)+0.5V) *3 tPLH:VDD=Please set up the rise up time between VDD=VOPL VDET more than 10µs. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/14 TSZ02201-0R7R0G300130-1-2 17.May.2013 Rev.003 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series ●Block Diagrams VDD Oscillator VOUT Circuit Counter Timer Vref GND Fig.1 BU45xxxxx Series VDD Oscillator Circuit Counter Timer Vref VOUT GND Fig.2 BU46xxxxx Series www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/14 TSZ02201-0R7R0G300130-1-2 17.May.2013 Rev.003 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series ●Typical Performance Curves 16 6 CIRCUIT CURRENT:IDD[µA] 5 【BU45K232G】 "LOW" OUTPUT CURRENT:IOL[mA] Ta=-40°C Ta=105°C 4 3 2 Ta=25°C Ta=-40°C 1 14 【BU45K232G】 12 10 8 Ta=25°C 6 Ta=105°C 4 2 0 0 0 1 2 3 4 5 6 0 7 2 3 4 5 6 VDD SUPPLY VOLTAGE:VDD[V] DRAIN-SOURCE VOLTAGE:VDS[V] Fig.3 Circuit Current Fig.4 “Low” Output Current VDD=1.2V 50 7 8 【BU45K232G】 【BU46K232G】 40 OUTPUT VOLTAGE:VOUT[V] 7 "HIGH" OUTPUT CURRENT:IOH(mA) 1 Ta=-40°C 30 Ta=25°C 20 Ta=105°C 10 Ta=25°C 6 Ta=-40°C 5 Ta=105°C 4 3 2 1 0 0 0 1 2 3 4 0 5 2 3 4 5 6 DRAIN-SOURCE VOLTAGE:VDS[V] VDD SUPPLY VOLTAGE:VDD [V] Fig.5 “HIGH” Output Current VDD=6V Fig.6 I/O Characteristics www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 1 6/14 7 TSZ02201-0R7R0G300130-1-2 17.May.2013 Rev.003 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series ●Typical Performance Curves - Continued 3.0 2.6 CIRCUIT CURRENT WHEN ON : IDD1 [µA] DETECTION VOLTAGE:VOUT[V] [BU45K232G] 2.5 Low to high(V DET +∆V DET ) 2.4 2.3 High to low(V DET ) 2.2 2.1 2.8 【BU45K232G】 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 -40 -20 0 20 40 60 80 100 -40 -20 TEMPERATURE:Ta[°C] 20 40 60 80 100 TEMPERATURE:Ta[°C] Fig.8 Circuit Current when ON (VDD=VDET-0.2V) VDD=2.1V Fig.7 Detection Voltage Release Voltage 0.6 3.5 【BU45K232G】 3.3 MINIMUM OPERATING VOLTAGE:V OPL [V] CIRCUIT CURRENT WHEN OFF:I DD 2 [uA] 0 3.1 2.9 2.7 2.5 2.3 2.1 1.9 1.7 1.5 【BU45K232G】 0.5 0.4 0.3 0.2 0.1 0 -40 -20 0 20 40 60 80 100 TEMPERATURE:Ta[°C] -20 0 20 40 60 80 100 TEMPERATURE:Ta[°C] Fig.10 Operating Limit Voltage Fig.9 Circuit Current when OFF (VDD=VDET+1V) VDD=3.3V www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 -40 7/14 TSZ02201-0R7R0G300130-1-2 17.May.2013 Rev.003 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series ●Typical Performance Curves - Continued 300 3 【BU45K232G】 【BU45K232G】 260 "LOW" DELAY TIME:TPHL[µs] "HIGH" DELAY TIME:TPLH [ms] 280 240 220 200 180 160 140 120 100 2 1 0 -40 -20 0 20 40 60 80 100 -20 0 20 40 60 TEMPERATURE:Ta[°C] TEMPERATURE:Ta[°C] Fig.11 Output Delay Time “Low” ”High” Fig.12 Output Delay Time “High” ”Low” www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 -40 8/14 80 100 TSZ02201-0R7R0G300130-1-2 17.May.2013 Rev.003 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series ●Application Information Explanation of Operation For both the open drain type (Fig.13) and the CMOS output type (Fig.14), the detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BU45xxxxx series uses an open drain output type, it is necessary to connect a pull-up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD VDD R1 R1 Vref Q2 Vref Reset VOUT Oscillator Oscillator Circuit Counter R2 R2 Timer Reset Circuit Counter Timer Q1 R3 Q1 R3 GND VOUT GND Fig.13 (BU45xxxxx Type Internal Block Diagram) Fig.14 (BU46xxxxx Type Internal Block Diagram) Reference Data Examples of Leading (tPLH) and Falling (tPHL) Output tPLH[ms] 208 208 VDD=1.8V 2.8V Part Number BU45K232G BU46K232G tPHL[µs] 1.4 1.4 VDD=2.8V 1.8V *This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. Timing Waveform Example: The following shows the relationship between the input voltages VDD and the output voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (the circuits are those in Fig. 13 and 14). 1 VDD VDD VDET+ΔVDET VDET 0V VOPL ⑤ VOH tPLH tPLH VOUT tPHL VOL tPHL ① ② ③ Fig.15 ④ Timing Waveform When the power supply is turned on, the output is unstable from after over the operating limit voltage (VOPL) until tPHL. Therefore it is possible that the reset signal is not outputted when the rise time of VDD is faster than tPHL. 2 When V DD is greater than VOPL but less than the reset release voltage (VDET + ∆VDET), the output voltages will switch to Low. 3 If V DD exceeds the reset release voltage (VDET + ∆VDET), the counter timer start and VOUT switches from L to H. 4 If V DD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power supply fluctuation, VOUT switches to L (with a delay of tPHL). 5 The potential difference between the detection voltage and the release voltage is known as the hysteresis width (∆VDET). The system is designed such that the output does not toggle with power supply fluctuations within this hysteresis width, thus, preventing malfunctions due to noise. Timing may change depending on application and use. Please verify and confirm using practical applications. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/14 TSZ02201-0R7R0G300130-1-2 17.May.2013 Rev.003 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series ●Circuit Applications 1. Examples of a common power supply detection reset circuit. VDD1 Application examples of BU45xxxxx series (Open Drain output type) and BU46xxxxx series (CMOS output type) are shown below. VDD2 RL BU45xxxxx RST Micro controller CASE1: Power supply of microcontroller (VDD2) differs from the power supply of the reset detection (VDD1). Use an open drain output Type (BU45xxxxx series) device with a load resistance RL as shown Fig.16. CL （Noise-filtering Capacitor） GND Fig.16 Open Drain Output Type CASE2: Power supply of the microcontroller (VDD1) is same as the power supply of the reset detection (VDD1). Use a CMOS output type (BU46xxxxx) device or an open drain output type (BU45xxxxx) with pull up resistor between the output and VDD1. (As shown Fig.17) VDD1 BU46xxxxx RST Micro controller When a capacitance CL for noise filtering is connected to the VOUT pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (VOUT). CL （Noise-filtering Capacitor） GND Fig.17 CMOS Output Type 2. The following is an example of a circuit application in which an OR connection between two types of detection voltage resets the microcontroller. VDD1 VDD2 VDD3 RL BU45xxxxx BU45xxxxx RST Micro controller GND Fig. 18 To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain output type (BU45xxxxx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller (VDD3) as shown in Fig. 18. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/14 TSZ02201-0R7R0G300130-1-2 17.May.2013 Rev.003 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series Examples of the power supply with resistor dividers. In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow may cause malfunction in the systems operation such as output oscillations, etc. V1 R2 I1 VDD BU45xxxxx BU46xxxxx R1 CIN VOUT CL GND Fig. 19 When an in-rush current (I1) flows into the circuit (Refer to Fig. 19) at the time when output switches from “Low” to “High”, a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low” condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to oscillation. IDD In-rush Current 0 VDD VDET Fig. 20 Current Consumption vs. Power Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/14 TSZ02201-0R7R0G300130-1-2 17.May.2013 Rev.003 Datasheet BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series ●Operational Notes 1) Absolute Maximum Ratings Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. 2) GND Voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 3) Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 4) Bypass Capacitor for Noise Rejection To help reject noise, put a 1uF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND. Be careful when using extremely big capacitor as transient response will be affected. 5) Short Between Pins and Mounting Errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 6) Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 7) The VDD line impedance might cause oscillation because of the detection current. 8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 9) A VDD lower than the mininum input voltage puts the VOUT in high impedance state. VOUT must be pulled up to VDD. 10) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak resistance. 11) External parameters The recommended parameter range for RL is 50kΩ to 470kΩ. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 12) Power on reset operation Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation. 13) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 14) Rush current When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to the parasitic capacitance of internal logic may be unstable. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/14 TSZ02201-0R7R0G300130-1-2 17.May.2013 Rev.003 BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series Datasheet ●Physical Dimension, Tape and Reel Information Package Name SSOP3F www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/14 TSZ02201-0R7R0G300130-1-2 17.May.2013 Rev.003 BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series Datasheet ●Revision History Date Revision 24.Jan.2013 13.Feb.2013 001 002 17.May.2013 003 Changes New Release Change max limit of IDD1 and IDD2. Change max limit of IDD1 and IDD2. Change min and max limits of TPLH. Add rows to the table of Electrical Characteristics. Change max limit of Leak Current when OFF Modify the sentence structure in General Description and Operational Notes. Change limits for VDET at VDET=2.5V,3.0V,3.3V,4.2V,4.8V www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/14 TSZ02201-0R7R0G300130-1-2 17.May.2013 Rev.003 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. ●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. ●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. ●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. ●Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. ●Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet ●Other Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved.