Datasheet Voltage Detector IC Series Low Voltage Free Delay Time Setting CMOS Voltage Detector IC Series BU42xx series BU43xx series ●General Description ROHM’s BU42xx and BU43xx series are CMOS Voltage Detector ICs with adjustable output delay. It is a high-accuracy, low current consumption Voltage Detector IC series with a built-in delay circuit. The lineup was established with two output types (Nch open drain and CMOS output) and detection voltages range from 0.9V to 4.8V in increments of 0.1V, so that the series may be selected according to application. ●Features Delay Time Controlled by external Capacitor Two output types (Nch open drain and CMOS output) Ultra-low current consumption Wide operating temperature range Very small and low height package Package SSOP5 and SOP4 is similar to SOT-23-5 and SC-82 respectively (JEDEC) ●Key Specifications Detection voltage: 0.9V to 4.8V (Typ.) 0.1V steps High accuracy detection voltage: ±1.0% Ultra-low current consumption: 0.55µA (Typ.) Operating temperature range: -40°C to +125°C ●Package SSOP5: 2.90mm x 2.80mm x 1.25mm SOP4: 2.00mm x 2.10mm x 0.95mm VSOF5: 1.60mm x 1.60mm x 0.60mm ●Applications Circuits using microcontrollers or logic circuits that require a reset. ●Typical Application Circuit VDD1 VDD1 VDD2 RL RST BU42xx CIN CT CIN RST BU43xx Micro controller CT CL CL (Capacitor for noise filtering) (Capacitor for noise filtering) GND Open Drain Output type BU42xx series ●Connection Diagram & Pin Descriptions SSOP5 SOP4 N.C. CT TOP VIEW TOP VIEW VOUT 3 GND GND 4 N.C. Unconnected terminal 5 CT Capacitor connection terminal for output delay time CMOS Output type BU43xx series VOUT 4 VSOF5 TOP VIEW CT 3 Lot. No 1 GND VDD GND PIN Symbol Function No. 1 VOUT Reset output 2 VDD Power supply voltage GND Marking Lot. No Marking Micro controller 4 VOUT Marking 1 2 3 VOUT SUB CT 2 VDD PIN Symbol Function No. 1 GND GND 2 VDD Power supply voltage Capacitor connection 3 CT terminal for output delay time Reset output GND VDD 4 5 Lot. No PIN Symbol Function No. 1 VOUT Reset output 2 SUB Substrate* Capacitor connection 3 CT terminal for output delay time 4 VDD Power supply voltage 5 GND GND *Connect the substrate to VDD ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed for protection against radioactive rays 1/13 TSZ02201-0R7R0G300050-1-2 2.Aug.2013 Rev.007 BU42xx series Datasheet BU43xx series ●Ordering Information B U x Part Number x x Output Type 42 : Open Drain 43 : CMOS x x Reset Voltage Value 09 : 0.9V 0.1V step 48 : 4.8V - T Package G : SSOP5 F : SOP4 FVE : VSOF5 R Packaging and forming specification TR : Embossed tape and reel SSOP5 5 4 1 2 0.2Min. +0.2 1.6 −0.1 2.8±0.2 <Tape and Reel information> +6° 4° −4° 2.9±0.2 3 Tape Embossed carrier tape Quantity 3000pcs TR Direction of feed The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin +0.05 0.42 −0.04 0.05±0.05 1.1±0.05 1.25Max. +0.05 0.13 −0.03 0.95 0.1 Direction of feed Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. VSOF5 +6° 4° –4° 0.9±0.05 2.1±0.2 1 2 0.05 1.2 ± 0.05 5 +0.05 0.13 –0.03 4 (MAX 1.28 include BURR) 3 1.6 ± 0.05 1.3 4 0.2MAX 1.6±0.05 1.0±0.05 2.0±0.2 0.27±0.15 +0.2 1.25 –0.1 SOP4 1 2 3 S 0.13±0.05 +0.05 0.42 –0.04 0.1 0.6MAX 0.05±0.05 1.05Max. ) S +0.05 0.32 –0.04 0.5 (Unit : mm) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0.22±0.05 (Unit : mm) 2/13 TSZ02201-0R7R0G300050-1-2 2.Aug.2013 Rev.007 BU42xx series Datasheet BU43xx series ●Lineup Output Type Open Drain Detection Voltage Marking Part Number CMOS Marking Part Number 4.8V ZR BU4248 1H BU4348 4.7V ZQ BU4247 1G BU4347 4.6V ZP BU4246 1F BU4346 4.5V ZN BU4245 1E BU4345 4.4V ZM BU4244 1D BU4344 4.3V ZL BU4243 1C BU4343 4.2V ZK BU4242 1B BU4342 4.1V ZJ BU4241 1A BU4341 4.0V ZH BU4240 0Z BU4340 3.9V ZG BU4239 0Y BU4339 3.8V ZF BU4238 0X BU4338 3.7V ZE BU4237 0W BU4337 3.6V ZD BU4236 0V BU4336 3.5V ZC BU4235 0U BU4335 3.4V ZB BU4234 0T BU4334 3.3V ZA BU4233 0S BU4333 3.2V YZ BU4232 0R BU4332 3.1V YY BU4231 0Q BU4331 3.0V YX BU4230 0P BU4330 2.9V YW BU4229 0N BU4329 2.8V YV BU4228 0M BU4328 2.7V YU BU4227 0L BU4327 2.6V YT BU4226 0K BU4326 2.5V YS BU4225 0J BU4325 2.4V YR BU4224 0H BU4324 2.3V YQ BU4223 0G BU4323 2.2V YP BU4222 0F BU4322 2.1V YN BU4221 0E BU4321 2.0V YM BU4220 0D BU4320 1.9V YL BU4219 0C BU4319 1.8V YK BU4218 0B BU4318 1.7V YJ BU4217 0A BU4317 1.6V YH BU4216 ZZ BU4316 1.5V YG BU4215 ZY BU4315 1.4V YF BU4214 ZX BU4314 1.3V YE BU4213 ZW BU4313 1.2V YD BU4212 ZV BU4312 1.1V YC BU4211 ZU BU4311 1.0V YB BU4210 ZT BU4310 0.9V YA BU4209 ZS BU4309 www.rohm.com © 2013 ROHM Co., Ltd. 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TSZ22111・15・001 3/13 TSZ02201-0R7R0G300050-1-2 2.Aug.2013 Rev.007 BU42xx series Datasheet BU43xx series ●Absolute Maximum Ratings Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output Output Current *1*4 SSOP5(SOT-23-5) Power *2*4 SOP4(SC-82) Dissipation *3*4 VSOF5 Operation Temperature Range Ambient Storage Temperature Symbol VDD VOUT Io Pd Limit -0.3 to +7 GND-0.3 to +7 GND-0.3 to VDD+0.3 70 540 400 210 Unit V -40 to +125 -55 to +125 °C °C Topt Tstg V mA mW *1 Reduced by 5.4mW/°C when used over 25°C. *2 Reduced by 4.0mW/°C when used over 25°C. *3 Reduced by 2.1mW/°C when used over 25°C. *4 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board). ●Electrical Characteristics (Unless Otherwise Specified Ta=-25 to 125°C) Parameter Symbol Condition VDET(T) VDET(T) ×1.01 VDET=1.8V Ta=+25°C Ta=-40°C to 85°C Ta=85°C to 125°C 1.782 1.741 1.731 1.8 - 1.818 1.860 1.870 VDET=2.5V Ta=+25°C Ta=-40°C to 85°C Ta=85°C to 125°C VDET=3.0V Ta=+25°C Ta=-40°C to 85°C Ta=85°C to 125°C VDET=3.3V Ta=+25°C Ta=-40°C to 85°C Ta=85°C to 125°C 2.475 2.418 2.404 2.970 2.901 2.885 3.267 3.191 3.173 4.158 4.061 4.039 0.70 0.90 VDD-0.5 VDD-0.5 - 2.5 3.0 3.3 4.2 0.15 0.20 0.25 0.30 0.35 0.40 0.30 0.35 0.40 0.45 0.50 0.55 - 2.525 2.584 2.597 3.030 3.100 3.117 3.333 3.410 3.428 4.242 4.341 4.364 0.88 1.05 1.23 1.40 1.58 1.75 1.40 1.58 1.75 1.93 2.10 2.28 0.05 0.5 0.5 VDET Ta=+25°C Ta=-40°C to 85°C Ta=85°C to 125°C VDET =0.9 to 1.3V VDET =1.4 TO 2.1V VDET =2.2 TO 2.7V Circuit Current when ON IDD1 VDD=VDET-0.2V VDET =2.8 to 3.3V VDET =3.4 to 4.2V VDET =4.3 to 4.8V VDET =0.9 TO 1.3V VDET =1.4 TO 2.1V VDET =2.2 to 2.7V Circuit Current when OFF IDD2 VDD=VDET+2.0V VDET =2.8 to 3.3V VDET =3.4 to 4.2V VDET =4.3 to 4.8V VOL≤0.4V, Ta=25 to 125°C, RL=470kΩ Operating Voltage Range VOPL VOL≤0.4V, Ta=-40 to 25°C, RL=470kΩ VDD=4.8V, ISOURCE=1.7 mA,VDET=0.9V to 3.9V ‘High’ Output Voltage (Pch) VOH VDD=6.0V, ISOURCE=2.0 mA,VDET=4.0V to 4.8V VDD=0.85V, ISINK = 20 µA ‘Low’ Output Voltage (Nch) VOL VDD=1.5V, ISINK = 1 mA, VDET=1.7 to 4.8V VDD=2.4V, ISINK = 3.6 mA, VDET=2.7 to 4.8V *1: Design Guarantee. (Outgoing inspection is not done on all products.) VDET(T) : Standard Detection Voltage (0.9V to 4.8V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. VDET=4.2V www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Max. VDET(T) ×0.99 VDD=HÆL, Ta=25°C, RL=470kΩ Detection Voltage Min. Limit Typ. 4/13 Unit V µA µA V V V V V TSZ02201-0R7R0G300050-1-2 2.Aug.2013 Rev.007 BU42xx series Datasheet BU43xx series ●Electrical Characteristics (Unless Otherwise Specified Ta=-25 to 125°C) - continued Parameter Symbol Leak Current when OFF Ileak CT pin Threshold Voltage VCTH Output Delay Resistance RCT CT pin Output Current ICT Detection Voltage Temperature coefficient Hysteresis Voltage Min. VDD ×0.35 VDD ×0.40 9 5 200 Limit Typ. 0 0 VDD ×0.45 VDD ×0.50 10 40 400 Max. 0.1 1 VDD ×0.55 VDD ×0.60 11 - - ±30 - VDET≤1.0V VDET ×0.03 VDET ×0.05 VDET ×0.08 VDET≥1.1V VDET ×0.03 VDET ×0.05 VDET ×0.07 Condition VDD=VDS=7V Ta=-40 to 85°C VDD=VDS=7V Ta=85 to 125°C VDD=VDET×1.1, VDET=0.9 to 2.5V Ta=25°C RL=470kΩ VDD=VDET×1.1, VDET=2.6 to 4.8V Ta=25°C RL=470kΩ *1 VDD=VDET×1.1 VCT=0.5V Ta=25°C VCT=0.1V VDD=0.85V VCT=0.5V VDD=1.5V VDET=1.7 to 4.8V VDET/∆T Ta=-40°C to 125°C ∆VDET VDD=LÆHÆL Ta=-40 to 125°C RL=470kΩ Unit µA V MΩ µA ppm/°C V *1: Design Guarantee. (Outgoing inspection is not done on all products.) VDET(T) : Standard Detection Voltage (0.9V to 4.8V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/13 TSZ02201-0R7R0G300050-1-2 2.Aug.2013 Rev.007 BU42xx series Datasheet BU43xx series ●Block Diagrams VDD VOUT Vref CT GND Fig.1 BU42xx Series VDD VOUT Vref CT GND Fig.2 BU43xx www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/13 Series TSZ02201-0R7R0G300050-1-2 2.Aug.2013 Rev.007 BU42xx series Datasheet BU43xx series ●Typical Performance Curves "LOW" OUTPUT CURRENT ： IOL [mA] CIRCUIT CURRENT ： IDD [μA] 0.6 【BU4216】 【BU4316】 0.5 0.4 0.3 0.2 0.1 0.0 1 2 3 4 5 6 7 【BU4216】 【BU4216F】 【BU4316】 4 3 2 VDD =1.2V 1 0 0.0 0.5 1.0 1.5 2.0 2.5 VDD SUPPLY VOLTAGE ：VDD [V] DRAIN-SOURCE VOLTAGE ： VDS[V] Fig.3 Circuit Current Fig.4 “LOW” Output Current 25 7 【BU4318】 【BU4318G】 20 OUTPUT VOLTAGE ： VOUT [V] "HIGH" OUTPUT CURRENT ： IOH [mA] 0 5 VDD =6.0V 15 VDD =4.8V 10 5 0 BU4216F】 【 【BU4216】 【BU4316】 6 5 4 3 2 1 0 0 1 2 3 4 5 6 0 1 2 3 4 5 6 DRAIN-SOURCE VOLTAGE ： VDS[V] VDD SUPPLY VOLTAGE ：VDD [V] Fig.5 “High” Output Current Fig.6 I/O Characteristics www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/13 7 TSZ02201-0R7R0G300050-1-2 2.Aug.2013 Rev.007 BU42xx series Datasheet BU43xx series ●Typical Performance Curves – continued 700 0.8 【BU4216】 BU4216F】 【 【BU4316】 CT OUTPUT CURRENT ： ICT [μA] OUTPUT VOLTAGE ： VOUT [V] 1.0 0.6 0.4 0.2 0.0 0.0 1.0 1.5 2.0 400 300 200 100 2.5 0 0.5 1 1.5 2 2.5 VDD SUPPLY VOLTAGE ： VDD [V] VDD SUPPLY VOLTAGE ： VDD [V] Fig.7 Operating Limit Voltage Fig.8 CT Terminal Current CIRCUIT CURRENT WHEN ON ： IDD1 [μA] DETECTION VOLTAGE ： VDET[V] 500 0 0.5 2.0 Low to high(VDET+ΔVDET) 1.5 High to low(VDET) 【BU4216】 BU4216F】 【【BU4316】 1.0 -40 【BU4216】 【BU4216F】 【BU4316】 600 0 40 80 120 TEMPERATURE ： Ta[℃] 0.5 【BU4216】 【BU4216F】 【BU4316】 0.4 0.3 0.2 0.1 0.0 -40 0 40 80 120 TEMPERATURE ： Ta[℃] Fig.9 Detecting Voltage Release Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Fig.10 Circuit Current when ON 8/13 TSZ02201-0R7R0G300050-1-2 2.Aug.2013 Rev.007 BU42xx series Datasheet BU43xx series ●Typical Performance Curves – continued 1.0 MINIMUM OPERATING VOLTAGE ： V OPL[V] CIRCUIT CURRENT WHEN OFF ： IDD2 [μA] 1.0 【BU4216】 【BU4216F】 【BU4316】 0.8 0.6 0.4 0.2 0.0 -40 0 40 80 【BU4216】 【BU4216F】 【BU4316】 0.5 0.0 -40 120 0 TEMPERATURE ： Ta[℃] 80 120 TEMPERATURE ： Ta[℃] Fig.11 Circuit Current when OFF Fig.12 Operating Limit Voltage 18 10000 【BU4216F】 【BU4216】 【BU4316】 16 14 12 10 8 6 4 2 0 -40 BU4216F】 【【BU4216】 1000 DELAY TIME ： TPLH[ms] RESISTANCE OF CT ： RCT [MΩ] 40 【BU4316】 100 10 1 0.1 0.01 0.001 0 40 80 120 0.0001 0.01 0.1 CAPACITANCE OF CT ： CCT[μF] TEMPERATURE ： Ta[℃] Fig.13 CT Terminal Circuit Resistance www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0.001 Fig.14 Delay Time (tPLH) and CT Terminal External Capacitance 9/13 TSZ02201-0R7R0G300050-1-2 2.Aug.2013 Rev.007 BU42xx series Datasheet BU43xx series ●Application Information Explanation of Operation For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VouT terminal voltage switches from either “High” to “Low” or from “Low” to “High”. BU42xx and BU43xx series have delay time function which set tPLH (Output “Low”Æ”High”) using an external capacitor (CCT). Because the BU42xx series uses an open drain output type, it is necessary to connect a pull-up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD VDD Q2 R1 R1 RESET Vref VDD Vref RESET VOUT R2 R2 Q1 VOUT Q1 Q3 Q3 R3 R3 GND GND CT Fig.15 (BU42xx series Internal Block Diagram) CT Fig.16 (BU43xx type Internal Block Diagram) Setting of Detector Delay Time The delay time of this detector IC can be set at the rise of VDD by the capacitor connected to CT terminal. Delay time at the rise of VDD tPLH:Time until when VouT rises to 1/2 of VDD after VDD rises up and beyond the release voltage(VDET+∆VDET) TPLH=-1×CCT×RCT×ln CCT: RCT: VDD-VCTH VDD CT pin Externally Attached Capacitance CT pin Internal Impedance(P.3 RCT refer.) VCTH: ln: CT pin Threshold Voltage(P.3 VCTH refer.) Natural Logarithm Reference Data of Falling Time (tPHL) Output Examples of Falling Time (tPHL) Output Part Number tPHL [µs] BU4245 275.7 BU4345 359.3 * This data is for reference only. The figures will vary with the application, so please confirm the actual operating conditions before use. Timing Waveforms Example: The following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are shown in Fig.15 and 16). ① When the power supply is turned on, the output is unstable from after over the operating limit voltage (VOPL) until tPHL. Therefore, it is VDET+ΔVDET possible that the reset signal is not outputted when the rise time of ⑤ VDET VDD is faster than tPHL. VDD VOPL ② When VDD is greater than VOPL but less than the reset release 0V voltage (VDET+∆VDET), the CT terminal (VCT) and output (VOUT) voltages will switch to L. 1/2 VDD ③ If VDD exceeds the reset release voltage (VDET+VDET), then VOUT VCT switches from L to H (with a delay to the CT terminal). ④ If VDD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power supply fluctuation, tPLH tPHL tPLH VOUT switches to L (with a delay of tPHL). tPHL VOUT ⑤ The potential difference between the detection voltage and the release voltage is known as the hysteresis width (VDET). The system ① ② ③ ④ is designed such that the output does not toggle with power supply Fig.17 Timing Waveforms fluctuations within this hysteresis width, preventing malfunctions due to noise. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/13 TSZ02201-0R7R0G300050-1-2 2.Aug.2013 Rev.007 BU42xx series Datasheet BU43xx series ●Circuit Applications 1) Examples of common power supply detection reset circuits VDD1 VDD2 Application examples of BU42xx series (Open Drain output type) and BU43xx series (CMOS output type) are shown below. RL CASE1: Power supply of microcontroller (VDD2) differs from the power supply of the reset detection (VDD1). Use an open drain output Type (BU42xx series) device with a load resistance RL as shown Fig.18. Micro RST controller BU42xx CT CIN CL (Capacitor for noise filtering) GND Fig.18 Open Drain Output type VDD1 Micro RST controller BU43xx CIN CT CL CASE2: Power supply of microcontroller (VDD1) is the same as the power supply of the reset detection (VDD1). Use a CMOS output type (BU43xx series) device or an open drain output type (BU42xx series) device with a pull up resistor between the output and VDD1. When a capacitance CL for noise filtering is connected to VouT pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall time of the output voltage (VouT). (Capacitor for noise filtering) GND Fig.19 CMOS Output type 2) The following is an example of a circuit application in which an OR connection between two types of detection voltage resets the microcontroller. VDD1 VDD2 VDD3 RL BU42xx NO.1 BU42xx NO.2 RST microcontroller CT CT GND Fig.20 To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain output type (BU42xx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller (VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/13 TSZ02201-0R7R0G300050-1-2 2.Aug.2013 Rev.007 BU42xx series Datasheet BU43xx series 3) Examples of the power supply with resistor dividers In applications wherein the power supply input terminal (VDD) of an IC has resistor dividers, it is possible that an in-rush current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output oscillations). (In-rush current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level switches from “High” to “Low” or vice versa.) V1 IDD R2 I1 R1 Through Current V DD BU42xx BU43xx CIN V OUT CL GND VDD VDET 0 Fig.21 A voltage drop [in-rush current (I1)] × [input resistor (R2)] is caused by the in-rush current, and causes the input voltage to drop when the output switches from “Low” to “High”. When the input voltage decreases and falls below the detection voltage, the output voltage switches from “High” to “Low”. At this time, the in-rush current stops flowing through output “Low”, and the voltage drop is reduced. As a result, the output switches from “Low” to “High”, which again causes the in-rush current to flow and the voltage to drop. This operation repeats and will result to oscillation. Consider the use of BD52xx when the power supply input has resistor dividers. VDD - IDD Peak Current Ta=25°C Temp - IDD(BU42xx) BU49xx,BU43xx 10 VDD3V VDD6V VDD7V VDD4V 2.5 BU48xx,BU42xx BD52xx IDD peak Current[mA] IDD-peak[mA] 2.0 BD53xx 1 0.1 0.01 0.001 1.5 1.0 0.5 0.0 3 4 5 6 7 8 9 10 -50 -30 -10 10 VDD[V] 30 50 Temp 70 90 110 130 Fig.22 Current Consumption vs. Power Supply Voltage * This data is for reference only. The figures will vary with the application, so please confirm the actual operating conditions before use. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/13 TSZ02201-0R7R0G300050-1-2 2.Aug.2013 Rev.007 BU42xx series Datasheet BU43xx series ●Operational Notes 1) Absolute maximum ratings Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. 2) Ground Voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 3) Recommended operating conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 4) Bypass Capacitor for Noise Rejection To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND. Be careful when using extremely big capacitor as transient response will be affected. 5) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 6) Operation under strong electromagnetic field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 7) The VDD line impedance might cause oscillation because of the detection current. 8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD) condition. 10) External parameters The case of needless “Delay Time”, recommended to insert more 470kΩ resister between VDD and CT. The recommended value of RL Resistor is over 50kΩ to 1MΩ for VDET=1.5V to 4.8V, and over 100kΩ to 1MΩ for VDET=0.9V to 1.4V. The recommended value of CT Capacitor is over 100pF to 0.1µF. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 11) Power on reset operation Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual operation. 12) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 13) Rush current When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. 14) CT pin discharge Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation. 15) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the VDD terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the pull up resistor should be less than 1/10 of the assumed leak resistance. The value of Rct depends on the external resistor that is connected to CT terminal, so please consider the delay time that is decided by t × RCT × CCT changes. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/13 TSZ02201-0R7R0G300050-1-2 2.Aug.2013 Rev.007 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. ●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. ●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. ●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. ●Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. ●Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet ●Other Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved.